Lamp bead structure
By combining a large-size reflector cup with a diffuser, the problem of uneven light from the LED beads is solved, achieving uniform light emission from the top and bottom of the LED beads, improving light utilization and luminous efficiency, and enhancing the stability and lifespan of the LED beads.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2026-03-31
AI Technical Summary
In traditional LED structures, light is concentrated in the top epoxy resin layer for diffusion, resulting in uneven light distribution and an inability to provide uniform lighting effects. This is particularly problematic in places requiring large-area uniform lighting, such as shopping malls and showrooms, as it negatively impacts product display and visual experience.
The design employs a combination of a large-sized reflector cup, an epoxy resin layer with a diffusing agent, and a positive electrode support. The reflector cup reflects light, and the diffusing agent scatters light. Combined with the auxiliary electrode of the positive electrode plate, this improves the current distribution and forms a combination of two different light effects, ensuring uniform light distribution.
This achieves uniform light emission from the top and bottom of the LED beads, improves light utilization and luminous efficiency, extends the lifespan of the LED beads, and enhances their stability and current distribution.
Smart Images
Figure CN224069056U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of LED bead technology, and specifically relates to an LED bead structure. Background Technology
[0002] In the field of lighting technology, LED chips, as important light-emitting elements, play a crucial role in the lighting effect due to their luminous performance and light distribution. With the increasing demands for lighting quality, improving the luminous efficiency of LED chips, enhancing light uniformity, and achieving multi-area light emission have become research hotspots.
[0003] Traditional LED chip structures typically employ simple encapsulation methods, with the light-emitting chip directly encapsulated in a gel. This lack of effective control over light propagation and distribution results in poor lighting performance. While some LED chips utilize lenses for encapsulation, the optical design of these lenses is often inadequate, hindering uniform light diffusion and efficient propagation. In some existing LED chip designs, an epoxy resin layer is placed on top of the lens to achieve light diffusion. However, since light can only diffuse through this top epoxy resin layer, the light emitted by the chip tends to form a concentrated beam during propagation. This results in a brighter central area and a dimmer peripheral area, creating noticeable bright spots and dark zones, failing to provide uniform lighting. In locations requiring large-area uniform lighting, such as shopping malls and showrooms, this uneven lighting problem negatively impacts product display and the visual experience.
[0004] In view of this, we propose a lamp bead structure that enables the lamp bead to emit light in two locations to solve the above problems. Utility Model Content
[0005] The present invention aims to solve the technical problem in the prior art where most of the light is concentrated in the top epoxy resin layer A for diffusion, making it impossible to fully utilize the light emitted by the light-emitting chip.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a lamp bead structure, comprising an epoxy resin lens, a light-emitting chip, a positive electrode bracket, and a negative electrode bracket;
[0007] The top layer of the epoxy resin lens is an epoxy resin layer A with a diffusing agent, and the middle layer is a conventional epoxy resin layer B.
[0008] The light-emitting chip is fixed inside the reflector cup of the negative electrode bracket. The bottom edge of the reflector cup is provided with a secondary reflection step, and the reflector cup adopts a lamp cup structure with the largest size.
[0009] The light-emitting chip includes, from top to bottom, a positive gallium nitride semiconductor, a light-emitting layer, a negative gallium nitride semiconductor, and a negative electrode plate. The positive electrode plate is located on the top side of the positive gallium nitride semiconductor. The negative electrode plate is bonded to the bottom of the reflector cup of the negative electrode support by conductive silver paste. The positive electrode plate is connected to the positive electrode support by a metal wire to form a complete circuit.
[0010] Preferably, the light-emitting chip, the positive electrode holder, and the negative electrode holder are encapsulated using an epoxy resin lens.
[0011] Preferably, the secondary reflection step of the reflector cup has a height of 0.2mm±0.05mm and a width of 0.15mm±0.03mm; the surface of the secondary reflection step is coated with a nano-scale titanium dioxide reflective film with a thickness of 50nm±10nm and a reflectivity of ≥98%.
[0012] Preferably, the bottom edge of the positive electrode plate is provided with an auxiliary electrode located outside the light-emitting layer region of the light-emitting chip.
[0013] Preferably, the sidewall of the reflector cup has an inclination angle of 45°±2°, and the bottom of the cup is mirror-polished with a roughness Ra≤0.1μm.
[0014] As a preferred option, the epoxy resin lens is formed by a double injection molding process. First, the high light transmittance window in the center is injection molded, and then the epoxy resin layer A containing a diffusing agent is injection molded at 120℃±5℃.
[0015] Preferably, the negative electrode holder is located on the side with a notch on the bottom colloid portion of the epoxy resin lens, the positive electrode holder is connected to a positive electrode pin that penetrates the colloid portion, and the negative electrode holder is connected to a negative electrode pin that penetrates the colloid portion.
[0016] Preferably, the metal wire is gold or copper.
[0017] Compared with the prior art, the technical effects and advantages of this utility model are:
[0018] 1. In this LED chip structure, the light emitted by the light-emitting chip is first reflected by a reflector cup into the middle conventional epoxy resin layer B. Within the conventional epoxy resin layer B, the light propagates along a relatively regular path, similar to the light propagation method of a conventional lamp, thus forming the lower segment of light with a special effect. When the light propagates to the top epoxy resin layer A with a diffusing agent, the diffusing agent scatters the light. The scattered light is evenly distributed within the epoxy resin layer A with the diffusing agent, emitting in all directions, thus exhibiting a uniform light emission and diffusion effect, forming the upper segment of light with a special effect. This combination of dividing the light into two segments with different light emission effects combines the light emission characteristics of a conventional lamp with the soft light effect of uniform diffusion, creating a unique special effect that allows the LED chip to emit light from two different locations.
[0019] 2. The side wall angle, mirror polishing, and secondary reflection step design of the reflector cup effectively reflect the light emitted by the light-emitting chip to the light-emitting direction, reducing light loss, improving light utilization, and thus improving the overall luminous efficiency of the LED.
[0020] 3. Epoxy resin lenses possess excellent insulation, corrosion resistance, and mechanical properties, effectively protecting the LED chip, positive electrode holder, and negative electrode holder from external environmental influences and extending the lifespan of the LED. The negative electrode holder is located on the notched side of the bottom gel portion of the epoxy resin lens. The positive and negative electrode holders are respectively connected to pins that penetrate the gel portion. This layout ensures the stability of the LED structure and facilitates the connection between the LED and external circuitry.
[0021] 4. The auxiliary electrode at the bottom edge of the positive electrode plate of the light-emitting chip can improve the current distribution in the light-emitting layer, making the current flow through the light-emitting layer more evenly, thereby improving the luminous efficiency and stability of the light-emitting layer. Attached Figure Description
[0022] Figure 1 This is a three-dimensional perspective view of the present invention;
[0023] Figure 2 This is a main sectional view of the present invention;
[0024] Figure 3 This is a schematic diagram of the structure of the light-emitting chip of this utility model.
[0025] In the diagram: 1. Epoxy resin lens; 2. Light-emitting chip; 21. Positive electrode gallium nitride semiconductor; 22. Light-emitting layer; 23. Negative electrode gallium nitride semiconductor; 24. Negative electrode plate; 25. Positive electrode plate; 26. Auxiliary electrode; 3. Positive electrode support; 4. Negative electrode support; 5. Epoxy resin layer A; 7. Epoxy resin layer B; 8. Reflector cup; 9. Metal wire; 10. Colloidal part; 11. Notch; 12. Positive electrode pin; 13. Negative electrode pin; 14. Secondary reflection step. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] The following combination Figures 1 to 3 This application will be described in further detail.
[0028] This application discloses a lamp bead structure, including an epoxy resin lens 1, a light-emitting chip 2, a positive electrode bracket 3, and a negative electrode bracket 4. The light-emitting chip 2, the positive electrode bracket 3, and the negative electrode bracket 4 are encapsulated by the epoxy resin lens 1. The negative electrode bracket 4 is located on the side of the bottom colloid portion 10 of the epoxy resin lens 1 with a notch 11. The positive electrode bracket 3 is connected to a positive electrode pin 12 that penetrates the colloid portion 10, and the negative electrode bracket 4 is connected to a negative electrode pin 13 that penetrates the colloid portion 10.
[0029] The epoxy resin lens 1 possesses excellent insulation, corrosion resistance, and mechanical properties, effectively protecting the light-emitting chip 2, positive electrode bracket 3, and negative electrode bracket 4 from external environmental influences such as dust, moisture, and chemicals, thus extending the lifespan of the LED. The pins passing through the adhesive portion 10 facilitate electrical connection between the LED and external circuitry, ensuring normal operation. The rational bracket layout and encapsulation method guarantee the stability of the LED structure, making it less prone to damage during installation and use.
[0030] The top layer of the epoxy resin lens 1 is an epoxy resin layer A5 with a diffusing agent, and the middle layer is a conventional epoxy resin layer B7.
[0031] The light-emitting chip 2 is fixed inside the reflector cup 8 of the negative electrode bracket 4. The bottom edge of the reflector cup 8 is provided with a secondary reflection step 14, and the reflector cup 8 adopts a lamp cup structure with the largest size.
[0032] The synergistic effect of the large-size reflector cup 8, the conventional epoxy resin layer B7, and the epoxy resin layer A5 with a diffusing agent, along with the large-size reflector cup 8 at the bottom, allows for the collection of more light emitted by the light-emitting chip 2. The large-size reflector cup 8 provides a larger surface area for receiving light, reflecting more light that might otherwise be scattered in other directions back to the light-emitting direction. This ensures that the LED has a similar luminous efficacy to conventional LEDs, i.e., sufficient light intensity output.
[0033] The top epoxy resin layer A5 with a diffusing agent diffuses the light reflected by the reflector cup 8 and propagated through the intermediate conventional epoxy resin layer B7. The diffusing agent scatters the light, preventing it from concentrating in one direction and dispersing it evenly in all directions. This diffusion effect makes the light emitted by the LED beads softer, avoiding the glare that can occur with conventional LEDs. Simultaneously, because the large reflector cup 8 provides ample light, the diffusion layer has more light to diffuse, resulting in a richer effect.
[0034] The large reflector cup 8 reflects the light to the middle conventional epoxy resin layer B7. The light propagates in the conventional epoxy resin layer B7 and reaches the epoxy resin layer A5 with a diffusing agent for diffusion. In this way, uniformly diffused light can be seen from the top of the lamp bead (at the epoxy resin layer A5 with the diffusing agent), while direct light emission similar to that of a conventional LED can be seen from the bottom of the lamp bead (the light emission position of the reflector cup 8). It is equivalent to the lamp bead emitting light from both the top and bottom, which improves the overall light emission effect.
[0035] The sidewall of the reflector cup 8 has an inclination angle of 45°±2°, and the bottom of the cup is mirror-polished with a roughness Ra≤0.1μm. A secondary reflection step 14 is provided on the edge of the bottom of the reflector cup 8; the height of the secondary reflection step 14 is 0.2mm±0.05mm, and the width is 0.15mm±0.03mm; the surface of the secondary reflection step 14 is coated with a nano-scale titanium dioxide reflective film with a thickness of 50nm±10nm and a reflectivity ≥98%.
[0036] The side wall of the reflector cup 8 is tilted at an angle of 45°±2°. This angle design can effectively reflect the light emitted by the light-emitting chip 2 to the light-emitting direction of the lamp bead, thereby improving the utilization rate and light-emitting efficiency of the light.
[0037] The bottom of the cup is mirror-polished with a roughness Ra≤0.1μm, which reduces diffuse reflection of light at the bottom of the cup, allowing more light to be reflected in the desired direction and further improving the utilization rate of light.
[0038] The bottom edge of the reflector cup 8 is provided with a secondary reflection step 14. The surface of the step is coated with a nano-scale titanium dioxide reflective film with a thickness of 50nm±10nm and a reflectivity of ≥98%. The secondary reflection step 14 can reflect the light emitted by the light-emitting chip 2 that propagates towards the bottom edge of the cup, guiding the light that might otherwise be lost to the light-emitting direction, thereby improving the overall luminous efficiency of the lamp bead.
[0039] The light-emitting chip 2 includes, from top to bottom, a positive gallium nitride semiconductor 21, a light-emitting layer 22, a negative gallium nitride semiconductor 23, and a negative electrode plate 24. A positive electrode plate 25 is located on one side of the top of the positive gallium nitride semiconductor 21. The negative electrode plate 24 is bonded to the bottom of the reflector cup 8 of the negative electrode support 4 using conductive silver paste. The positive electrode plate 25 is connected to the positive electrode support 3 via a metal wire 9, forming a complete circuit; the metal wire 9 can be gold or copper. An auxiliary electrode 26 is located on the bottom edge of the positive electrode plate 25, outside the region of the light-emitting layer 22 of the light-emitting chip 2.
[0040] The positive and negative gallium nitride semiconductors 21 and 23 of the light-emitting chip 2 are connected to the positive electrode plate 25 and negative electrode plate 24, respectively. They are connected to the positive and negative electrode support 4 via conductive silver paste and metal wires 9 to form a complete circuit, ensuring that current can pass through the light-emitting chip 2 normally, enabling it to emit light. Gold or copper wires have good conductivity, ensuring the stability of current transmission.
[0041] An auxiliary electrode 26 is provided at the bottom edge of the positive electrode plate 25, located outside the region of the light-emitting layer 22 of the light-emitting chip 2. The auxiliary electrode 26 can improve the current distribution, making the current flow more evenly through the light-emitting layer 22, thereby improving the light emission uniformity and efficiency of the light-emitting layer 22.
[0042] In this LED structure, the light emitted by the light-emitting chip 2 is first reflected by the reflector cup 8 and enters the middle conventional epoxy resin layer B7. Within the conventional epoxy resin layer B7, the light propagates along a relatively regular path, similar to the light propagation method of a conventional lamp, thus forming the lower segment of light with a special effect. When the light propagates to the top epoxy resin layer A5 with a diffusing agent, the diffusing agent scatters the light. The scattered light is evenly distributed within the epoxy resin layer A5 with the diffusing agent, emitting in all directions, thus exhibiting a uniform light emission and diffusion effect, forming the upper segment of light with a special effect. This combination of dividing the light into two segments with different light emission effects combines the light emission characteristics of a conventional lamp with the soft, uniformly diffused light effect, creating a unique and special light effect.
[0043] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A lamp bead structure comprising an epoxy lens (1), a light emitting chip (2), a positive electrode support (3) and a negative electrode support (4), characterized in that: the top layer of the epoxy lens (1) is an epoxy layer A (5) with a diffusing agent, and a conventional epoxy layer B (7) is used in the middle; the light emitting chip (2) is fixed in a reflecting cup (8) of the negative electrode support (4), the bottom edge of the reflecting cup (8) is provided with a secondary reflecting step (14), and the reflecting cup (8) adopts a lamp cup structure with an increased size; the light emitting chip (2) comprises, from top to bottom, a positive electrode gallium nitride semiconductor (21), a light emitting layer (22), a negative electrode gallium nitride semiconductor (23) and a negative electrode plate (24), the top side of the positive electrode gallium nitride semiconductor (21) is provided with a positive electrode plate (25), the negative electrode plate (24) is adhered to the bottom of the reflecting cup (8) of the negative electrode support (4) through conductive silver adhesive, and the positive electrode plate (25) is connected to the positive electrode support (3) through a metal wire (9) to form a complete circuit. The light emitting chip (2), the positive electrode support (3) and the negative electrode support (4) are packaged through the epoxy lens (1).
2. The lamp bead structure according to claim 1, wherein: The secondary reflecting step (14) of the reflecting cup (8) has a height of 0.2 mm±0.05 mm and a width of 0.15 mm±0.03 mm; the surface of the secondary reflecting step (14) is coated with a nano titanium dioxide reflecting film with a film thickness of 50 nm±10 nm and a reflectivity of ≥98%.
3. The lamp bead structure according to claim 1, wherein: The bottom edge of the positive electrode plate (25) is provided with an auxiliary electrode (26) located outside the light emitting layer (22) region of the light emitting chip (2).
4. The lamp bead structure of claim 1, wherein: The side wall of the reflecting cup (8) has an inclination angle of 45°±2°, the bottom is mirror-polished, and the roughness Ra is ≤0.1 μm.
5. The lamp bead structure according to claim 1, wherein: The negative electrode support (4) is located on one side of the bottom gel part (10) of the epoxy lens (1) with a notch (11), the positive electrode support (3) is connected with a positive electrode pin (12) penetrating through the gel part (10), and the negative electrode support (4) is connected with a negative electrode pin (13) penetrating through the gel part (10).
6. The lamp bead structure according to claim 1, wherein: The metal wire (9) is a gold wire or a copper wire.
7. The lamp bead structure according to claim 1, wherein: