Spot welding device for microelectronic chip processing

Abstract

The utility model relates to the technical field of microelectronic chip processing, in particular to a spot welding device for microelectronic chip processing, which comprises a bottom plate, a fixing frame, a spot welding head and a supporting table. The fixing frame is arranged at the upper end of the bottom plate, and a horizontal position adjusting mechanism is arranged in the fixing frame; a height adjusting mechanism is arranged in the horizontal position adjusting mechanism, and a spot welding head is arranged at the lower end of the height adjusting mechanism. When the device is used and the surfaces of the fixing holes are covered with materials, negative pressure in the fixing holes can adsorb the materials, so that air flow in the fixing holes is reduced, the fixing holes are prevented from being blocked by the fixing balls, and the fixing holes which are not blocked by the materials can block the fixing holes under the air flow effect and the negative pressure effect. And therefore, the equipment can automatically limit different materials, and the machining efficiency of the equipment is improved.

Description

Technical Field

[0001] This utility model relates to the field of microelectronic chip processing technology, and in particular to a spot welding device for microelectronic chip processing. Background Technology

[0002] Microelectronic chips, or IC chips, are integrated circuits made by placing a large number of microelectronic components (transistors, resistors, capacitors, etc.) onto a plastic substrate to form a chip. In chip manufacturing, welding equipment is needed to solder the electronic components onto the plastic substrate. However, general welding equipment has some drawbacks, such as:

[0003] Conventional welding equipment cannot automatically fix different materials during use, which requires adjustments when processing different materials, thus affecting the overall processing efficiency and hindering the use of the equipment. Utility Model Content

[0004] The purpose of this invention is to provide a spot welding device for microelectronic chip processing to solve the problems mentioned in the background art.

[0005] A spot welding device for microelectronic chip processing includes a base plate, a fixing frame, a spot welding head, and a support platform: the base plate is provided with a fixing frame at its upper end, the fixing frame is provided with a horizontal position adjustment mechanism inside, the horizontal position adjustment mechanism is provided with a height adjustment mechanism inside, and the height adjustment mechanism is provided with a spot welding head at its lower end;

[0006] The upper end of the base plate is provided with a front-to-back position adjustment mechanism, and the side of the front-to-back position adjustment mechanism is provided with a support platform for placing materials.

[0007] Preferably, the horizontal position adjustment mechanism includes a motor, a lead screw, and a support frame. The motor is disposed on the side of the fixed frame, the output end of the motor is connected to the lead screw, the side of the lead screw is threadedly connected to the support frame, and the support frame is slidably disposed on the side of the fixed frame.

[0008] When the device is in use, the motor drives the lead screw to rotate. Since the fixed frame limits the support frame, the position of the support frame is adjusted as the lead screw rotates, thereby adjusting the position of the spot welding head.

[0009] Preferably, the height adjustment mechanism includes a first electric push rod and a connecting frame. The first electric push rod is disposed at the upper end of the support frame, and the output end of the first electric push rod passes through the support frame and is connected to the connecting frame. A spot weld is connected to the side of the connecting frame.

[0010] When the device is in use, the height of the connecting frame and the spot welding head is adjusted by the first electric push rod, so that the spot welding head can process the workpiece.

[0011] Preferably, the front and rear position adjustment mechanism includes a support plate and a second electric push rod. The support plate is disposed on the upper end of the base plate, and the second electric push rod is disposed on the side of the support plate. The output end of the second electric push rod passes through the support plate and is connected to the support platform.

[0012] When the device is in use, the second electric push rod drives the support platform to move, thereby moving the support platform and the workpiece on its surface, and adjusting the position of the workpiece to facilitate processing.

[0013] Preferably, the upper end of the base plate is provided with an "I"-shaped guide rail, and the guide rail is slidably connected to the support platform.

[0014] When the support platform moves to adjust the position of the workpiece, the guide rail will limit the support platform, thereby increasing the stability of the support platform during movement and preventing misalignment.

[0015] Preferably, an air pump is installed inside the support platform, and fixing holes are evenly distributed on the upper surface of the support platform. The fixing holes are connected to the air inlet of the air pump, and the air outlet of the air pump is located on the outside of the support platform.

[0016] When the device is in use, an air pump draws gas out of the fixing hole, thereby generating suction to adsorb and fix the workpiece on its surface, preventing misalignment of materials during the welding process.

[0017] Preferably, the upper end of the fixing hole is funnel-shaped, a fixing ball is provided at the upper end of the fixing hole, and a fixing spring is provided at the lower end of the fixing hole, with the fixing spring in contact with the fixing ball.

[0018] When the device is in use, the suction of the air pump gradually increases, which in turn increases the suction of the fixed ball. When material is placed on the surface of the fixing hole, the pressure difference between the outside gas and the inside of the fixing hole will fix the material, and the thrust on the fixing ball inside the fixing hole will also decrease. Meanwhile, when the other fixing holes without material are subjected to the gradually increasing suction, they will automatically block and fix the fixing holes by moving the fixing balls downward, thereby improving the adsorption and fixing effect of the device. After processing is completed, the fixing spring will push the fixing ball upward, thereby returning the fixing ball to its original position.

[0019] The beneficial effects of this utility model are:

[0020] 1. When the device is in use, when the surface of the fixing hole is covered with material, the negative pressure inside the fixing hole will adsorb the material, thereby reducing the air flow inside the fixing hole and preventing the fixing ball from clogging the fixing hole. The fixing hole that is not blocked by material will be blocked by the air flow and the negative pressure, thus enabling the equipment to automatically limit the movement of different materials and improve the processing efficiency of the equipment. Attached Figure Description

[0021] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0022] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the internal structure of the fixing frame of this utility model;

[0024] Figure 3 This is a schematic diagram of the installation structure of the second electric push rod and support plate of this utility model;

[0025] Figure 4 This is a schematic diagram of the internal structure of the support platform of this utility model.

[0026] In the diagram: 1. Base plate; 2. Fixing frame; 3. Motor; 4. Lead screw; 5. Support frame; 6. First electric push rod; 7. Connecting frame; 8. Air pump; 9. Spot welding head; 10. Support plate; 11. Second electric push rod; 12. Support platform; 13. Guide rail; 14. Fixing hole; 15. Fixing ball; 16. Fixing spring. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] In practical implementation: such as Figure 1-4 As shown, a spot welding device for microelectronic chip processing includes a base plate 1, a fixing frame 2, a spot welding head 9, and a support platform 12: the base plate 1 is provided with a fixing frame 2 at its upper end, the fixing frame 2 is provided with a horizontal position adjustment mechanism inside, the horizontal position adjustment mechanism is provided with a height adjustment mechanism inside, and the lower end of the height adjustment mechanism is provided with a spot welding head 9.

[0029] The upper end of the base plate 1 is provided with a front-to-back position adjustment mechanism, and the side of the front-to-back position adjustment mechanism is provided with a support platform 12 for placing materials.

[0030] The horizontal position adjustment mechanism includes a motor 3, a lead screw 4, and a support frame 5. The motor 3 is located on the side of the fixed frame 2. The output end of the motor 3 is connected to the lead screw 4. The side of the lead screw 4 is threadedly connected to the support frame 5. The support frame 5 is slidably located on the side of the fixed frame 2.

[0031] When the device is in use, the motor 3 drives the lead screw 4 to rotate. Since the fixed frame 2 limits the support frame 5, the position of the support frame 5 will be adjusted as the lead screw 4 rotates, thereby adjusting the position of the spot welding head 9.

[0032] The height adjustment mechanism includes a first electric push rod 6 and a connecting frame 7. The first electric push rod 6 is located at the upper end of the support frame 5. The output end of the first electric push rod 6 passes through the support frame 5 and is connected to the connecting frame 7. The side of the connecting frame 7 is connected to a spot weld head 9.

[0033] When the device is in use, the height of the connecting frame 7 and the spot welding head 9 is adjusted by the first electric push rod 6, so that the spot welding head 9 can process the workpiece.

[0034] The front and rear position adjustment mechanism includes a support plate 10 and a second electric push rod 11. The support plate 10 is set at the upper end of the base plate 1, and the second electric push rod 11 is set on the side of the support plate 10. The output end of the second electric push rod 11 passes through the support plate 10 and is connected to the support platform 12.

[0035] When the device is in use, the second electric push rod 11 drives the support platform 12 to move, thereby moving the support platform 12 and the workpiece on its surface, and adjusting the position of the workpiece to facilitate processing.

[0036] The upper end of the base plate 1 is provided with an "I"-shaped guide rail 13, which is slidably connected to the support platform 12.

[0037] When the support platform 12 moves to adjust the position of the workpiece, the guide rail 13 will limit the support platform 12, thereby increasing the stability of the support platform 12 during movement and preventing the support platform 12 from being misaligned.

[0038] An air pump 8 is installed inside the support platform 12. Fixing holes 14 are evenly opened on the upper surface of the support platform 12. The fixing holes 14 are connected to the air inlet end of the air pump 8. The exhaust end of the air pump 8 is located on the outside of the support platform 12.

[0039] When the device is in use, the air pump 8 draws out the gas from the fixing hole 14, thereby generating suction to adsorb and fix the workpiece on its surface, preventing the material from being misaligned during the welding process.

[0040] The upper part of the fixing hole 14 is funnel-shaped, and a fixing ball 15 is provided at the upper part of the fixing hole 14. A fixing spring 16 is provided at the lower part of the fixing hole 14, and the fixing spring 16 is in contact with the fixing ball 15.

[0041] When the device is in use, the suction of the air pump 8 gradually increases, which in turn gradually increases the suction of the fixed ball 15. When material is placed on the surface of the fixing hole 14, the pressure difference between the outside gas and the inside of the fixing hole 14 will fix the material, and the thrust on the fixing ball 15 inside the fixing hole 14 will also decrease. When the other fixing holes 14 without material are subjected to the gradually increasing suction, they will automatically block and fix the fixing holes 14 by moving the fixing ball 15 downward, thereby improving the adsorption and fixing effect of the device. After processing is completed, the fixing spring 16 will push the fixing ball 15 upward, thereby returning the fixing ball 15 to its original position.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0043] Finally, it should be noted that the above are merely preferred embodiments of this utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A spot welding device for microelectronic chip processing, characterized by Includes a base plate (1), a fixing frame (2), a spot welding head (9) and a support platform (12): the base plate (1) is provided with a fixing frame (2) at its upper end, the fixing frame (2) is provided with a horizontal position adjustment mechanism inside, the horizontal position adjustment mechanism is provided with a height adjustment mechanism inside, and the lower end of the height adjustment mechanism is provided with a spot welding head (9). The upper end of the base plate (1) is provided with a front-to-back position adjustment mechanism, and the side of the front-to-back position adjustment mechanism is provided with a support platform (12) for placing materials.

2. A spot welding device for microelectronic chip processing according to claim 1, characterized in that: The horizontal position adjustment mechanism includes a motor (3), a lead screw (4) and a support frame (5). The motor (3) is located on the side of the fixed frame (2). The output end of the motor (3) is connected to the lead screw (4). The side of the lead screw (4) is threadedly connected to the support frame (5). The support frame (5) is slidably located on the side of the fixed frame (2).

3. A spot welding device for microelectronic chip processing according to claim 2, characterized in that: The height adjustment mechanism includes a first electric push rod (6) and a connecting frame (7). The first electric push rod (6) is located at the upper end of the support frame (5). The output end of the first electric push rod (6) passes through the support frame (5) and is connected to the connecting frame (7). The side of the connecting frame (7) is connected to a spot weld head (9).

4. The spot welding device for microelectronic chip processing of claim 1, wherein: The front and rear position adjustment mechanism includes a support plate (10) and a second electric push rod (11). The support plate (10) is set at the upper end of the base plate (1). The second electric push rod (11) is provided on the side of the support plate (10). The output end of the second electric push rod (11) passes through the support plate (10) and is connected to the support platform (12).

5. A spot welding device for microelectronic chip processing according to claim 4, characterized in that: The upper end of the base plate (1) is provided with an I-shaped guide rail (13), and the guide rail (13) is slidably connected to the support platform (12).

6. A spot welding device for microelectronic chip processing according to claim 4, wherein: An air pump (8) is installed inside the support platform (12). Fixing holes (14) are evenly opened on the upper surface of the support platform (12). The fixing holes (14) are connected to the air inlet end of the air pump (8). The exhaust end of the air pump (8) is located on the outside of the support platform (12).

7. A spot welding device for microelectronic chip processing according to claim 6, characterized in that: The upper part of the fixed hole (14) is funnel-shaped, and a fixed ball (15) is provided at the upper part of the fixed hole (14). A fixed spring (16) is provided at the lower part of the fixed hole (14), and the fixed spring (16) is in contact with the fixed ball (15).

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