Frame with groove positioning function

Abstract

The utility model relates to a frame with groove positioning, which belongs to the technical field of diode production, and comprises a connecting sheet, a radiating fin and a pin, the connecting sheet is welded on the radiating fin, the pin is welded on the connecting sheet, a first welding sheet and a chip which are used for welding are arranged between the connecting sheet and the radiating fin, and the first welding sheet is welded on the radiating fin. A first soldering lug groove matched with the first soldering lug and the chip is formed in the radiating fin; a second welding piece used for welding is installed between the pin and the connecting piece, a second welding piece groove used in cooperation with the second welding piece is formed in the pin, the second welding piece groove and the first welding piece groove are adopted to achieve the fine positioning effect, the problem of welding deviation of a product is avoided, and the product quality is improved. The defect that the soldering lug deviates in the soldering process is overcome, it is guaranteed that the soldering lug and the chip are fixed in the carrying process, meanwhile, operability of the assembling procedure is more convenient, and the problem of poor soldering caused by the fact that the soldering lug and the chip are placed in a deviated mode is solved.

Description

Technical Field

[0001] This utility model relates to the field of diode manufacturing technology, specifically to a frame with grooved positioning. Background Technology

[0002] The manufacturing process of diodes includes chip fabrication, assembly and soldering, molding, testing, and packaging. There are two main assembly and soldering methods: one is to use an assembly machine to combine the frame, solder pads, chip, and connectors, and then complete the soldering operation in a vacuum furnace; the other is to use a soldering machine to directly assemble and solder the solder paste, frame, chip, and connectors together.

[0003] Soldering is a crucial process in semiconductor device manufacturing, offering advantages such as stable quality, large production volumes, low cost, and high efficiency. It is widely used in the packaging of integrated circuits, discrete semiconductor devices, resistors, capacitors, coils, and other components. With the development of science and technology in my country, soldering processes are constantly being updated, and soldering methods are being innovated accordingly.

[0004] Currently, soldering processes utilize solder paste to bond the component rack, chip, and jumper wires together. Alternatively, chips, solder pads, component racks, and connectors can be assembled and then soldered in a vacuum furnace. Solder paste has a lower melting point than solder pads, requiring flux when used, and an additional cleaning process is needed after soldering to remove solder slurry. Solder pads have a high melting point, are corrosion-resistant, and retain their effectiveness even after prolonged exposure to air and water vapor, with relatively lower requirements for material storage conditions. Solder pad assembly is the preferred soldering method. When using solder pads in the soldering process, the positioning of the solder pads should be the primary consideration. If the solder pads are misaligned during soldering, the soldering area between the chip and the component rack / connector is very small. Under high current surges, the chip may break down due to the small soldering area, causing diode failure. Furthermore, existing frame structures still pose a risk of large soldering voids: not only is positioning inaccurate and operation inconvenient, but there are also potential quality issues. Utility Model Content

[0005] This invention aims to solve the above-mentioned technical problems by providing a frame with grooved positioning.

[0006] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0007] A frame with grooved positioning includes a connecting piece, a heat sink, and pins, wherein the connecting piece is soldered onto the heat sink, and the pins are soldered onto the connecting piece;

[0008] A first welding plate and a chip for welding are installed between the connecting plate and the heat sink;

[0009] The heat sink has a first solder pad groove for use with the first solder pad and the chip;

[0010] A second soldering tab for soldering is installed between the pin and the connecting tab;

[0011] The pin has a second solder pad groove for use with the second solder pad.

[0012] Preferably, the first welding piece is arranged in two sets.

[0013] Preferably, the chip is mounted between two first bonding pads.

[0014] Preferably, the first and second weld pad grooves are cylindrical groove structures.

[0015] Preferably, the height of the first solder pad and the chip is greater than the depth of the groove of the first solder pad.

[0016] Preferably, a limiting block is mounted on the pin to restrict the movement of the connecting piece.

[0017] Preferably, the connecting piece has a through hole.

[0018] Preferably, the pin has a C-type structure.

[0019] With the above structure, this utility model has the following advantages:

[0020] This invention uses the second solder pad groove and the first solder pad groove to achieve precise positioning, avoid the problem of soldering misalignment in the product, make up for the lack of soldering misalignment during the soldering process, ensure the fixation of the solder pad and chip during the handling process, and at the same time make the assembly process more convenient to operate, avoiding the problem of poor soldering caused by the misalignment of the solder pad and chip.

[0021] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is an exploded view of this utility model;

[0024] Figure 2 This is a cross-sectional view of the present invention.

[0025] As shown in the figure: 1. Connecting piece; 2. First welding piece; 3. Chip; 4. First welding piece groove; 5. Heat sink; 6. Second welding piece; 7. Second welding piece groove; 8. Pin. Detailed Implementation

[0026] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] The present invention will now be described in further detail in conjunction with the full text.

[0029] Combined with appendix Figure 1 and Figure 2 A frame with grooved positioning includes a connecting piece 1, a heat sink 5, and pins 8. The connecting piece 1 is soldered to the heat sink 5, and the pins 8 are soldered to the connecting piece 1. A first soldering piece 2 and a chip 3 for soldering are installed between the connecting piece 1 and the heat sink 5. A first soldering piece groove 4 is formed on the heat sink 5 to cooperate with the first soldering piece 2 and the chip 3. A second soldering piece 6 for soldering is installed between the pins 8 and the connecting piece 1. A second soldering piece groove 7 is formed on the pins 8 to cooperate with the second soldering piece 6. The second soldering piece 6 is installed in the second soldering piece groove 7, and the first soldering piece 2 and the chip 3 are placed in the first soldering piece groove 4. Both the second soldering piece groove 7 and the first soldering piece groove 4 play a role in precise positioning, compensating for the shortcomings of soldering misalignment during the soldering process, and making the assembly process more convenient.

[0030] In specific implementation of this utility model, such as Figure 1 As shown, the first welding piece 2 is arranged in two groups, and the chip 3 is installed between the two first welding pieces 2. The two first welding pieces 2 securely weld the chip 3 between the connecting piece 1 and the heat sink 5.

[0031] The first solder pad groove 4 and the second solder pad groove 7 are cylindrical groove structures. The use of cylindrical groove structures ensures the filling material for the assembly of solder pads and chips 3.

[0032] The height of the first solder pad 2 and the chip 3 must be greater than the depth of the first solder pad groove 4.

[0033] In specific implementation of this utility model, such as Figure 1 As shown, one side of the connecting piece 1 protrudes, and the protrusion is installed between two limiting blocks. The pin 8 is fitted with a limiting block that first restricts the movement of the connecting piece 1. The pin 8 and the connecting piece 1 are welded together by the second welding piece 6. Specifically, the connecting piece 1 is positioned by a special carbon mold fixture and transferred to a vacuum furnace for welding.

[0034] A through hole is made on the connecting piece 1.

[0035] Pin 8 has a C-type structure.

[0036] The working steps of this utility model are as follows:

[0037] The first step is to place the first welding piece 2 into the first welding piece groove 4;

[0038] The second step is to fill chip 3 onto the first solder pad 2;

[0039] The third step is to re-insert the first soldering piece 2 onto the chip 3 within the first soldering piece groove 4;

[0040] Fourth step, place the second welding piece 6 into the second welding piece groove 7;

[0041] The fifth step involves placing the connecting piece 1 on the first welding piece 2 and the second welding piece 6, and transferring the product to a vacuum furnace for welding under the action of the carbon mold.

[0042] Both the second solder pad groove 7 and the first solder pad groove 4 serve a precise positioning function, compensating for the insufficient welding misalignment of the solder pads during the welding process. At the same time, they make the assembly process more convenient and avoid welding defects caused by misalignment of the solder pads and chip 3.

[0043] The present invention and its embodiments have been described above. This description is not restrictive, and the embodiments shown throughout the text are only one of the embodiments of the present invention. The actual structure is not limited to this. In conclusion, if a person skilled in the art is inspired by this description and designs a similar structure and embodiment without departing from the inventive spirit of the present invention, such design should fall within the protection scope of the present invention.

Claims

1. A recessed framed mount, comprising: It comprises a connecting sheet (1), a radiating sheet (5) and a pin (8), the connecting sheet (1) is welded on the radiating sheet (5), and the pin (8) is welded on the connecting sheet (1); First welding sheets (2) and chips (3) for welding are arranged between the connecting sheet (1) and the radiating sheet (5); First welding sheet recesses (4) for the first welding sheets (2) and the chips (3) are arranged on the radiating sheet (5); Second welding sheets (6) for welding are arranged between the pin (8) and the connecting sheet (1); Second welding sheet recesses (7) for the second welding sheets (6) are arranged on the pin (8).

2. The recessed positioning frame of claim 1, wherein: The first welding sheets (2) are arranged in two groups.

3. The recessed positioning frame of claim 2, wherein: The chips (3) are arranged between the two first welding sheets (2).

4. The recessed locating frame of claim 1, wherein: The first welding sheet recesses (4) and the second welding sheet recesses (7) are cylindrical groove structures.

5. The recessed positioning frame of claim 1, wherein: The height of the first welding sheets (2) and the chips (3) is greater than the depth of the first welding sheet recesses (4).

6. The recessed locating frame of claim 1, wherein: Limiting blocks for limiting the movement of the connecting sheet (1) are arranged on the pin (8).

7. The recessed locating frame of claim 1, wherein: Through holes are arranged on the connecting sheet (1).

8. The recessed locating frame of claim 1, wherein: The pin (8) is a C-shaped structure.

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