White light LED module

Abstract

The utility model relates to the technical field of LEDs, in particular to a white light LED module which comprises an LED wafer, the LED wafer is fixed on a substrate, a first light-transmitting packaging layer is arranged on the substrate and wraps the LED wafer, a second light-transmitting packaging layer is arranged outside the first light-transmitting packaging layer, the color of the second light-transmitting packaging layer is different from the light-emitting color of the LED wafer, and the first light-transmitting packaging layer and the second light-transmitting packaging layer are arranged on the substrate. The second light-transmitting packaging layer is located on the outer wall of the first light-transmitting packaging layer and arranged in an equal-thickness mode, the equal-thickness design of the second light-transmitting packaging layer avoids light refraction and scattering differences caused by uneven thickness, the consistency of light propagation in all directions is ensured, the stable light emitting effect can be maintained, and the light emitting efficiency is improved. And the utilization rate of light is improved to a certain extent, so that the module can still keep good optical performance in a long-term use process.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to a white LED module. Background Technology

[0002] Miniature white chip LEDs are widely used in various applications due to their small size and low power consumption. Currently, most miniature white chip LEDs adopt a single-layer molded packaging structure, in which phosphor is uniformly dispersed and mixed into the encapsulating colloid.

[0003] However, due to the influence of LED chip packaging structure and phosphor distribution characteristics, the emitted color of LED chips varies significantly depending on their orientation. When an LED chip is operating, the phosphor layer on top of the chip is relatively thin, resulting in a lower conversion rate of blue light as it penetrates the phosphor layer. A large amount of blue light is directly transmitted, causing the light emitted from directly above the chip to have a bluish tint. Conversely, the phosphor layer on the sides of the chip is thicker, and blue light interacts with the phosphor during propagation, being converted into yellow light, thus causing the light emitted from the sides to have a yellowish tint.

[0004] This unevenness in the emitted color causes significant color shifts in LEDs during lighting scenarios, affecting the color reproduction of illuminated objects. In display scenarios, it leads to color distortion and unnatural color transitions between adjacent pixels, greatly reducing the visual effect of lighting and display applications and making it difficult to meet the requirements of high-end application scenarios with high color consistency. Utility Model Content

[0005] The purpose of this utility model is to provide a white LED module that solves the problem of uneven light emission in LED modules mentioned above, thereby achieving consistency in the color of light emitted from different directions in the white LED module and ensuring the quality of the finished white LED module.

[0006] The technical solution adopted in this utility model is as follows:

[0007] A white LED module, comprising:

[0008] LED chips;

[0009] A substrate on which the LED chip is fixed;

[0010] A first light-transmitting encapsulation layer is disposed on the substrate and encapsulates the LED chip;

[0011] The second light-transmitting encapsulation layer is disposed outside the first light-transmitting encapsulation layer;

[0012] The color of the second light-transmitting encapsulation layer is different from the color of the LED chip's light emission;

[0013] The second light-transmitting encapsulation layer is located on the outer wall of the first light-transmitting encapsulation layer and has the same thickness.

[0014] This utility model also has the following technical features:

[0015] In one embodiment of the present invention, the first light-transmitting encapsulation layer is in the shape of a cuboid, the second light-transmitting encapsulation layer is in the shape of a rectangular box, and the second light-transmitting encapsulation layer is sleeved on the outside of the first light-transmitting encapsulation layer, with each wall of the second light-transmitting encapsulation layer arranged with equal thickness.

[0016] In one embodiment of this utility model, the first light-transmitting encapsulation layer is hemispherical, the second light-transmitting encapsulation layer is bowl-shaped, the bowl opening of the second light-transmitting encapsulation layer is attached to the outside of the first light-transmitting encapsulation layer, and the walls of the second light-transmitting encapsulation layer are arranged with equal thickness.

[0017] In one embodiment of the present invention, the substrate is generally rectangular, the LED chip is generally rectangular, and the LED chip is fixed at the geometric center of one side of the substrate.

[0018] In one embodiment of the present invention, the substrate is generally circular, the LED chip is generally cubic, and the LED chip is fixed at the center of one side of the substrate.

[0019] In one embodiment of this utility model, the first light-transmitting encapsulation layer covers all the walls of the LED chip with equal thickness.

[0020] In one embodiment of the present invention, a rectangular annular groove is provided on one side of the substrate, and the edge of the opening of the second light-transmitting encapsulation layer extends into the rectangular annular groove.

[0021] In one embodiment of the present invention, an annular groove is provided on one side of the substrate, and the bowl-shaped edge of the second light-transmitting encapsulation layer is engaged in the annular groove.

[0022] In one embodiment of the present invention, a rectangular groove is provided on one side of the substrate, the rectangular groove being located at the geometric center of one side of the substrate, and the LED chip is fixed in the rectangular groove.

[0023] In one embodiment of the present invention, a circular groove is formed at the center of one side of the substrate, and the LED chip is fixed in the circular groove.

[0024] Compared with existing technologies, the beneficial effects of this invention are as follows: Traditional single-layer molded LED chips exhibit color variations in different directions due to uneven phosphor distribution. This module, by setting first and second transparent encapsulation layers of different colors, optically modulates the light emitted from the LED chip twice with different characteristics. When light is emitted from the LED chip and passes through the first and second transparent encapsulation layers in sequence, the different colored encapsulation layers selectively absorb and scatter the light, compensating for the spectral differences caused by the chip structure and phosphor distribution. This significantly improves the consistency of the emitted light color. Furthermore, the uniform thickness design of the second transparent encapsulation layer avoids differences in light refraction and scattering caused by uneven thickness, ensuring consistent light propagation in all directions. This not only helps maintain a stable light output effect but also improves light utilization to a certain extent, enabling the module to maintain good optical performance during long-term use. Attached Figure Description

[0025] Figure 1 A front view of a prior art white LED module;

[0026] Figure 2 This is a front view of a white LED module in one embodiment of the present invention;

[0027] Figure 3 This is a front view of a white LED module in another embodiment of the present invention;

[0028] Figure 4 This is a front view of a white LED module in another embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of the structure of the white LED module after the first and second light-transmitting encapsulation layers are removed in one embodiment of the present invention;

[0030] Figure 6 This is a cross-sectional view of the substrate in another embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of the white LED module after the first and second light-transmitting encapsulation layers are removed in another embodiment of the present invention;

[0032] Figure 8 This is a schematic diagram of the substrate structure in another embodiment of the present invention;

[0033] Explanation of icon numbers:

[0034] 10. LED chips;

[0035] 20. Substrate; 21. Rectangular annular groove; 22. Annular groove; 23. Rectangular groove; 24. Circular groove;

[0036] 30. First light-transmitting encapsulation layer;

[0037] 40. Second transparent encapsulation layer. Detailed Implementation

[0038] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0039] The illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0040] See Figure 1 Taking the existing technology shown in the figure as an example, due to the influence of the LED chip packaging structure and phosphor distribution characteristics, the light emission color of the LED chip varies significantly in different directions. When the LED chip is working, the phosphor layer on top of the chip is relatively thin, and the conversion ratio of blue light during the process of penetrating the phosphor layer is low, resulting in a large amount of blue light being directly transmitted, causing the light emitted from directly above the chip to be bluish. Conversely, the phosphor layer on the side of the chip is thicker, and the blue light interacts with the phosphor during propagation and is converted into yellow light, resulting in the light emission color of the side-emitted light being yellowish. To address this, a white LED module is proposed, comprising: an LED chip 10; a substrate 20, wherein the LED chip 10 is fixed on the substrate 20; a first light-transmitting encapsulation layer 30, disposed on the substrate 20 and encapsulating the LED chip 10; and a second light-transmitting encapsulation layer 40, disposed outside the first light-transmitting encapsulation layer 30; the color of the second light-transmitting encapsulation layer 40 is different from the light emission color of the LED chip 10; wherein the second light-transmitting encapsulation layer 40 is disposed with the same thickness as the outer wall of the first light-transmitting encapsulation layer 30.

[0041] In one embodiment, the first light-transmitting encapsulation layer 30 is an encapsulation layer formed by mixing and curing epoxy resin and diffusion powder, and is itself transparent or translucent.

[0042] In one embodiment, see Figure 2 , Figure 3 and Figure 4The LED chip 10 is a blue LED, which emits blue light. The second light-transmitting encapsulation layer 40 is an encapsulation layer formed by curing epoxy resin and yellow phosphor. When the blue light emitted by the LED chip 10 passes through the first light-transmitting encapsulation layer 30 and the second light-transmitting encapsulation layer 40, the light appears white. The second light-transmitting encapsulation layer 40 is set with the same thickness as the outer wall of the first light-transmitting encapsulation layer 30, which avoids the difference in light refraction and scattering caused by uneven thickness, and ensures the consistency of light propagation in all directions. This not only helps to maintain a stable light output effect, but also improves the utilization rate of light to a certain extent.

[0043] In one embodiment, see Figure 2 and Figure 3 When this structure is applied in a cuboid LED module, the first light-transmitting encapsulation layer 30 is generally cuboid in shape, and the second light-transmitting encapsulation layer 40 is generally rectangular box in shape. The second light-transmitting encapsulation layer 40 is fitted over the first light-transmitting encapsulation layer 30, and all walls of the second light-transmitting encapsulation layer 40 are arranged with equal thickness. Figure 2 In the second light-transmitting encapsulation layer 40, the thicknesses h1 and h2 of each surface are equal.

[0044] In one embodiment, after the LED chip 10 is electrically connected to the conductor via gold wire, the first layer is encapsulated by using a colloid of transparent epoxy resin and diffusion powder to cure and form a first light-transmitting encapsulation layer 30. Then, a second encapsulation is performed by using a colloid of epoxy resin and yellow phosphor to cure and form a second light-transmitting encapsulation layer 40.

[0045] In another embodiment, see Figure 4 When this structure is applied in a dot-shaped LED module, the first light-transmitting encapsulation layer 30 is hemispherical, the second light-transmitting encapsulation layer 40 is bowl-shaped, the bowl opening of the second light-transmitting encapsulation layer 40 is attached to the outside of the first light-transmitting encapsulation layer 30, and the walls of the second light-transmitting encapsulation layer 40 are arranged with equal thickness.

[0046] In one embodiment, see Figure 3 To ensure the uniformity of light emission on all sides of the rectangular LED module, the substrate 20 is in the shape of a rectangular strip, the LED chip 10 is in the shape of a rectangular strip, and the LED chip 10 is fixed at the geometric center of one side of the substrate 20.

[0047] See Figure 3The substrate 20 and the LED chip 10 can be a cuboid structure with consistent length, width and height ratios. When the LED chip 10 is fixed at the center of one side of the substrate 20, the light emitted by the LED chip 10 passes through the first light-transmitting encapsulation layer 30 and the second light-transmitting encapsulation layer 40. The distance that the light emitted by the LED chip 10 penetrates through the outer encapsulation layer remains consistent. This mechanism can eliminate the differences in light refraction and scattering to the greatest extent, ensuring the consistency of light propagation in all directions, which not only helps to maintain a stable light output effect.

[0048] In one embodiment, the first light-transmitting encapsulation layer 30 encapsulates each wall of the LED chip 10 with equal thickness.

[0049] In the above embodiments, the first light-transmitting encapsulation layer 30 is generally rectangular box-shaped. After the first light-transmitting encapsulation layer 30 is encapsulated outside the substrate 20 and the LED chip 10, Figure 3 In the first light-transmitting encapsulation layer 30, the wall thicknesses s1 and s2 of each surface are equal, and the wall thicknesses h1 and h2 of each surface of the second light-transmitting encapsulation layer 40 are equal. The first light-transmitting encapsulation layer 30 and the second light-transmitting encapsulation layer 40 are arranged with equal wall thicknesses, thereby eliminating the differences in light refraction and scattering to the greatest extent and ensuring the consistency of light propagation in all directions.

[0050] In one embodiment, see Figure 6 A rectangular annular groove 21 is provided on one side of the substrate 20, and the edge of the opening of the second light-transmitting encapsulation layer 40 extends into the rectangular annular groove 21.

[0051] The rectangular annular groove 21 is formed around the periphery of the LED chip 10 and can be used to accommodate the opening of the second light-transmitting encapsulation layer 40.

[0052] In another embodiment, see Figure 7 and Figure 8 When applied to a dot-shaped LED module, in order to ensure the light-emitting effect of the dot-shaped LED module, the substrate 20 is generally circular, the LED chip 10 is generally cubic, and the LED chip 10 is fixed at the center position of one side of the substrate 20.

[0053] In one embodiment, see Figure 7 The LED chip 10 is disposed at the center of one side of the substrate 20. After the first light-transmitting encapsulation layer 30 and the second light-transmitting encapsulation layer 40 are encapsulated on the outside of the substrate 20, the blue light emitted by the LED chip 10 passes through the first light-transmitting encapsulation layer 30 and the second light-transmitting encapsulation layer 40, which can eliminate the differences in light refraction and scattering to the greatest extent and ensure the consistency of light propagation in all directions.

[0054] In one embodiment, see Figure 8An annular groove 22 is provided on one side of the substrate 20, and the bowl-shaped edge of the second light-transmitting encapsulation layer 40 is fitted into the annular groove 22.

[0055] In one embodiment, see Figure 6 To fix the LED chip 10, a rectangular groove 23 is provided on one side of the substrate 20. The rectangular groove 23 is located at the geometric center of one side of the substrate 20, and the LED chip 10 is fixed in the rectangular groove 23.

[0056] In one embodiment, a cuboid LED chip 10 can be fixed in a rectangular groove 23 by using charged silver paste.

[0057] In another embodiment, see Figure 8 In order to fix the cube-shaped LED chip 10, a circular groove 24 is provided at the center of one side of the substrate 20, and the LED chip 10 is fixed in the circular groove 24.

[0058] In one embodiment, a cubic LED chip 10 can be fixed in a circular groove 24 using charged silver paste.

[0059] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0060] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A white LED module, characterized by The application relates to an LED wafer (10), a substrate (20) on which the LED wafer (10) is fixed, a first light-transmitting encapsulating layer (30) arranged on the substrate (20) and wrapping the LED wafer (10), and a second light-transmitting encapsulating layer (40) arranged outside the first light-transmitting encapsulating layer (30). The color of the second light-transmitting encapsulating layer (40) is different from the light-emitting color of the LED wafer (10). The first light-transmitting encapsulating layer (30) is in the shape of a cuboid, the second light-transmitting encapsulating layer (40) is in the shape of a rectangular box, and the second light-transmitting encapsulating layer (40) is arranged outside the first light-transmitting encapsulating layer (30) and is in the shape of a rectangular box. The first light-transmitting encapsulating layer (30) is in the shape of a hemisphere, the second light-transmitting encapsulating layer (40) is in the shape of a bowl, the bowl opening of the second light-transmitting encapsulating layer (40) is arranged outside the first light-transmitting encapsulating layer (30), and the wall of the second light-transmitting encapsulating layer (40) is in the shape of a bowl. The substrate (20) is in the shape of a rectangular strip, the LED wafer (10) is in the shape of a rectangular strip, and the LED wafer (10) is fixed at the geometric center of one side of the substrate (20). The substrate (20) is in the shape of a circular plate, the LED wafer (10) is in the shape of a square, and the LED wafer (10) is fixed at the center of one side of the substrate (20). The first light-transmitting encapsulating layer (30) wraps the LED wafer (10) and is in the shape of a rectangular box.

2. The white LED module according to claim 1, characterized in that: One side of the substrate (20) is provided with a rectangular ring groove (21), and the box opening edge of the second light-transmitting encapsulating layer (40) extends into the rectangular ring groove (21).

3. The white LED module of claim 1, wherein: One side of the substrate (20) is provided with a ring groove (22), and the bowl opening edge of the second light-transmitting encapsulating layer (40) is clamped in the ring groove (22).

4. The white LED module of claim 2, wherein: One side of the substrate (20) is provided with a rectangular groove (23) arranged at the geometric center of one side of the substrate (20), and the LED wafer (10) is fixed in the rectangular groove (23).

5. The white LED module of claim 3, wherein: One side of the substrate (20) is provided with a circular groove (24) arranged at the center of one side of the substrate (20), and the LED wafer (10) is fixed in the circular groove (24).

6. The white LED module of claim 4, wherein: ​ 7. The white LED module of claim 6, wherein: ​ 8. The white LED module of claim 5, wherein: ​ 9. The white LED module of claim 7, wherein: ​ 10. The white LED module of claim 8, wherein: ​

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