Semiconductor wafer surface defect detection device

Abstract

The utility model relates to the technical field of defect detection, in particular to a semiconductor wafer surface defect detection device which comprises a box body, the upper surface of the box body is fixedly connected with a controller, the upper surface of the box body is fixedly connected with a display, the side surface of the box body is fixedly connected with a servo motor, and the servo motor is fixedly connected with the controller. A servo motor is arranged on the base, the output end of the servo motor is fixedly connected with a reciprocating screw rod, the outer surface of the reciprocating screw rod is movably connected with a visual module, and the visual module comprises a second detection plate and a mounting seat. The two cameras carry out visual information input on the lower portion, two rows of crystals can be detected at the same time, the detection efficiency is improved, when the two cameras are opposite, visual information input can be carried out on the front faces and the back faces of the crystals in the same row at the same time, the device is suitable for refined detection of the single row of crystals, and the detection mode is more flexible.

Description

Technical Field

[0001] This utility model relates to the field of defect detection technology, specifically a semiconductor wafer surface defect detection device. Background Technology

[0002] The defect detection device is used to detect defects on the outer surface of semiconductor wafers. Semiconductor wafers are key materials for manufacturing IGBTs. In the prior art, visual inspection is used for detection. For reference, there is a semiconductor wafer surface defect detection device described in announcement number CN222600960U, which includes a detection box. A motor is fixedly connected to the side surface of the detection box. A second rotating shaft is provided on the front surface of the motor. A second gear is fixedly connected to the front surface of the second rotating shaft. A first gear is meshed with the outer surface of the second gear. A first rotating shaft is fixedly connected to the rear surface of the first gear.

[0003] The aforementioned device assists in detection by rotating the clamped wafer, and can detect the front circuit part and the back polished part of the wafer. However, it cannot record information from both sides at the same time, and the method of recording surface information is relatively simple. When focusing on detecting the circuit part, it still performs single-row detection, which reduces the detection efficiency of the device. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor wafer surface defect detection device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor wafer surface defect detection device includes a housing, a controller fixedly connected to the upper surface of the housing, a display fixedly connected to the upper surface of the housing, a servo motor fixedly connected to the side surface of the housing, and a reciprocating lead screw fixedly connected to the output end of the servo motor.

[0007] A vision module is movably connected to the outer surface of the reciprocating lead screw. The vision module includes a second detection plate and a mounting base. The second detection plate is fitted to the outer surface of the reciprocating lead screw. A hinge plate is hinged to one end of the second detection plate, and a first detection plate is hinged to one end of the hinge plate. There are two mounting bases, which are respectively fixedly connected to the upper surfaces of the first and second detection plates. A camera is fixedly connected to the lower surface of the mounting base.

[0008] Furthermore, the box body is equipped with a lifting mechanism, which includes an electric push rod and a slide. The electric push rod is fixedly connected to the upper surface of the box body, and the output end of the electric push rod is fixedly connected to a connecting frame. The slide is slidably connected to the inside of the box body, and the connecting frame and the slide are fixedly connected. A glass plate is placed on the upper surface of the slide.

[0009] Furthermore, the vision module also includes a connecting shaft, a threaded sleeve, and a detection lamp. The connecting shaft is embedded in the side surface of the hinge plate and can hinge the second detection plate and the first detection plate. The two ends of the connecting shaft are threaded, the threaded sleeve is threaded to the two ends of the connecting shaft, and the detection lamp is fixedly connected to the lower surface of the mounting base.

[0010] Furthermore, the reciprocating lead screw is rotatably connected to the inner wall of the housing, and a guide rod is fixedly connected to the inner wall of the housing, the guide rod penetrating the second detection plate.

[0011] Furthermore, the upper surface of the hinge plate is fixedly connected to a wire storage box, the inner bottom surface of the wire storage box is threadedly connected to a limit post, the upper end of the limit post is fixedly connected to a blocking ring, the outer surface of the limit post is nested with a spring, and the outer surface of the limit post is nested with a contact plate.

[0012] Furthermore, the lower surface of the box is fixedly connected to a support leg, the upper surface of the box is provided with a through groove, and the front surface of the box is hinged with a door.

[0013] Furthermore, a wire frame is fixedly connected to the upper surface of the second detection plate, and a rubber sleeve is embedded in the upper surface of the wire frame.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. The shape of the vision module itself is adjustable. When the second detection plate, hinge plate and the first detection plate in the vision module are on the same straight line, the two cameras will input visual information from below, and can detect two rows of crystals at the same time to improve detection efficiency. When the two cameras are facing each other, they can input visual information from both sides of the same row of crystals at the same time, which is suitable for fine detection of single-row crystals and makes the detection method more flexible.

[0016] 2. The crystal is placed on the upper surface of the glass plate. The width of the glass plate can be customized according to actual needs. When testing a single row, a narrow glass plate is used to facilitate flipping the first test plate. The electric push rod is started, and the output end of the electric push rod, together with the connecting frame, drives the slide to move, thereby adjusting the height of the glass plate in the box, which is convenient for testing crystals of different specifications. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of this utility model from another angle;

[0019] Figure 3 This is a schematic diagram of the cross-sectional structure of the box body of this utility model;

[0020] Figure 4 This is a schematic diagram of the visual module structure of this utility model.

[0021] In the diagram: 1. Housing; 101. Support leg; 102. Through slot; 103. Housing door; 2. Servo motor; 201. Reciprocating screw; 202. Guide rod; 3. Lifting mechanism; 301. Electric push rod; 302. Connecting frame; 303. Slide carriage; 4. Glass plate; 5. Controller; 6. Display; 7. Vision module; 701. Hinge plate; 702. Threaded sleeve; 703. First detection plate; 704. Second detection plate; 705. Mounting base; 706. Detection light; 707. Camera; 708. Connecting shaft; 8. Wire frame; 801. Rubber sleeve; 9. Wire storage box; 901. Limiting post; 902. Blocking ring; 903. Spring; 904. Contact plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 In this embodiment of the present invention, a semiconductor wafer surface defect detection device includes a housing 1, a controller 5 fixedly connected to the upper surface of the housing 1, a display 6 fixedly connected to the upper surface of the housing 1, a servo motor 2 fixedly connected to the side surface of the housing 1, and a reciprocating lead screw 201 fixedly connected to the output end of the servo motor 2.

[0024] A vision module 7 is movably connected to the outer surface of the reciprocating lead screw 201. The vision module 7 includes a second detection plate 704 and a mounting base 705. The second detection plate 704 is fitted and connected to the outer surface of the reciprocating lead screw 201. A hinge plate 701 is hinged to one end of the second detection plate 704, and a first detection plate 703 is hinged to one end of the hinge plate 701. There are two mounting bases 705, which are fixedly connected to the upper surfaces of the first detection plate 703 and the second detection plate 704, respectively. A camera 707 is fixedly connected to the lower surface of the mounting base 705.

[0025] Specifically, during use, the vision module 7, in conjunction with the controller 5, detects the outer surface of the semiconductor wafer, and the results are displayed on the display 6. This is existing technology and will not be elaborated further here. The servo motor 2 is started, and the reciprocating screw 201, driven by the spiral groove on the outer surface, enables the vision module 7 to perform reciprocating linear motion. The shape of the vision module 7 itself is adjustable. When the second detection plate 704, the hinge plate 701, and the first detection plate 703 in the vision module 7 are on the same straight line, the two cameras 707 record visual information from below, which can simultaneously detect two rows of crystals, improving detection efficiency. When the two cameras 707 are facing each other, visual information can be recorded from both sides of the same row of crystals at the same time, which is suitable for fine detection of a single row of crystals, making the detection method more flexible.

[0026] Example 1

[0027] like Figure 1-4 As shown, a lifting mechanism 3 is provided inside the housing 1. The lifting mechanism 3 includes an electric push rod 301 and a slide 303. The electric push rod 301 is fixedly connected to the upper surface of the housing 1. A connecting frame 302 is fixedly connected to the output end of the electric push rod 301. The slide 303 is slidably connected to the inside of the housing 1. The connecting frame 302 and the slide 303 are fixedly connected. A glass plate 4 is placed on the upper surface of the slide 303.

[0028] In this embodiment, the crystal is placed on the upper surface of the glass plate 4. The width of the glass plate 4 can be customized according to actual usage requirements. When performing single-row testing, a narrow glass plate 4 is used to facilitate flipping the first testing plate 703. The electric push rod 301 is activated, and the output end of the electric push rod 301, together with the connecting frame 302, drives the slide 303 to move, thereby adjusting the height of the glass plate 4 in the housing 1, which facilitates the testing of crystals of different specifications.

[0029] like Figure 1-3 As shown, a support leg 101 is fixedly connected to the lower surface of the box 1, a through groove 102 is opened on the upper surface of the box 1, and a box door 103 is hinged to the front surface of the box 1.

[0030] In this embodiment, the support leg 101 supports the housing 1, and the through groove 102 facilitates the entry of wires into the housing 1. The connection method of the wires is as follows: Figure 1 , 2 As shown in Figure 3, the door 103 is used to reduce the interference of external factors on the interior of the box 1 during testing.

[0031] Example 2

[0032] Based on Embodiment 1, in order to remedy the problem that the first detection plate 703 is inconvenient to adjust in Embodiment 1.

[0033] like Figure 1-4 As shown, the vision module 7 also includes a connecting shaft 708, a threaded sleeve 702, and a detection lamp 706. The connecting shaft 708 is embedded in and connected to the side surface of the hinge plate 701, and can hinge the second detection plate 704 and the first detection plate 703. The two ends of the connecting shaft 708 are threaded, and the threaded sleeve 702 is threaded to the two ends of the connecting shaft 708. The detection lamp 706 is fixedly connected to the lower surface of the mounting base 705. The reciprocating screw 201 is rotatably connected to the inner wall of the housing 1. The inner wall of the housing 1 is fixedly connected to a guide rod 202, which passes through the second detection plate 704.

[0034] In this embodiment, manually rotating the threaded sleeve 702 removes the squeezing force on the second detection plate 704 and the first detection plate 703, thereby adjusting the angle between the first detection plate 703, the second detection plate 704, and the hinge plate 701, so that the three form a U-shape. Rotating the threaded sleeve 702 in the opposite direction fixes the second detection plate 704 and the first detection plate 703, allowing the two cameras 707 to be positioned opposite each other. The guide rod 202 limits the movement of the second detection plate 704.

[0035] like Figure 1-4 As shown, a wire storage box 9 is fixedly connected to the upper surface of the hinge plate 701. A limit post 901 is threadedly connected to the inner bottom surface of the wire storage box 9. A blocking ring 902 is fixedly connected to the upper end of the limit post 901. A spring 903 is nested and connected to the outer surface of the limit post 901. A contact plate 904 is nested and movably connected to the outer surface of the limit post 901. A wire frame 8 is fixedly connected to the upper surface of the second detection plate 704. A rubber sleeve 801 is embedded and connected to the upper surface of the wire frame 8.

[0036] In this embodiment, since the second detection plate 704 and the first detection plate 703 are restricted by the wire when they are flipped, the length of the wire is adjusted beforehand. Specifically, the excess wire is stored in the wire storage box 9. The contact plate 904 is manually slid upward to overcome the elastic force of the spring 903 and separate from the wire. The wire can then be pulled out from the opening on the side surface of the wire storage box 9. After releasing the wire, it can be re-fixed by the contact plate 904 to compensate for the length of the wire and prevent the wire from affecting the angle adjustment between the first detection plate 703 and the second detection plate 704. Before entering the wire storage box 9, the wire passes through the rubber sleeve 801. The rubber sleeve 801 and the through groove 102 are slidably connected, which can pull the wire when the position of the vision module 7 is adjusted.

[0037] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0038] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor wafer surface defect detection device, comprising a box (1), the upper surface of the box (1) is fixedly connected with a controller (5), the upper surface of the box (1) is fixedly connected with a display (6), the side surface of the box (1) is fixedly connected with a servo motor (2), the output end of the servo motor (2) is fixedly connected with a reciprocating screw rod (201); characterized in that The outer surface of the reciprocating screw rod (201) is movably connected with a vision module (7), the vision module (7) comprises: A second detection plate (704) is movably connected to the outer surface of the reciprocating screw rod (201), one end of the second detection plate (704) is hingedly connected with a hinge plate (701), one end of the hinge plate (701) is hingedly connected with a first detection plate (703); Two mounting seats (705) are fixedly connected to the upper surfaces of the first detection plate (703) and the second detection plate (704) respectively, and the lower surface of the mounting seat (705) is fixedly connected with a camera (707).

2. The semiconductor wafer surface defect inspection apparatus according to claim 1, wherein The inside of the box (1) is provided with a lifting mechanism (3), the lifting mechanism (3) comprises: An electric push rod (301) is fixedly connected to the upper surface of the box (1), the output end of the electric push rod (301) is fixedly connected with a connecting frame (302); A sliding frame (303) is slidingly connected to the inside of the box (1), the connecting frame (302) and the sliding frame (303) are fixedly connected, and the upper surface of the sliding frame (303) is provided with a glass plate (4).

3. The semiconductor wafer surface defect inspection apparatus according to claim 1, wherein The vision module (7) further comprises: A connecting shaft (708) is embeddedly connected to the side surface of the hinge plate (701), the second detection plate (704) and the first detection plate (703) can be hingedly connected, and threads are formed in both ends of the connecting shaft (708); A threaded sleeve (702) is threaded on both ends of the connecting shaft (708); A detection lamp (706) is fixedly connected to the lower surface of the mounting seat (705).

4. The apparatus for detecting surface defects of a semiconductor wafer according to any one of claims 1 to 3, wherein The reciprocating screw rod (201) and the inner wall of the box (1) are rotatably connected, the inner wall of the box (1) is fixedly connected with a guide rod (202), and the guide rod (202) penetrates through the second detection plate (704).

5. The apparatus for detecting surface defects of a semiconductor wafer according to any one of claims 1 to 3, wherein The upper surface of the hinge plate (701) is fixedly connected with a wire storage box (9), the inner bottom surface of the wire storage box (9) is threadedly connected with a limiting column (901), the upper end of the limiting column (901) is fixedly connected with a blocking ring (902), the outer surface of the limiting column (901) is nestedly connected with a spring (903), and the outer surface of the limiting column (901) is nestedly movably connected with a contact plate (904).

6. The semiconductor wafer surface defect inspection apparatus according to claim 1, wherein The lower surface of the box (1) is fixedly connected with a supporting leg (101), the upper surface of the box (1) is provided with a through groove (102), and the front surface of the box (1) is hingedly connected with a box door (103).

7. The semiconductor wafer surface defect inspection apparatus according to claim 1, wherein The upper surface of the second detection plate (704) is fixedly connected with a wire guide frame (8), and the upper surface of the wire guide frame (8) is embeddedly connected with a rubber sleeve (801).

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