Carrier for crystal degumming

Abstract

The utility model relates to a carrier for crystal degumming, and relates to the technical field of polishing machine abrasive materials, the carrier comprises a base body layer, a bonding layer arranged on the outer side of the base body layer and a first abrasive particle layer arranged on the outer side of the bonding layer, the first abrasive particle layer is composed of a plurality of regularly arranged abrasive particle units, the abrasive particle units are fixed to the bonding layer in an embedded connection mode, an elastic buffer layer made of flexible materials is arranged between every two adjacent abrasive particle units, and the elastic buffer layers are used for reducing friction force between carriers. The bonding layer can firmly fix the abrasive particle units on the surface of the bonding layer, meanwhile, the elastic buffer layer is protected, the elastic buffer layer can reduce the friction force between carriers, and the effects of improving the stability of the carriers and prolonging the service life are achieved.

Description

Technical Field

[0001] This application relates to the field of abrasive technology for polishing machines, and in particular to a carrier for degumming crystals. Background Technology

[0002] Eddy current finishing machines, as important surface treatment equipment, are widely used in polishing, deburring, and surface finishing of metal parts. In modern industrial manufacturing, their efficient and uniform processing results provide crucial support for improving product quality and production efficiency. The abrasive structure, as one of the core components of the eddy current finishing machine, directly affects the processing effect and equipment performance. Currently, with the continuous improvement of manufacturing requirements for product surface quality, developing high-performance abrasive structures has become a key direction for industry development.

[0003] In existing technologies, various abrasive structure designs are typically employed to achieve efficient surface treatment. For example, abrasive grains are directly bonded to the metal substrate, or a multi-layered abrasive structure is used to improve grinding performance. Additionally, different bonding materials, such as epoxy resin and phenolic resin, are used to enhance the bond strength between the abrasive grains and the substrate. Furthermore, to optimize grinding efficiency, some designs adjust the arrangement or density distribution of the abrasive grains, and even add a protective coating to the surface of the abrasive grains to extend their service life. These methods, to some extent, meet the needs of different application scenarios.

[0004] However, existing abrasive structures generally suffer from problems such as weak abrasive grain fixation, insufficient bonding strength in multi-layer structures, and excessive friction between abrasive grains. This leads to abrasive grain detachment during high-speed operation, affecting processing quality and equipment lifespan. This problem urgently needs to be solved to further improve the performance of eddy current finishing machines. Utility Model Content

[0005] To address the problem of excessive friction between abrasive grains, this application provides a carrier for debinding crystals.

[0006] This application provides a carrier for degumming crystals, employing the following technical solution:

[0007] A carrier for degumming crystals includes a substrate layer, an adhesive layer disposed on the outside of the substrate layer, and a first abrasive layer disposed on the outside of the adhesive layer. The first abrasive layer is composed of a plurality of regularly arranged abrasive units, which are fixed to the adhesive layer by an embedded connection. An elastic buffer layer made of flexible material is provided between adjacent abrasive units to reduce the friction between the carriers.

[0008] By adopting the above technical solution, the adhesive layer can firmly fix the abrasive unit on its surface, while protecting the elastic buffer layer. The elastic buffer layer can reduce the friction between carriers, thereby improving the stability of the carrier and extending its service life.

[0009] Optionally, the embedded connection method involves embedding the abrasive unit portion into a groove formed on the surface of the adhesive layer.

[0010] By adopting the above technical solution, it is ensured that the abrasive unit can be firmly embedded without excessively weakening the strength of the bonding layer.

[0011] Optionally, the elastic buffer layer is made of silicone rubber or polyurethane.

[0012] By adopting the above technical solutions, silicone rubber has excellent high temperature resistance and elasticity, making it suitable for high temperature working environments, while polyurethane performs better under normal temperature conditions due to its high strength and wear resistance.

[0013] Optionally, the surface of the substrate layer is provided with a plurality of microporous structures, which are used to increase the contact area between the adhesive layer and the substrate layer.

[0014] By adopting the above technical solution, the microporous structure is used to increase the contact area between the adhesive layer and the substrate layer, thereby improving the bonding strength between the adhesive layer and the substrate layer.

[0015] Optionally, the microporous structure is distributed in an array.

[0016] By adopting the above technical solution, the bonding strength between the adhesive layer and the substrate layer can be further improved.

[0017] Optionally, the abrasive unit includes a bottom abrasive grain disposed on the surface of the adhesive layer and a surface abrasive grain disposed on the bottom abrasive grain, wherein the hardness of the bottom abrasive grain is greater than that of the surface abrasive grain.

[0018] By adopting the above technical solution, it is possible to reduce the wear rate of surface abrasive particles while ensuring overall grinding performance.

[0019] Optionally, a transition layer is provided between the bottom abrasive grains and the surface abrasive grains, and the transition layer is a ceramic composite material.

[0020] By adopting the above technical solution, stress concentration between the bottom abrasive grains and the surface abrasive grains is alleviated, and the stability of the overall structure is improved.

[0021] Optionally, the adhesive layer is epoxy resin.

[0022] By adopting the above technical solution, epoxy resin has excellent bonding performance and chemical corrosion resistance, which can firmly fix the abrasive unit to the surface of the adhesive layer.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. The adhesive layer can firmly fix the abrasive unit on its surface, while protecting the elastic buffer layer. The elastic buffer layer can reduce the friction between the carriers, thereby improving the stability of the carrier and extending its service life.

[0025] 2. The combination of bottom-layer and surface-layer abrasive grains can reduce the wear rate of the surface-layer abrasive grains while ensuring overall grinding performance. Attached Figure Description

[0026] Figure 1 This is a cross-sectional view of the carrier used for crystal degumming;

[0027] Figure 2 This is a schematic diagram of the abrasive unit of the carrier used for crystal degumming.

[0028] Explanation of reference numerals in the attached figures: 1. Substrate layer; 2. Adhesive layer; 3. First abrasive layer; 31. Abrasive unit; 311. Bottom abrasive; 312. Surface abrasive; 313. Transition layer; 32. Elastic buffer layer. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0030] This application discloses a carrier for degumming crystals. (Refer to...) Figure 1 and Figure 2 The carrier for degumming crystals includes a substrate layer 1, an adhesive layer 2, and a first abrasive layer 3. The adhesive layer 2 is installed on the outside of the substrate layer 1, and the first abrasive layer 3 is installed on the outside of the adhesive layer 2. The first abrasive layer 3 is composed of a plurality of regularly arranged abrasive units 31. The abrasive units 31 are fixed to the adhesive layer 2 by an embedded connection, and an elastic buffer layer 32 made of flexible material is provided between adjacent abrasive units 31. The inner side of the elastic buffer layer 32 is connected to the outer side of the adhesive layer 2, and the elastic buffer layer 32 is used to reduce the friction between the carriers. In this embodiment, the substrate layer 1 is a metal material or a ceramic material, such as stainless steel or alumina ceramic.

[0031] In this embodiment, the abrasive unit 31 is fixed to the adhesive layer 2 via an embedded connection, and an elastic buffer layer 32 made of flexible material is provided between adjacent abrasive units 31. The elastic buffer layer 32 can reduce the friction between the carriers, thereby improving the stability of the carriers and extending their service life. In this embodiment, the adhesive layer 2 is epoxy resin. Epoxy resin has excellent bonding performance and chemical corrosion resistance, which can firmly fix the abrasive unit 31 to the surface of the adhesive layer 2, while also protecting the elastic buffer layer 32. To further improve the bonding effect, an appropriate amount of filler, such as silica or alumina powder, can be added to the epoxy resin to improve its mechanical properties and thermal stability. In addition, the curing process of the epoxy resin also needs to be strictly controlled. A heat curing method is adopted, with a curing temperature range of 80°C to 120°C and a curing time range of 1 hour to 3 hours.

[0032] Specifically, the embedded connection method is achieved by partially embedding the abrasive unit 31 into a groove formed on the surface of the adhesive layer 2. The groove on the surface of the adhesive layer 2 can be rectangular, circular, or trapezoidal, etc., and the specific shape is selected according to actual needs. For example, rectangular grooves are suitable for uniformly distributed abrasive units 31, while circular grooves are more suitable for areas requiring localized reinforcement. The groove depth is usually 1 / 3 to 1 / 2 of the height of the abrasive unit 31 to ensure that the abrasive unit 31 can be firmly embedded without excessively weakening the strength of the adhesive layer 2.

[0033] Specifically, the elastic buffer layer 32 is made of a flexible material, such as silicone rubber or polyurethane. Silicone rubber has excellent high-temperature resistance and elasticity, making it suitable for high-temperature working environments, while polyurethane performs better at room temperature due to its high strength and wear resistance. The thickness of the elastic buffer layer 32 is typically 0.1 mm to 0.5 mm to ensure that it effectively reduces friction between carriers without significantly increasing the overall thickness. The elastic buffer layer 32 can be formed by spraying, injection molding, or compression molding, with the specific process selected based on the characteristics of the flexible material.

[0034] Specifically, the surface of the substrate layer 1 is provided with multiple microporous structures. These microporous structures increase the contact area between the adhesive layer 2 and the substrate layer 1, thereby improving the bonding strength. The microporous structures can be circular, square, or honeycomb-like, with pore diameters ranging from 50 μm to 500 μm and depths ranging from 1.5 to 3 times the pore diameter. The microporous structures are arranged in an array, and the arrangement can be adjusted according to actual needs, such as square or triangular arrays. The fabrication methods for the microporous structures include laser drilling, chemical etching, or mechanical drilling.

[0035] Specifically, the abrasive unit 31 includes a bottom abrasive grain 311 and a surface abrasive grain 312. The bottom abrasive grain 311 is connected to the surface of the bonding layer 2, and the surface abrasive grain 312 is connected to the surface of the bottom abrasive grain 311. The hardness of the bottom abrasive grain 311 is greater than that of the surface abrasive grain 312. The bottom abrasive grain 311 is made of high-hardness materials such as silicon carbide and alumina, while the surface abrasive grain 312 is made of relatively low-hardness materials such as corundum and diamond, but with good wear resistance. This design can reduce the wear rate of the surface abrasive grain 312 while ensuring overall grinding performance. A transition layer 313 is provided between the bottom abrasive grain 311 and the surface abrasive grain 312. The transition layer 313 is made of ceramic composite material, such as zirconium oxide-alumina composite material. The thickness of the transition layer 313 is typically 0.2 mm to 1 mm, and its function is to alleviate stress concentration between the bottom abrasive grain 311 and the surface abrasive grain 312, thereby improving the stability of the overall structure.

[0036] The implementation principle of this embodiment is as follows: the abrasive unit 31 is firmly fixed to the bonding layer 2 through an embedded connection, and the elastic buffer layer 32 is used to reduce the friction between the carriers, thereby effectively solving the problems of insecure fixing of the abrasive unit 31 and excessive friction. The introduction of the microporous structure further enhances the bonding strength between the bonding layer 2 and the substrate layer 1, while the design of the bottom abrasive 311 and the surface abrasive 312 optimizes the grinding performance and service life. The overall solution not only improves the stability of the carrier but also significantly extends the service life of the equipment.

[0037] Example 2

[0038] The difference between this embodiment and the above embodiments is that the elastic buffer layer 32 adopts a double-layer structure design, with the inner layer being silicone rubber and the outer layer being polyurethane.

[0039] Specifically, the double-layer elastic buffer layer 32 combines the high-temperature resistance of silicone rubber with the high strength of polyurethane, enabling it to adapt to a wider temperature range and working environment. The inner silicone rubber layer is 0.2 mm thick, and the outer polyurethane layer is 0.3 mm thick, with the two layers firmly bonded together by an adhesive.

[0040] The implementation principle of this embodiment is as follows: the double-layer elastic buffer layer 32 not only reduces friction but also has better environmental adaptability, making it suitable for grinding tasks under complex working conditions.

[0041] Example 3

[0042] The difference between this embodiment and the above embodiment is that the bottom abrasive 311 adopts a granular design, and the surface abrasive 312 adopts a sheet-like design.

[0043] Specifically, the granular bottom abrasive grains 311 have a higher surface area and stronger gripping force, while the flake-shaped surface abrasive grains 312 provide a more uniform grinding effect. The particle diameter of the bottom abrasive grains 311 is 0.5 mm to 2 mm, and the flake thickness of the surface abrasive grains 312 is 0.1 mm to 0.5 mm.

[0044] The implementation principle of this embodiment is as follows: the combined design of granular bottom abrasive grains 311 and sheet-like surface abrasive grains 312 further optimizes the grinding performance, enabling the carrier to perform well under different materials and different precision requirements.

[0045] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A carrier for degumming crystals, characterized in that: It includes a substrate layer (1), an adhesive layer (2) disposed on the outside of the substrate layer (1), and a first abrasive layer (3) disposed on the outside of the adhesive layer (2). The first abrasive layer (3) is composed of a plurality of regularly arranged abrasive units (31). The abrasive units (31) are fixed on the adhesive layer (2) by an embedded connection. An elastic buffer layer (32) made of flexible material is provided between adjacent abrasive units (31). The elastic buffer layer (32) is used to reduce the friction between the carriers.

2. The carrier for degumming crystal according to claim 1, characterized in that: The embedded connection method is that the abrasive unit (31) is partially embedded in the groove formed on the surface of the adhesive layer (2).

3. The carrier for degumming crystal according to claim 1, characterized in that: The elastic buffer layer (32) is made of silicone rubber or polyurethane.

4. The carrier for degumming crystal according to claim 1, characterized in that: The substrate layer (1) has a plurality of microporous structures on its surface, which are used to increase the contact area between the adhesive layer (2) and the substrate layer (1).

5. A carrier for degumming crystals according to claim 4, characterized in that: The microporous structures are distributed in an array.

6. The carrier for degumming crystal according to claim 1, characterized in that: The abrasive unit (31) includes a bottom abrasive (311) disposed on the surface of the adhesive layer (2) and a surface abrasive (312) disposed on the bottom abrasive (311), wherein the hardness of the bottom abrasive (311) is greater than that of the surface abrasive (312).

7. A carrier for degumming crystal according to claim 6, characterized in that: A transition layer (313) is provided between the bottom abrasive grains (311) and the surface abrasive grains (312), and the transition layer (313) is a ceramic composite material.

8. The carrier for degumming crystal according to claim 1, characterized in that: The adhesive layer (2) is epoxy resin.

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