Intelligent floor

Abstract

The utility model relates to an intelligent floor which comprises a floor body and a sensor mounting plate arranged below the floor body, and a printed capacitance sensing array layer, a shielding layer, a sensing layer and a heat conduction layer are sequentially embedded in the sensor mounting plate from top to bottom. The sensing layer comprises a flexible piezoresistive film layer, a circuit board layer arranged below the flexible piezoresistive film layer and a piezoelectric ceramic unit layer arranged below the circuit board layer, and a sensor is arranged on the circuit board layer. The printed capacitance sensing array layer and the sensing layer are additionally designed on the basis of an existing assembled floor, the sensing layer comprises the flexible piezoresistive film layer, the circuit board layer and the piezoelectric ceramic unit layer, various different sensors can be arranged on the circuit board layer to achieve monitoring of various data, meanwhile, the piezoelectric ceramic units are arranged, and the sensing layer can be used for sensing the various data. The circuit board can be powered, and self power supply is realized.

Description

Technical Field

[0001] This utility model relates to a smart floor. Background Technology

[0002] With the rapid development of the Internet of Things and smart fitness equipment, the functional requirements of sports flooring, as the infrastructure of sports venues, are gradually evolving from traditional load-bearing and decorative functions to intelligent functions.

[0003] Existing documents contain numerous patents related to smart floors, such as utility model patent CN220645010U, which discloses a smart floor including a support frame, floor panels, and fixing blocks. A sealing gasket is fixedly connected to the inner bottom wall of the support frame. A support column is snapped into the inner wall of the fixing blocks for support, and an extension column for adjustment is snapped into the bottom of the support column. A pressure sensor body is snapped into the inner wall of the floor panel, and a maintenance plate for protection is snapped into the inside of the floor panel. This smart floor, through the arrangement of the support frame, maintenance plate, floor panel, pressure sensor body, support column, and extension column, with the floor panel snapped into the inner wall of the support frame, effectively protects the pressure sensor body and facilitates later maintenance, reducing maintenance costs. The pressure sensor body can detect abnormal pressure conditions on the surface of the floor panel. However, this type of smart floor can only be used for pressure monitoring, providing limited data, and it does not disclose how data is collected, powered, or heated. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a smart floor with multiple sensors to achieve multi-dimensional data collection.

[0005] The technical solution adopted in this utility model is:

[0006] A smart floor includes a floor body and a sensor mounting plate disposed below the floor body. The sensor mounting plate has a printed capacitive sensing array layer, a shielding layer, a sensing layer and a thermally conductive layer embedded from top to bottom. The sensing layer includes a flexible piezoresistive thin film layer, a circuit board layer disposed below the flexible piezoresistive thin film layer and a piezoelectric ceramic unit layer disposed below the circuit board layer. The sensor is disposed on the circuit board layer.

[0007] Furthermore, the sensor includes a MEMS triaxial accelerometer located at the center, SMD temperature and humidity sensors located at the four corners, a Zigbee module located on one side, and a supercapacitor located on the other side. The circuit board layer includes an FR4 circuit board located below the MEMS triaxial accelerometer, SMD temperature and humidity sensors, Zigbee module, and supercapacitor, and a flexible circuit board for connecting the FR4 circuit board. Through holes are opened on the flexible piezoresistive thin film layer at positions corresponding to the SMD temperature and humidity sensors.

[0008] Furthermore, the piezoelectric ceramic unit layer includes several piezoelectric ceramic units disposed at the edge, and the piezoelectric ceramic units are connected to a supercapacitor disposed on the FR4 circuit board to provide power.

[0009] Furthermore, the shielding layer is made of copper foil-ferrite with windows opened on it to allow the signals from the Zigbee module to pass through.

[0010] Furthermore, the FR4 circuit board is also equipped with a signal conditioning module.

[0011] Furthermore, a thermally conductive silicone pad is provided on the bottom surface of the FR4 circuit board, and the bottom surface of the thermally conductive silicone pad is in contact with the thermally conductive layer.

[0012] Furthermore, the thermally conductive layer is made of anodized aluminum foil and is connected to the Zigbee module via thermally conductive silicone.

[0013] Furthermore, a support column is provided below the sensor mounting plate, and a drainage hole is provided on the sensor mounting plate.

[0014] Furthermore, it also includes a host computer that communicates with the Zigbee module.

[0015] The positive effects of this utility model are:

[0016] This invention adds a printed capacitive sensing array layer and a sensing layer to the existing interlocking flooring. The sensing layer includes a flexible piezoresistive film layer, a circuit board layer, and a piezoelectric ceramic unit layer. Various sensors can be set on the circuit board layer to monitor various data. It also has a piezoelectric ceramic unit that can power the circuit board, achieving self-powering. In actual installation, each floorboard can work independently. Furthermore, the printed capacitive sensing array and the flexible piezoresistive film can deform. When the floor is subjected to pressure and deforms, it will not cause the sensors and their connections to malfunction. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the sensing layer of this utility model;

[0019] Figure 3 This is a schematic diagram of the sensor arrangement of this utility model. Detailed Implementation

[0020] As attached Figure 1-3As shown, this embodiment discloses a smart floor, including a floor body 1 and a sensor mounting plate 2 disposed below it. The sensor mounting plate 2 may be made of the same material as the floor body 1. A printed capacitive sensing array layer 3, a shielding layer 4, a sensing layer 5 and a thermally conductive layer 6 are sequentially embedded in the sensor mounting plate 2 from top to bottom. The sensing layer 5 includes a flexible piezoresistive thin film layer 9, a circuit board layer disposed below the flexible piezoresistive thin film layer 9 and a piezoelectric ceramic unit layer disposed below the circuit board layer. A sensor is disposed on the circuit board layer.

[0021] The printed capacitive sensing array layer 3 is used to monitor static pressure distribution (such as standing posture), and achieves high-precision, multi-dimensional pressure distribution monitoring through non-contact capacitive sensing technology.

[0022] The sensing layer 5 adopts a three-layer structure, including a flexible piezoresistive film layer 9, a circuit board layer, and a piezoelectric ceramic unit layer. The piezoelectric ceramic unit layer is connected to the circuit board layer to provide power, and the printed capacitive sensing array layer 3 is also connected to the circuit board layer to provide power and data communication. The flexible piezoresistive film is used to capture dynamic impact forces (such as running and jumping) and works in conjunction with the printed capacitive sensing array to collect pressure under different conditions.

[0023] The circuit board layer includes several FR4 circuit boards 12 and flexible circuit boards 13. Sensors are provided on the FR4 circuit boards 12, including a MEMS triaxial accelerometer 15, an SMD temperature and humidity sensor 11, a Zigbee module 16, and a supercapacitor. The MEMS triaxial accelerometer 15 is located at the center of the floor, the SMD temperature and humidity sensor 11 is located at the four corners of the floor, the Zigbee module 16 is located to the left of the MEMS triaxial accelerometer 15, and the supercapacitor is located to the right of the MEMS triaxial accelerometer 15. The supercapacitor is connected to the piezoelectric ceramic unit layer to store energy and power the circuit board layer. A micro-via 10 is opened on the flexible piezoresistive thin film layer 9 at the position corresponding to the SMD temperature and humidity sensor 11.

[0024] The MEMS triaxial accelerometer 15, the SMD temperature and humidity sensor 11, and the Zigbee module 16 are all mounted on the FR4 circuit board 12. These FR4 circuit boards 12 are connected to each other through a flexible circuit board 13. A signal conditioning module can also be mounted on the circuit board.

[0025] The piezoelectric ceramic unit layer includes several piezoelectric ceramic units 17, which are mounted on the bottom surface of the FR4 circuit board 12 and generate electricity through the vertical pressure of stepping.

[0026] Zigbee module 16 uses Zigbee 3.0 and can also be equipped with an inverted-F antenna. The shielding layer 4 uses a copper foil-ferrite structure with windows to allow the signal from the Zigbee module 16 to pass through. The copper foil and ferrite primarily filter high-frequency interference above 2.5GHz, while Zigbee 3.0 operates in the 2.4GHz band, effectively ensuring the signal transmission of the Zigbee module 16. Multiple Zigbee modules 16 can form a mesh network.

[0027] The thermal conductive layer 6 is made of anodized aluminum foil. The Zigbee module 16 is connected to it through thermally conductive silicone. A thermally conductive silicone pad 8 is provided on the bottom surface of the FR4 circuit board 12, and the bottom surface of the thermally conductive silicone pad 8 is in contact with the thermal conductive layer 6.

[0028] Meanwhile, several support pillars 7 are provided on the bottom surface of the sensor mounting plate 2. Preferably, one support pillar 7 is provided directly below each FR4 circuit board 12 to support each sensor. Additionally, drainage holes should be provided on the floor body 1 and the sensor mounting plate 2 to allow drainage from the floor surface. The drainage holes should avoid the locations of the sensors and circuit boards to ensure normal operation of each sensor. Clips 18 for connecting adjacent floor bodies 1 are provided on the side of the floor body 1.

[0029] Preferably, a buffer material can also be filled in the gap between the flexible piezoresistive film layer 9 and the flexible circuit board 13.

[0030] This utility model should also include a host computer for collecting data uploaded by the Zigbee module.

[0031] This invention fulfills the intelligent requirements of flooring, enabling it to detect and upload various data points, providing a data foundation for big data computing. It also features self-powered operation, eliminating the need for an additional power supply structure; each floorboard can operate independently, reducing maintenance complexity. Furthermore, the printed capacitive sensor array, flexible piezoresistive film, and flexible circuit board are all deformable, ensuring that deformation under pressure will not cause malfunctions in the sensors or their connections.

[0032] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A smart floor, characterized in that... It includes a floor body (1) and a sensor mounting plate (2) disposed below the floor body (1). A printed capacitive sensing array layer (3), a shielding layer (4), a sensing layer (5) and a heat-conducting layer (6) are sequentially embedded in the sensor mounting plate (2) from top to bottom. The sensing layer (5) includes a flexible piezoresistive thin film layer (9), a circuit board layer disposed below the flexible piezoresistive thin film layer (9) and a piezoelectric ceramic unit layer disposed below the circuit board layer. A sensor is provided on the circuit board layer.

2. The smart floor according to claim 1, characterized in that... The sensor includes a MEMS triaxial accelerometer (15) located at the center, an SMD temperature and humidity sensor (11) located at the four corners, a Zigbee module (16) located on one side, and a supercapacitor located on the other side. The circuit board layer includes an FR4 circuit board (12) located below the MEMS triaxial accelerometer (15), the SMD temperature and humidity sensor (11), the Zigbee module (16), and the supercapacitor, and a flexible circuit board (13) for connecting the FR4 circuit board. A through hole (10) is opened on the flexible piezoresistive thin film layer (9) at the position corresponding to the SMD temperature and humidity sensor (11).

3. The smart floor according to claim 2, characterized in that... The piezoelectric ceramic unit layer includes several piezoelectric ceramic units (17) located at the edge, and the piezoelectric ceramic units (17) are connected to a supercapacitor located on the FR4 circuit board (12) to provide power.

4. A smart floor according to claim 2, characterized in that... The shielding layer (4) is made of copper foil-ferrite with windows opened on it to allow the signal of the Zigbee module (16) to pass through.

5. A smart floor according to claim 2, characterized in that... The FR4 circuit board (12) is also equipped with a signal conditioning module.

6. A smart floor according to claim 2, characterized in that... A thermally conductive silicone pad (8) is provided on the bottom surface of the FR4 circuit board (12), and the bottom surface of the thermally conductive silicone pad (8) is in contact with the thermally conductive layer (6).

7. A smart floor according to claim 1, characterized in that... The thermally conductive layer (6) is made of anodized aluminum foil and is connected to the Zigbee module (16) via thermally conductive silicone.

8. A smart floor according to claim 1, characterized in that... A support column (7) is provided below the sensor mounting plate, and a drainage hole is provided on the sensor mounting plate (2).

9. A smart floor according to claim 2, characterized in that... It also includes a host computer that communicates with the Zigbee module (16).

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