Batch burning test system for tilt angle sensors

Abstract

The utility model relates to a batch burning test system of a tilt angle sensor. The batch burning test system comprises a batch burning test tool, a plurality of test terminals and a plurality of test terminals, wherein the batch burning test tool is used for realizing batch clamping, replacement and test connection of a to-be-tested makeup PCB (Printed Circuit Board); the double-shaft rotary table is used for rotating the batch burning test tool to different test angles under the control of the upper computer; and the upper computer is connected with the to-be-tested makeup PCB through the burner and the data acquisition unit so as to realize burning of a test program and acquisition and conversion of output data of the tilt angle sensor, and performs rough test result judgment. The utility model has the advantages that the production efficiency is greatly improved, the product yield is improved, the operation complexity is simplified, the degree of dependence on operators is reduced, the manual intervention is reduced, and the like.

Description

Technical Field

[0001] This utility model relates to the field of tilt sensor production and testing, and in particular to a batch programming and testing system for tilt sensors. Background Technology

[0002] In the production process of tilt sensors, the circuit board (PCB) must pass programming and preliminary testing before proceeding to the next step. Programming involves writing firmware into the microcontroller on the circuit board, while preliminary testing is performed after firmware programming to check whether the circuit board's operating current and output signals are normal.

[0003] Currently, the programming process relies on manually connecting the programming cables to the circuit boards of the tilt sensors under test one by one, followed by connecting the output and power cables. Testing is then done manually by monitoring whether the supply current and output signal meet the required standards. However, this method is inefficient and prone to errors during repetitive operations. Furthermore, the operator's skill level significantly impacts production efficiency and yield. During the programming and initial testing phases, operators frequently handle the circuit boards, and static electricity from their bodies can damage electronic components, leading to a decrease in yield. More seriously, some components damaged by static electricity may not show immediate problems, but their lifespan is significantly shortened, affecting the overall product lifespan. Therefore, there is a need to develop a batch programming and testing system for tilt sensors. Utility Model Content

[0004] To address the technical problems in the background art, this utility model provides a batch programming and testing system for tilt sensors, used to realize batch programming, rough testing, and debugging of tilt sensors of different models. The system includes:

[0005] Batch programming and testing fixture: used to enable batch clamping, replacement and testing of PCB panels to be tested;

[0006] Dual-axis rotary table: used to rotate the batch programming and testing fixture to different testing angles under the control of the host computer;

[0007] The host computer is connected to the PCB panel under test via a programmer and a data acquisition unit to program the test and acquire and convert the output data of the tilt sensor, and to make a rough judgment on the test results.

[0008] Furthermore, the batch programming test fixture includes an upper fixed part and a lower replacement part. The upper fixed part is pressed down and lifted by a press-pull quick clamp. The lower replacement part is installed on the dual-axis turntable, and different models of the panelized PCBs to be tested correspond to their respective lower replacement parts.

[0009] Furthermore, the upper fixing part includes an upper clamping plate made of magnetic material and covered with an insulating layer on its lower surface, and a plurality of upper magnetic assemblies respectively adsorbed on the lower surface of the upper clamping plate. Each upper magnetic assembly includes a first stud with internal threaded holes at both ends, and a first countersunk magnet fixedly disposed at the upper and lower end faces of the first stud through threaded holes.

[0010] Furthermore, the lower replacement part includes, from top to bottom, the PCB to be tested, the lower positioning component, the PCB tooling board, the lower magnetic component, and the lower clamping plate made of magnetic material with an insulating layer on its upper surface, and the lower clamping plate is mounted on the dual-axis turntable.

[0011] Furthermore, the PCB fixture is a PCB board with the same structure as the panelized PCB under test but without electronic components. Both the PCB fixture and the panelized PCB under test have the same programming port, power supply port, data output port, mounting and positioning holes, and internal wiring. Both are supported and assisted in positioning by the lower positioning component.

[0012] Furthermore, the PCB fixture board and the PCB panel to be tested are positioned by positioning pins and mounting positioning holes, and each corresponding programming port, power supply port and data output port communicates through telescopic spring probes. The lower end of the telescopic spring probe is soldered to the PCB fixture board, and the upper end is inserted and pressed against the corresponding port of the PCB panel to be tested.

[0013] Furthermore, the lower positioning component includes a second iron stud, and the lower magnetic attraction component includes a third copper stud with internal threaded holes at both ends and a second countersunk magnet disposed on the lower end face of the third stud and adsorbed onto the upper surface of the lower clamping plate. The upper end face of the second stud is a flat surface, and the lower end is threaded and, after passing through the PCB fixture plate, engages with the threaded hole on the upper end face of the third stud to tighten it.

[0014] Furthermore, the attraction force of the first countersunk magnet at the upper end face of the first stud is greater than that of the first countersunk magnet at the lower end face, and the attraction force of the first countersunk magnet at the upper end face of the first stud is the same as that of the second countersunk magnet at the lower end face of the third stud.

[0015] Furthermore, the lengths of both the first stud and the second stud are greater than the height of the electronic components on the PCB panel to be tested.

[0016] A batch programming and testing method for tilt sensors includes the following steps:

[0017] 1) Assemble the entire batch programming fixture board: For the tilt sensor of the current model to be tested, install the telescopic spring probe, positioning pin, second stud and third stud at the corresponding positions on the PCB fixture board to form the entire batch programming fixture board;

[0018] 2) Positioning the upper magnetic suction assembly: The entire batch programming fixture board is attracted to the lower clamping plate by the second countersunk magnet, so that the first stud is aligned and attracted to the upper end face of the second stud by the first countersunk magnet on its lower end face. After pressing down the upper clamping plate to attract the first countersunk magnet on the upper end face of the first stud to the upper clamping plate, the upper clamping plate is lifted up to separate the first stud from the second stud.

[0019] 3) Install the PCB under test: Align the PCB under test with the mounting positioning hole using the positioning pin, and after aligning the corresponding port with the head of the telescopic spring probe, press down the upper clamping plate to make the head of the compressed telescopic spring probe fully extend into the corresponding port of the PCB under test, and make the upper end of the positioning pin fully inserted into the corresponding mounting positioning hole, so as to realize stable power supply and data communication between the PCB under test and the PCB fixture board.

[0020] 4) Batch programming test: The batch programming test fixture with the PCB to be tested installed is mounted on the dual-axis turntable. The host computer sends the programming firmware through the programmer. The data acquisition device automatically collects and monitors the operating current and output angle information of each tilt sensor PCB to be tested on the PCB to be tested. The dual-axis turntable is controlled to rotate to the set angle, and the angle data output by each tilt sensor PCB to be tested is monitored to see if there is a regular change. After the programming and rough test are qualified, the upper clamp is lifted, the current PCB to be tested is removed, and then the next PCB to be tested is replaced according to steps 1)-3) until the programming and testing process of all PCBs to be tested for the current model is completed.

[0021] Compared with the prior art, the present invention has the following advantages:

[0022] This invention provides a batch programming and testing system for tilt sensors, replacing the original manual wiring and individual programming and testing method. This significantly improves production efficiency, reduces operational complexity, and decreases reliance on operators, effectively increasing product yield. Furthermore, this invention features a compact structure and easy installation, enabling batch programming and testing using existing dual-axis turntables and host computers. Additionally, for testing different models of tilt sensors, corresponding batch programming fixtures can be prepared in advance; during testing, only the entire fixture needs to be replaced, making it convenient, fast, and efficient. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the system structure of this utility model;

[0024] Figure 2A schematic diagram of the main structure of the batch programming and testing fixture;

[0025] Figure 3 A side view of the batch programming test fixture.

[0026] Figure 4 Isometric view of the batch programming and testing fixture;

[0027] Figure 5 This is a schematic diagram of the third stud.

[0028] Figure 6 This is a flowchart illustrating the usage method of a batch programming and testing system for tilt sensors.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Batch programming and testing fixture; 11. Upper clamping plate; 12. Lower clamping plate; 13. PCB to be tested; 14. PCB fixture board; 15. First countersunk magnet; 16. First stud; 17. Telescopic spring probe; 18. Second stud; 19. Third stud; 110. Second countersunk magnet; 21. Programmer; 22. Data acquisition unit; 3. Dual-axis rotary table; 4. Host computer. Detailed Implementation

[0031] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. This embodiment is based on the technical solution of the present invention and provides detailed implementation methods and specific operating procedures; however, the scope of protection of the present invention is not limited to the following embodiments.

[0032] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of this embodiment, it should be noted that the terms "upper," "lower," "inner," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0034] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0035] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0036] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0037] Example

[0038] like Figure 1 As shown, this utility model provides a batch programming and testing system for tilt sensors, which can adapt to different models and types of tilt sensors and perform batch programming, coarse testing, and debugging. The system includes a host computer 4, a dual-axis turntable 3, a programmer 21, a data acquisition unit 22, and a batch programming and testing fixture 1. The batch programming and testing fixture 1 is mounted on the dual-axis turntable 3 via an operating table. The operating table has a pull-out quick clamp that can be pressed down on the top of the batch programming and testing fixture 1. The host computer 4 is connected to the dual-axis turntable 3 and controls the rotation of the dual-axis turntable 3, so that the batch programming and testing fixture 1 is positioned at different testing angles. The host computer 4 has a programming and coarse testing program installed. It communicates with the batch programming and testing fixture 1 through the programmer 21 and the data acquisition unit 22 to complete the programming, conversion and acquisition of output data, and perform coarse testing to determine whether it is qualified.

[0039] In this example, the programmer 21 is specifically an 8-channel USB to TTL circuit board. Each serial port can be independently controlled and communicated, and programming is performed through ISP, enabling simultaneous programming of 8 channels.

[0040] The data acquisition unit 22 is designed to accommodate tilt sensor PCBs with different data output types. The data output types of the tilt sensor PCBs include digital and analog signals. Digital signals include CAN, 232, 485, 3.3VTTL, and 5VTTL signals, while analog signals include current and voltage signals. The data acquisition unit 22 can convert these different types of output data and send them to the host computer 4. In addition, the programmer 21 and the data acquisition unit 22 can be set separately or integrated on the same circuit board to reduce space occupation.

[0041] like Figure 2-4As shown, the batch programming test fixture 1 mainly consists of two parts: an upper fixing part and a lower replacement part. The upper fixing part includes an upper clamping plate 11 and multiple upper magnetic components. Each upper magnetic component corresponds to each tilt sensor PCB to be tested on the PCB panel to be tested. The upper clamping plate 11 is specifically a magnetic material plate (in this example, a steel plate or iron plate) with an insulating layer on its lower surface. It serves both as a magnetic attraction and as a means to prevent electromagnetic interference. Its upper surface is set opposite to the pull-out quick clamp. When the head of the pull-out quick clamp is pressed down, it presses against the upper surface of the upper clamping plate.

[0042] Each upper magnetic attachment assembly includes a copper cylindrical first stud 16 with internal threaded holes at both ends, and a first countersunk magnet 15 fixedly disposed at the upper and lower end faces of the first stud 16 through threaded holes. The first stud 16 is attracted to the lower surface of the upper clamping plate 11 by the first countersunk magnet 15 on the upper end face, and is attracted to the lower replacement part by the first countersunk magnet 15 on the lower end face. In this example, the length of the first stud 16 is set to 3-4cm, the purpose of which is to offset the electrical components installed on the upper surface of the panel PCB 13 to be tested in height.

[0043] The lower replacement part, from top to bottom, includes the panel PCB 13 to be tested (in this example, the panel PCB 13 to be tested has 8 tilt sensor PCBs with 2*4 on it), PCB fixture board 14, lower positioning assembly, lower magnetic suction assembly and lower clamping plate 12. The lower clamping plate 12 is fixed on the dual-axis turntable and rotates with the dual-axis turntable to different test angles. Its structure is the same as the upper clamping plate 11, and its upper surface is also covered with an insulating layer.

[0044] Multiple lower magnetic assemblies are provided, each corresponding to each tilt sensor PCB under test on the PCB panel to be tested, and each lower magnetic assembly includes a copper cylindrical third stud 19 with internal threaded holes at both ends (e.g. Figure 5 (as shown) and a second countersunk magnet 110 fixedly installed at the lower end face of the third stud 19 through a threaded hole, the third stud 19 being attracted to the upper surface of the lower clamping plate 12 by the second countersunk magnet 110 at the lower end face;

[0045] The PCB fixture 14 is a PCB board with the same structure as the panel PCB 13 under test, except that it does not have corresponding electronic components such as resistors, inductors, and chips soldered on it. Both have the same programming port, power supply port, data output port, mounting and positioning holes, and internal wiring. The two communicate through multiple telescopic spring probes 17. The bottom of the telescopic spring probe 17 is soldered to the corresponding port of the PCB fixture 14, and the retractable needle-shaped top is plugged into the corresponding port of the panel PCB 13 under test. During programming test, after the corresponding telescopic spring probe 17 is installed, the pull-out quick clamp needs to be operated to press down the upper clamp 11, thereby driving the panel PCB 13 under test to press down the telescopic spring probe 17, ensuring stable communication between the panel PCB 13 under test and the PCB fixture 14.

[0046] To ensure complete alignment and prevent misalignment between the PCB fixture 14 and the PCB to be tested 13, positioning is achieved using locating pins at the four corners in conjunction with mounting locating holes. Additionally, lower positioning components are needed for support and auxiliary positioning. Multiple lower positioning components are provided, each including a hexagonal iron second stud 18. It is important to note that the upper surface of the second stud 18 is a flat surface. After the upper clamping plate 11 is pressed down, it contacts the lower surface of the PCB to be tested 13, where it is attracted by the first countersunk magnet 15 on the lower surface of the first stud 16. A screw is located on the lower surface of the second stud 18, which, after passing through the PCB fixture 14, engages with the threaded hole on the upper surface of the third stud 19 to tighten and secure the PCB fixture 14. In this example, the length of the second stud 18 is set to 3-4 cm to offset the electrical components mounted on the lower surface of the PCB to be tested 13 in height.

[0047] In addition, in order to better replace and position the lower replacement part, in this utility model, the attraction force of the first countersunk magnet 15 at the upper end face of the first stud 16 is greater than that of the first countersunk magnet 15 at the lower end face, and the attraction force of the first countersunk magnet 15 at the upper end face of the first stud 16 is similar to or the same as that of the second countersunk magnet 110 at the lower end face of the third stud 19, so as to ensure that it is stably attached to the upper and lower clamping plates.

[0048] In this way, the PCB 13 to be tested is positioned with the PCB fixture board 14 through the lower positioning component and positioning pin, and forms a whole after communicating with multiple telescopic spring probes 17. This whole is then attached to the lower clamping plate 12 by the lower magnetic component to form a complete lower replacement part. It can be seen that the lower replacement part is a unified whole. When it is necessary to perform batch programming tests on tilt sensors of different models, the PCB of the tilt sensor to be tested can be pre-assembled into the lower replacement part, and then the whole replacement can be performed to speed up the programming test efficiency.

[0049] The host computer 4 is connected to the corresponding programming port of the PCB fixture board 14 through the 8-channel programmer 21 to complete the batch programming process. The host computer 4 is also connected to the corresponding data output port on the PCB fixture board 14 through the data acquisition unit 22 to receive the output data of each tilt sensor PCB under test, thereby realizing automated coarse measurement and determining whether the output data changes regularly when the dual-axis turntable rotates to the test angle.

[0050] like Figure 6 As shown, based on the above-mentioned batch programming and testing system for tilt sensors, this utility model also provides a batch programming and testing method for tilt sensors, the specific steps of which are as follows:

[0051] I. Preparation Stage:

[0052] 11) For a specific model of tilt sensor PCB to be tested, first weld the bottom of the telescopic spring probe to the corresponding port of the PCB fixture (including power port, programming port, data output port, etc.), then fix the bottom of the positioning pin to the positioning hole of the PCB fixture, and assemble the second stud and the third stud with the second countersunk magnet to the upper and lower surfaces of the PCB fixture respectively, thereby forming the batch programming fixture of the tilt sensor of this model.

[0053] 12) After the entire batch programming fixture board is attached to the upper surface of the lower clamping plate by the second countersunk magnet at the bottom of the third stud, the first countersunk magnet on the lower end face of the first stud is attached to the upper end face of the third stud for positioning. The upper clamping plate is pressed down so that the first countersunk magnet on the upper end face of the first stud is attached to the upper clamping plate. Since the attraction force of the first countersunk magnet on the upper end face of the first stud is greater than that of the first countersunk magnet on the lower end face, the upper clamping plate is then lifted up, and the first countersunk magnet on the lower end face of the first stud separates from the upper end face of the third stud, thus completing the positioning of the first stud on the upper clamping plate.

[0054] 13) Align the PCB panel to be tested with the positioning pins to the positioning holes to achieve initial positioning, and align the corresponding ports with the heads of the telescopic spring probes to achieve initial communication contact and provide auxiliary support (before installing and positioning the PCB panel to be tested, the top of the positioning pins and the heads of the telescopic spring probes are at the same height in the vertical direction, while the upper surface of the second stud is about 1-2mm lower than the top of the positioning pins and the heads of the telescopic spring probes to provide space for downward pressure). At this time, press down the upper clamping plate of the pull-out quick clamp (its stroke is 1-2mm), thereby compressing the heads of the telescopic spring probes to fully extend into the corresponding ports of the PCB panel to be tested, and making the upper end of the positioning pin fully inserted into the corresponding positioning hole, ensuring power supply and data communication between the PCB panel to be tested and the PCB fixture board;

[0055] II. Testing Phase

[0056] The batch programming and testing fixture with the PCB to be tested mounted is installed on a dual-axis turntable. The host computer sends the programming firmware through the programmer. The data acquisition device automatically collects and monitors the operating current and output angle of each tilt sensor PCB to be tested on the PCB to be tested. The dual-axis turntable is controlled to rotate to the set angle. The angle data output by each tilt sensor PCB to be tested is monitored to see if there is a regular change. After the programming and rough test are qualified, the upper clamp is lifted and the current PCB to be tested is removed. Then, the next PCB to be tested is replaced according to step 13). The testing stage is repeated until the programming and testing process of all PCBs to be tested is completed.

[0057] If you need to program and test a panel PCB of a different model of tilt sensor, you need to install a telescopic spring probe, a second stud, and a third stud on the PCB fixture board according to the positioning holes and ports of the panel PCB of that model to form a new batch programming fixture board. Replace the entire fixture board during testing to proceed with the subsequent batch programming and testing steps.

[0058] In summary, this utility model provides a batch programming and testing system and method for tilt sensors, replacing the original manual wiring and individual programming and testing method. This significantly improves production efficiency, reduces operational complexity, and decreases reliance on operators, effectively increasing product yield. Furthermore, this utility model has a compact structure and is easy to install. It can utilize existing dual-axis turntables and host computers to complete batch programming and testing. Additionally, for testing different models of tilt sensors, corresponding batch programming fixtures can be prepared in advance, requiring only complete replacement during testing, making it convenient, fast, and efficient.

[0059] The preferred embodiments of this utility model have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of this utility model without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of this utility model through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A batch burning test system of a tilt sensor, which is used to realize batch burning, rough measurement and debugging of different models of tilt sensors, characterized in that, The system comprises: A batch burning test tool (1) for realizing batch clamping, replacement and test connection of the to-be-tested PCB (13); A double-axis turntable (3) for realizing rotation of the batch burning test tool (1) to different test angles under the control of the upper computer (4); The upper computer (4) is connected with the to-be-tested PCB (13) through a burner (21) and a data collector (22) to realize burning of a test program, collection and conversion of output data of an inclination sensor, and rough measurement result judgment.

2. The mass burn-in test system of a tilt sensor according to claim 1, wherein, The batch burning test tool (1) comprises an upper fixing part and a lower replacement part, the upper fixing part is realized by pressing and pulling type quick clamps, the lower replacement part is installed on the double-axis turntable (3), and different models of to-be-tested PCBs (13) correspond to respective lower replacement parts.

3. A mass burn-in test system for tilt sensors as claimed in claim 2, wherein, The upper fixing part comprises an upper clamping plate (11) made of magnetic material and covered with an insulating layer on the lower surface, and a plurality of upper magnetic attraction assemblies respectively attached to the lower surface of the upper clamping plate (11), each upper magnetic attraction assembly comprises a first threaded hole at both ends of a first stud (16), and a first countersunk magnet (15) fixedly arranged at the upper and lower ends of the first stud (16) through the threaded holes.

4. The mass burn-in test system of claim 3, wherein, The lower replacement part comprises a to-be-tested PCB (13), a lower positioning assembly, a PCB tool plate (14), a lower magnetic attraction assembly and a lower clamping plate (12) made of magnetic material and covered with an insulating layer on the upper surface, which are sequentially arranged from top to bottom, and the lower clamping plate (12) is installed on the double-axis turntable (3).

5. A bulk burn-in test system for tilt sensors as claimed in claim 4, wherein, The PCB tool plate (14) is a PCB plate member with the same structure as the to-be-tested PCB (13) and without electronic components, the PCB tool plate (14) and the to-be-tested PCB (13) have the same burning port, power supply port, data output port, mounting positioning hole and internal wiring, and are supported and auxiliary positioned by the lower positioning assembly.

6. A bulk burn-in test system for tilt sensors as claimed in claim 5, wherein, The PCB tool plate (14) and the to-be-tested PCB (13) are positioned by the positioning pin cooperating with the mounting positioning hole, and each corresponding burning port, power supply port and data output port is communicated by a telescopic spring probe (17), the lower end of the telescopic spring probe (17) is welded on the PCB tool plate (14), and the upper end is inserted and pressed in the corresponding port of the to-be-tested PCB (13).

7. The mass burn-in test system for tilt sensors of claim 5, wherein, The lower positioning assembly comprises a second threaded hole at both ends of a second stud (18) made of iron, the lower magnetic attraction assembly comprises a third threaded hole at both ends of a third stud (19) made of copper and a second countersunk magnet (110) arranged on the lower end surface of the third stud (19) and attached to the upper surface of the lower clamping plate (12), the upper end surface of the second stud (18) is a flat surface, the lower end is provided with a threaded hole and is screwed with the threaded hole of the upper end surface of the third stud (19) after passing through the PCB tool plate (14).

8. A bulk burn-in test system for tilt sensors as claimed in claim 7, wherein, The suction force of the first countersunk magnet (15) at the upper end face of the first stud (16) is greater than the suction force of the first countersunk magnet (15) at the lower end face, and the suction force of the first countersunk magnet (15) at the upper end face of the first stud (16) is the same as the suction force of the second countersunk magnet (110) at the lower end face of the third stud (19).

9. The mass burn-in test system for tilt sensors of claim 7, wherein, The lengths of the first stud (16) and the second stud (18) are higher than the height of the electronic components on the to-be-tested layout PCB (13).

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