Semiconductor device test tool
By designing a semiconductor device testing fixture, the problem of contact deviation caused by displacement was solved, the stability of test data and protection of devices were achieved, the risk of damage was reduced, and the accuracy of testing and the service life of the equipment were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-16
- Publication Date
- 2026-04-03
AI Technical Summary
In the prior art, contact deviations caused by displacement during the testing of semiconductor devices affect the stability of test data, and abnormal situations such as friction and collision can damage test probes and device pins.
The semiconductor device testing fixture includes a test stage, a sliding mounting base, test probes, and a driving device. It achieves precise electrical connection between the test probes and the device through linear motion, and uses structures such as guide posts, reset components, limit blocks, and mounting slots to ensure stability and accurate positioning.
It greatly reduces contact deviation, ensures the stability and accuracy of test data, reduces equipment maintenance costs and raw material consumption, and extends the service life of test fixtures and devices.
Smart Images
Figure CN224081692U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic device testing technology, and more specifically, to a semiconductor device testing fixture. Background Technology
[0002] In the manufacturing process of electronic products, performance testing of power modules is a crucial step, and the accuracy of the test directly affects the product quality and reliability.
[0003] Existing testing devices involve directly mounting the semiconductor device under test onto a drive unit. During testing, the drive unit moves the semiconductor device towards the test component. The drive unit has a large stroke, and displacement can occur in the semiconductor device as it follows the drive unit, leading to contact deviations. This, in turn, can cause contact misalignment between the semiconductor device and the test board pins, affecting the stability of the test data. Utility Model Content
[0004] The purpose of this application is to provide a semiconductor device testing fixture that can improve the testing stability of semiconductor devices.
[0005] The embodiments of this application are implemented as follows:
[0006] This application provides a semiconductor device testing fixture, including a test stage and a mounting base slidably disposed above the test stage. A test circuit is disposed inside the test stage, and a test probe electrically connected to the test circuit is disposed above the test stage. A driving device is disposed above the test stage. After the driving device moves linearly toward the mounting base by a preset stroke, it drives the mounting base to move toward the test stage, so that the test probe passes through the mounting base and electrically connects with the semiconductor device inside the mounting base.
[0007] Optionally, as an implementable method, the test bench is provided with guide posts, and the mounting base is slidably disposed on the guide posts.
[0008] Optionally, as an implementable method, a reset component is provided on the test bench, with its two ends connected to the test bench and the mounting base, respectively.
[0009] Alternatively, as an implementable method, a limit block is provided on the test bench, the limit block being used to abut against the mounting base.
[0010] Alternatively, as one possible implementation, the mounting base is provided with mounting slots for placing semiconductor devices.
[0011] Optionally, as an implementable method, the bottom of the mounting slot is provided with a test hole corresponding to the test probe, and the test probe passes through the test hole to be electrically connected to the semiconductor device in the mounting base.
[0012] Optionally, as one possible implementation, the driving device includes a linear drive and a pressure block disposed on the linear drive, wherein the linear drive drives the pressure block to move toward or away from the mounting base.
[0013] Optionally, as an implementable method, the outer wall of the test bench is provided with a test interface that is electrically connected to the test circuit, and the test equipment is connected through the test interface.
[0014] Optionally, as an implementable method, the test bench is also provided with a switch electrically connected to the test circuit.
[0015] Optionally, as an implementable method, the bottom of the test bench is provided with a positioning groove, through which the test bench is fixed in a preset position.
[0016] The beneficial effects of the embodiments of this application include:
[0017] The semiconductor device testing fixture provided in this application includes a test stage and a mounting base slidably mounted above the test stage. A test circuit is installed inside the test stage, and test probes electrically connected to the test circuit are positioned above the test stage. A driving device is located above the test stage. The driving device moves linearly towards the mounting base for a preset distance, then moves the mounting base towards the test stage, allowing the test probes to pass through the mounting base and electrically connect with the semiconductor device inside. Compared to traditional methods that rely on the semiconductor device directly following the large-scale movement of the driving device, this significantly reduces contact deviations caused by displacement. The mounting base provides stable support and precise positioning for the semiconductor device, ensuring consistent and reliable contact between the semiconductor device and the test probes during each test, effectively guaranteeing the stability of the test data. It reduces abnormal situations such as friction and collisions caused by poor contact between the semiconductor device and the test probes, lowering the risk of damage to the test probe tips and semiconductor device pins. This not only ensures the accuracy of the test data but also extends the service life of the overall testing fixture and the semiconductor device itself, reducing equipment maintenance costs and material waste. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is one of the structural schematic diagrams of the semiconductor device testing fixture provided in the embodiments of this application;
[0020] Figure 2 This is a second schematic diagram of the structure of the semiconductor device testing fixture provided in the embodiments of this application;
[0021] Figure 3 This is the third schematic diagram of the semiconductor device testing fixture provided in the embodiments of this application.
[0022] Icons: 100-Semiconductor device test fixture; 110-Test stage; 111-Test probe; 112-Guide post; 113-Reset component; 114-Limit block; 115-Test interface; 116-Positioning slot; 120-Mounting base; 121-Mounting slot; 122-Test hole; 130-Drive device. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0025] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0026] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0027] Please refer to Figure 1 , Figure 2 and Figure 3 This embodiment provides a semiconductor device testing fixture 100, including a test stage 110 and a mounting base 120 slidably disposed above the test stage 110. A test circuit is disposed inside the test stage 110, and a test probe 111 electrically connected to the test circuit is disposed above the test stage 110. A driving device 130 is disposed above the test stage 110. After the driving device 130 moves linearly toward the mounting base 120 for a preset stroke, it drives the mounting base 120 to move toward the test stage 110, so that the test probe 111 passes through the mounting base 120 and electrically connects with the semiconductor device inside the mounting base 120.
[0028] When using the semiconductor device testing fixture 100 of this application, a semiconductor device is placed in the mounting base 120. When the driving device 130 is started, it first moves linearly towards the mounting base 120 for a preset stroke. This preset stroke is the stroke from the initial position of the driving end to contact with the mounting base 120, allowing the driving device 130 to contact the mounting base 120. After completing this initial stroke, the driving device 130 drives the mounting base 120 to move towards the test stage 110. At this time, the mounting base 120 moves under the push of the driving device 130, allowing the test probe 111 to pass smoothly and accurately through the pre-reserved pinhole channel on the mounting base 120, achieving a tight and deviation-free electrical connection with the semiconductor device fixed in the mounting base 120, thereby establishing a stable test path for reliable performance testing.
[0029] The semiconductor device testing fixture 100 provided in this application includes a test stage 110 and a mounting base 120 slidably disposed above the test stage 110. A test circuit is disposed within the test stage 110, and a test probe 111 electrically connected to the test circuit is disposed above the test stage 110. A driving device 130 is disposed above the test stage 110. After the driving device 130 moves linearly toward the mounting base 120 by a preset stroke, it drives the mounting base 120 to move toward the test stage 110, so that the test probe 111 passes through the mounting base 120 and electrically connects with the semiconductor device inside the mounting base 120. Compared to the traditional method that relies on the semiconductor device directly following the large-scale movement of the driving device 130, this significantly reduces contact deviation caused by displacement. The mounting base 120 provides stable support and precise positioning for the semiconductor device, ensuring that the semiconductor device and the test probe 111 maintain a consistent and reliable contact state during each test, effectively guaranteeing the stability of the test data. This reduces abnormal situations such as friction and collision caused by poor contact between semiconductor devices and test probes 111, and reduces the risk of damage to the tip of test probes 111 and the pins of semiconductor devices. It not only ensures the accuracy of test data, but also extends the service life of the test fixture as a whole and the semiconductor devices themselves, and reduces equipment maintenance costs and raw material consumption.
[0030] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, a guide post 112 is provided on the test bench 110, and the mounting base 120 is slidably disposed on the guide post 112.
[0031] Specifically, a guide post 112 is provided on the test bench 110. The mounting base 120 cooperates with the guide post 112 through a specific sliding structure, allowing the mounting base 120 to slide stably and precisely up and down along the axial direction of the guide post 112. The guide post 112 is typically made of a high-strength, low-friction metal material, such as stainless steel, with a finely ground and polished surface to ensure the smoothness of the sliding process of the mounting base 120 and to have sufficient rigidity to withstand the weight of the mounting base 120 and the semiconductor device, as well as the lateral forces generated during movement. The guide post 112 provides a precise guiding path for the movement of the mounting base 120, effectively avoiding instability such as offset and wobbling during the up and down movement of the mounting base 120, further ensuring the accuracy of the contact between the test probe 111 and the semiconductor device pins, thereby improving the reliability of the test data. On the other hand, compared with a simple planar slide rail structure, the guide post 112 can better distribute the forces other than those in the vertical direction, extending the service life of the entire test fixture and reducing the risk of component wear and deformation due to long-term use.
[0032] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, a reset component 113 is provided on the test bench 110, and the two ends of the reset component 113 are connected to the test bench 110 and the mounting base 120 respectively.
[0033] Specifically, the reset component 113 equipped on the test bench 110 is connected to the mounting base 120 at both ends by reliable connection methods, such as snap-fit connection or threaded connection. The reset component 113 can be made of a spring with good elasticity or elastic rubber. After the mounting base 120 moves toward the test bench 110 under the action of the drive device 130 to complete the test, the reset component 113 uses its own elastic restoring force to pull the mounting base 120 back to the initial position.
[0034] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, a limit block 114 is provided on the test bench 110, and the limit block 114 is used to abut against the mounting base 120.
[0035] Specifically, the limiting block 114 is fixedly installed on the test stage 110. Its position and height are precisely designed according to the movement trajectory of the mounting base 120 and the optimal contact position between the test probe 111 and the semiconductor device. The limiting block 114 is usually made of hard plastic or metal with a certain cushioning treatment on the surface, such as attaching rubber pads. When the mounting base 120 moves downward under the drive of the drive device 130, the limiting block 114 can abut against a specific part of the mounting base 120, preventing the mounting base 120 from moving further downward. This precisely controls the distance between the mounting base 120 and the test stage 110, ensuring that the contact between the test probe 111 and the semiconductor device is just right. By setting the limiting block 114, the downward limit position of the mounting base 120 can be accurately controlled, effectively preventing the test probe 111 from being excessively squeezed and damaged due to excessive downward movement of the mounting base 120. This protects the test probe 111, a key test component, and reduces the maintenance cost of the test fixture. Meanwhile, precise contact control ensures that the electrical connection between the semiconductor device and the test probe 111 remains consistent during each test, which helps improve the repeatability and comparability of test data and provides a guarantee for accurate evaluation of product quality.
[0036] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3As shown, the mounting base 120 is provided with mounting slots 121 for placing semiconductor devices. The mounting slots 121 provide dedicated fixing space for the semiconductor devices, greatly improving their stability within the mounting base 120. Compared to a simple planar placement method, this more effectively prevents device displacement during testing, ensuring accurate alignment between the test probes 111 and the semiconductor device pins, thereby improving test accuracy. Furthermore, this customized mounting slot 121 design for different devices makes the test fixture more versatile, meeting diverse semiconductor device testing needs.
[0037] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the bottom of the mounting slot 121 is provided with a test hole 122 corresponding to the test probe 111. The test probe 111 passes through the test hole 122 and is electrically connected to the semiconductor device inside the mounting base 120. The existence of the test hole 122 provides a direct channel for the connection between the test probe 111 and the semiconductor device, making the electrical connection between the two smoother and more efficient, reducing interference factors in the signal transmission process, and improving the accuracy of test data. In addition, a well-designed test hole 122 can guide the test probe 111 to accurately locate the pin position of the semiconductor device, further optimizing the contact effect and ensuring the reliability of the test. This design advantage is particularly obvious for semiconductor devices with complex pin distributions.
[0038] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the drive device 130 includes a linear drive component and a pressure block mounted on the linear drive component. The linear drive component drives the pressure block to move towards or away from the mounting base 120. The high-precision stroke control of the linear drive component ensures the accuracy of the drive device 130's actions throughout the testing process, allowing the movement of the mounting base 120 to strictly follow the preset procedure, thus improving the controllability of the testing process. The rational design of the pressure block ensures uniform force transmission, effectively pushing the mounting base 120 while protecting it from unnecessary damage, thereby extending the overall service life of the testing fixture and laying the foundation for stable and reliable test data acquisition.
[0039] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3As shown, the outer wall of the test bench 110 is equipped with a test interface 115 that is electrically connected to the test circuit, through which test equipment is connected. The existence of the test interface 115 greatly expands the functional expandability of the test fixture, enabling it to be easily used with external test equipment such as professional oscilloscopes, signal generators, and data acquisition cards, achieving more comprehensive and in-depth test analysis of semiconductor devices. Through standardized interfaces and protective design, not only is the ability to acquire and analyze test data improved, but the reliability and stability of the test fixture in complex test environments are also ensured, meeting the diverse needs of different users and different test scenarios.
[0040] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the test bench 110 is also equipped with a switch electrically connected to the test circuit. The switch provides a convenient control method for the testing process, allowing operators to easily start and stop the test, improving the flexibility and efficiency of the test operation. Simultaneously, through precise circuit control, it effectively prevents problems such as test circuit failure and semiconductor device damage caused by misoperation or prolonged power-on, ensuring the safety of the test fixture and the test object, and reducing test costs.
[0041] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the bottom of the test bench 110 is provided with a positioning groove 116, which fixes the test bench 110 in a preset position. The positioning groove 116 ensures the precise positioning of the test bench 110 in the preset position, providing a basic guarantee for the stable operation of the entire testing fixture. The stable position of the test bench 110 helps to maintain the relative positional relationship between the test probe 111 and the semiconductor device, improving the repeatability and accuracy of the test data. At the same time, preventing displacement of the test bench 110 also avoids problems such as damage to the test components and test interruption that may be caused by accidental movement, improving the reliability and safety of the testing work, and is especially suitable for batch testing scenarios in automated production lines.
[0042] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A semiconductor device testing tool, characterized by, The utility model provides a test platform and mounting seat are slidably arranged above the test platform, the test circuit is arranged in the test platform, the test probe is arranged above the test platform and is electrically connected with the test circuit, driving device is arranged above the test platform, the driving device is linearly moved towards the mounting seat and drives the mounting seat to move towards the test platform after preset stroke, so that the test probe is electrically connected with the semiconductor device in the mounting seat.
2. The semiconductor device testing tool of claim 1, wherein, The test platform is provided with a guide column, and the mounting seat is slidably arranged on the guide column.
3. The semiconductor device testing tool of claim 1, wherein, The test platform is provided with a reset member, and the two ends of the reset member are respectively connected with the test platform and the mounting seat.
4. The semiconductor device testing tool of claim 1, wherein, The test platform is provided with a limiting block, and the limiting block is used for abutting against the mounting seat.
5. The semiconductor device testing tool of claim 1, wherein, The mounting seat is provided with a mounting groove for placing a semiconductor device.
6. The semiconductor device testing tool of claim 5, wherein, The bottom of the mounting groove is provided with a test hole corresponding to the test probe, and the test probe is electrically connected with the semiconductor device in the mounting seat through the test hole.
7. The semiconductor device testing tool of claim 1, wherein, The driving device comprises a linear driving member and a pressing block arranged on the linear driving member, and the pressing block is driven by the linear driving member to move towards or away from the mounting seat.
8. The semiconductor device testing tool of claim 1, wherein, The outer wall of the test platform is provided with a test interface electrically connected with the test circuit, and the test equipment is connected through the test interface.
9. The semiconductor device testing tool of claim 1, wherein, The test platform is also provided with a switch electrically connected with the test circuit.
10. The semiconductor device testing tool of claim 1, wherein, The bottom of the test platform is provided with a positioning groove, and the test platform is fixed in a preset station through the positioning groove.