High-thermal-conductivity ceramic circuit board

Abstract

The utility model belongs to the field of ceramic circuit boards, and particularly relates to a high-thermal-conductivity ceramic circuit board, which comprises a circuit board main body, the circuit board main body consists of a ceramic substrate, copper sheets and an assembly welding layer, the copper sheets are bonded at the top and the bottom of the ceramic substrate at high temperature, the assembly welding layer is coated on the surfaces of the copper sheets, and the ceramic substrate is arranged on the surface of the assembly welding layer. A heat conduction assembly is arranged in the ceramic substrate, the heat conduction assembly comprises a main hole penetrating through the ceramic substrate, auxiliary holes are formed in the two sides of the ceramic substrate, and a plurality of sub holes are formed in the ceramic substrate; the air inlet assembly is arranged on one side of the interior of the main hole and one side of the interior of the auxiliary hole so that external airflow can be accelerated when entering the main hole and the auxiliary hole, the sub-holes are communicated with the main hole and the auxiliary hole through the multiple sub-holes so that heat of the ceramic substrate can be taken away through the rapidly-passing airflow, heat dissipation compensation can be conducted on the ceramic substrate through the groove and the air guide opening, and the heat dissipation efficiency of the ceramic substrate is improved. The heat conduction and heat dissipation performance of the ceramic substrate is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of ceramic circuit boards, specifically a high thermal conductivity ceramic circuit board. Background Technology

[0002] Ceramic circuit boards are thermally conductive organic ceramic circuit boards made using thermally conductive ceramic powder and organic binders. With the deepening application of electronic technology in various fields, the high integration of circuit boards has become an inevitable trend. Highly integrated packaging modules require a good heat dissipation and support system. Ceramic materials have good high-frequency performance and electrical performance, and have properties that organic substrates do not have, such as high thermal conductivity, chemical stability and excellent thermal stability. They are ideal packaging materials for the next generation of large-scale integrated circuits and power electronic modules.

[0003] While ceramic circuit boards provide a guarantee for the increasing integration, intelligence and miniaturization of electronic products due to their excellent specifications and product characteristics, they also require continuous improvement in power density, better heat dissipation and high thermal conductivity. Therefore, how to improve the thermal conductivity and heat dissipation performance of ceramic circuit boards is a key technology to promote the development of the ceramic circuit board industry. Therefore, a high thermal conductivity ceramic circuit board is proposed to address the above issues. Utility Model Content

[0004] To address the shortcomings of existing technologies, which require continuously increasing power density, better heat dissipation, and high thermal conductivity of ceramic circuit boards, this invention proposes a high thermal conductivity ceramic circuit board.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a high thermal conductivity ceramic circuit board, including a circuit board body, the circuit board body is composed of a ceramic substrate, a copper sheet and a soldering layer, the copper sheet is bonded to the top and bottom of the ceramic substrate at high temperature, the soldering layer is coated on the surface of the copper sheet, and a heat-conducting component is provided inside the ceramic substrate.

[0006] The heat-conducting component includes a main hole penetrating the ceramic substrate, secondary holes on both sides of the ceramic substrate, and several sub-holes inside the ceramic substrate. The sub-holes are connected to the main hole and secondary holes, and air inlet components are provided inside the main hole and secondary holes.

[0007] Preferably, the air intake assembly includes bearings fixedly installed inside the main hole and the secondary hole, a sleeve fixedly installed inside the bearing, and a spiral blade fixedly installed on the inner wall of the sleeve.

[0008] Preferably, both the main hole and the secondary hole are fixedly installed with air outlet pipes, and the diameter of one side of the air outlet pipe is smaller than the diameter of the other side of the air outlet pipe.

[0009] Preferably, the ceramic substrate has several grooves at its top and bottom, and several air vents at its top and bottom, with the air vents connected to the grooves.

[0010] Preferably, the surface of the circuit board body is provided with a plurality of heat dissipation holes, which are respectively connected to the main hole, the secondary hole, the groove and the air guide.

[0011] Preferably, the surface of the circuit board body is provided with a plurality of through holes, and the inner walls of the plurality of through holes are electroplated with a first electroplated copper layer.

[0012] Preferably, the surface of the circuit board body is provided with a plurality of mounting holes, and the inner wall of one of the mounting holes is electroplated with a second electroplated copper layer.

[0013] The advantages of this utility model are:

[0014] 1. This utility model provides an air intake component on one side inside the main hole and the secondary hole, which accelerates the external airflow when it enters the main hole and the secondary hole. By providing several sub-holes that are connected to the main hole and the secondary hole, the heat of the ceramic substrate is carried away by the rapidly passing airflow. The heat dissipation of the ceramic substrate is compensated by the groove and the air guide, thereby effectively improving the thermal conductivity and heat dissipation performance of the ceramic substrate.

[0015] 2. This utility model, by setting an air inlet component, allows the airflow to contact the spiral blades when passing through the sleeve, causing the spiral blades to drive the sleeve to rotate and the spiral blades to axially propel the airflow, thereby increasing the gas flow rate. Furthermore, by setting an air outlet pipe, the gas discharge speed is increased, thereby quickly dissipating the heat in the main and secondary holes and effectively improving the heat conduction effect of the heat conduction component. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the high thermal conductivity ceramic circuit board structure of this utility model;

[0018] Figure 2 This is a schematic cross-sectional view of the ceramic substrate of this utility model;

[0019] Figure 3 This is a schematic diagram of the ceramic substrate structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the air intake component structure of this utility model.

[0021] In the diagram: 1. Circuit board body; 101. Ceramic substrate; 102. Copper sheet; 103. Soldering layer; 2. Heat-conducting component; 21. Main hole; 22. Secondary hole; 23. Sub-hole; 24. Air inlet component; 2401. Bearing; 2402. Sleeve; 2403. Spiral blade; 25. Air outlet duct; 3. Groove; 31. Air guide; 4. Heat dissipation hole; 5. Through hole; 51. First electroplated copper layer; 6. Mounting hole; 61. Second electroplated copper layer. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0023] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0024] This application discloses a high thermal conductivity ceramic circuit board. (Refer to...) Figure 2 and Figure 3 A high thermal conductivity ceramic circuit board includes a circuit board body 1. The circuit board body 1 is composed of a ceramic substrate 101, a copper sheet 102 and a soldering layer 103. The copper sheet 102 is bonded to the top and bottom of the ceramic substrate 101 at high temperature. The soldering layer 103 is coated on the surface of the copper sheet 102. A thermally conductive component 2 is disposed inside the ceramic substrate 101.

[0025] The heat-conducting component 2 includes a main hole 21 penetrating the ceramic substrate 101, secondary holes 22 on both sides of the ceramic substrate 101, and a plurality of sub-holes 23 inside the ceramic substrate 101. The sub-holes 23 are connected to the main hole 21 and the secondary holes 22. An air inlet component 24 is provided inside the main hole 21 and the secondary holes 22. By providing an air inlet component 24 on one side inside the main hole 21 and the secondary holes 22, the external airflow is accelerated when it enters the main hole 21 and the secondary holes 22. By providing a plurality of sub-holes 23, the sub-holes 23 are connected to the main hole 21 and the secondary holes 22, so that the heat of the ceramic substrate 101 is carried away by the rapidly passing airflow, thereby effectively improving the heat conduction and heat dissipation performance of the ceramic substrate 101.

[0026] Reference Figure 2 and Figure 4The air inlet assembly 24 includes a bearing 2401 fixedly installed inside the main hole 21 and the secondary hole 22. A sleeve 2402 is fixedly installed inside the bearing 2401, and a spiral blade 2403 is fixedly installed on the inner wall of the sleeve 2402. When the airflow enters the sleeve 2402, the airflow comes into contact with the spiral blade 2403, and the spiral blade 2403 drives the sleeve 2402 to rotate inside the bearing 2401, so that the spiral blade 2403 can axially propel the airflow to increase the airflow velocity in the main hole 21 and the secondary hole 22.

[0027] Reference Figure 1 and Figure 2 Both the main hole 21 and the secondary hole 22 are fixedly installed with air outlet pipes 25. The diameter of one end of the air outlet pipe 25 is smaller than the diameter of the other end. By setting the air outlet pipe 25 and making the diameter of one end of the air outlet pipe 25 smaller than the diameter of the other end, the gas in the main hole 21 and the secondary hole 22 can be compressed and the gas can be quickly discharged from the main hole 21 and the secondary hole 22 to increase the heat discharge speed.

[0028] Reference Figure 1 and Figure 3 The top and bottom of the ceramic substrate 101 are provided with a number of grooves 3 and a number of air guides 31. The air guides 31 are connected to the grooves 3. By setting the grooves 3 and the air guides 31 and connecting the air guides 31 and the grooves 3, the airflow can pass through the air guides 31 and the grooves 3 and pass through the surface of the ceramic substrate 101, thereby dissipating heat from the heat conduction blind area of ​​the heat conduction component 2, so as to compensate for the heat dissipation of the ceramic substrate 101 and ensure uniform heat conduction of the ceramic substrate 101.

[0029] Reference Figure 1 and Figure 2 The surface of the circuit board body 1 is provided with a plurality of heat dissipation holes 4, which are respectively connected to the main hole 21, the secondary hole 22, the groove 3 and the air guide 31. By setting a plurality of heat dissipation holes 4 and connecting the heat dissipation holes 4 to the main hole 21, the secondary hole 22, the groove 3 and the air guide 31 respectively, the contact area between the ceramic substrate 101 and the external air can be effectively increased, so that the heat dissipation holes 4 play an auxiliary role in heat dissipation of the main hole 21, the secondary hole 22, the groove 3 and the air guide 31.

[0030] Reference Figure 1 and Figure 3 The surface of the circuit board body 1 is provided with several through holes 5, and the inner wall of each of the through holes 5 is electroplated with a first electroplated copper layer 51. Electronic components can be easily connected to the circuit board body 1 through the through holes 5, and the electronic components can be connected to the copper sheet 102 circuit through the first electroplated copper layer 51.

[0031] Reference Figure 1 and Figure 3 The surface of the circuit board body 1 is provided with several mounting holes 6, and the inner wall of one of the mounting holes 6 is electroplated with a second electroplated copper layer 61; the mounting holes 6 make it easy to install the circuit board body 1 in the usage position, and the second electroplated copper layer 61 can be used to ground the circuit board body 1.

[0032] Working principle: By providing a main hole 21, a secondary hole 22, and a sub-hole 23 inside the ceramic substrate 101, the contact area between the ceramic substrate 101 and the external air can be increased. When the external airflow enters the main hole 21 and the secondary hole 22, the airflow comes into contact with the spiral blade 2403. The spiral blade 2403 drives the sleeve 2402 to rotate inside the bearing 2401, thereby allowing the spiral blade 2403 to axially propel the airflow, increasing the airflow velocity within the main hole 21 and the secondary hole 22. By providing an exhaust pipe 25, and making the diameter of one end of the exhaust pipe 25 smaller than the diameter of the other end, the gas within the main hole 21 and the secondary hole 22 can be compressed and quickly discharged, increasing the heat dissipation rate. The rapidly passing airflow then carries away the heat from the ceramic substrate 101, effectively... The thermal conductivity and heat dissipation performance of the ceramic substrate 101 is improved by simultaneously providing a groove 3 and an air vent 31, allowing airflow to pass through the air vent 31 and the groove 3 across the surface of the ceramic substrate 101, thereby dissipating heat from the thermal blind zone of the thermal conductive component 2 and compensating for the heat dissipation of the ceramic substrate 101. The heat dissipation holes 4 assist the main hole 21, the secondary hole 22, the groove 3, and the air vent 31 to make the thermal conductivity and heat dissipation of the ceramic substrate 101 more uniform. The through hole 5 facilitates the connection of electronic components to the circuit board body 1, and the first electroplated copper layer 51 connects the electronic components to the copper sheet 102 circuit. The soldering layer 103 prevents solder diffusion and provides insulation protection. The mounting hole 6 facilitates the installation of the circuit board body 1 in the usage position, and the second electroplated copper layer 61 can be used to ground the circuit board body 1.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A high thermal conductive ceramic circuit board, characterized by: The application relates to a circuit board body (1) which is composed of a ceramic substrate (101), copper sheets (102) and a brazing layer (103), the copper sheets (102) are high-temperature bonded on the top and bottom of the ceramic substrate (101), the brazing layer (103) is coated on the surface of the copper sheets (102), and the ceramic substrate (101) is internally provided with a heat conduction assembly (2). The heat conduction assembly (2) comprises a main hole (21) penetrating through the ceramic substrate (101), a secondary hole (22) is arranged on the two sides of the ceramic substrate (101), a plurality of sub-holes (23) are arranged in the ceramic substrate (101), the plurality of sub-holes (23) are in communication with the main hole (21) and the secondary hole (22), and the main hole (21) and the secondary hole (22) are internally provided with an air inlet assembly (24).

2. The high thermal conductivity ceramic circuit board of claim 1, wherein: The air inlet assembly (24) comprises a bearing (2401) fixedly installed in the main hole (21) and the secondary hole (22), the bearing (2401) is internally fixedly installed with a sleeve (2402), and the inner wall of the sleeve (2402) is fixedly installed with a spiral blade (2403).

3. The high thermal conductivity ceramic circuit board of claim 1, wherein: The main hole (21) and the secondary hole (22) are internally fixedly installed with an air outlet pipe (25), and the diameter of the pipe opening on one side of the air outlet pipe (25) is smaller than the diameter of the pipe opening on the other side of the air outlet pipe (25).

4. The high thermal conductivity ceramic circuit board of claim 1, wherein: The top and bottom of the ceramic substrate (101) are provided with a plurality of grooves (3), and the top and bottom of the ceramic substrate (101) are provided with a plurality of air guide openings (31), the plurality of air guide openings (31) are in communication with the plurality of grooves (3).

5. The high thermal conductivity ceramic circuit board of claim 4, wherein: A plurality of heat dissipation holes (4) are arranged on the surface of the circuit board body (1), and the plurality of heat dissipation holes (4) are in communication with the main hole (21) and the secondary hole (22), the grooves (3) and the air guide openings (31) respectively.

6. The high thermal conductivity ceramic circuit board of claim 1, wherein: A plurality of through holes (5) are arranged on the surface of the circuit board body (1), and the inner walls of the plurality of through holes (5) are respectively electroplated with first electroplated copper layers (51).

7. The high thermal conductivity ceramic circuit board of claim 1, wherein: A plurality of mounting holes (6) are arranged on the surface of the circuit board body (1), and the inner wall of one of the mounting holes (6) is electroplated with a second electroplated copper layer (61).

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