PCB heat dissipation structure

By designing a combined structure of base frame, heat dissipation components and flip frame on the PCB board, and by adjusting the position of the cooling fan, the problems of poor heat dissipation and complex maintenance of the PCB board are solved, achieving efficient heat dissipation and convenient maintenance.

CN224068984UActive Publication Date: 2026-03-31HEILONGJIANG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-25
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

The poor heat dissipation of existing PCBs leads to a shortened lifespan of electronic components, and the existing heat dissipation structure is complicated to disassemble and repair, affecting maintenance efficiency.

Method used

A structure including a base frame, heat dissipation components, a flip frame, and a cooling fan is designed. The heat dissipation components absorb and disperse heat, the flip frame can be flipped for easy maintenance, and the cooling fan can be adjusted in position. The combination of the cooling fan and the flip frame achieves efficient heat dissipation and facilitates maintenance without disassembling the heat dissipation structure.

Benefits of technology

It achieves efficient heat dissipation of the PCB board, extends the service life of electronic components, simplifies the maintenance process, and improves the ease of operation.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224068984U_ABST
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Abstract

The utility model relates to the technical field of PCB heat dissipation, in particular to a PCB heat dissipation structure which comprises a bottom frame, a heat dissipation assembly, bottom feet, a first supporting plate, a first clamping plate, a rotating shaft, an overturning frame, a guide rod, an adjusting seat, a heat dissipation fan, fixing screws, a PCB and mounting screws. When the PCB heat dissipation device is used, through the heat dissipation assembly arranged on the bottom frame and the heat dissipation fan arranged on the overturning frame, heat generated when a PCB works can be absorbed and dissipated through the heat dissipation assembly, and through the heat dissipation fan arranged on the overturning frame, air blowing cooling treatment can be conducted on a high-heating area on the PCB; by means of the structure, a good heat dissipation effect is achieved for the PCB, the position of the heat dissipation fan on the overturning frame can be adjusted on the overturning frame through the adjusting base, the heat dissipation fan can be flexibly adjusted to the position above a heating area of the PCB, and the heat dissipation effect is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to PCB board heat dissipation technical field, concretely relates to a PCB board heat dissipation structure. BACKGROUND

[0002] PCB board is printed circuit board, and the electric connection of electronic components is realized with insulating plate as base material, and it is the carrier of electrical interconnection of electronic components. It is made by electronic printing, and electronic components are etched on the surface of insulating and non-adhesive copper-clad pressure plate to form a small circuit network, so that various electronic components can form predetermined circuit connection and realize relay transmission function between electronic components.

[0003] At present, the electronic components of the existing PCB board will generate heat in the use process, and the service life of the components will be greatly reduced if the heat dissipation of the PCB board is not good, and the electronic components may be burned out in serious cases, and most of the heat dissipation structures are stacked and installed on the PCB board and fixed by bolts, but for the later maintenance, the heat dissipation structure needs to be disassembled as a whole to maintain the electrical components of the PCB board, and the operation steps are more, and the heat dissipation effect is poor.

[0004] Based on this, the utility model discloses a kind of PCB board heat dissipation structure to solve the above problems. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the shortcomings in the prior art, and provides a kind of PCB board heat dissipation structure.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of PCB board heat dissipation structure, including chassis, heat dissipation component, bottom foot, first support plate, first clamping plate, pivot, turnover frame, guide rod, adjusting seat, heat dissipation fan, fixed screw, PCB board and mounting screw, the inside of the chassis is provided with heat dissipation component, the upper portion of the heat dissipation component is placed with PCB board, the PCB board is fixedly connected with chassis by mounting screw, the left side of the upper end of the chassis is symmetrically provided with two first support plates, the right side of the upper end of the chassis is symmetrically provided with two first clamping plates, two the first support plate is provided with pivot, the pivot is rotatably connected with turnover frame, the turnover frame is provided with sliding slot, the sliding slot is symmetrically fixedly connected with guide rod, the adjusting seat is slidably connected with two guide rods, the adjusting seat is provided with heat dissipation fan, the heat dissipation fan is fixedly installed with adjusting seat by four fixed screws.

[0007] As a preferred technical scheme of the utility model, the lower end of the chassis is fixedly connected with four bottom feet, and mounting holes are formed in the four bottom feet.

[0008] As a preferred technical scheme of the utility model, the heat dissipation assembly comprises a uniform temperature plate, a heat conduction plate and radiating fins, the lower end of the uniform temperature plate is fixedly connected with the heat conduction plate, and the heat conduction plate is connected with a plurality of radiating fins.

[0009] As a preferred technical scheme of the utility model, the upper end of the uniform temperature plate is in contact with the lower end of the PCB.

[0010] As a preferred technical scheme of the utility model, the right end of the turnover frame is symmetrically provided with two second clamping plates, and the two second clamping plates are both screw-connected with connecting screws.

[0011] As a preferred technical scheme of the utility model, the two second clamping plates are connected with the two first clamping plates through the connecting screws.

[0012] As a preferred technical scheme of the utility model, the center of the adjusting seat is provided with a circular through hole, the upper end of the adjusting seat is fixedly connected with two extension plates in symmetry, the extension plates are both screw-connected with rotating bolts, and the lower end of the rotating bolt is in abutting connection with the turnover frame.

[0013] As a preferred technical scheme of the utility model, the heat dissipation fan is fixedly installed at the circular through hole of the adjusting seat, and the air outlet of the heat dissipation fan is in communication with the circular through hole.

[0014] Compared with the prior art, the utility model has the advantages of:

[0015] 1、The utility model discloses in using, through the heat dissipation assembly and the heat dissipation fan that the turnover frame is equipped with on the bottom frame, the heat dissipation assembly can absorb and dissipate the heat generated when the PCB works, and the heat dissipation fan that the turnover frame is equipped with can blow the high heat generation area on the PCB and carry out the cooling treatment, the above-mentioned structure reaches the better heat dissipation effect to the PCB, and the heat dissipation fan on the turnover frame can be adjusted to the position on the turnover frame through the adjusting seat, so that the heat dissipation fan can be adjusted to the above of the heat generation area of the PCB flexibly, improve the effect of heat dissipation.

[0016] 2、The utility model discloses in using, through the connecting screw that is used for connecting the first clamping plate and the second clamping plate and is rotated outward, can make the turnover frame whole around the pivot and turn up, until turning 180, when installing the PCB on the bottom frame is completely exposed, it is convenient to dismount or overhaul the electrical components on the PCB, simple structure, time -saving and labor -saving when using, it is more practical. DRAWINGS

[0017] The accompanying drawings are used to provide further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with the embodiments of the present application, and do not constitute a limitation to the present application. In the drawings:

[0018] Fig. 1 It is an overall front view structural schematic diagram of the present application;

[0019] Fig. 2 It is an overall left view structural schematic diagram of the present application;

[0020] Fig. 3 It is an overall right view structural schematic diagram of the present application;

[0021] Fig. 4 It is an overall bottom view structural schematic diagram of the present application;

[0022] Fig. 5 It is an overall unfolded structural schematic diagram of the present application;

[0023] Fig. 6 It is an overall half cut structural schematic diagram of the present application.

[0024] In the drawings: 1, base frame; 2, heat dissipation assembly; 201, uniform temperature plate; 202, heat conduction plate; 203, heat dissipation fin; 3, base foot; 301, mounting hole; 4, first supporting plate; 5, first clamping plate; 6, rotating shaft; 7, overturning frame; 701, sliding groove; 702, second clamping plate; 703, connecting screw; 8, guide rod; 9, adjusting seat; 901, extension plate; 902, screw bolt; 903, circular through hole; 10, heat dissipation fan; 11, fixing screw; 12, PCB board; 13, mounting screw. DETAILED DESCRIPTION

[0025] The accompanying drawings will be described below in conjunction with the embodiments of the present application. Figs. 1-6 The technical solutions in the embodiments of the present application are described clearly and completely, obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor are within the protection scope of the present application.

[0026] EMBODIMENT

[0027] Please refer to Figs. 1-6The utility model provides following technical scheme: A kind of PCB board heat dissipation structure, including chassis 1, heat dissipation assembly 2, bottom foot 3, first support plate 4, first clamping plate 5, pivot 6, turnover frame 7, guide rod 8, adjusting seat 9, heat dissipation fan 10, fixed screw 11, PCB board 12 and mounting screw 13, the inside of chassis 1 is provided with heat dissipation assembly 2, heat dissipation assembly 2 is placed with PCB board 12 above, PCB board 12 is fixedly connected with chassis 1 by mounting screw 13, the left side of the upper end of chassis 1 is symmetrically provided with two first support plate 4, the right side of the upper end of chassis 1 is symmetrically provided with two first clamping plate 5, two first support plate 4 are provided with pivot 6, pivot 6 is rotatably connected with turnover frame 7, turnover frame 7 is provided with sliding slot 701, sliding slot 701 is symmetrically fixedly connected with guide rod 8, adjusting seat 9 is slidably connected with two guide rods 8, adjusting seat 9 is provided with heat dissipation fan 10, heat dissipation fan 10 is fixedly installed with adjusting seat 9 by four fixed screws 11.

[0028] By the above structure, under the cooperation of heat dissipation assembly 2 and heat dissipation fan 10, the high heat generation area of PCB board 12 can be cooled, thereby achieving good heat dissipation effect and ensuring the normal use of PCB board 12, and the detachable and overturnable structure design of turnover frame 7 facilitates the maintenance of PCB board 12 during use.

[0029] The lower end of chassis 1 is fixedly connected with four bottom feet 3, and mounting holes 301 are formed in the four bottom feet 3.

[0030] Heat dissipation assembly 2 includes a uniform temperature plate 201, a heat conduction plate 202 and a plurality of heat dissipation fins 203, the lower end of the uniform temperature plate 201 is fixedly connected with the heat conduction plate 202, and the heat conduction plate 202 is connected with the plurality of heat dissipation fins 203.

[0031] The upper end of the uniform temperature plate 201 is in contact with the lower end of the PCB board 12.

[0032] The right end of the turnover frame 7 is symmetrically provided with two second clamping plates 702, and the two second clamping plates 702 are screw-connected with connecting screws 703.

[0033] The two second clamping plates 702 are connected with the two first clamping plates 5 through the connecting screws 703.

[0034] The first clamping plate 5 and the second clamping plate 702 are connected through the connecting screws 703, which facilitates the overturning of the turnover frame 7, is simple in structure and convenient to operate.

[0035] A circular through hole 903 is formed in the center of the adjusting seat 9, two extension plates 901 are symmetrically fixedly connected to the upper end of the adjusting seat 9, screw bolts 902 are screw-connected in the extension plates 901, and the lower ends of the screw bolts 902 are in abutting connection with the turnover frame 7.

[0036] The heat dissipation fan 10 is fixedly installed at the circular through hole 903 of the adjusting seat 9, and the air outlet of the heat dissipation fan 10 is communicated with the circular through hole 903.

[0037] By rotating the screwing bolt 902 upward, the screwing bolt 902 is separated from the turning frame 7, so that the adjusting seat 9 can slide in the sliding groove 701 along the guide rod 8, thereby facilitating the adjustment of the position of the heat dissipation fan 10 on the adjusting seat 9 according to the heating area of the PCB 12, and facilitating the heat dissipation of the heating area of the PCB 12 to achieve better heat dissipation effect.

[0038] The working principle and use process of the utility model are as follows: in specific use, the heat generated by the PCB 12 during work can be absorbed and evenly dispersed by the uniform temperature plate 201, and the heat is evenly dispersed to the heat conduction plate 202 and then transmitted to the radiating fins 203, then the heat is quickly dissipated by the plurality of radiating fins 203, and at the same time, the heat dissipation fan 10 is started, air is blown to the upper side of the PCB 12 by the heat dissipation fan 10, air cooling heat dissipation of the PCB 12 is realized, the heat dissipation assembly 2 and the heat dissipation fan 10 are used in cooperation, so that the PCB 12 achieves better heat dissipation effect, and the position of the heat dissipation fan 10 can be adjusted according to the heating position of the PCB 12, so as to adjust the heat dissipation fan 10 to the upper side of the heating element to achieve better heat dissipation effect, and when the electronic components on the PCB 12 need to be repaired, the connecting screw 703 for connecting the first clamping plate 5 and the second clamping plate 702 is rotated out, the turning frame 7 is turned over by 180°, so that the PCB 12 is exposed to provide a repair space, the electrical components of the PCB can be repaired without disassembling the heat dissipation structure, and the utility model has good practicability.

[0039] Finally, it should be noted that: the above only for preferred embodiments of the utility model, and not for limiting the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art, still can modify the technical scheme recorded in the foregoing embodiments, or equivalent replacement to part of technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model, should be included in the protection scope of the utility model.

Claims

1. A PCB board heat dissipation structure, comprising a base frame (1), a heat dissipation assembly (2), base feet (3), a first support plate (4), a first snap-fit ​​plate (5), a rotating shaft (6), a flip frame (7), a guide rod (8), an adjustment seat (9), a heat dissipation fan (10), fixing screws (11), a PCB board (12), and mounting screws (13), characterized in that: The inside of the chassis (1) is provided with a heat dissipation assembly (2), the upper side of the heat dissipation assembly (2) is placed with a PCB board (12), the PCB board (12) is fixedly connected with the chassis (1) through mounting screws (13), the left side of the upper end of the chassis (1) is symmetrically provided with two first supporting plates (4), the right side of the upper end of the chassis (1) is symmetrically provided with two first clamping plates (5), two first supporting plates (4) are provided between the two first supporting plates (4), a rotating shaft (6) is arranged on the rotating shaft (6), a turnover frame (7) is rotatably connected to the rotating shaft (6), a sliding groove (701) is formed in the turnover frame (7), guide rods (8) are symmetrically fixedly connected in the sliding groove (701), an adjusting seat (9) is slidably connected with the two guide rods (8), a heat dissipation fan (10) is arranged on the adjusting seat (9), and the heat dissipation fan (10) is fixedly installed on the adjusting seat (9) through four fixing screws (11).

2. The PCB heat dissipation structure of claim 1, wherein: The lower end of the chassis (1) is fixedly connected with four bottom feet (3), and mounting holes (301) are formed in the four bottom feet (3).

3. The PCB heat dissipation structure of claim 1, wherein: The heat dissipation assembly (2) comprises a uniform temperature plate (201), a heat conducting plate (202) and a heat dissipation fin (203), the lower end of the uniform temperature plate (201) is fixedly connected with the heat conducting plate (202), and the heat conducting plate (202) is connected with a plurality of heat dissipation fins (203).

4. The PCB heat dissipation structure of claim 3, wherein: The upper end of the uniform temperature plate (201) is in contact with the lower end of the PCB board (12).

5. The PCB heat dissipation structure of claim 1, wherein: The right end of the turnover frame (7) is symmetrically provided with two second clamping plates (702), and the two second clamping plates (702) are screw-connected with connecting screws (703).

6. The PCB heat dissipation structure of claim 5, wherein: Two second clamping plates (702) are connected with two first clamping plates (5) through connecting screws (703) respectively.

7. The PCB heat dissipation structure of claim 1, wherein: A circular through hole (903) is formed in the center of the adjusting seat (9), two extension plates (901) are symmetrically fixedly connected to the upper end of the adjusting seat (9), screw bolts (902) are screw-connected in the extension plates (901), and the lower ends of the screw bolts (902) are in abutting connection with the turnover frame (7).

8. The PCB heat dissipation structure of claim 1, wherein: The heat dissipation fan (10) is fixedly installed at the circular through hole (903) of the adjusting seat (9), and the air outlet of the heat dissipation fan (10) is in communication with the circular through hole (903).