Earphone microphone amplifying circuit for internal communication

By optimizing the signal transmission path and simplifying the circuit structure, the problems of sound distortion and insufficient amplification of weak signals in the internal communication of the headphone microphone amplifier circuit were solved, achieving higher communication clarity, reliability and stability, while reducing cost and power consumption.

CN224083679UActive Publication Date: 2026-04-03GUANGZHOU HUALIAN ELECTRIC TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-10
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing headphone microphone amplifier circuits are susceptible to external interference during internal communication, resulting in sound distortion and noise. They also have insufficient amplification capability for weak signals, and their circuit design is complex, costly, and unstable.

Method used

By employing specific component connection methods, including operational amplifier chip U1A, field-field transistor Q11, and transistor Q23, the signal transmission path is optimized, the amplification capability of weak signals is enhanced, and the circuit structure is simplified.

Benefits of technology

It reduces the impact of external interference on audio signals, reduces sound distortion and noise, improves communication clarity and accuracy, enhances the amplification capability of weak signals, reduces cost and power consumption, and improves circuit stability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224083679U_ABST
    Figure CN224083679U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of microphone circuits, and discloses an earphone microphone amplifying circuit for internal communication. Comprising a link socket J4, a resistor R47, a resistor R51, a coupling capacitor C36, a resistor R54, a capacitor C62, an operational amplifier chip U1A, a coupling capacitor C46, a resistor R86, a capacitor C61, a selection channel ESWS3, a resistor R63, a resistor R50, a resistor R59, a capacitor C60, a resistor R49, a field tube Q11, a coupling capacitor C33, a resistor R48, a resistor R57, a coupling capacitor C4, a triode Q23, a resistor R52, a resistor R85 and a capacitor C41. According to the invention, the influence of external interference on sound signals is reduced, sound distortion and noise are effectively reduced, and the definition and accuracy of internal communication are improved; compared with the prior art, the circuit provided by the utility model enhances the amplification capability of weak signals, improves the communication reliability, is simple and reasonable in structure, reduces the use of unnecessary elements, reduces the cost and power consumption, improves the stability of the circuit, and provides an earphone microphone amplification solution with better performance for an internal communication system.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of microphone circuit technology, specifically to an earphone microphone amplifier circuit for internal communication. Background Technology

[0002] In internal communication systems, the headphone microphone serves as a crucial audio input / output device, and the performance of its amplifier circuit directly impacts communication quality. The inventors, in their research on existing headphone microphone amplifier circuits, discovered the following shortcomings:

[0003] 1. The circuit structure design is not reasonable enough, making it susceptible to external interference during signal transmission, resulting in problems such as sound distortion and excessive noise, which seriously affects the clarity and accuracy of internal communication. For example, in noisy environments, it is difficult for the communicating parties to exchange information clearly and accurately;

[0004] 2. Existing amplifier circuits have limited amplification capabilities for weak signals and cannot effectively enhance the strength of audio signals, making voice signals prone to attenuation during transmission and reducing the reliability of communication.

[0005] 3. Some circuits employ complex designs and excessive components, increasing cost and power consumption, and resulting in poor stability.

[0006] In summary, there is an urgent need for a new headphone microphone amplifier circuit for internal communication to solve the above problems. Utility Model Content

[0007] The purpose of this application is to provide a headphone microphone amplifier circuit for internal communication to solve the technical problems mentioned in the background art.

[0008] To achieve the above objectives, this application discloses the following technical solution: a headset microphone amplifier circuit for internal communication, comprising a connector J4, resistors R47 and R51, coupling capacitors C36, R54, and C62, an operational amplifier chip U1A, coupling capacitors C46, ​​R86, and C61, a selection channel ESWS3, resistors R63, R50, R59, C60, and R49, a field-effect transistor Q11, coupling capacitors C33, R48, R57, and C4, a transistor Q23, resistors R52 and R85, and capacitor C41;

[0009] Specifically, pin 1 of the connection socket J4 is connected to the external headphone microphone and then grounded; pin 2 of the connection socket J4 is floating; pin 3 of the connection socket J4 is connected to pin 1 of the resistor R47; pin 2 of the resistor R47 and pin 1 of the resistor R51 are both connected to the negative terminal of the coupling capacitor C36; pin 2 of the resistor R51 is grounded; the positive terminal of the coupling capacitor C36, pin 1 of the resistor R54, and pin 1 of the capacitor C62 are all connected to pin 3 of the operational amplifier chip U1A; pin 2 of the capacitor C62 is grounded; and pin 4 of the operational amplifier chip U1A is connected to... The operational amplifier chip U1A has its pin 8 connected to VCC. The positive terminal of coupling capacitor C46, ​​pin 1 of resistor R86, and pin 1 of capacitor C61 are all connected to pin 1 of operational amplifier chip U1A. The selection channel ESWS3 and pin 1 of resistor R63 are both connected to the negative terminal of coupling capacitor C46. Pin 2 of resistor R63 is connected to GNDA. Pin 2 of capacitor C61, pin 1 of resistor R50, and pin 1 of resistor R59 are all connected to pin 2 of operational amplifier chip U1A. Pin 2 of resistor R50 and pin 1 of resistor R... Pin 2 of resistor R59 is connected to pin 1 of capacitor C60, and pin 2 of capacitor C60 is grounded. Pin 2 of resistor R59 and pin 1 of resistor R49 are both connected to pin 1 of MOSFET Q11. Pin 2 of MOSFET Q11 is connected to the positive terminal of coupling capacitor C33, and the negative terminal of coupling capacitor C33 is grounded. Pin 2 of resistor R49, pin 2 of resistor R54, pin 1 of resistor R48, and pin 1 of resistor R57 are all connected to pin 3 of MOSFET Q11. Pin 2 of resistor R57 is connected to VCC. Pin 2 of resistor R48... The positive terminal of the coupling capacitor C4 and pin 3 of the transistor Q23 are both connected to the negative terminal of the coupling capacitor C4. The negative terminal of the coupling capacitor C4 is grounded. Pin 2 of the transistor Q23 and pin 1 of the resistor R52 are both connected to VCC. Pin 2 of the resistor R52 and pin 1 of the resistor R85 are both connected to pin 1 of the transistor Q23. Pin 2 of the resistor R85 is connected to pin 1 of the capacitor C41. Pin 2 of the capacitor C41 is connected to the positive terminal of the coupling capacitor C46, ​​pin 1 of the resistor R86, pin 1 of the capacitor C61, and pin 1 of the operational amplifier chip U1A.

[0010] Beneficial effects: The headset microphone amplification circuit for internal communication disclosed in this application optimizes the signal transmission path, reduces the impact of external interference on the sound signal, effectively reduces sound distortion and noise, and improves the clarity and accuracy of internal communication; it enhances the amplification capability of weak signals, avoids attenuation of voice signals during transmission, improves communication reliability, and has a simple and reasonable circuit structure, reducing the use of unnecessary components, lowering costs and power consumption, while improving circuit stability, providing a superior headset microphone amplification solution for internal communication systems. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 The circuit diagram is provided for an embodiment of the present application for an earphone microphone amplifier circuit for internal communication. Detailed Implementation

[0013] The technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0014] In this document, the term "comprising" is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0015] This embodiment discloses, as follows: Figure 1 The diagram shows a headset microphone amplifier circuit for internal communication, comprising: connector J4, resistors R47 and R51, coupling capacitors C36, R54, and C62; operational amplifier chip U1A, coupling capacitor C46, ​​resistors R86 and C61; selection channel ESWS3, resistors R63, R50, R59, C60, and R49; MOSFET Q11, coupling capacitor C33, resistors R48 and R57, coupling capacitor C4; transistor Q23, resistors R52 and R85; and capacitor C41.

[0016] In this configuration, pin 1 of connector J4 is connected to the external headphone microphone and then grounded; pin 2 of connector J4 is left floating; pin 3 of connector J4 is connected to pin 1 of resistor R47; pins 2 of resistor R47 and pin 1 of resistor R51 are both connected to the negative terminal of coupling capacitor C36; pin 2 of resistor R51 is grounded; the positive terminal of coupling capacitor C36, pin 1 of resistor R54, and pin 1 of capacitor C62 are all connected to pin 3 of operational amplifier chip U1A; pin 2 of capacitor C62 is grounded; pin 4 of operational amplifier chip U1A... Pin 8 of op-amp chip U1A is grounded. Pin 8 is connected to VCC. The positive terminal of coupling capacitor C46, ​​pin 1 of resistor R86, and pin 1 of capacitor C61 are all connected to pin 1 of op-amp chip U1A. Select channel ESWS3 and pin 1 of resistor R63 are both connected to the negative terminal of coupling capacitor C46. Pin 2 of resistor R63 is connected to GNDA. Pin 2 of capacitor C61, pin 1 of resistor R50, and pin 1 of resistor R59 are all connected to pin 2 of op-amp chip U1A. Pin 2 of resistor R50 and resistor R59 are also connected to pin 2 of op-amp chip U1A. Pin 2 of resistor R86 is connected to pin 1 of capacitor C60, and pin 2 of capacitor C60 is grounded. Pin 2 of resistor R59 and pin 1 of resistor R49 are both connected to pin 1 of MOSFET Q11. Pin 2 of MOSFET Q11 is connected to the positive terminal of coupling capacitor C33, and the negative terminal of coupling capacitor C33 is grounded. Pin 2 of resistor R49, pin 2 of resistor R54, pin 1 of resistor R48, and pin 1 of resistor R57 are all connected to pin 3 of MOSFET Q11. Pin 2 of resistor R57 is connected to VCC, and pin 2 of resistor R48... The positive terminal of pin 3 of transistor Q23 and the positive terminal of coupling capacitor C4 are both connected to pin 3 of transistor Q23. The negative terminal of coupling capacitor C4 is grounded. Pin 2 of transistor Q23 and pin 1 of resistor R52 are both connected to VCC. Pin 2 of resistor R52 and pin 1 of resistor R85 are both connected to pin 1 of transistor Q23. Pin 2 of resistor R85 is connected to pin 1 of capacitor C41. Pin 2 of capacitor C41 is connected to the positive terminal of coupling capacitor C46, ​​pin 1 of resistor R86, pin 1 of capacitor C61, and pin 1 of op-amp chip U1A.

[0017] In one specific application of this embodiment, the external headphone microphone T1 is connected to pin 1 of the connector J4 (in this embodiment, the connector J4 is a 3PKF3500 straight pin connector SIP3), and then connected in series with resistor R47 to coupling capacitor C36. After amplification, the signal flows into pin 3 of the operational amplifier chip U1A (in this embodiment, the operational amplifier chip U1A is an LM833) for in-phase input. At this time, capacitor C62 is used for power supply filtering. Two signals are output from pin 1 of op-amp chip U1A. One signal is coupled and amplified by coupling capacitor C46 and output; the other signal is fed back through capacitor C41 and supplied to the base (pin 1) of transistor Q23 via resistor R85. After amplification at the collector (pin 3) of transistor Q23, it is input to the gate (pin 3) of MOSFET Q11 and output from the drain. It then passes through resistor R59 to pin 2 of op-amp chip U1A for inversion amplification. Surrounding components, capacitors C60 and C61, resistor R86, and resistor R59 form a filter circuit. Finally, after internal compensation and amplification, the signal is pre-amplified from pin 1 of op-amp chip U1A and coupled to the selection channel ESWS3 via coupling capacitor C46. Part of the signal is connected to ground (GNDA) via resistor R63, and the amplified signal is output from op-amp chip U1A to ESWS3.

[0018] Based on the above, this embodiment utilizes a headset microphone amplification circuit for internal communication to optimize the signal transmission path in terms of anti-interference, reduce the impact of external interference on the sound signal, effectively reduce sound distortion and noise, and improve the clarity and accuracy of internal communication. In terms of signal amplification, the operational amplifier chip U1A, MOSFET Q11, and transistor Q23 enhance the amplification capability of weak signals, avoid attenuation of voice signals during transmission, improve communication reliability, and the circuit structure is simple and reasonable, reducing the use of unnecessary components, lowering costs and power consumption, while improving circuit stability, providing a superior headset microphone amplification solution for internal communication systems.

[0019] In summary, the headset microphone amplification circuit for internal communication in this embodiment optimizes the signal transmission path, reduces the impact of external interference on the sound signal, effectively reduces sound distortion and noise, and improves the clarity and accuracy of internal communication. It enhances the amplification capability of weak signals, avoids attenuation of voice signals during transmission, improves communication reliability, and has a simple and reasonable circuit structure, reducing the use of unnecessary components, lowering costs and power consumption, while improving circuit stability. It provides a superior headset microphone amplification solution for internal communication systems.

[0020] Finally, it should be noted that the above description is only a preferred embodiment of this application and is not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A headset microphone amplification circuit for internal communications, characterized by, Linking socket J4, resistance R47, resistance R51, coupling capacitor C36, resistance R54, capacitor C62, operational amplifier chip U1A, coupling capacitor C46, capacitor C61, selection channel ESWS3, resistance R63, resistance R50, resistance R59, capacitor C60, resistance R49, field tube Q11, coupling capacitor C33, resistance R48, resistance R57, coupling capacitor C4, triode Q23, resistance R52, resistance R85 and capacitor C41 are included. Wherein, the 1st pin of the linking socket J4 is connected with the external earphone microphone and grounded, the 2nd pin of the linking socket J4 is suspended, the 3rd pin of the linking socket J4 is connected with the 1st pin of the resistance R47, the 2nd pin of the resistance R47 and the 1st pin of the resistance R51 are both connected with the negative electrode of the coupling capacitor C36, the 2nd pin of the resistance R51 is grounded, the positive electrode of the coupling capacitor C36, the 1st pin of the resistance R54 and the 1st pin of the capacitor C62 are all connected with the 3rd pin of the operational amplifier chip U1A, the 2nd pin of the capacitor C62 is grounded, the 4th pin of the operational amplifier chip U1A is grounded, the 8th pin of the operational amplifier chip U1A is connected with VCC, the positive electrode of the coupling capacitor C46, the 1st pin of the resistance R86 and the 1st pin of the capacitor C61 are all connected with the 1st pin of the operational amplifier chip U1A, the selection channel ESWS3 and the 1st pin of the resistance R63 are both connected with the negative electrode of the coupling capacitor C46, the 2nd pin of the resistance R63 is connected with GNDA, the 2nd pin of the capacitor C61, the 1st pin of the resistance R50 and the 1st pin of the resistance R59 are all connected with the 2nd pin of the operational amplifier chip U1A, the 2nd pin of the resistance R50 and the 2nd pin of the resistance R86 are both connected with the 1st pin of the capacitor C60, the 2nd pin of the capacitor C60 is grounded, the 2nd pin of the resistance R59 and the 1st pin of the resistance R49 are both connected with the 1st pin of the field tube Q11, the 2nd pin of the field tube Q11 is connected with the positive electrode of the coupling capacitor C33, the negative electrode of the coupling capacitor C33 is grounded, the 2nd pin of the resistance R49, the 2nd pin of the resistance R54, the 1st pin of the resistance R48 and the 1st pin of the resistance R57 are all connected with the 3rd pin of the field tube Q11, the 2nd pin of the resistance R57 is connected with VCC, the 2nd pin of the resistance R48 and the positive electrode of the coupling capacitor C4 are both connected with the 3rd pin of the triode Q23, the negative electrode of the coupling capacitor C4 is grounded, the 2nd pin of the triode Q23 and the 1st pin of the resistance R52 are both connected with VCC, the 2nd pin of the resistance R52 and the 1st pin of the resistance R85 are both connected with the 1st pin of the triode Q23, the 2nd pin of the resistance R85 is connected with the 1st pin of the capacitor C41, the 2nd pin of the capacitor C41 is connected with the positive electrode of the coupling capacitor C46, the 1st pin of the resistance R86, the 1st pin of the capacitor C61 and the 1st pin of the operational amplifier chip U1A.