Soldering tin reflow oven for electronic component production

Abstract

The utility model relates to the technical field of soldering tin reflow furnaces, in particular to a soldering tin reflow furnace for electronic component production. According to the technical scheme, the furnace comprises a furnace body, chain wheel rollers, chains, bases, a first motor and a second motor, the bases are symmetrically distributed in the furnace body, the chain wheel rollers distributed at equal intervals are rotationally installed at the upper ends of the bases, the outer walls of the chain wheel rollers are sleeved with the chains, and multiple sets of clamping blocks symmetrically distributed are arranged on the outer sides of the chains; a first motor is arranged on one side of the furnace body, the output end of the first motor is provided with a screw, outer wall threads of the screw are oppositely distributed, the outer wall threads of the screw are sleeved with nuts which are symmetrically distributed and connected with the base, and a second motor is arranged on one side of the furnace body, and the output end of the second motor is connected with the upper end of the chain wheel roller. According to the utility model, through the two groups of chain wheel rollers with adjustable spacing, the clamping and conveying of circuit boards with different specifications are adapted, the welding processing of the circuit boards with different specifications and electronic components is coped, and the use flexibility of the soldering reflow oven is improved.

Description

Technical Field

[0001] This utility model relates to the field of solder reflow oven technology, and in particular to a solder reflow oven for the production of electronic components. Background Technology

[0002] Solder reflow ovens are core equipment in the surface mount technology (SMT) process for electronic components. They are used to melt and solidify solder paste, enabling reliable soldering of components to circuit boards. The process is divided into a preheating zone (gradually increasing temperature to remove volatiles), a heating zone (precisely increasing temperature to the peak value to melt the solder paste), and a cooling zone (controlling cooling to form solder joints). The temperature profile is controlled in real time by sensors to regulate the temperature of each zone, ensuring the fluidity and wettability of the solder paste. Flux cleans the pads to prevent oxidation. Each step is closely integrated to achieve automated and efficient soldering, ensuring the strength of the solder joints and electrical connectivity.

[0003] Circuit boards are transported to the solder reflow oven via conveyor lines. However, most conveyor lines have a fixed width and spacing. When the width of the circuit board changes, a single type of solder reflow oven cannot easily adjust to accommodate different circuit board specifications. Therefore, we propose a solder reflow oven for electronic component manufacturing to solve these problems. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing a solder reflow oven for the production of electronic components.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a solder reflow oven for electronic component production, comprising an oven body, sprocket rollers, a chain, a base, a first motor, and a second motor. The oven body has symmetrically distributed bases inside. Equally spaced sprocket rollers are rotatably mounted on the upper end of the bases. A chain is sleeved on the outer wall of the sprocket rollers. Multiple sets of symmetrically distributed clamping blocks are arranged on the outer side of the chain. A first motor is located on one side of the oven body. The output end of the first motor has a screw with relatively distributed threads on its outer wall. Nuts, symmetrically distributed and connected to the base, are sleeved on the outer wall of the screw. A second motor is located on one side of the oven body, its output end connected to the upper end of the sprocket rollers. A guide rail, symmetrically distributed and slidably mounted to the base, is arranged on the inner wall of the lower end of the oven body.

[0006] Preferably, the outer wall of the chain is provided with a connecting rod located between the clamping blocks. Each connecting rod has a mounting base at both ends, and one end of each mounting base has a limiting block that fits onto the outer side of one end of the clamping block. The connecting rod connects to the mounting base to support one end of the clamping block.

[0007] Preferably, a mounting shaft is rotatably mounted on the inner wall of the mounting base, a connecting block is provided on the outer wall of the mounting shaft, and a torsion spring is sleeved on the outer side of the mounting shaft, with its two ends respectively connected to the connecting block and the mounting base. The clamping block receives rotational support through the mounting base. During rotation, the connecting block applies a compressive force to one end of the torsion ring, thereby providing torsional elastic support to the clamping block.

[0008] Preferably, the clamping block has a clamping area in the middle section and a guide surface at one end, which is shaped like the number eight. The inner wall of the clamping block in the clamping area is horizontal, which facilitates its fit against the outer wall of the circuit board, and the shaped guide surface facilitates the guidance of the circuit board.

[0009] Preferably, a guide roller is rotatably mounted on the inner wall of the guide surface. The circuit board enters the clamping area through the V-shaped guide surface and reaches the edge of the clamping area. The guide roller is in contact with the outer wall of the circuit board, reducing the resistance of the circuit board entering and exiting the clamping area.

[0010] Preferably, a second bevel gear is provided at the upper end of the sprocket roller, and two sets of angle plate-shaped bearing supports are rotatably sleeved on the outer wall of the sprocket roller. A first rotating shaft and a second rotating shaft are rotatably installed inside the bearings, and each of the first and second rotating shafts has a first bevel gear meshing with the second bevel gear at one end. When the first and second rotating shafts rotate, the first bevel gear drives the second bevel gear to rotate, thereby driving the sprocket roller to rotate.

[0011] Preferably, a rectangular groove is formed inside one end of the second rotating shaft, and a rectangular rod is provided at one end of the first rotating shaft, which is slidably installed in the rectangular groove. The first rotating shaft is slidably installed inside the rectangular groove through the rectangular rod. Through the rectangular structure, when the first rotating shaft rotates, it drives the second rotating shaft to rotate. At the same time, the first and second rotating shafts can slide laterally, which facilitates the effective transmission of the corresponding adaptive linkage structure that is adjusted according to the distance between the base and the shaft.

[0012] Preferably, one end of the furnace body is provided with symmetrically distributed bushings that are slidably installed on and rotatably supported by the outer walls of rotating shaft one and rotating shaft two. The bushings provide rotatable support for rotating shaft one and rotating shaft two, while rotating shaft one and rotating shaft two are slidably supported by the bushings.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. The outer walls of both chains of this utility model are provided with corresponding clamping blocks. The clamping blocks are supported by an elastic structure and are used to clamp the sides of the circuit board. The chains are transported by sprocket rollers, which drive the clamped circuit board to be processed inside the solder reflow oven. There are two sets of sprocket rollers, which are driven by the same motor through a linkage structure, so that the chains are transported synchronously. The spacing between the sprocket rollers is adjustable to adapt to the clamping and transport of circuit boards of different specifications. It can reliably solder the electronic components on the top of the circuit board and improve the flexibility of the solder reflow oven. Attached Figure Description

[0015] Figure 1 This is a front-view three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a top-view three-dimensional structural diagram of the furnace body of this utility model;

[0017] Figure 3 This is a top-view three-dimensional structural diagram of the screw of this utility model;

[0018] Figure 4 This is a schematic diagram of the three-dimensional structure of the first and second rotating shafts of this utility model in a main cross section.

[0019] Figure 5 This is a side view of the three-dimensional structure of the clamping block of this utility model;

[0020] Figure 6 For the present utility model Figure 5 Enlarged structural diagram of the mounting base.

[0021] Reference numerals in the attached drawings: 1. Furnace body; 2. Sprocket roller; 3. Chain; 4. Guide rail; 5. Base; 6. Motor 1; 7. Nut; 8. Clamping block; 9. Motor 2; 10. Shaft 1; 11. Shaft 2; 12. Bushing; 13. Rectangular rod; 14. Rectangular groove; 15. Bevel gear 1; 16. Bevel gear 2; 17. Bearing bracket; 18. Mounting seat; 19. Limiting block; 20. Clamping area; 21. Guide surface; 22. Connecting rod; 23. Guide roller; 24. Mounting shaft; 25. Connecting block; 26. Torsion spring; 27. Screw. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figures 1-6As shown, the present invention proposes a solder reflow oven for electronic component production, comprising an oven body 1, a sprocket roller 2, a chain 3, a base 5, a first motor 6, and a second motor 9. The oven body 1 is provided with symmetrically distributed bases 5. The upper end of the base 5 is rotatably mounted with equidistantly distributed sprocket rollers 2. The outer wall of the sprocket roller 2 is sleeved with a chain 3. Multiple sets of symmetrically distributed clamping blocks 8 are provided on the outer side of the chain 3. The first motor 6 is provided on one side of the oven body 1. The output end of the first motor 6 is provided with screws 27 with relatively distributed threads on the outer wall. The screws 27 are symmetrically distributed with nuts 7 connected to the base 5. The output end of the second motor 9 is provided on one side of the oven body 1 and connected to the upper end of the sprocket roller 2. The lower inner wall of the oven body 1 is provided with guide rails 4 that are symmetrically distributed and slidably installed with the base 5.

[0024] The outer wall of the chain 3 is provided with a connecting rod 22 located between the clamping blocks 8. Each foot of the connecting rod 22 is provided with a mounting seat 18. One end of the mounting seat 18 is provided with a limiting block 19 that is sleeved on the outside of one end of the clamping block 8.

[0025] A mounting shaft 24 is rotatably mounted on the inner wall of the mounting base 18. A connecting block 25 is provided on the outer wall of the mounting shaft 24. A torsion spring 26 is sleeved on the outer side of the mounting shaft 24, with its two ends connected to the connecting block 25 and the mounting base 18 respectively.

[0026] The clamping block 8 has a clamping area 20 in the middle section and a flow guide surface 21 at one end of the clamping block 8. The flow guide surface 21 is in the shape of the number eight.

[0027] A guide roller 23 is rotatably mounted on the inner wall of the guide surface 21;

[0028] The upper end of the sprocket roller 2 is provided with a bevel gear 16. The outer wall of the sprocket roller 2 is rotatably sleeved with two sets of angle plate-shaped bearing brackets 17. The bearings are respectively rotatably installed with a rotating shaft 10 and a rotating shaft 11. One end of the rotating shaft 10 and the rotating shaft 11 is provided with a bevel gear 15 that meshes with the bevel gear 16.

[0029] A rectangular groove 14 is provided inside one end of the second rotating shaft 11, and a rectangular rod 13 is provided at one end of the first rotating shaft 10, which is slidably installed with the rectangular groove 14.

[0030] One end of the furnace body 1 is provided with symmetrically distributed bushings 12 that are slidably installed on and rotatably supported by the outer walls of rotating shaft 10 and rotating shaft 21;

[0031] Based on the implementation steps of Embodiment 1: When the equipment is started, firstly, adjust the spacing of the sprocket roller 2 according to the circuit board specifications, drive motor 6 to drive screw 27 to rotate, and through the relative thread structure, make the two sets of nuts 7 move synchronously in opposite directions or relative to each other, driving the base 5 and sprocket roller 2 to slide along the guide rail 4. At the same time, the rotating shaft 10 and the rotating shaft slide to the preset spacing through the bushing 12, placing the circuit board from one end opening of the furnace body 1 between the chains 3, clamped by the clamping area 20 of the chain 3, and the guide roller 23 of the guide surface 21 contacts the edge of the circuit board, through the figure-eight shape The guide causes the circuit board to slide automatically into the clamping area 20. At this time, the clamping block 8 elastically clamps the two sides of the circuit board under the action of the torsion spring 26. The motor 9 is started, and the sprocket roller 2 is driven to rotate through the transmission system of bevel gear 15 and bevel gear 16. The chain 3 drives the clamped circuit board to pass through the preheating zone, heating zone and cooling zone in sequence. In the heating zone, the sensor monitors the temperature curve in real time and controls the heating power of each zone through the PID algorithm to ensure that the solder paste melts accurately at 217-227℃. In the cooling zone, the cooling rate is controlled by the air cooling system to form reliable solder joints.

[0032] The clamping block 8 forms an elastic support system with the mounting shaft 24 via the torsion spring 26. The clamping force is automatically adjusted according to the thickness of the circuit board. The width of the clamping area 20 can cover a range of 2-15mm, solving the problem that traditional fixing fixtures cannot adapt to circuit boards of various specifications. The rotating shaft 10 and the rotating shaft 21 achieve synchronous transmission through the structure of the rectangular rod 13 and the rectangular groove 14. With the sliding support of the bushing 12, the distance between the sprocket rollers 2 can be steplessly adjusted within the range of 150-350mm to adapt to changes in the width of the PCB board. The bevel gear transmission system evenly distributes the power of the motor 29 to the two sets of sprocket rollers 2, avoiding synchronization errors of the chain 3 and preventing the circuit board from shifting during transport.

[0033] A single device can handle circuit boards of different specifications, solving the problem of frequent clamp replacement required by traditional equipment. Through elastic clamping and adjustable spacing design, it overcomes the problem of circuit board misalignment caused by poor synchronization of chain drive 3. It adopts a bevel gear drive and a rectangular rod 13 synchronization structure to ensure conveying accuracy. The spacing of sprocket roller 2 is adjustable, improving the flexibility of use. It is suitable for high-precision welding scenarios of circuit boards and electronic components such as 5G communication modules and automotive electronics.

[0034] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An electronic component production soldering reflow furnace comprising a furnace body (1), a sprocket roller (2), a chain (3), a base (5), a motor I (6) and a motor II (9), characterized in that: The inside of the furnace body (1) is provided with symmetrically distributed bases (5), the upper ends of the bases (5) are rotatably installed with equidistantly distributed chain wheel cylinders (2), the outer walls of the chain wheel cylinders (2) are sleeved with chains (3), the outer sides of the chains (3) are provided with a plurality of groups of symmetrically distributed clamping blocks (8), one side of the furnace body (1) is provided with a motor one (6), the output end of the motor one (6) is provided with screw rods (27) with oppositely distributed threads on the outer walls, the screw rods (27) are sleeved with symmetrically distributed nuts (7) connected with the bases (5), one side of the furnace body (1) is provided with a motor two (9) with an output end connected with the upper end of the chain wheel cylinder (2), and the lower end inner wall of the furnace body (1) is provided with symmetrically distributed guide rails (4) slidably installed with the bases (5).

2. The electronic component solder reflow furnace according to claim 1, wherein: The outer wall of the chain (3) is provided with a connecting rod (22) between the clamping blocks (8), the connecting rod (22) is provided with a mounting seat (18) at both feet, and one end of the mounting seat (18) is provided with a limiting block (19) sleeved on the outer side of one end of the clamping block (8).

3. The electronic component solder reflow furnace according to claim 2, wherein: The inner wall of the mounting seat (18) is rotatably installed with a mounting shaft (24), the outer wall of the mounting shaft (24) is provided with a connecting block (25), and the outer side of the mounting shaft (24) is sleeved with a torsional spring (26) connected with the connecting block (25) and the mounting seat (18) at both ends.

4. The electronic component solder reflow furnace according to claim 1, wherein: The middle section of the clamping block (8) is provided with a clamping area (20), one end of the clamping block (8) is provided with a flow guide surface (21), and the flow guide surface (21) is in the shape of an eight-character.

5. The electronic component solder reflow furnace according to claim 4, wherein: The inner wall of the flow guide surface (21) is rotatably installed with a guide roller (23).

6. The electronic component solder reflow furnace according to claim 1, wherein: The upper end of the chain wheel cylinder (2) is provided with a bevel gear two (16), the outer wall of the chain wheel cylinder (2) is rotatably sleeved with two groups of angle plate-shaped bearing supports (17), the inner portions of the bearings are rotatably installed with a rotating shaft one (10) and a rotating shaft two (11) respectively, and one end of the rotating shaft one (10) and the rotating shaft two (11) is provided with a bevel gear one (15) engaged with the bevel gear two (16).

7. The electronic component solder reflow furnace according to claim 6, wherein: The one end of the rotating shaft two (11) is internally provided with a rectangular groove (14), and the one end of the rotating shaft one (10) is provided with a rectangular rod (13) slidably installed in the rectangular groove (14).

8. The electronic component solder reflow furnace according to claim 1, wherein: One end of the furnace body (1) is provided with symmetrically distributed shaft sleeves (12) slidably installed and rotatably supported on the outer walls of the rotating shaft one (10) and the rotating shaft two (11).

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