Uniform flow field hard alloy anodic oxidation device

By designing a uniform flow field hard alloy anodizing device in the electroplating tank, the problem of uneven flow of electroplating solution is solved, the uniformity of the coating and the quality of electroplating are improved, and the loss of electroplating solution is reduced, which has environmental and economic benefits.

CN224077571UActive Publication Date: 2026-04-03WUXI QIANGXING SURFACE ENGINEERING EQUIPMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-30
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

In existing electroplating technologies, the electroplating solution does not flow evenly in the electroplating tank, resulting in insufficient uniformity of the coating and affecting the electroplating effect and coating quality.

Method used

A uniform flow field hard alloy anodizing device was designed. By installing a liquid uniform chamber orifice plate and a return flow chamber orifice plate on both sides of the tank, combined with a stirrer and an anode scraper, a stable liquid flow field is formed to ensure uniform distribution and stirring effect of the electroplating solution.

Benefits of technology

It achieves uniform distribution of electroplating solution, improves the uniformity and quality of the coating, reduces waste of electroplating solution, and has the advantages of being environmentally friendly and low-cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a uniform flow field hard alloy anodic oxidation device which comprises a tank body and oxidation anodes, the oxidation anodes are installed on two side plates of a tank chamber of the tank body, a liquid homogenizing cavity pore plate and a backflow cavity pore plate are fixedly installed at the front end and the rear end of the tank chamber of the tank body respectively, and an adjusting pore plate is adjustably installed on the liquid homogenizing cavity pore plate; the liquid uniformizing cavity pore plate and the end plate at the corresponding end of the tank body define a stirring and liquid uniformizing cavity, and a stirrer is arranged in a cavity body of the stirring and liquid uniformizing cavity; a backflow cavity is defined by the backflow cavity pore plate and an end plate at the corresponding end of the tank body, and the backflow cavity leads to the stirring and liquid homogenizing cavity through a circulating pipeline; and a movable anode scraping plate is arranged on the oxidation anode. The liquid uniformizing holes in the liquid uniformizing cavity pore plate correspond to the liquid uniformizing adjusting holes in the adjusting pore plate in a one-to-one mode, and the adjusting pore plate is adjustably installed on the liquid uniformizing cavity pore plate through pore plate adjusting bolts. The device can form a stable liquid flow field in the tank, ensures uniform distribution of metal ions, and is particularly suitable for precise anodic oxidation treatment of hard alloy.
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Description

Technical Field

[0001] This utility model relates to a surface treatment technology device for forming a metal coating on the surface of a metal component using electrochemical principles, and more particularly to an improvement in the structure of the anodic oxidation reaction tank used in the surface treatment device. Background Technology

[0002] Electroplating is a surface treatment technology that uses electrochemical principles to form a metallic coating on the surface of metallic or non-metallic components. It is widely used in numerous industrial fields, including machinery manufacturing, light industry, electronics, aerospace, and instrumentation. During electroplating, the workpiece in the plating bath acts as the cathode, while the plating metal, typically a hard alloy such as nickel or molybdenum, acts as the anode. When direct current passes through the plating solution, metal cations migrate towards the cathode under the influence of the potential difference, gain electrons, and are reduced to metal atoms, which then deposit on the surface of the workpiece to form the coating.

[0003] The uniformity, hardness, and structure of the plating layer on a workpiece are crucial indicators that must be considered when electroplating products. For existing electroplated metals, especially for precision electroplating of hard alloys, insufficient plating uniformity is a common problem. The main factor affecting plating uniformity is the concentration difference of the electroplating solution within the electroplating tank (anodic oxidation reaction tank). This directly impacts the plating quality. The vortices and dead zones formed by the flow of the electroplating solution in the tank create an uneven flow field, resulting in uneven distribution of metal ions and an unstable, uneven plating environment, thus affecting the plating effect and plating quality. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is to provide a uniform flow field hard alloy anodizing device that can form a stable liquid flow field in the tank and ensure the uniform distribution of metal ions in the electroplating solution.

[0005] To solve the above-mentioned technical problems, the present invention provides a uniform flow field hard alloy anodizing device, comprising a tank and an oxide anode. The oxide anode is mounted on two side plates of the tank chamber. A uniform flow chamber orifice plate and a reflux chamber orifice plate are fixedly mounted at the front and rear ends of the tank chamber, respectively. An adjusting orifice plate is adjustablely mounted on the uniform flow chamber orifice plate. The uniform flow chamber orifice plate and the end plates at the corresponding ends of the tank body form a stirring uniform flow chamber, and a stirrer is provided in the chamber of the stirring uniform flow chamber. The reflux chamber orifice plate and the end plates at the corresponding ends of the tank body form a reflux chamber, and the reflux chamber is connected to the stirring uniform flow chamber through a circulation pipeline. A movable anode scraper is provided on the oxide anode.

[0006] Furthermore, the liquid equalization holes on the liquid equalization chamber plate and the liquid equalization adjustment holes on the adjustment plate are in one-to-one correspondence, and the adjustment plate is adjustablely mounted on the liquid equalization chamber plate by means of the adjustment bolts.

[0007] Furthermore, the agitator is a paddle agitator, which is connected to a stirring motor.

[0008] Furthermore, the stirring motor is a geared motor.

[0009] Furthermore, a filter and a circulation pump are connected in series in the circulation pipeline, with the filter located at the suction end of the circulation pump.

[0010] Furthermore, the reflux chamber orifice plate and the liquid equalization chamber orifice plate are evenly distributed with a plurality of through holes on their surfaces, and the through hole ratio of the liquid equalization chamber orifice plate is equal to the through hole ratio of the reflux chamber orifice plate.

[0011] Furthermore, the perforation rate of the reflux chamber orifice plate, the regulating orifice plate, and the liquid equalization chamber orifice plate is 60%-80%.

[0012] Furthermore, the anode scraper is slidably supported on the scraper guide rod, and a scraper screw is screwed onto the anode scraper, which is connected to the screw motor for transmission.

[0013] Furthermore, the screw motor is a geared motor.

[0014] In the above structure, since the front and rear ends of the tank are respectively surrounded by the uniform liquid chamber plate and the return liquid chamber plate and the corresponding end plate of the tank, the electroplating solution is fed into the uniform liquid chamber to form a full supply chamber. The supply chamber filled with electroplating solution supplies liquid to the electroplating tank in a dispersed form on the plate surface, which overcomes the supply vortex and dead zone formed by the current supply pipe, and is conducive to forming a stable and uniform circulating liquid flow field in the electroplating tank. On the other hand, a stirrer is set in the uniform liquid chamber, and the electroplating solution is homogenized by the stirring action of the stirrer. Through the combined action of the uniform liquid chamber and the stirrer, the metal ions in the plating tank are uniformly distributed.

[0015] Furthermore, since both the liquid distribution chamber orifice plate and the return flow chamber orifice plate adopt an orifice plate structure, the orifice plate forms a liquid distribution on the plate surface, which makes the flow velocity on each cross section in the plating tank consistent. This ensures that the electroplating solution flows through the surface of the workpiece to be plated at the same flow rate and speed, ensuring the uniform deposition of metal ions on the workpiece, thereby forming a uniform coating and greatly improving the electroplating quality.

[0016] Furthermore, the presence of an anode scraper on the oxide anode allows for timely removal of dirt and impurities from the anode surface, ensuring its purity and improving the quality and adhesion of the electroplated layer. This is particularly beneficial for the precision and high-quality electroplating of cemented carbide. In this invention, the reflux chamber is connected to the stirring chamber via a circulation loop, creating a circulating flow of the electroplating solution within the tank. This solves the problem of environmental pollution caused by electroplating solution leakage and reduces waste due to solution loss, offering the dual advantages of environmental friendliness and low cost. Attached Figure Description

[0017] The uniform flow field hard alloy anodizing device of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0018] Figure 1 This is a schematic diagram of a specific embodiment of the uniform flow field hard alloy anodizing device of this utility model;

[0019] Figure 2 yes Figure 1 A-A cross-section.

[0020] In the diagram, 1—tank body, 2—stirring and homogenizing chamber, 3—circulation pipeline, 4—circulation pump, 5—filter, 6—plating tank chamber, 7—return chamber, 8—return chamber orifice plate, 9—return hole, 10—screw motor, 11—scraper guide rod, 12—anode scraper, 13—oxidized anode, 14—scraper screw, 15—adjusting orifice plate, 16—homogenizing adjustment hole, 17—homogenizing chamber orifice plate, 18—homogenizing hole, 19—stirring motor, 20—stirrer, 21—orifice plate adjusting bolt. Detailed Implementation

[0021] like Figure 1 , Figure 2 The uniform flow field hard alloy anodizing apparatus shown includes a tank 1. The bottom plate, side plates, and end plates of the tank 1 form an upward-opening rectangular plating tank 6. The tank plates of the tank 1 are made of polymer materials such as polypropylene. These materials not only have good corrosion resistance and electrical insulation properties, but also effectively protect the surface of the workpiece, making them particularly suitable for forming precision plating layers on the workpiece surface. During operation, the plating tank 6 is filled with the appropriate electroplating solution.

[0022] Oxidation anodes 13 are installed on both sides of the tank plate of the tank body 1. A uniform liquid distribution chamber plate 17 and a reflux chamber plate 8 are fixedly installed at both ends of the plating tank chamber 6 of the tank body 1. The uniform liquid distribution chamber plate 17, the corresponding end plates of the tank body 1, the bottom plate of the tank body 1, and the top plate of the uniform liquid distribution chamber form a closed stirring and uniform liquid distribution chamber 2. Two stirrers 20 are installed in the stirring and uniform liquid distribution chamber 2. Each stirrer 20 includes a stirring shaft and blades fixed to the stirring shaft; in this embodiment, multi-layer blades are used. Two stirring motors 19 are installed on the top plate of the uniform liquid distribution chamber. The stirring shafts of the stirrers 20 pass through the top plate of the uniform liquid distribution chamber and are connected to the output shafts of the corresponding stirring motors 19. The stirring motors 19 are geared motors.

[0023] The reflux chamber orifice plate 8, the end plate at the other end of the tank 1, the bottom plate of the tank 1, and the top plate of the reflux chamber form a closed reflux chamber 7. One end of the circulation pipeline 3 is connected to the reflux chamber 7, and the other end of the circulation pipeline 3 is connected to the stirring and homogenizing chamber 2. A filter 5 and a circulation pump 4 are also connected in series on the circulation pipeline 3. The filter 5 is a commonly used PP electroplating filter, and the circulation pump 4 is a commonly used corrosion-resistant infusion pump.

[0024] An adjusting orifice plate 15 is installed on the inner side of the uniform liquid chamber orifice plate 17 via an adjusting bolt 21. The uniform liquid chamber orifice plate 17 and the adjusting orifice plate 15 adopt the same orifice plate structure, that is, both have a corresponding circular through hole evenly distributed on their surfaces. The adjusting orifice plate 15 is provided with a bolt groove, through which the adjusting bolt 21 passes and is screwed onto the uniform liquid chamber orifice plate 17. The relative position of the two orifice plates is adjusted so that the corresponding through holes on the two orifice plates match or stagger, thereby adjusting the flow rate and velocity of the electroplating solution entering the plating tank 6.

[0025] The reflux chamber orifice plate 8, the regulating orifice plate 15, and the uniform liquid chamber orifice plate 17 are all equipped with a plurality of circular through holes, although other geometric shapes are also possible. The through hole ratios of the reflux chamber orifice plate 8, the regulating orifice plate 15, and the uniform liquid chamber orifice plate 17 are all equal, and their through hole ratios are preferably controlled between 60% and 80% depending on the specific electroplating process. In this embodiment, the through hole ratio is 70%. The through hole ratio is the ratio of the sum of the areas of the through holes on the plate surface to the area of ​​the corresponding plate surface.

[0026] Movable anode scrapers 12 are provided on both sides of the oxidation anodes 13 in the plating tank 6 of the tank body 1. The anode scraper 12 includes a scraper base plate and a soft scraper blade fixedly installed on the base plate. Two slides are provided on the scraper base plate, and a scraper guide rod 11 is slidably mounted on each slide. The scraper guide rod 11 is fixedly installed on the tank body 1. A drive nut is also installed on the scraper base plate. The drive nut and the scraper screw 14 form a screw-nut drive pair. The drive end of the scraper screw 14 is connected to the output end of the screw motor 10. The screw motor 10 is installed on the outside of the end plate of the tank body 1 and is a geared motor.

[0027] The above are only some preferred embodiments of this utility model, but this utility model is not limited thereto, and many improvements and modifications can be made. Any improvements and modifications made based on the basic principles of this utility model should be considered to fall within the protection scope of this utility model.

Claims

1. A uniform flow field cemented carbide anodizing device, comprising a tank body (1) and an anode (13) for oxidation, the anode (13) for oxidation is installed on the two side plates of the tank bore of the tank body (1), characterized in that: The groove body (1) is fixedly installed with liquid uniformizing cavity orifice plate (17) and reflux cavity orifice plate (8) at the front and rear ends of the bore, respectively, the liquid uniformizing cavity orifice plate (17) is adjustably installed with adjusting orifice plate (15); the liquid uniformizing cavity orifice plate (17) and the end plate of the corresponding end of the groove body (1) enclose stirring liquid uniformizing cavity (2), the stirring device (20) is arranged in the cavity of the stirring liquid uniformizing cavity (2); the reflux cavity orifice plate (8) and the end plate of the corresponding end of the groove body (1) enclose reflux cavity (7), the reflux cavity (7) is connected to the stirring liquid uniformizing cavity (2) through circulation pipeline (3); the movable anode scraper (12) is arranged on the oxidation anode (13).

2. The uniform flow field cemented carbide anodizing device according to claim 1, characterized in that: The liquid uniformizing orifice (18) on the liquid uniformizing cavity orifice plate (17) and the liquid uniformizing adjusting orifice (16) on the adjusting orifice plate (15) are one-to-one corresponding, the adjusting orifice plate (15) is adjustably installed on the liquid uniformizing cavity orifice plate (17) through orifice plate adjusting bolt (21).

3. The uniform flow field cemented carbide anodizing apparatus according to claim 1, characterized in that: The stirring device (20) adopts paddle stirring device, the stirring device (20) is drivingly connected with stirring motor (19).

4. The uniform flow field cemented carbide anodizing device according to claim 3, characterized in that: The stirring motor (19) is a speed reducer motor.

5. The uniform flow field cemented carbide anodizing apparatus according to claim 1, characterized in that: The circulation pipeline (3) is serially connected with filter (5) and circulation pump (4), the filter (5) is located at the suction end of the circulation pump (4).

6. The uniform flow field cemented carbide anodizing apparatus according to claim 1, characterized in that: The plate surface of the reflux cavity orifice plate (8), adjusting orifice plate (15) and liquid uniformizing cavity orifice plate (17) is uniformly distributed with a plurality of through holes, the through hole rate of the liquid uniformizing cavity orifice plate (17) is equal to the through hole rate of the reflux cavity orifice plate (8).

7. The uniform flow field cemented carbide anodizing device according to claim 6, characterized in that: The through hole rate of the reflux cavity orifice plate (8), adjusting orifice plate (15) and liquid uniformizing cavity orifice plate (17) is 60%-80%.

8. The uniform flow field cemented carbide anodizing apparatus according to claim 1, characterized in that: The anode scraper (12) is slidingly supported on scraper guide rod (11), the scraper screw rod (14) is also screwed on the anode scraper (12), the scraper screw rod (14) is drivingly connected with screw rod motor (10).

9. The uniform flow field cemented carbide anodizing apparatus according to claim 8, characterized in that: The screw rod motor (10) is a speed reducer motor.