Self-alignment brazing mold for ceramic packaging shell and PIN and semiconductor production equipment

Abstract

The utility model provides a self-alignment brazing mold for a ceramic packaging shell and a PIN needle and semiconductor production equipment, which belong to the field of semiconductor manufacturing and comprise an upper mold and a lower mold, a ceramic shell and a pin-shaped piece are arranged on the lower mold, and the pin-shaped piece is arranged on the upper mold. The centering inclined plane formed by the recess of the upper die can center and position the ceramic shell in the downward moving process, and the first positioning plane on the periphery of the upper die can be in guide fit with the second positioning plane on the inner side of the lower die, so that the upper die is prevented from deviating in the vertical moving process. Compared with the prior art, the positioning die for welding the ceramic shell is improved, so that the technical problem that the positioning precision and efficiency of the PIN and the ceramic shell are poor in the welding process of the existing semiconductor device is solved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing, and more specifically, it relates to a self-aligning brazing mold for a ceramic package shell and PIN pins. This utility model also relates to a semiconductor production equipment. Background Technology

[0002] Ceramic pin array housings are a common type of through-hole package. The vertical pins on the bottom are arranged in an array, typically used in high-frequency, high-power applications. Their advantages include good heat dissipation and high-frequency performance. The housing mainly consists of three parts: the sealing ring, the ceramic component, and the pins (pins are metallic materials used in connectors to conduct electrical (signal) signals). Its main structure involves soldering the sealing ring to the ceramic cavity side and soldering the leads to the bottom of the ceramic component in a vertical arrangement.

[0003] The main body of the casing is mostly a ceramic substrate with corresponding nickel-plated pads on the back. The pins are distributed on the pads, and there are certain requirements for the position of the pins on the pads.

[0004] Due to limitations in processing technology, all parts of the housing have certain dimensional tolerances, including the outer dimensions of ceramic parts, cavity dimensions, height dimensions, outer dimensions of PIN pins, and cavity dimensions of the mold. These tolerances accumulate to a large number. Therefore, during the brazing process of the housing, it is impossible to precisely limit the PIN pins and ceramic body through the brazing mold. This results in the inability to control the relative position of the PIN pins and ceramic body within a small range, making it difficult to guarantee product requirements.

[0005] Currently, for this type of casing, the existing brazing method requires manual inspection of the pads and components under a microscope at high magnification. Fine adjustments are then made to ensure the relative position of the pins on the pads. This method is inefficient, requires highly skilled operators, and is difficult to meet the demands of mass production. Utility Model Content

[0006] The purpose of this invention is to provide a self-aligning brazing mold for ceramic packaging shell and PIN pin, so as to solve the technical problem of poor positioning accuracy and efficiency of PIN pin and ceramic shell in the existing semiconductor device soldering process.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is: to provide a self-aligning brazing mold for a ceramic encapsulation shell and PIN pins, comprising:

[0008] The upper mold has a first recessed groove at the bottom, and a centering slope is formed in the inner wall of the first recessed groove. The centering slope is used to press down on the edge of the ceramic shell to be welded. The outer periphery of the upper mold has a first positioning plane, which is parallel to the vertical direction.

[0009] The lower mold has a second recessed part at the top, the ceramic shell to be welded is placed in the second recess, the bottom surface of the second recess has a positioning hole for positioning the pin-shaped part, the upper mold is fastened in the second recess, and the inner sidewall of the second recess forms a second positioning plane parallel to the vertical direction. The first positioning plane and the second positioning plane slide and adapt to each other vertically.

[0010] As the upper mold moves from top to bottom, the centering inclined surface presses against the ceramic shell to be welded, so that the ceramic shell to be welded is located in the lower center of the upper mold.

[0011] In one possible implementation, the bottom surface of the second recess is further provided with a downwardly recessed third recess, in which the ceramic shell to be welded is disposed.

[0012] In one possible implementation, the upper mold is set in two separate parts and includes a first part and a second part arranged in sequence from top to bottom. The bottom of the first part is concave upward and has two oppositely arranged first centering slopes. The bottom of the second part is concave upward and has two oppositely arranged second centering slopes. The two first centering slopes and the two second centering slopes form a centering slope arranged in a rectangle.

[0013] The outer periphery of the first mold has at least two oppositely arranged and parallel first positioning planes, and the outer periphery of the second mold has at least two oppositely arranged and parallel first positioning planes. Any first positioning plane of the second mold is perpendicular to any first positioning plane of the first mold.

[0014] There are four second positioning planes, and each second positioning plane is adapted to slide up and down with each of the first positioning planes.

[0015] In one possible implementation, the centering ramp includes four positioning ramps arranged in a rectangular pattern.

[0016] In one possible implementation, the number of the first positioning planes is four, and each of the first positioning planes is connected end to end in a rectangle.

[0017] In one possible implementation, the top of the upper mold has a cutout.

[0018] In one possible implementation, the self-aligning brazing mold for the ceramic package housing and the PIN pins further includes a modular fixing cylinder disposed in the positioning hole. The fixing cylinder is inserted into and adapted to the positioning hole, and the inner wall of the fixing cylinder is used to position the pin-shaped component.

[0019] In one possible implementation, the positioning hole is a through hole.

[0020] Compared with the prior art, the beneficial effects of the self-aligning brazing mold for the ceramic packaging shell and PIN pins provided by this utility model are as follows:

[0021] As the upper mold moves downward, the centering slope provided on the inner side of the first recess continuously presses against the ceramic shell to be welded, ensuring that the ceramic shell is in a suitable welding position. Furthermore, during the welding process, the centering slope continuously presses against the ceramic shell, preventing positional displacement. In addition to the above-mentioned beneficial effects, the lower mold in this invention can also be equipped with positioning holes. Thus, with the cooperation of the upper and lower molds, precise positioning between the ceramic shell to be welded and the PIN pins can be achieved. The entire process requires no manual operation, solving the technical problem that existing brazing methods can only rely on manual adjustment. This is beneficial for improving the assembly efficiency and mass production speed of ceramic packaging shells.

[0022] Another objective of this invention is to provide a semiconductor manufacturing apparatus, including the self-aligning brazing mold for the ceramic package shell and PIN pins mentioned above.

[0023] Compared with the prior art, the semiconductor production equipment of this utility model has all the advantages of the self-aligning brazing mold of the ceramic package shell and PIN pins, which will not be elaborated here. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0025] Figure 1 This is a schematic diagram of the first mold parting structure provided by the present invention;

[0026] Figure 2 This is a schematic diagram of the second mold-splitting structure provided by the present invention;

[0027] Figure 3 This is a schematic diagram of the upper mold of the self-aligning brazing mold for the ceramic packaging shell and PIN pins of this utility model.

[0028] Figure 4 This is a schematic diagram of the lower mold of the self-aligning brazing mold for the ceramic packaging shell and PIN pins of this utility model.

[0029] In the picture:

[0030] 1. Upper mold; 101. First centering slope; 102. Second centering slope; 103. First positioning plane; 104. Positioning slope; 11. First parting line; 12. Second parting line;

[0031] 2. Lower mold; 21. Positioning hole; 22. Second positioning plane. Detailed Implementation

[0032] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other.

[0033] In the description of this utility model, it should be noted that if terms such as "upper", "lower", "inner", "back" or indicating orientation or positional relationship appear, they are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] Furthermore, in the description of this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "joining," and "connector" should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model in light of the specific circumstances.

[0035] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0036] Please refer to the following: Figures 1 to 4The self-aligning brazing mold for ceramic encapsulation shell and PIN pin provided by this utility model will now be described. It includes an upper mold 1 and a lower mold 2. The upper mold 1 has a first recessed area at its bottom, with a centering slope formed on the inner wall of the first recess. The centering slope is used to press down on the edge of the ceramic shell to be welded. A first positioning plane 103 is provided on the outer periphery of the upper mold 1, parallel to the vertical direction. As the upper mold 1 moves from top to bottom, the centering slope forms a centering position for the ceramic shell to be welded. The lower mold 2 has a second recessed area at its top, where the ceramic shell to be welded is placed. A positioning hole 21 is provided on the bottom surface of the second recess, used to position the pin-shaped component. The upper mold 1 is fastened into the second recess. A second positioning plane 22 parallel to the vertical direction is formed on the inner wall of the second recess (e.g., ...). Figure 4 As shown), the first positioning plane 103 consists of multiple rectangular planes connected end to end, and similarly, the second positioning plane 22 also consists of multiple rectangular planes connected end to end; the first positioning plane 103 and the second positioning plane 22 slide and adapt to each other up and down; during the process of the upper mold 1 moving from top to bottom, the centering slope presses the ceramic shell to be welded so that the ceramic shell to be welded is located in the lower middle part of the upper mold 1.

[0037] It should be noted that the specific shape of the centering bevel can be flexibly set according to the shape of the ceramic shell. When the shape of the ceramic shell is an axisymmetric figure, the shape of the first concave area formed by the centering bevel is similar to a frustum or an isosceles trapezoid (e.g., Figure 3 As shown in the figure, this is to bring the ceramic shell closer to the processing station during the pressing process.

[0038] Compared to existing technologies, in the above embodiment, during the downward movement of the upper mold 1, the ceramic shell to be welded can be continuously pressed by the centering slope provided on the inner side of the first recess, so that the ceramic shell is in a suitable welding position. Furthermore, during the welding process, the centering slope can always press the ceramic shell to prevent the ceramic shell from shifting position during welding. In addition to the above-mentioned beneficial effects, the lower mold 2 in this embodiment can also be equipped with positioning holes 21. Thus, with the cooperation of the upper mold 1 and the lower mold 2, a precise positioning between the ceramic shell to be welded and the PIN pin can be formed. The whole process does not require manual operation, which solves the technical problem that the existing brazing method can only be adjusted manually, thereby improving the assembly efficiency and mass production speed of the ceramic packaging shell.

[0039] In addition to the aforementioned beneficial effects, in one possible embodiment, the bottom surface of the second recess is further provided with a downwardly recessed third recess, in which the ceramic shell to be welded is disposed, so as to form a preliminary positioning of the ceramic shell and prevent the lower end face of the upper mold 1 from directly abutting against the ceramic shell.

[0040] Considering that some of the shells to be welded are elongated, the existing regular polygonal or circular first recesses are not effective for centering such shells. To solve this problem, such as Figure 1 and Figure 2 As shown, the upper mold 1 is divided into two parts, including a first mold 11 and a second mold 12 arranged in layers from top to bottom. The bottom of the first mold 11 is concave upward and has two oppositely arranged first centering slopes 101. The bottom of the second mold 12 is concave upward and has two oppositely arranged second centering slopes 102. The two first centering slopes 101 and the two second centering slopes 102 form a rectangular arrangement of centering slopes. The outer periphery of the first mold 11 has at least two oppositely arranged and parallel first positioning planes 103. The outer periphery of the second mold 12 has at least two oppositely arranged and parallel first positioning planes 103. Any first positioning plane 103 of the second mold 12 is perpendicular to any first positioning plane 103 of the first mold 11. There are four second positioning planes 22, and each second positioning plane 22 is adapted to slide up and down with each first positioning plane 103.

[0041] With this configuration, both the first mold 11 and the second mold 12 can press the ceramic shell through their respective centering slopes, thereby positioning the ceramic shell. Furthermore, in this embodiment, both molds can guide the vertical movement of the two molds through the sliding adaptation of the outer peripheral positioning plane with the second positioning plane 22 of the lower mold 2. In addition to the above feasible implementation, the two first centering slopes 101 of the first mold 11 can also position the second mold 12 to prevent positional displacement during the overlap of the two.

[0042] To accommodate welding of most ceramic housings to pin-shaped parts, in one possible implementation, the centering bevel includes four positioning bevels 104 arranged in a rectangular pattern (e.g., Figure 3 As shown in the figure, during the downward movement of the four positioning inclined planes 104, the central axis of the ceramic shell to be welded coincides with the center point of the rectangle mentioned above, so as to achieve precise positioning of the ceramic shell to be welded.

[0043] In one possible embodiment, there are four first positioning planes 103, and each first positioning plane 103 is connected end to end in a rectangle. Preferably, in order to reduce weight, the top of the upper mold 1 is provided with a hollowed-out section.

[0044] In one possible embodiment, the self-aligning brazing mold for the ceramic package housing and the PIN pins further includes a modular fixing cylinder disposed in the positioning hole 21. The fixing cylinder is inserted into and adapted to the positioning hole 21, and the inner wall of the fixing cylinder is used to position the pin-shaped component. In this way, when it is necessary to replace the pin-shaped component with another specification, the specification of the fixing cylinder can be changed to achieve the corresponding effect without replacing the entire lower mold 2. Preferably, in one possible implementation, the positioning hole 21 is a through hole to facilitate the machining and feeding of the positioning hole 21.

[0045] Based on the same inventive concept, this utility model also proposes a semiconductor manufacturing equipment, which includes the self-aligning brazing mold for the ceramic package shell and PIN pins mentioned above.

[0046] Compared with the prior art, the semiconductor production equipment of this utility model has all the advantages of the self-aligning brazing mold of the ceramic package shell and PIN pins, which will not be elaborated here.

[0047] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A self-aligning brazing mold for a ceramic encapsulation shell and PIN pins, characterized in that, include: The upper mold (1) has a first recessed recess at the bottom, and a centering slope is formed in the inner wall of the first recess. The centering slope is used to press down on the edge of the ceramic shell to be welded. The outer periphery of the upper mold (1) has a first positioning plane (103), which is parallel to the vertical direction. The lower mold (2) has a second recessed part at the top, and the ceramic shell to be welded is placed in the second recess. The bottom surface of the second recess has a positioning hole (21), which is used to position the pin-shaped part. The upper mold (1) is fastened in the second recess. The inner sidewall of the second recess forms a second positioning plane (22) parallel to the vertical direction. The first positioning plane (103) and the second positioning plane (22) slide and adapt to each other vertically. As the upper mold (1) moves from top to bottom, the centering slope presses against the ceramic shell to be welded, so that the ceramic shell to be welded is located in the lower middle part of the upper mold (1).

2. The self-aligning brazing mold for the ceramic packaging shell and PIN pins as described in claim 1, characterized in that, The bottom surface of the second recess is also provided with a downwardly recessed third recess, in which the ceramic shell to be welded is located.

3. The self-aligning brazing mold for the ceramic packaging shell and PIN pins as described in claim 2, characterized in that, The upper mold (1) is set in two parts and includes a first mold (11) and a second mold (12) arranged in layers from top to bottom. The bottom of the first mold (11) is concave upward and has two first centering slopes (101) arranged opposite to each other. The bottom of the second mold (12) is concave upward and has two second centering slopes (102) arranged opposite to each other. The two first centering slopes (101) and the two second centering slopes (102) form a centering slope arranged in a rectangle. The outer periphery of the first mold (11) is provided with at least two oppositely arranged and parallel first positioning planes (103), and the outer periphery of the second mold (12) is provided with at least two oppositely arranged and parallel first positioning planes (103), and any first positioning plane (103) of the second mold (12) is perpendicular to any first positioning plane (103) of the first mold (11). There are four second positioning planes (22), and each second positioning plane (22) is adapted to slide up and down with each first positioning plane (103).

4. The self-aligning brazing mold for the ceramic packaging shell and PIN pins as described in claim 1, characterized in that, The centering ramp includes four positioning ramps (104) arranged in a rectangular pattern.

5. The self-aligning brazing mold for the ceramic packaging shell and PIN pins as described in claim 1, characterized in that, There are four first positioning planes (103), and each first positioning plane (103) is connected end to end in a rectangle.

6. The self-aligning brazing mold for the ceramic packaging shell and PIN pins as described in claim 1, characterized in that, The top of the upper mold (1) is hollowed out.

7. The self-aligning brazing mold for the ceramic packaging shell and PIN pins as described in claim 1, characterized in that, The self-aligning brazing mold for the ceramic encapsulation shell and the PIN pin also includes a modular fixing cylinder disposed in the positioning hole (21). The fixing cylinder is inserted into and adapted to the positioning hole (21), and the inner wall of the fixing cylinder is used to position the pin-shaped part.

8. The self-aligning brazing mold for the ceramic packaging shell and PIN pins as described in claim 7, characterized in that, The positioning hole (21) is a through hole.

9. A semiconductor manufacturing apparatus, characterized in that, The self-aligning soldering mold for the ceramic package housing and PIN pins as described in any one of claims 1 to 8.

Images