Efficient heat dissipation device for machine room

Abstract

The utility model belongs to the technical field of machine room equipment, and particularly relates to an efficient heat dissipation device for a machine room, which comprises the machine room, a server is fixedly mounted at the bottom of an inner cavity of the machine room, and a heat dissipation and dehumidification mechanism is fixedly mounted on the inner surface of the machine room; the heat dissipation and dehumidification mechanism comprises a dehumidification assembly, the dehumidification assembly comprises an air inlet pipe, a dehumidification box is fixedly installed on the outer surface of the air inlet pipe, a semiconductor chilling plate is fixedly installed on the inner surface of the dehumidification box, and a cold guide plate is fixedly installed on the outer surface of the semiconductor chilling plate. According to the efficient heat dissipation device for the machine room, a first motor drives a first rotating shaft to rotate, the first rotating shaft drives first rotating blades to rotate, external air is blown into a dehumidification box from an air inlet pipe, the air enters the dehumidification box and then collides with a cold guide plate, and water molecules in the air are pre-cooled and condensed; and then the air flows into the storage box along the drainage frame, and the air becomes cold air after passing through the multiple cold guide plates.

Description

Technical Field

[0001] This utility model relates to the field of computer room equipment technology, and in particular to a high-efficiency heat dissipation device for computer rooms. Background Technology

[0002] With the development of intelligent buildings, a series of computer equipment such as communication and monitoring systems have been integrated into computer rooms, increasing the density of equipment and the heat generation. However, the development of server integration technology has led to the widespread adoption of rack servers and blade servers in computer rooms. In comparison, the original desktop computers and tower servers each occupied a large space and had relatively low heat generation per unit volume. Nowadays, computer rooms are all equipped with rack servers or blade servers. In extreme cases, the heat generated by a single rack can reach 8,000-20,000W. High-temperature environments are not conducive to the long-term use of computer equipment and can easily damage the equipment itself. In an overly dry environment, a short circuit in the equipment can easily cause a fire.

[0003] Publication No.: CN211650626U, a high-efficiency intelligent heat dissipation device for building computer rooms, including a room body, a cooling device on one side of the room body, multiple fixed pipes rotatably connected to the top of the room body, a second spray plate fixed to the lower end of the fixed pipes, first spray plates rotatably connected to both sides of the second spray plate, and two electric telescopic rods rotatably connected to one side of the second spray plate. This utility model can adjust the angle of the spray plates according to the situation, thereby efficiently cooling the equipment placed in the cabinet, ensuring it is at its normal operating temperature, and effectively filtering the gas, thus ensuring the air quality in the computer room, which is beneficial to the normal operation of computer equipment and facilitates maintenance personnel in the computer room. However, in actual operation, the following problems may arise:

[0004] 1. This patent uses water flow to exchange heat with air, making the air full of cool air. However, this method of heat dissipation will increase the moisture in the air. Excessive humid air will cause water droplets to condense on the server surface, which can easily lead to short circuits on the server circuit board due to water, or even mold growing inside the server.

[0005] 2. Since the servers are neatly arranged in the server room, the air outlet of this patented heat sink can only dissipate heat to the servers within the range of the air outlet. Moreover, since the heat points of the servers are inside, the cool air cannot be blown into the servers, resulting in poor heat dissipation. Utility Model Content

[0006] In order to overcome the defects of the prior art mentioned above, the inventors conducted in-depth research and, after a great deal of creative work, completed this utility model.

[0007] Specifically, the technical problem to be solved by this utility model is to provide a high-efficiency heat dissipation device for computer rooms, so as to solve the technical problems that the air blown in by the radiators in the current computer room has a high moisture content, which can easily affect the servers in the computer room, and the radiators can only dissipate heat from the top of the server, while the heat dissipation effect at the bottom and inside of the server is poor.

[0008] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0009] A high-efficiency heat dissipation device for computer rooms includes a computer room, wherein a server is fixedly installed at the bottom of the computer room cavity, and a heat dissipation and dehumidification mechanism is fixedly installed on the inner surface of the computer room.

[0010] The heat dissipation and dehumidification mechanism includes a dehumidification component, which includes an air inlet pipe. A dehumidification box is fixedly installed on the outer surface of the air inlet pipe. A semiconductor refrigeration chip is fixedly installed on the inner surface of the dehumidification box. A cold conduction plate is fixedly installed on the outer surface of the semiconductor refrigeration chip.

[0011] As an improved technical solution, the dehumidification assembly also includes a flow guide frame, the top of which is connected to the bottom of the dehumidification box, and a storage box is fixedly installed at the bottom of the flow guide frame.

[0012] As an improved technical solution, the dehumidification component further includes a heat dissipation box, the right side of which is fixedly connected to the left side of the dehumidification box, and a heat-conducting plate is fixedly installed on the inner surface of the heat dissipation box. The inner surface of the heat-conducting plate is fixedly connected to the outer surface of the semiconductor cooling chip.

[0013] As an improved technical solution, the heat dissipation and dehumidification mechanism further includes a heat dissipation component, which includes a first connecting frame. The outer surface of the first connecting frame is fixedly connected to the inner surface of the dehumidification box. A first motor is fixedly installed on the inner surface of the first connecting frame. A first rotating shaft is fixedly installed at the output end of the first motor through a coupling. A first rotating blade is fixedly installed on the outer surface of the first rotating shaft.

[0014] As an improved technical solution, the heat dissipation assembly further includes a second connecting frame, the outer surface of which is fixedly connected to the inner surface of the heat dissipation box, a second motor is fixedly installed on the inner surface of the second connecting frame, a second rotating shaft is fixedly installed at the output end of the second motor through a coupling, and a second rotating blade is fixedly installed on the outer surface of the second rotating shaft.

[0015] As an improved technical solution, the heat dissipation and dehumidification mechanism further includes a cooling component, which includes a main connecting pipe rack. One end of the main connecting pipe rack is connected to the front of the dehumidification box, and the other end of the main connecting pipe rack passes through the machine room and extends into the interior of the machine room. The outer surface of the main connecting pipe rack is connected to a branch connecting pipe rack, and the bottom of the branch connecting pipe rack is connected to a cooling rack.

[0016] As an improved technical solution, the cooling component further includes a flow divider, the outer surface of which is fixedly connected to the inner surface of the cooling rack.

[0017] As an improved technical solution, the cooling component also includes an air outlet, which is formed on the outer surface of the cooling rack.

[0018] After adopting the above technical solution, the beneficial effects of this utility model are:

[0019] 1. This utility model incorporates a dehumidification design for the air in the computer room. This is achieved through the combined use of an air inlet duct and dehumidification box with a primary motor and a primary rotating shaft; the primary rotating shaft and primary rotating blades with a semiconductor cooling chip and a cold-conducting plate; and the cold-conducting plate and airflow guide with a storage box. This dehumidifies and cools the external air, allowing the servers in the computer room to dissipate heat and preventing high moisture content in the air from affecting server operation.

[0020] 2. This utility model improves the efficiency of heat dissipation for servers in the computer room by adding a design that enhances heat dissipation. Through the combined use of dehumidification box and main connecting pipe rack with branch connecting pipe rack and cooling rack, and the combined use of cooling rack and distribution rack with air outlet, each server in the computer room can be evenly cooled by the airflow, avoiding the problem that the airflow from the heat dissipation equipment can only blow to the top of the server and the bottom of the server has poor heat dissipation effect. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0022] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the high-efficiency heat dissipation device for computer rooms according to this utility model.

[0023] Figure 2 This is a partial three-dimensional cross-sectional view of the dehumidification component of the high-efficiency heat dissipation device for computer rooms according to this utility model.

[0024] Figure 3This is a three-dimensional partial cross-sectional view of the heat dissipation box of the high-efficiency heat dissipation device for computer rooms according to this utility model.

[0025] Figure 4 This is a partial three-dimensional cross-sectional view of the cooling component of the high-efficiency heat dissipation device for computer rooms according to this utility model.

[0026] Figure 5 This utility model relates to a high-efficiency heat dissipation device for computer rooms. Figure 1 A schematic diagram of the enlarged structure of A.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Computer room; 2. Server; 3. Heat dissipation and dehumidification mechanism; 31. Dehumidification component; 311. Air inlet duct; 312. Dehumidification box; 313. Semiconductor cooling chip; 314. Cold conduction plate; 315. Air diversion rack; 316. Storage box; 317. Heat dissipation box; 318. Heat conduction plate; 32. Heat dissipation component; 321. Connecting frame 1; 322. Motor 1; 323. Rotating shaft 1; 324. Rotating blade 1; 325. Connecting frame 2; 326. Motor 2; 327. Rotating shaft 2; 328. Rotating blade 2; 33. Cooling component; 331. Main connecting pipe rack; 332. Branch connecting pipe rack; 333. Cooling rack; 334. Flow divider; 335. Air outlet. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0031] Meanwhile, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three options. Taking "A and / or B" as an example, it includes option A, option B, or an option that satisfies both A and B.

[0032] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0033] like Figure 1 , Figure 2 and Figure 3 As shown in the figure, this embodiment provides a high-efficiency heat dissipation device for computer rooms. The high-efficiency heat dissipation device for computer rooms includes a computer room 1, a server 2 is fixedly installed at the bottom of the inner cavity of the computer room 1, and a heat dissipation and dehumidification mechanism 3 is fixedly installed on the inner surface of the computer room 1.

[0034] The heat dissipation and dehumidification mechanism 3 includes a dehumidification component 31, which includes an air inlet pipe 311. A dehumidification box 312 is fixedly installed on the outer surface of the air inlet pipe 311. A semiconductor cooling chip 313 is fixedly installed on the inner surface of the dehumidification box 312. A cold plate 314 is fixedly installed on the outer surface of the semiconductor cooling chip 313.

[0035] The thermoelectric cooler 313 is electrically connected to an external power supply and is controlled by an external PLC programming program.

[0036] like Figure 1 , Figure 2 and Figure 3 As shown, the dehumidification assembly 31 also includes a flow guide 315, the top of which is connected to the bottom of the dehumidification box 312, and a storage box 316 is fixedly installed at the bottom of the flow guide 315.

[0037] like Figure 1 , Figure 2 and Figure 3 As shown, the dehumidification assembly 31 also includes a heat sink 317. The right side of the heat sink 317 is fixedly connected to the left side of the dehumidification box 312. A heat-conducting plate 318 is fixedly installed on the inner surface of the heat sink 317. The inner surface of the heat-conducting plate 318 is fixedly connected to the outer surface of the semiconductor cooling chip 313.

[0038] like Figure 1 , Figure 2 and Figure 3As shown, the heat dissipation and dehumidification mechanism 3 also includes a heat dissipation component 32. The heat dissipation component 32 includes a first connecting frame 321. The outer surface of the first connecting frame 321 is fixedly connected to the inner surface of the dehumidification box 312. A first motor 322 is fixedly installed on the inner surface of the first connecting frame 321. A first rotating shaft 323 is fixedly installed at the output end of the first motor 322 through a coupling. A first rotating blade 324 is fixedly installed on the outer surface of the first rotating shaft 323.

[0039] Motor 322 is electrically connected to an external power source and is controlled by an external PLC programming program.

[0040] like Figure 1 , Figure 2 and Figure 3 As shown, the heat dissipation assembly 32 also includes a second connecting frame 325. The outer surface of the second connecting frame 325 is fixedly connected to the inner surface of the heat dissipation box 317. A second motor 326 is fixedly installed on the inner surface of the second connecting frame 325. A second rotating shaft 327 is fixedly installed on the output end of the second motor 326 through a coupling. A second rotating blade 328 is fixedly installed on the outer surface of the second rotating shaft 327.

[0041] Motor 326 is electrically connected to an external power source and is controlled by an external PLC programming program.

[0042] like Figure 1 , Figure 4 and Figure 5 As shown, the heat dissipation and dehumidification mechanism 3 also includes a cooling component 33. The cooling component 33 includes a main connecting pipe rack 331. One end of the main connecting pipe rack 331 is connected to the front of the dehumidification box 312. The other end of the main connecting pipe rack 331 passes through the machine room 1 and extends into the interior of the machine room 1. A branch connecting pipe rack 332 is connected to the outer surface of the main connecting pipe rack 331. A cooling rack 333 is connected to the bottom of the branch connecting pipe rack 332.

[0043] like Figure 1 , Figure 4 and Figure 5 As shown, the cooling assembly 33 also includes a flow divider 334, the outer surface of which is fixedly connected to the inner surface of the cooling rack 333.

[0044] like Figure 1 , Figure 4 and Figure 5 As shown, the cooling component 33 also includes an air outlet 335, which is formed on the outer surface of the cooling rack 333.

[0045] In use, the No. 1 motor 322 drives the No. 1 rotating shaft 323 to rotate, which in turn drives the No. 1 rotating blade 324 to rotate, blowing external air from the air inlet pipe 311 into the dehumidification box 312. After entering the dehumidification box 312, the air collides with the cooling plate 314, and the water molecules in the air are pre-cooled and condensed. Then, the air flows into the storage box 316 along the guide frame 315. After passing through multiple cooling plates 314, the air becomes cold air and then enters the main connecting pipe rack 331 and the cooling racks 333 of each branch connecting pipe rack 332. The split rack 334 divides the airflow into two airflows, so that the cooling energy is evenly sprayed out from the air outlet 335 of the cooling rack 333 to dissipate heat from the server 2 in the middle.

[0046] It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. Furthermore, it should be understood that after reading the technical description of this utility model, those skilled in the art can make various alterations, modifications, and / or variations to this utility model, and all such equivalent forms also fall within the scope of protection defined by the appended claims.

Claims

1. A high-efficiency heat dissipation device for a machine room, comprising a machine room (1), characterized in that: The bottom of the inner cavity of the machine room (1) is fixedly installed with a server (2), and the inner surface of the machine room (1) is fixedly installed with a heat dissipation and dehumidification mechanism (3); The heat dissipation and dehumidification mechanism (3) comprises a dehumidification assembly (31), the dehumidification assembly (31) comprises an air inlet pipe (311), the outer surface of the air inlet pipe (311) is fixedly installed with a dehumidification box (312), the inner surface of the dehumidification box (312) is fixedly installed with a semiconductor refrigeration sheet (313), and the outer surface of the semiconductor refrigeration sheet (313) is fixedly installed with a cold lead plate (314).

2. The high-efficiency heat dissipation device for a machine room according to claim 1, characterized in that: The dehumidification assembly (31) further comprises a drainage frame (315), the top of the drainage frame (315) is communicated with the bottom of the dehumidification box (312), and the bottom of the drainage frame (315) is fixedly installed with a storage box (316).

3. The high-efficiency heat dissipation device for a machine room according to claim 1, characterized by: The dehumidification assembly (31) further comprises a heat dissipation box (317), the right side of the heat dissipation box (317) is fixedly connected with the left side of the dehumidification box (312), the inner surface of the heat dissipation box (317) is fixedly installed with a heat conduction plate (318), and the inner surface of the heat conduction plate (318) is fixedly connected with the outer surface of the semiconductor refrigeration sheet (313).

4. The high-efficiency heat dissipation device for a machine room according to claim 1, characterized by: The heat dissipation and dehumidification mechanism (3) further comprises a heat dissipation assembly (32), the heat dissipation assembly (32) comprises a first connecting frame (321), the outer surface of the first connecting frame (321) is fixedly connected with the inner surface of the dehumidification box (312), the inner surface of the first connecting frame (321) is fixedly installed with a first motor (322), the output end of the first motor (322) is fixedly installed with a first rotating shaft (323) through a shaft coupling, and the outer surface of the first rotating shaft (323) is fixedly installed with a first rotating blade (324).

5. The high-efficiency heat dissipation device for a machine room according to claim 4, characterized in that: The heat dissipation assembly (32) further comprises a second connecting frame (325), the outer surface of the second connecting frame (325) is fixedly connected with the inner surface of the heat dissipation box (317), the inner surface of the second connecting frame (325) is fixedly installed with a second motor (326), the output end of the second motor (326) is fixedly installed with a second rotating shaft (327) through a shaft coupling, and the outer surface of the second rotating shaft (327) is fixedly installed with a second rotating blade (328).

6. The high-efficiency heat dissipating device for a machine room according to claim 1, characterized by: The heat dissipation and dehumidification mechanism (3) further comprises a cooling assembly (33), the cooling assembly (33) comprises a main communication pipe frame (331), one end of the main communication pipe frame (331) is communicated with the front surface of the dehumidification box (312), the other end of the main communication pipe frame (331) penetrates through the machine room (1) and extends into the machine room (1), the outer surface of the main communication pipe frame (331) is communicated with a branch communication pipe frame (332), and the bottom of the branch communication pipe frame (332) is communicated with a cooling frame (333).

7. The high-efficiency heat dissipation device for a machine room according to claim 6, characterized in that: The cooling assembly (33) further comprises a flow distribution frame (334), and the outer surface of the flow distribution frame (334) is fixedly connected with the inner surface of the cooling frame (333).

8. The high-efficiency heat dissipation device for a machine room according to claim 6, characterized in that: The cooling assembly (33) further comprises an air outlet hole (335) formed in the outer surface of the cooling frame (333).

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