High-stability thermosensitive crystal resonator
By optimizing the lead wire position and introducing fixed protective components, the problems of easy etching of leads and displacement at high temperatures in the fine-tuning process of traditional thermistor resonators have been solved, achieving higher stability and frequency stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-31
AI Technical Summary
Traditional thermistor resonators are prone to lead etching during the fine-tuning process, which affects stability. Furthermore, the softening of the soldering material at high temperatures can lead to solder joint fatigue or damage, increasing the risk of displacement and poor contact.
The sputtering structure on the quartz wafer surface is optimized by moving the lead wire between the main electrode and the secondary electrode outward to the edge of the wafer and using a fixed protective component for limiting it, including a protective base, a fixed iron frame and a limiting block. Gold electrodes are deposited by high vacuum ion beam sputtering coating process and the thermistor is fixed with solder paste.
This improves the stability of the thermistor resonator, avoids the effects of fine-tuning etching and the risk of displacement at high temperatures, and ensures frequency stability and reliability.
Smart Images

Figure CN224068634U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of thermistor resonator technology, specifically a highly stable thermistor resonator. Background Technology
[0002] A thermistor crystal resonator typically consists of a piezoelectric quartz crystal wafer, a thermistor, conductive adhesive, a base, and a metal cover. The piezoelectric quartz crystal wafer is usually rectangular or circular. The packaging base typically has pre-drilled grooves to house the thermistor. Electrodes are plated on both sides of the piezoelectric quartz crystal wafer and fixed to the package shell by conductive adhesive. The electrodes are connected to the base pins of the package shell via leads. AC voltage is applied through the pins to the upper and lower electrodes of the quartz crystal wafer, causing the quartz chip to generate an inverse piezoelectric effect, thus producing oscillation. Simultaneously, the thermistor senses the ambient temperature and transmits the temperature signal to the IC. The IC, through its internal circuitry, adjusts the frequency output of the crystal oscillation circuit in a timely manner, stabilizing it within a controllable range. With the continuous development of microelectronic products, the requirements for thermistor crystal resonators have also increased. Higher requirements exist because the leads between the main and secondary electrodes of the sputtered structure on the surface of the quartz crystal resonator in traditional thermistors are directly connected. During the fine-tuning process, the leads are easily etched, affecting the stability of the thermistor resonator. Therefore, a new sputtering structure needs to be developed to avoid the impact of the fine-tuning process. Secondly, traditional thermistors are fixed on the circuit board by welding or adhesive. In actual use, the temperature of the thermistor resonator will rise due to power consumption and load conditions. High temperature may cause the welding material (such as solder) to soften, thereby reducing the strength of the weld joint. This may lead to fatigue or damage of the solder joint, increasing the risk of displacement and poor contact of the thermistor resonator. To address the above problems, the inventors propose a highly stable thermistor resonator to solve the above problems. Utility Model Content
[0003] To address the issues of improving the stability of thermistor resonators and preventing displacement during use, this invention aims to provide a highly stable thermistor resonator.
[0004] To solve the above technical problems, the present invention adopts the following technical solution: a highly stable thermistor crystal resonator, comprising a thermistor base, a quartz crystal, a metal cover plate, a thermistor, a main electrode, a secondary electrode, and leads. The thermistor base is hollow inside and contains a quartz crystal and a thermistor. The top of the thermistor base is provided with a metal cover plate. The outer wall of the thermistor base is provided with a fixing and protective component, which is fixedly installed on a circuit board.
[0005] Compared to traditional structures, the lead wire connecting the main electrode and the secondary electrode on the surface of the quartz wafer is moved outward from the edge of the quartz wafer, avoiding the width range of the main electrode. The lead wire is shaped as follows: it extends straight from the secondary electrode for a certain distance and then makes an obtuse angle bend to connect to the side edge of the main electrode.
[0006] Preferably, the fixed protective assembly includes a protective base and a fixed iron frame. One end of the fixed iron frame is rotatably installed in the protective base. Two symmetrically distributed limiting blocks that cooperate with the fixed iron frame are fixedly provided on one side of the top of the protective base. A limiting frame that cooperates with the thermal base is fixedly provided on the top of the protective base, and the thermal base is inserted into the limiting frame. Two symmetrically distributed fixing blocks are fixedly provided on the side of the top of the protective base away from the limiting blocks, and the fixed iron frame is rotatably installed on the fixing blocks. Both ends of the protective base are provided with circular grooves, and bolts are inserted through the circular grooves.
[0007] Preferably, the bottom of the thermistor base has a groove, the thermistor is disposed in the groove, and is fixedly connected to the thermistor base by solder paste.
[0008] Preferably, the quartz wafer surface is plated with gold electrodes, and the coating process is a high-vacuum ion beam sputtering coating process.
[0009] Preferably, the quartz wafer is bonded and fixed inside the thermistor base with conductive adhesive, and the metal cover plate is welded to the opening on the top of the thermistor base using parallel welding encapsulation technology.
[0010] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0011] 1. This utility model optimizes the sputtering shape and structure of the quartz crystal, so that the position of the lead connecting the main and secondary electrodes is moved outward from the edge of the wafer compared to the traditional structure, avoiding the width range of the main electrode. The lead shape extends straight from the secondary electrode for a certain distance and then makes an obtuse angle bend to connect to the side edge of the main electrode. After the lead is moved outward, the probability of fine-tuning etching to the lead is reduced due to factors such as the tolerance of the fine-tuning fixture and the offset of the product placement position, thereby improving the stability of the thermistor resonator.
[0012] 2. This utility model, by setting a fixed protective component, allows the thermal base to be inserted into the limiting frame for positioning and welding while simultaneously limiting its lateral movement. A fixed iron frame is flipped and inserted into the corresponding limiting block to further limit its position. The fixed iron frame, through a metal cover plate, applies a downward force to the thermal base, ensuring it adheres tightly to the circuit board and providing vertical limitation. This combination of lateral and vertical limiting effectively prevents displacement of the thermal base during use, improving the stability of the thermal crystal resonator. Attached Figure Description
[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0014] Figure 1 This is a schematic diagram of the lead connection between the traditional main and secondary electrodes in this utility model;
[0015] Figure 2 This is a schematic diagram of the improved wire connection between the main and auxiliary electrode leads in this utility model;
[0016] Figure 3 This is a schematic diagram showing the etching of a portion of the electrode surface where the micro-adjustment hole size is too small in this utility model.
[0017] Figure 4 This is a first schematic diagram of the etching range for the micro-adjustment hole size offset in this utility model;
[0018] Figure 5 This is a second schematic diagram of the etching range for the micro-adjustment hole size offset in this utility model;
[0019] Figure 6 This is a schematic diagram of the improved micro-adjustment hole size offset etching range in this utility model;
[0020] Figure 7 This is a schematic diagram of the overall structure of this utility model;
[0021] Figure 8 This is a schematic diagram of the overall exploded structure of this utility model;
[0022] Figure 9 This is a schematic diagram of the structure of the fixed protective component in this utility model;
[0023] Figure 10 This is a schematic diagram of the side-section structure of this utility model.
[0024] In the diagram: 1. Thermistor base; 101. Groove; 2. Quartz crystal; 3. Metal cover plate; 4. Thermistor; 5. Fixing and protection assembly; 51. Protective base; 52. Fixing iron frame; 53. Limiting block; 54. Limiting frame; 55. Circular groove; 56. Fixing block; 6. Bolt; 7. Main electrode; 8. Secondary electrode; 9. Lead wire. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] like Figure 1-10 As shown, this utility model provides a highly stable thermistor crystal resonator, including a thermistor base 1, a quartz crystal 2, a metal cover plate 3, a thermistor 4, a main electrode 7, a secondary electrode 8, and leads 9. The quartz crystal 2 and the thermistor 4 are hollow inside the thermistor base 1. The metal cover plate 3 is provided at the top of the thermistor base 1. A fixing and protective component 5 is provided on the outer wall of the thermistor base 1, and the fixing and protective component 5 is fixedly installed on the circuit board.
[0027] Compared to the conventional structure, the lead 9 connecting the main electrode 7 and the secondary electrode 8 on the surface of the quartz wafer 2 is moved outward from the edge of the quartz wafer 2, avoiding the width range of the main electrode 7. The lead 9 is shaped as follows: it extends straight from the secondary electrode 8 for a certain distance and then makes an obtuse bend to connect to the side edge of the main electrode 7.
[0028] By adopting the above technical solution, after the lead 9 is moved outward, the probability of fine-tuning etching onto the lead 9 is reduced due to factors such as the tolerance of the fine-tuning fixture and the offset of the product placement position, thereby improving the stability of the thermistor crystal resonator.
[0029] The fixed protective component 5 includes a protective base 51 and a fixed iron frame 52. One end of the fixed iron frame 52 is rotatably installed in the protective base 51. Two symmetrically distributed limit blocks 53 that cooperate with the fixed iron frame 52 are fixed on one side of the top of the protective base 51.
[0030] By adopting the above technical solution, the fixed iron frame 52 is flipped and then locked into the slot in the limiting block 53 to limit the fixed iron frame 52. The fixed iron frame 52 is fixed and limited by contact with the metal cover plate 3, so as to prevent the thermal base 1 from shifting.
[0031] The bottom of the thermistor base 1 has a groove 101, the thermistor 4 is placed in the groove 101 and is fixedly connected to the thermistor base 1 by solder paste.
[0032] By adopting the above technical solution, the thermistor 4 is welded to the bottom groove 101 of the thermistor base 1.
[0033] The surface of the quartz wafer 2 is plated with gold electrodes, and the coating process is a high-vacuum ion beam sputtering coating process.
[0034] By adopting the above technical solution, gold electrodes are deposited on the surface of the quartz wafer 2 through a high-vacuum ion beam sputtering coating process.
[0035] The quartz crystal 2 is bonded and fixed inside the thermistor base 1 with conductive adhesive, and the metal cover plate 3 is welded to the opening on the top of the thermistor base 1 using parallel welding encapsulation technology.
[0036] By adopting the above technical solution, the quartz wafer 2 is fixedly installed in the thermal base 1.
[0037] The top of the protective base 51 is fixed with a limiting frame 54 that works in conjunction with the thermal base 1, and the thermal base 1 is inserted into the limiting frame 54.
[0038] By adopting the above technical solution, the limiting frame 54 limits the thermal base 1.
[0039] Two symmetrically distributed fixing blocks 56 are fixedly provided on the top side of the protective base 51 away from the limiting block 53, and the fixing iron frame 52 is rotatably installed on the fixing blocks 56.
[0040] By adopting the above technical solution, the fixed iron frame 52 can rotate on the fixed block 56.
[0041] The protective base 51 has circular grooves 55 at both ends, and bolts 6 are inserted through the circular grooves 55.
[0042] By adopting the above technical solution, the protective base 51 is fixedly installed in the circuit board by bolts 6.
[0043] Working principle: First, a quartz crystal 2 is formed. Electrodes are plated on the quartz crystal 2. Traditionally, the electrode surfaces are square and the upper and lower electrode surfaces are the same size. The lead 9 between the main electrode 7 and the secondary electrode 8 is directly connected as follows: Figure 1 As shown, the position of the lead 9 between the main electrode 7 and the sub-electrode 8 is changed to be moved outwards towards the wafer edge compared to the traditional structure, avoiding the width range of the main electrode 7. The shape of the lead 9 is such that it extends straight from the sub-electrode 8 for a certain distance, then makes an obtuse angle bend, and connects to the side edge of the main electrode 7. Figure 2 As shown, during the fine-tuning process, because the upper electrode surface needs to be etched, if the size of the fine-tuning hole is too small, only a portion of the upper electrode surface will be etched. Figure 3 As shown, when the external temperature changes, the uneven coating leads to different shrinkage rates, causing instability in the crystal oscillator. If the micro-adjustment hole size is just right or slightly larger, the tolerance of the micro-adjustment fixture and the product placement may cause misalignment, making it easy to etch the lead 9. Figure 4 and Figure 5As shown, the inability to maintain the circuitry on the surface of the quartz crystal wafer 2 will also cause instability in the crystal oscillator. Moving the lead 9 outwards towards the edge of the wafer reduces the impact of tolerances and placement misalignments in the fine-tuning fixture. Using a fine-tuning hole of the correct or slightly larger size makes it less likely to etch the lead 9. Figure 6 As shown, this makes the temperature measurement frequency more stable;
[0044] During the installation of the thermal base 1, the protective base 51 is first fixedly installed on the corresponding position of the circuit board using bolts 6. Then, the thermal base 1 is placed in the limiting frame 54 on the protective base 51 to position and limit the thermal base 1. The thermal base 1 is then welded and fixed. After welding, the fixing iron frame 52 is manually flipped so that the other end of the fixing iron frame 52 is engaged in the corresponding slot in the limiting block 53 to limit the fixing iron frame 52. At this time, the bottom end of the fixing iron frame 52 is tightly attached to the metal cover plate 3 and applies a downward force to the thermal base 1, which limits the thermal base 1 vertically and makes the thermal base 1 tightly attached to the circuit board.
[0045] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.
Claims
1. A high-stability thermosensitive crystal resonator comprising a thermosensitive base (1), a quartz wafer (2), a metal cover plate (3), a thermistor (4), a main electrode (7), a sub-electrode (8) and a lead wire (9), characterized in that: The heat-sensitive base (1) is internally hollow with a quartz crystal wafer (2) and a thermistor (4), the top end of the heat-sensitive base (1) is provided with a metal cover plate (3), the outer wall of the heat-sensitive base (1) is provided with a fixed protection assembly (5), and the fixed protection assembly (5) is fixedly installed on a circuit board; The lead wire (9) connected between the main electrode (7) and the auxiliary electrode (8) on the surface of the quartz crystal wafer (2) is located outward from the edge of the quartz crystal wafer (2) compared with the traditional structure, avoiding the width range of the main electrode (7), and the lead wire (9) is shaped to extend straight from the auxiliary electrode (8) for a distance and then be connected to the side edge of the main electrode (7) through an obtuse angle.
2. A highly stable thermal crystal resonator as claimed in claim 1, wherein, The fixed protection assembly (5) comprises a protection base (51) and a fixed iron stand (52), one end of the fixed iron stand (52) is rotatably installed in the protection base (51), and two limiting blocks (53) symmetrically distributed and used in cooperation with the fixed iron stand (52) are fixedly arranged on one side of the top end of the protection base (51).
3. The high-stability thermistor resonator as described in claim 1, characterized in that, The bottom of the heat-sensitive base (1) is provided with a groove (101), the thermistor (4) is arranged in the groove (101) and fixedly connected with the heat-sensitive base (1) through tin paste.
4. A high-stability thermistor resonator as described in claim 1, characterized in that, The surface of the quartz crystal wafer (2) is plated with a gold electrode, and the plating process is a high-vacuum ion beam sputtering plating process.
5. A high-stability thermistor resonator as described in claim 1, characterized in that, The quartz crystal wafer (2) is fixedly connected in the heat-sensitive base (1) through conductive glue, and the metal cover plate (3) is welded to the opening at the top of the heat-sensitive base (1) through parallel welding packaging technology.
6. A high-stability thermistor resonator as described in claim 2, characterized in that, The top end of the protection base (51) is fixedly provided with a limiting frame (54) used in cooperation with the heat-sensitive base (1), and the heat-sensitive base (1) is inserted into the limiting frame (54).
7. A high-stability thermistor resonator as described in claim 2, characterized in that, The top end of the protection base (51) is fixedly provided with two fixed blocks (56) symmetrically distributed on the side away from the limiting block (53), and the fixed iron stand (52) is rotatably installed on the fixed blocks (56).
8. A high-stability thermistor resonator as described in claim 7, characterized in that, The protection base (51) is provided with a circular groove (55) at both ends, and a bolt (6) is inserted through the circular groove (55).