Tube shell packaging structure, packaging assembly and electronic equipment

Abstract

The utility model discloses a tube shell packaging structure (200), a packaging assembly (12) and electronic equipment, relates to the field of device packaging, and aims to improve the reliability of a device. According to the specific scheme, the tube shell packaging structure (200) comprises a packaging shell (210), a heat conduction part (220) and an electric connecting piece (230). The packaging shell (210) is connected with the heat conduction part (220) to define a sealing cavity (201), the sealing cavity (201) is used for accommodating the signal transmission device (20), and the heat conductivity coefficient of the heat conduction part (220) is larger than that of the packaging shell (210); the electric connecting piece (230) penetrates through the packaging shell (210). The packaging shell (210) can be made of a material with poor thermal conductivity, so that the selectivity of the material of the packaging shell (210) is increased. The packaging shell (210) can be made of a material which is not prone to deformation at high temperature or a material with the thermal expansion coefficient matched with that of the signal transmission device (20), so that the tube shell packaging structure (200) has the advantages of being good in heat conduction, good in mechanical performance and the like, the reliability of the signal transmission device (20) is guaranteed, or the packaging shell (210) can be made of glass with low cost, and the cost of the tube shell packaging structure (200) is reduced.

Description

[0001] This application claims priority to Chinese patent application filed on March 10, 2023, with application number 202310261080.5 and entitled "Tube and Shell Packaging Structure, Packaging Component and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of device packaging, and more particularly to a housing packaging structure, packaging components, and electronic devices. Background Technology

[0003] Hermetic packaging refers to packaging that prevents contaminants (such as liquids, gases, or solids) from intruding and corroding. Therefore, hermetic packaging structures have high requirements for sealing performance. Typically, hermetic packaging structures are inconvenient to replace and repair. Once a device (such as a chip) is packaged within a hermetic packaging structure, it is difficult to readjust the internal structure. Therefore, the performance of the hermetic packaging structure is one of the main factors affecting the reliability of the device. Utility Model Content

[0004] This application provides a casing structure, a packaging component, and an electronic device, aiming to solve the problem of reduced device reliability caused by the packaging structure.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A first aspect of this application provides a housing package structure for encapsulating a signal transmission device. The housing package structure includes a housing, a thermally conductive portion, and an electrical connector. The housing and the thermally conductive portion are connected to form a sealed cavity for housing the signal transmission device. The thermal conductivity of the thermally conductive portion is greater than that of the housing. The electrical connector penetrates the housing, with one end for electrical connection to the signal transmission device and the other end located outside the sealed cavity. Therefore, since the thermal conductivity of the thermally conductive portion is greater than that of the housing, its thermal conductivity is superior. Heat within the sealed cavity can be preferentially transferred to the outside of the sealed cavity through the thermally conductive portion, preventing the poor thermal conductivity of the housing package structure from affecting the performance of the signal transmission device. Because the electrical connector is connected to the housing, the heat within the sealed cavity has a smaller impact on the electrical connector, ensuring excellent connection performance between the signal transmission device and the electrical connector, and improving the reliability of the signal transmission device. Furthermore, the housing can be made of a material with poor thermal conductivity, increasing the choice of housing material; for example, lower-cost glass can be used. Alternatively, the package can be made of a material that is not easily deformed at high temperatures, preventing deformation of the package structure under high-temperature conditions that could damage the connection performance of electrical connectors and signal transmission devices. Furthermore, a non-deformable package can prevent a decrease in the airtightness of the sealed cavity due to deformation, thus improving the reliability of the signal transmission devices.

[0007] In conjunction with the first aspect, in some feasible implementations, the signal transmission device has an optical interface, and the housing package structure further includes a light-transmitting portion connected to the housing, wherein the projection of the optical interface onto the surface of the housing is located within the area of ​​the light-transmitting portion. Thus, the light-transmitting portion allows optical signals to pass through the sealed cavity, and the housing package structure can encapsulate a signal transmission device with optical signal input or output functions, thereby improving the reliability of the signal transmission device.

[0008] In conjunction with the first aspect, in some feasible embodiments, the housing package structure is also used to connect optical elements. The housing package structure further includes an adapter for connecting the optical elements, the adapter being connected to the housing, and the projection of the adapter onto the surface of the housing being located within the area of ​​the light-transmitting portion. Thus, the adapter for connecting the optical elements can be fabricated on the housing. When the housing package structure and the optical elements are connected, the assembly time of the adapter can be saved, the assembly and adjustment processes of the light-transmitting portion and the adapter can be omitted, and the assembly and adjustment costs can be reduced.

[0009] In conjunction with the first aspect, in some feasible implementations, the adapter is made of glass. This ensures that the thermal expansion coefficients of the adapter and the light-transmitting part are compatible, their deformations are similar at high temperatures, their connection performance is good, and the encapsulation structure provides protection for optical signal propagation.

[0010] In conjunction with the first aspect, in some feasible ways, the adapter is integrally formed with the housing, or the adapter is connected to the housing via a connector. Thus, the adapter and housing can be connected using various methods, and the connection method can be selected based on the properties of the materials.

[0011] In conjunction with the first aspect, in some feasible embodiments, the housing encapsulation structure is also used to connect optical elements. The housing encapsulation structure further includes an optical extraction assembly comprising a sleeve, an optical fiber, and a fixing member. The optical fiber is used to connect to the optical element, and the fixing member is sleeved on the optical fiber. The sleeve has a receiving channel, and the fixing member is located within the receiving channel and connected to the sleeve. The projection of the optical fiber onto the surface of the housing is located within the area of ​​the light-transmitting portion. Thus, after the optical element and the optical fiber are connected, the optical signal within the housing encapsulation structure can be propagated to the optical element through the optical extraction assembly, simplifying the assembly process of the optical element and the housing encapsulation structure.

[0012] In conjunction with the first aspect, in some feasible embodiments, the housing package structure is also used to connect optical elements. This housing package structure further includes an optical fiber element, one end of which is connected to the light-transmitting portion, and the other end of which is used to connect to the optical element. Thus, after the optical element and the optical fiber element are connected, the optical signal within the housing package structure can be propagated to the optical element through the optical fiber element, simplifying the assembly process of the optical element and the housing package structure.

[0013] In conjunction with the first aspect, in some feasible embodiments, one end of the optical fiber element is located inside the sealed cavity, and the other end is located outside the sealed cavity. Therefore, the optical fiber element located inside the sealed cavity can be better coupled to the signal transmission device, achieving the purpose of optical signal propagation.

[0014] In conjunction with the first aspect, in some feasible embodiments, both the sleeve and the fixing element are made of glass. This ensures that the thermal expansion coefficients of the sleeve, fixing element, and light-transmitting part are compatible, their deformation at high temperatures is similar, the connection performance between the light extraction component and the light-transmitting part is good, and the encapsulation structure provides protection for optical signal propagation.

[0015] In conjunction with the first aspect, in some feasible implementations, the casing structure further includes a lens assembly located between the light-transmitting portion and the fixing member, and connected to the sleeve. Thus, the lens assembly can shape the light signal passing through the light-transmitting portion to accommodate more optical path designs.

[0016] In conjunction with the first aspect, in some feasible ways, the light-transmitting part is a curved mirror. Thus, the curved mirror can shape the light rays.

[0017] In conjunction with the first aspect, in some feasible embodiments, the encapsulation shell has a window extending through it, and a light-transmitting portion covers the window, which is connected to the encapsulation shell via a connecting layer. Thus, the light-transmitting portion and the encapsulation shell can be manufactured separately and then assembled, and they can be made of different materials.

[0018] In conjunction with the first aspect, in some feasible ways, the light-transmitting part and the packaging shell are integrally formed. This simplifies the manufacturing process of the light-transmitting part and the packaging shell, provides high mechanical strength and excellent airtightness at the connection point, improves the mechanical properties of the packaging structure, and enhances the reliability of the signal transmission device.

[0019] In conjunction with the first aspect, in some feasible embodiments, the package includes: a substrate and a housing, the housing being located on one side of the substrate and connected to the substrate, the electrical connector penetrating the substrate, and the thermally conductive portion connected to the substrate; the thermal conductivity of the thermally conductive portion is greater than that of the substrate. Thus, the signal transmission device can be mechanically connected to the substrate, while simultaneously being electrically connected to the electrical connector. Heat from both the signal transmission device and the substrate can be transferred to the outside of the sealed cavity through the thermally conductive portion. Furthermore, the electrical connector and the thermally conductive portion are independently configured, so even if the thermally conductive portion deforms, the impact on the signal transmission device is minimal. The substrate can be made of a non-deformable material, reducing poor contact between the signal transmission device and the electrical connector due to substrate warping. This improves the reliability of the signal transmission device.

[0020] In conjunction with the first aspect, in some feasible methods, a heat-conducting hole is formed through the substrate, and the heat-conducting part is located within the heat-conducting hole. Thus, the substrate and the heat-conducting part can be fabricated separately and then joined together.

[0021] In conjunction with the first aspect, in some feasible embodiments, the package structure further includes: a first wiring layer connected to a surface of the substrate facing or away from the sealed cavity, and the first wiring layer being electrically connected to the electrical connector. Thus, the first wiring layer can increase the space for circuit design in the package structure, enriching the circuit design options for the package structure to adapt to different needs of signal transmission devices.

[0022] In conjunction with the first aspect, in some feasible implementations, the package structure further includes a second wiring layer. The substrate includes multiple stacked support layers, with a second wiring layer disposed between adjacent support layers. The electrical connector penetrates each support layer, and the second wiring layer is electrically connected to the electrical connector. Thus, the second wiring layer can enrich the circuit design options of the package structure to adapt to different requirements of signal transmission devices.

[0023] In conjunction with the first aspect, in some feasible ways, the material of the enclosure includes glass. Thus, glass can prevent the ingress of contaminants such as gases, and its high strength can improve the mechanical properties of the casing structure.

[0024] In conjunction with the first aspect, in some feasible embodiments, the substrate material includes at least one selected from AlN, SiC, AlSiC, glass, Kovar alloy, and Invar alloy. Thus, all of the aforementioned materials have a coefficient of thermal expansion compatible with silicon. In embodiments where the signal transmission device is a silicon-based chip or ceramic, the coefficients of thermal expansion of the substrate and the signal transmission device are compatible, and their deformations are similar. After temperature changes in the packaging assembly, good contact exists between the substrate and the signal transmission device, resulting in excellent mechanical reliability and improved reliability of the signal transmission device.

[0025] In conjunction with the first aspect, in some feasible embodiments, the enclosure includes an interconnected top plate and a surrounding plate, the top plate being disposed opposite to the substrate, and the substrate being connected to the surrounding plate. Thus, the enclosure can be a split structure, reconnected when packaging signal transmission devices, allowing for the application of more packaging processes.

[0026] In conjunction with the first aspect, in some feasible implementations, the material of the heat-conducting part includes a metallic material. Therefore, metallic materials possess excellent thermal conductivity, providing excellent protection for the heat dissipation performance of the housing structure and preventing the signal transmission device from overheating and affecting its performance.

[0027] In conjunction with the first aspect, in some feasible embodiments, the metallic material includes at least one of copper, tungsten, and copper-tungsten alloys. The aforementioned materials exhibit good thermal conductivity and airtightness, a high thermal conductivity coefficient, and thus provide excellent thermal conductivity.

[0028] In conjunction with the first aspect, in some feasible methods, the electrical connector is formed by electroplating, electroless plating, sputtering, or curing a conductive paste. Therefore, there are many methods for preparing the electrical connector, which can be selected according to actual needs.

[0029] Secondly, a packaging assembly is provided, comprising a signal transmission device and any of the housing packaging structures provided in the first aspect, wherein the signal transmission device is located within the sealed cavity and is electrically connected to the electrical connector. Therefore, the aforementioned housing packaging structure has superior performance and can improve the reliability of the signal transmission device.

[0030] In conjunction with the second aspect, in some feasible embodiments, the signal transmission device includes at least one of a light source, a receiver, a modulator, a chip, and a microelectromechanical system (MEMS) device. Thus, the superior performance of this packaging assembly provides an optimal environment for the aforementioned signal transmission device.

[0031] Thirdly, an electronic device is provided, comprising: a body and the encapsulation assembly provided in the second aspect, wherein the encapsulation shell is connected to the body, and one end of the electrical connector located outside the sealed cavity is electrically connected to the body. Thus, the superior performance of the encapsulation assembly can improve the reliability of the signal transmission device. Attached Figure Description

[0032] Figure 1a This is a schematic diagram of the structure of the fiber optic transceiver provided in an embodiment of this application.

[0033] Figure 1b This is a schematic diagram of the structure of a packaging component provided in an embodiment of this application.

[0034] Figure 1c This is a schematic diagram of another encapsulation component provided in an embodiment of this application.

[0035] Figure 2 This is a schematic diagram of the casing structure of the related technology.

[0036] Figure 3 This is a schematic diagram of a casing structure and a signal transmission device provided in an embodiment of this application.

[0037] Figure 4 This is a schematic diagram of another casing structure and signal transmission device provided in the embodiments of this application.

[0038] Figure 5 This is a schematic diagram of another casing structure and signal transmission device provided in the embodiments of this application.

[0039] Figure 6a This is a schematic diagram of a substrate and an electrical connector provided in an embodiment of this application.

[0040] Figure 6b This is a schematic diagram of another substrate, electrical connector, and signal transmission device provided in an embodiment of this application.

[0041] Figure 6c This is a schematic diagram of another substrate, electrical connector, and signal transmission device provided in an embodiment of this application.

[0042] Figure 6d This is a schematic diagram of another substrate, electrical connector, and signal transmission device provided in an embodiment of this application.

[0043] Figure 7a This is a schematic diagram of a light-transmitting part and a surrounding panel provided in an embodiment of this application.

[0044] Figure 7b This is another structural schematic diagram of the light-transmitting part and the surrounding panel provided in an embodiment of this application.

[0045] Figure 8a This is a schematic diagram of a casing package structure including an adapter, provided as an embodiment of this application.

[0046] Figure 8b This is a schematic diagram of another casing structure including an adapter provided in an embodiment of this application.

[0047] Figure 9a for Figure 8b The diagram shows the casing structure and the connection of the optical element.

[0048] Figure 9b for Figure 8b The diagram shows the casing structure and the connection structure of the optical element.

[0049] Figure 9c This is a schematic diagram of a connection structure between a casing packaging structure and an optical element provided in an embodiment of this application.

[0050] Figure 9d This is a schematic diagram of another connection structure between the housing packaging structure and the optical element provided in the embodiments of this application.

[0051] Figure 10a This is a flowchart illustrating the packaging process of a signal transmission device using a housing packaging structure provided in an embodiment of this application.

[0052] Figure 10b To complete Figure 10a A schematic diagram of the structure after S1.

[0053] Figure 10c To complete Figure 10a A schematic diagram of the structure after S2.

[0054] Icons: 10-Fiber optic transceiver; 11-Power supply; 12-Packaging assembly; 13-Collimating lens; 12-Packaging assembly; 101-Input terminal; 102-Output terminal; 20-Signal transmission device; 200-Tube package structure; 01-Tube package structure; 02-Outer shell; 03-Base plate; 04-Chip; 05-High temperature co-fired ceramic component; 07-Optical window; 06-Receiving cavity; 201-Sealed cavity; 202-First wiring layer; 2 03-Second wiring layer; 204-Support layer; 210-Encapsulation shell; 211-Substrate; 212-Cover; 213-Top plate; 214-Enclosure plate; 220-Heat-conducting part; 230-Electrical connector; 240-Light-transmitting part; 250-Adapter; 251-Accommodation channel; 260-Optical extraction assembly; 261-Sleeve; 262-Fixing component; 263-Lens assembly; 206-Flange; 207-Optical element; 205-Fiber optic cable. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0056] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0057] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0058] This application provides an electronic device. The application does not limit the application of the electronic device; it can be configured according to its type. For example, the electronic device can be a device for converting optical signals to electrical signals, and can be used in a laser transmitting radar module, fiber optic transceiver, or optical module, etc. Alternatively, the electronic device can be an electrical signal transmission device. It can be used as a power management device, power conversion device, or motor drive device, etc. The following description uses a fiber optic transceiver as an example.

[0059] Figure 1a For a schematic diagram of the structure of the fiber optic transceiver 10 provided in the embodiments of this application, please refer to [link / reference]. Figure 1a The fiber optic transceiver 10 includes a main body and a packaging assembly 12, which is connected to the main body. The main body includes a power supply 11, a collimating lens 13, and an optical element 207. The packaging assembly 12 includes a housing structure 200 and a signal transmission device 20. The power supply 11 and the signal transmission device 20 are electrically connected, and the light emitted by the signal transmission device 20 can pass through the collimating lens 13 and be transmitted into the optical element 207.

[0060] For example, the signal transmission device 20 is a light-emitting chip, which is electrically connected to the power supply 11. The power supply 11 provides an electrical signal to the signal transmission device 20, and the light-emitting chip converts the electrical signal into an optical signal, which is then output from the housing package structure 200. The optical element 207 can be an optical fiber, optical cable, or similar structure.

[0061] Figure 1b Please refer to the structural schematic diagram of an encapsulation component 12 provided in an embodiment of this application. Figure 1b The packaging component 12 includes a housing packaging structure 200 and a signal transmission device 20, with the signal transmission device 20 located within the housing packaging structure 200.

[0062] This application does not limit the packaging process of the packaging component 12. Exemplarily, the packaging component 12 is an hermetically sealed package. Hermetically sealed packages are typically used to protect the signal transmission device 20 from corrosion by contaminants (such as gases, liquids, or solids), thereby ensuring the reliable operation of the signal transmission device 20.

[0063] Figure 1b In the package 12, there are an input terminal 101 and an output terminal 102. The input terminal 101 is connected to the signal transmission device 20, and the output terminal 102 is also connected to the signal transmission device 20. The excellent performance of the package structure 200 directly affects the reliability of the signal transmission device 20. Figure 1b The dashed lines in the diagram are used to indicate the location of the signal transmission device 20, and do not indicate that the signal transmission device 20 is exposed on the surface of the package assembly 12.

[0064] The embodiments of this application do not limit the aforementioned signal connection; for example, it can be an optical communication connection, an electrical connection, etc.

[0065] The embodiments of this application do not limit the structure of the signal transmission device 20. For example, the signal transmission device 20 may be a light source, a receiver, a modulator, a chip, or a micro-electro-mechanical system (MEMS) device, etc.

[0066] The structure of the encapsulation component 12 is configured according to the type of signal transmission device 20. In embodiments where the signal transmission device 20 is used to transmit optical signals, the encapsulation component 12 is provided with a window for light to pass through. In embodiments where the signal transmission device is not used to transmit optical signals, the encapsulation component 12 may not be provided with a window for light to pass through.

[0067] Figure 1b In the example, the signal transmission device 20 is a structure with optical signal acquisition or optical signal transmission capabilities. For example, the signal transmission device 20 can be an optical control chip (liquid crystal on silicon), a receiver, a light source, or other structures. Input terminal 101 is an electrical interface; one end of input terminal 101 is electrically connected to the signal transmission device 20, and the other end is electrically connected to the power supply 11. Input terminal 101 is also an optical interface; one end of output terminal 102 is optically connected to the signal transmission device 20, and the other end is optically connected to the optical element 207. Conversely, if input terminal 101 is an optical interface and output terminal 102 is an electrical interface, then...

[0068] Figure 1c This is a schematic diagram of another encapsulation component 12 provided in an embodiment of this application. Figure 1c and Figure 1b The difference is that,Figure 1c In this configuration, both input terminal 101 and output terminal 102 are electrical interfaces. Both input terminal 101 and output terminal 102 are electrically connected to the signal transmission device 20.

[0069] Figure 1c In the example, the signal transmission device 20 may not have a structure that has optical signal acquisition or optical signal transmission capabilities. For example, the signal transmission device 20 may be a chip that converts electrical signals into electrical signals. Figure 1c In this circuit, input terminal 101 is an electrical interface, with one end electrically connected to signal transmission device 20 and the other end electrically connected to power supply and other structures. Output terminal 102 is an electrical interface, with one end electrically connected to signal transmission device 20 and the other end electrically connected to electrical signal receiving device.

[0070] Figure 1c In this embodiment, both input terminal 101 and output terminal 102 are located on one side of the encapsulation component 12. It is understood that the relative positions of input terminal 101 and output terminal 102 are not limited in this application embodiment. For example, input terminal 101 and output terminal 102 can be opposite each other, or input terminal 101 and output terminal 102 can be located on adjacent sides of the encapsulation component 12 respectively.

[0071] Figure 2 This is a schematic diagram of the casing structure 01 of the related technology. Figure 2 In the middle, the tube-shell packaging structure 01 includes a shell 02, a base plate 03, a chip 04, and a high-temperature co-fired ceramic component 05.

[0072] The outer casing 02 and the base plate 03 are sealed together to form a receiving cavity 06. The chip 04 is located inside the receiving cavity 06, and the high-temperature co-fired ceramic component 05 penetrates through the outer casing 02, and the high-temperature co-fired ceramic component 05 and the chip 04 are electrically connected. A light window 07 is provided on the outer casing 02, and the light window 07 penetrates through the outer casing 02. The optical signal of the chip 04 can be emitted through the light window 07.

[0073] Figure 2 In this case, both the outer casing 02 and the base plate 03 are made of metal. The material and processing costs are relatively high. Therefore, this application provides a packaging assembly 12 to improve the performance of the casing structure 200 and enhance the reliability of the signal transmission device 20.

[0074] Figure 3 This is a schematic diagram of a casing structure 200 and a signal transmission device 20 provided in an embodiment of this application. Figure 3 In the middle, the casing structure 200 includes a casing 210, a heat-conducting part 220 and an electrical connector 230.

[0075] The heat-conducting part 220 is connected to the encapsulation shell 210, and the heat-conducting part 220 and the encapsulation shell 210 together form a sealed cavity 201, which is used to accommodate the signal transmission device 20. The thermal conductivity of the heat-conducting part 220 is greater than that of the encapsulation shell 210.

[0076] Electrical connector 230 penetrates the enclosure 210. One end of electrical connector 230 is used for electrical connection with signal transmission device 20, and the other end is located outside the sealed cavity 201. The aforementioned input terminal 101 is located at the end of electrical connector 230 located outside the sealed cavity 201. Exemplarily, the end of electrical connector 230 located in the sealed cavity 201 can be connected to a power supply or other structure.

[0077] Thus, the thermal conductivity of the heat-conducting part 220 is greater than that of the encapsulation shell 210, and the thermal conductivity of the heat-conducting part 220 is superior to that of the encapsulation shell 210. Heat within the sealed cavity 201 is preferentially transferred to the outside of the sealed cavity 201 through the heat-conducting part 220, preventing the poor thermal conductivity of the encapsulation structure 200 from affecting the performance of the signal transmission device 20 and extending the reliability of the signal transmission device 20. Since the electrical connector 230 is connected to the encapsulation shell 210, the heat within the sealed cavity 201 has a relatively small impact on the electrical connector 230, ensuring excellent connection performance between the signal transmission device 20 and the electrical connector 230. Furthermore, the encapsulation shell 210 can be made of a material with poor thermal conductivity, increasing the material options for the encapsulation shell 210 and reducing material costs. For example, the encapsulation shell 210 can be made of a material that is not easily deformed at high temperatures, preventing deformation of the encapsulation structure 200 under high-temperature environments that could damage the connection performance between the electrical connector 230 and the signal transmission device 20. Furthermore, the non-deformable encapsulation shell 210 can prevent the airtightness of the sealed cavity 201 from being reduced due to deformation, which can also extend the reliability of the signal transmission device 20.

[0078] This application does not limit the material of the heat-conducting part 220. Exemplarily, the material of the heat-conducting part 220 includes a metallic material. Metallic materials have better thermal conductivity and airtightness, which can improve the heat dissipation capacity of the casing structure 200.

[0079] For example, the material of the heat-conducting part 220 includes at least one selected from copper, silicon, AlN, Al2O3, and copper-tungsten alloy. The aforementioned materials have good thermal conductivity and a high thermal conductivity coefficient, providing excellent protection for the heat dissipation performance of the casing structure 200.

[0080] The shape and size of the heat-conducting part 220 are not limited in this embodiment, and can be set according to the thermal conductivity of the heat-conducting part 220 and the heat dissipated by the signal transmission device 20 in the working state.

[0081] This application does not limit the structure of the encapsulation shell 210. Exemplarily, the encapsulation shell 210 includes a substrate 211 and a cover 212, with the cover 212 located on one side of the substrate 211 and connected to it. An electrical connector 230 is connected to the substrate 211.

[0082] The embodiments of this application do not limit the connection method between the heat-conducting part 220 and the substrate 211. For example, a heat-conducting hole is formed on the substrate 211, the heat-conducting hole penetrates the substrate 211, and the heat-conducting part 220 is located inside the substrate 211 and connected to the substrate 211.

[0083] The number of heat-conducting parts 220 is not limited in this embodiment. For example, the number of heat-conducting parts 220 can be one, two or more.

[0084] The embodiments of this application do not limit the relative positions of the heat-conducting part 220 and the substrate 211. For example, the substrate 211 may surround the heat-conducting part 220 and be connected to the heat-conducting part 220, or the heat-conducting part 220 may be connected to one end of the substrate 211. Alternatively, the heat-conducting part 220 may surround the substrate 211 and be connected to the substrate 211.

[0085] This application does not limit the connection method between the heat-conducting part 220 and the signal transmission device 20. For example, the heat-conducting part 220 and the signal transmission device 20 can be in direct contact, which can shorten the heat conduction distance between the heat-conducting part 220 and the signal transmission device 20 and improve the heat conduction capacity. For example, the heat-conducting part 220 and the signal transmission device 20 can be bonded together.

[0086] Figure 3 In the structure, the heat-conducting part 220 penetrates the substrate 211, and the electrical connector 230 also penetrates the substrate 211. The heat-conducting part 220, the substrate 211, and the cover 212 together form a sealed cavity 201. The thermal conductivity of the heat-conducting part 220 is greater than that of the substrate 211.

[0087] Thus, the signal transmission device 20 can be mechanically connected to the substrate 211, while the signal transmission device 20 and the electrical connector 230 are electrically connected. Heat from both the signal transmission device 20 and the substrate 211 can be transferred to the outside of the sealed cavity 201 through the heat-conducting part 220. Furthermore, the electrical connector 230 and the heat-conducting part 220 are independently configured, so even if the heat-conducting part 220 deforms, the impact on the signal transmission device 20 is minimal. The substrate 211 can be made of a material that is not easily deformed, reducing the risk of poor contact between the signal transmission device 20 and the electrical connector 230 due to warping of the substrate 211. This improves the reliability of the signal transmission device 20.

[0088] The positional relationship between the heat-conducting part 220 and the electrical connector 230 is not limited to... Figure 3Examples are shown. For instance, in some embodiments, the heat-conducting portion 220 penetrates the substrate 211, or the electrical connector 230 penetrates the cover 212. Alternatively, in other embodiments of this application, the electrical connector 230 penetrates the junction of the substrate 211 and the cover 212.

[0089] The embodiments of this application do not limit the way the heat-conducting part 220 and the electrical connector 230 are electrically connected. For example, the heat-conducting part 220 and the electrical connector 230 can be electrically connected by bonding wire or by surface mount technology.

[0090] The shape of the sealing cavity 201 is not limited in this embodiment. The shape of the sealing cavity 201 can be set according to the shape of the signal transmission device 20. For example, the sealing cavity 201 is a square cavity.

[0091] This application does not limit the material of the substrate 211. Exemplarily, the material of the substrate 211 includes at least one selected from glass, AlN, Al2O3, SiC, AlSiC, and Kovar alloy. All of the aforementioned materials are compatible with the coefficient of thermal expansion of the signal transmission device 20, and the substrate 211 and the signal transmission device 20 have compatible coefficients of thermal expansion, resulting in similar deformations. After the temperature of the packaging assembly 12 changes, the substrate 211 maintains good contact with the signal transmission device 20, exhibiting excellent mechanical reliability, which is beneficial for improving the reliability of the package structure 200.

[0092] In embodiments where the substrate 211 is made of glass, the material cost of the substrate 211 is relatively low. Furthermore, in embodiments where the substrate 211 is made of glass and the thermally conductive part 220 is made of at least one of copper, silicon, AlN, and copper-tungsten alloy, the matching coefficients of thermal expansion of the substrate 211 and the thermally conductive part 220 are beneficial for improving the reliability of the housing package structure 200.

[0093] Similarly, the shape of the cover 212 is not limited in this embodiment. Its shape can be set according to the shape of the signal transmission device 20. For example, the cover 212 is a square cover.

[0094] In the embodiments of this application, the cover 212 includes a top plate 213 and a surrounding plate 214, the top plate 213 and the surrounding plate 214 are connected to each other, the top plate 213 is disposed opposite to the base plate 211, and the base plate 211 is connected to the surrounding plate 214.

[0095] In some embodiments of this application, after the casing encapsulation structure 200 is fabricated, the substrate 211 and the surrounding plate 214 are connected, while the top plate 213 and the surrounding plate 214 are not connected, and a sealed cavity 201 is not formed. When using the casing encapsulation structure 200 to encapsulate the signal transmission device 20 or when fabricating the encapsulation assembly 12, the top plate 213 and the surrounding plate 214 are connected to form a sealed cavity 201.

[0096] In other embodiments of this application, after the casing encapsulation structure 200 is fabricated, the substrate 211 and the surrounding plate 214 are not connected, while the top plate 213 and the surrounding plate 214 are connected, and a sealed cavity 201 is not formed. When using the casing encapsulation structure 200 to encapsulate the signal transmission device 20 or when fabricating the encapsulation assembly 12, the substrate 211 and the surrounding plate 214 are connected to form a sealed cavity 201.

[0097] This application embodiment does not limit the connection method of the top plate 213 and the surrounding plate 214. For example, the top plate 213 and the surrounding plate 214 can be welded, bonded, etc. Alternatively, the top plate 213 and the surrounding plate 214 can be connected as an integral molded part.

[0098] Similarly, this application embodiment does not limit the connection method of the enclosure 214 and the substrate 211, such as welding or bonding the enclosure 214 and the substrate 211.

[0099] This application does not limit the materials of the top plate 213 and the surrounding plate 214. Exemplarily, both the top plate 213 and the surrounding plate 214 are made of glass. The glass top plate 213 and the surrounding plate 214 can provide excellent airtightness for the sealed cavity 201. In addition, in embodiments where the substrate 211 is made of at least one of glass, AlN, Al2O3, SiC, AlSiC, Kovar alloy, and Invar alloy, the glass surrounding plate 214 has a compatible coefficient of thermal expansion with the substrate 211, and the connection between the surrounding plate 214 and the substrate 211 is less prone to cracking due to internal stress.

[0100] Alternatively, in some embodiments, the materials of the top plate 213 and the surrounding plate 214 may also be SiC, AlSiC, AlN, Al2O3, Kovar alloy, Invar alloy, etc.

[0101] The embodiments of this application do not limit the structure of the electrical connector 230. For example, the electrical connector 230 can be a high-temperature co-fired ceramic sheet (HTCC), or the electrical connector 230 can be a metal part, or the electrical connector 230 can be a cured conductive paste, etc.

[0102] Figure 3In this design, a through-hole is provided on the substrate 211, and the electrical connector 230 is a conductive material filled within the through-hole. The electrical connector 230 can be fabricated, for example, by forming the through-hole on the substrate 211 using methods such as laser etching or laser engraving, and then filling the through-hole with a conductive material using electroplating, electroless plating, or magnetron sputtering. Alternatively, a conductive paste can be filled into the through-hole, and then the conductive paste can be cured. Figure 3 The electrical connector 230 has a low manufacturing cost and a small size, occupying little space. Furthermore, the distribution of the electrical connector 230 on the substrate 211 can be customized as needed.

[0103] It is understood that in other embodiments, Figure 3 The electrical connector 230 shown can also be installed on the enclosure 214 or the top plate 213.

[0104] Figure 4 This is a schematic diagram of another casing structure 200 and signal transmission device 20 provided in the embodiments of this application. Figure 4 and Figure 3 The difference lies in the structure of the electrical connector 230; please refer to the following description for the rest. Figure 3 The example shown. Figure 4 In this structure, the electrical connector 230 is a high-temperature co-fired ceramic sheet, which penetrates the enclosure plate 214. The electrical connector 230 and the signal transmission device 20 are connected by bonding wires. The high-temperature co-fired ceramic sheet has good mechanical properties, and the electrical connector 230 is not easily deformed, thus ensuring the excellent mechanical properties of the casing structure 200.

[0105] The high-temperature co-fired ceramic sheet is welded to the surrounding plate 214. In some embodiments, the material of the surrounding plate 214 is close to the melting point of the high-temperature co-fired ceramic sheet, which can avoid gaps or air bubbles between the high-temperature co-fired ceramic sheet and the surrounding plate 214, and improve the airtightness of the casing encapsulation structure 200.

[0106] Figure 5 This is a schematic diagram of another casing structure 200 and signal transmission device 20 provided in the embodiments of this application. Figure 5 and Figure 3 The difference lies in the structure of the electrical connector 230; please refer to the following description for the rest. Figure 3 The example shown. Figure 5 In this embodiment, the electrical connector 230 includes multiple metal rods arranged in an array. Each metal rod penetrates the enclosure 214, and larger diameter metal rods can be selected, such as wall-mounted pins. Wall-mounted pins have excellent mechanical properties, ensuring the excellent mechanical properties of the housing structure 200.

[0107] Understandable, Figure 4 and Figure 5The electrical connectors 230 can all be mounted on the base plate 211 or the top plate 213.

[0108] In some embodiments, to fully utilize the space of the package structure 200, the package structure 200 may further include a wiring layer. The wiring layer is electrically connected to the electrical connector 230. This can enrich the wiring scheme of the package structure 200.

[0109] In embodiments of this application, the wiring layer may be located on the inner surface or the outer surface of the package 210, or the wiring layer may be located inside the space between the inner and outer surfaces of the package 210. Similarly, the wiring layer may be disposed on the substrate 211, the top plate 213, or the surrounding plate 214 depending on the position of the electrical connector 230.

[0110] In this configuration, the wiring layer is not connected to the heat-conducting part 220. As a result, the deformation of the heat-conducting part 220 has a smaller impact on the wiring layer, and the deformation of the heat-conducting part 220 has a smaller impact on the electrical connection between the wiring layer and the electrical connector 230, which can improve the electrical performance of the housing package structure 200.

[0111] This application does not limit the material of the wiring layer. For example, the material of the wiring layer can be copper or gold.

[0112] Figure 6a Please refer to the structural schematic diagram of a substrate 211 and an electrical connector 230 provided in the embodiments of this application. Figure 6a One surface of the substrate 211 is connected to the first wiring layer 202, and the first wiring layer 202 is connected to one end of the electrical connector 230.

[0113] The first wiring layer 202 can increase the length of the wiring inside the package structure 200, expand the wiring space of the package structure 200, and increase the wiring design options of the package structure 200.

[0114] This application embodiment does not limit the positional relationship between the first wiring layer 202 and the sealing cavity 201. For example, the first wiring layer 202 is located inside the sealing cavity 201, and the first wiring layer 202 and the electrical connector 230 are electrically connected at one end of the sealing cavity 201, and the signal transmission device 20 is electrically connected to the first wiring layer 202. Alternatively, the first wiring layer 202 is located outside the sealing cavity 201, and the first wiring layer 202 and the electrical connector 230 are electrically connected at one end outside the sealing cavity 201. Figure 6a In this process, the side of the substrate 211 closest to the first wiring layer 202 can be located inside the sealing cavity 201 or outside the sealing cavity 201.

[0115] Figure 6bFor a schematic diagram of another substrate 211, electrical connector 230, and signal transmission device 20 provided in an embodiment of this application, please refer to [link / reference needed]. Figure 6b Both surfaces of the substrate 211 are connected to the first wiring layer 202. One end of the electrical connector 230 is electrically connected to one of the first wiring layers 202, and the other end of the electrical connector 230 is electrically connected to the other first wiring layer 202. The first wiring layer 202 located inside the sealed cavity 201 is connected to the signal transmission device 20, and the first wiring layer 202 located outside the sealed cavity 201 is used for electrical connection with other structures such as power supplies.

[0116] exist Figure 6b In the example, the wiring length within the package structure 200 is relatively long, further increasing the wiring space of the package structure 200. Part of the circuit design can be placed on the first wiring layer 202, making full use of the space of the package structure 200.

[0117] Figure 6c For a structural schematic diagram of another substrate 211, electrical connector 230, and signal transmission device 20 provided in the embodiments of this application, please refer to [link / reference]. Figure 6c The substrate 211 includes two support layers 204, with a second wiring layer 203 disposed between the two support layers 204. An electrical connector 230 passes through each support layer 204, and the second wiring layer 203 and the first wiring layer 202 are electrically connected through the electrical connector 230. In this way, the wiring path can be further increased, and the wiring space of the package structure 200 can be expanded.

[0118] exist Figure 6c In this design, the two support layers 204 can be made of the same or different materials. For example, the support layer 204 closer to the sealing cavity 201 can be made of a material with a coefficient of thermal expansion similar to that of the signal transmission device 20. This can reduce the internal stress between the signal transmission device 20 and the support layer 204 closer to the sealing cavity 201, avoiding problems such as poor contact caused by this internal stress. The support layer 204 farther from the sealing cavity 201 can be made of a material with excellent thermal conductivity, improving the thermal conductivity of the substrate 211.

[0119] In some embodiments, the support layer 204 may have more layers, such as three, four, or more. A second wiring layer 203 is provided between two support layers 204. The second wiring layer 203 is electrically connected to an electrical connector 230 that penetrates the support layer 204. Similarly, the structure of each support layer 204 may be the same or different.

[0120] It is understood that in embodiments where the substrate 211 includes multiple support layers 204, a second wiring layer 203 may not be provided between the two support layers 204. Similarly, the structure of each support layer 204 may be the same or different.

[0121] Alternatively, in some embodiments, the first wiring layer 202 and the electrical connector 230 are connected as a single molded component. For example, Figure 6d For a structural schematic diagram of another substrate 211, electrical connector 230, and signal transmission device 20 provided in the embodiments of this application, please refer to [link / reference]. Figure 6d The substrate 211 includes two support layers 204, and the surface of the support layer 204 has a first wiring layer 202, which also serves as an electrical connector 230.

[0122] For example, Figure 6d The upper surface of the substrate 211 faces the sealed cavity. One end of the first wiring layer 202 is located inside the sealed cavity for electrical connection with the signal transmission device. The other end of the first wiring layer 202 is located outside the sealed cavity.

[0123] and Figure 6d Similarly, in embodiments where the substrate 211 includes one, three, four, or more support layers 204, the first wiring layer 202 and the electrical connector 230 are connected as a single integral part. Further details will not be provided here.

[0124] As described above, the electrical connector 230 can be disposed at any position on the enclosure 210. For example, the electrical connector 230 can be disposed on the top plate 213, or the electrical connector 230 can be disposed on the surrounding plate 214. It is understood that in embodiments where the electrical connector 230 is disposed on the top plate 213 or the surrounding plate 214, the structural relationship between the top plate 213 and the electrical connector 230, or the structural relationship between the surrounding plate 214 and the electrical connector 230, can be referred to the foregoing. Figure 6a , Figure 6b , Figure 6c or Figure 6d The structural relationship between the substrate 211 and the electrical connector 230 shown will not be described again here.

[0125] Please refer to it again. Figure 1b In embodiments where the signal transmission device 20 is a light source, optoelectronic device, or light-emitting chip, the output terminal 102 is an optical interface. Therefore, the housing package structure 200 needs to be provided with a light-transmitting portion 240 to allow light to pass through. The light-transmitting portion 240 is connected to the package shell 210. The structure of the light-transmitting portion 240 is described exemplarily below.

[0126] Please refer to it again. Figure 3 In this embodiment, the position of the light-transmitting portion 240 is not limited. It can be positioned according to the installation position of the signal transmission device 20 within the sealed cavity 201. For example, the light-transmitting portion 240 can be connected to the substrate 211, the top plate 213, or the surrounding plate 214. The following description uses the connection between the light-transmitting portion 240 and the surrounding plate 214 as an example.

[0127] This application embodiment does not limit the positional relationship between the light-transmitting portion 240 and the electrical connector 230. The relative positions of the electrical interface and optical interface of the signal transmission device 20 can be used. For example, the projection of the optical interface of the signal transmission device 20 onto the encapsulation shell 210 is located within the area of ​​the light-transmitting portion 240, allowing the optical signal output from the optical interface of the signal transmission device 20 to propagate to the light-transmitting portion 240.

[0128] The light-transmitting portion 240 is connected to the surrounding plate 214, and the electrical connector 230 is connected to the substrate 211. Thus, the light-emitting direction of the light-transmitting portion 240 is not parallel to the extending direction of the electrical connector 230, allowing for better avoidance of obstruction between the optical interface and the electrical interface of the signal transmission device 20. For example, Figure 3 In the middle, the lower part of the tube-shell package structure 200 is connected to the power supply and other structures, and light can be emitted from the side of the tube-shell package structure 200.

[0129] The connection method between the light-transmitting part 240 and the surrounding plate 214 is not limited in this embodiment. Figure 3 In this embodiment, the light-transmitting portion 240 and the surrounding plate 214 are integrally molded parts. The material of the surrounding plate 214 is also glass, which has a low material cost. The material and manufacturing cost of the light-transmitting portion 240 are also low. Alternatively, in some embodiments, the light-transmitting portion 240 and the surrounding plate 214 are connected by a connecting part, which can be an adhesive layer or a welded layer. Or, the light-transmitting portion 240 and the surrounding plate 214 are connected as an integrally molded part.

[0130] Figure 7a This is a schematic diagram of a structure of the light-transmitting part 240 and the surrounding plate 214 provided in an embodiment of this application. Figure 7a In this configuration, the light-transmitting portion 240 and the surrounding plate 214 are bonded together. For example, a light-transmitting window is provided on the surrounding plate 214, which penetrates the surrounding plate 214 and communicates with the sealing cavity 201. The light-transmitting portion 240 and the surrounding plate 214 are connected and cover the aforementioned light-transmitting window. The light-transmitting portion 240 and the surrounding plate 214 can be manufactured independently and then reconnected. The material selection for the light-transmitting portion 240 is less correlated with the material selection for the surrounding plate 214. The surrounding plate 214 has a wider range of material options, and its material can be selected based on cost, performance, etc.

[0131] Figure 7b This is a schematic diagram illustrating another structure of the light-transmitting portion 240 and the surrounding plate 214 provided in an embodiment of this application. Figure 7bIn this configuration, the light-transmitting portion 240 and the surrounding plate 214 are connected as a single molded part. Exemplarily, the light-transmitting portion 240 and the surrounding plate 214 are formed by a molding process. Exemplarily, in embodiments where the material of the surrounding plate 214 is a light-transmitting material (e.g., glass), the surrounding plate 214 allows light to pass through, and part or all of the area of ​​the surrounding plate 214 can serve as the light-transmitting portion 240. This simplifies the manufacturing process of the light-transmitting portion 240 and the surrounding plate 214, reduces manufacturing complexity, and minimizes defects such as air bubbles or gaps at the connection point between the light-transmitting portion 240 and the surrounding plate 214, thus improving the airtightness of the sealing cavity 201.

[0132] The shape of the light-transmitting portion 240 is not limited in this embodiment. For example, the light-transmitting portion 240 can be a plane mirror or a curved mirror. The shape of the light-transmitting portion 240 can be designed to shape the light passing through it.

[0133] In embodiments where the encapsulation assembly 12 has a light-transmitting portion 240, the encapsulation assembly 12 can be connected to optical elements such as optical fibers or optical cables, so that the optical signal of the signal transmission device 20 is coupled from the light-transmitting portion 240 to the optical element. Alternatively, due to the reversibility of light, the optical signal of the optical element is coupled from the light-transmitting portion 240 to the signal transmission device 20.

[0134] In some embodiments, the shape of the light-transmitting portion 240 can be designed so that while allowing light to pass through, it also has mechanical connections with other optical elements.

[0135] Furthermore, in some embodiments of this application, in order to connect the housing package structure 200 to the optical element, the housing package structure 200 may also include a connection structure for adapting to the optical element, the connection structure being used for connecting to the optical element. Since the embodiments of this application do not limit the structure of the optical element, the embodiments of this application also do not limit the structure of the aforementioned connection structure; some examples are described below.

[0136] Figure 8a Please refer to the schematic diagram of a housing package structure 200 including an adapter 250 provided in this application embodiment. Figure 8a The housing encapsulation structure 200 also includes an adapter 250, which is connected to the enclosure 214. A light-transmitting portion 240 is opposite to the adapter 250. The projection of the adapter 250 onto the surface of the enclosure 214 is located within the area of ​​the light-transmitting portion 240. This allows light signals within the sealed cavity 201 to be transmitted through the light-transmitting portion 240 to the adapter 250.

[0137] The adapter 250 is used to connect the optical element. In this way, the adapter 250 connecting the optical element can be fabricated on the package 210. When the package structure 200 is connected to the optical element, the assembly time of the adapter 250 can be saved, the assembly and adjustment process of the light-transmitting part 240 and the adapter 250 can be omitted, and the assembly and adjustment cost can be reduced.

[0138] This application does not limit the material of the adapter 250. For example, the material of the adapter 250 can be glass or metal. In the embodiment where the adapter 250 is made of glass, the thermal expansion coefficients of the adapter 250 and the light-transmitting part 240 are compatible, the deformation of the adapter 250 and the light-transmitting part 240 is close at high temperatures, the connection performance between the adapter 250 and the light-transmitting part 240 is excellent, and the optical signal loss through the casing structure 200 is small.

[0139] This application embodiment does not limit the structure of the adapter 250, and it can be configured according to the structure of the optical element. For example, the adapter 250 is matched with a fiber optic connector, and the aforementioned fiber optic connector can be, for example, an FC (ferrule connector), an SC (square connector), a biconical connector, a MU (miniature unit coupling) connector, or an LC (line connector), etc. Alternatively, the aforementioned fiber optic connector can also be of other types.

[0140] This application does not limit the connection method between the adapter 250 and the enclosure 214. Exemplarily, the adapter 250 and the enclosure 214 are connected by a connector, which may be an adhesive or a solder layer. Alternatively, in some embodiments, the adapter 250 and the enclosure 214 are connected as a single molded part.

[0141] In some embodiments, depending on the optical path design, the housing package structure 200 may also be configured with an optical lead-out component for connection with an optical element.

[0142] Figure 8b A schematic diagram of another housing package structure 200 including an optical extraction component 260 provided in this application embodiment. Figure 8bIn the package 200, the optical output assembly 260 also includes a sleeve 261, an optical fiber 205, and a fixing member 262. The fixing member 262 is sleeved on the optical fiber 205. The sleeve 261 has a receiving channel 251, and the fixing member 262 is located within the receiving channel 251 and connected to the sleeve 261. The projection of the optical fiber 205 onto the surface of the package 210 is located within the area of ​​the light-transmitting portion 240. Thus, the optical output assembly 260 can extract optical signals from inside the package 200 through the optical fiber 205. This saves assembly time for the package 200 and the optical components.

[0143] This application does not limit the materials of the sleeve 261 and the fastener 262. For example, both the sleeve 261 and the fastener 262 can be made of glass. In this way, the materials of the sleeve 261 and the fastener 262 are the same as the material of the light-transmitting part 240, which can reduce the difference in the coefficients of thermal expansion of the three and avoid different deformations at the same temperature that lead to different connection strengths. In some embodiments, the materials of the sleeve 261 and the fastener 262 can also be other materials such as ceramic.

[0144] For example, optical fiber 205 can be connected to optical cable or other optical fiber to transmit the optical signal of signal transmission device 20 inside the housing encapsulation structure 200 to the optical cable or other optical fiber.

[0145] The shape of the receiving channel 251 is not limited in this embodiment and can be configured according to the connection method of the fastener 262 and the sleeve 261. For example, in an embodiment where the fastener 262 and the sleeve 261 are interference fit, the inner circumferential surface of the receiving channel 251 is circular. Alternatively, in an embodiment where the fastener 262 and the sleeve 261 are snap-fit, the inner wall of the receiving channel 251 can be provided with a snap-fit ​​portion for connection with the fastener 262.

[0146] In some embodiments, depending on the optical path design, the housing package structure 200 may also include a lens assembly, which can shape the light transmitted through the light-transmitting portion 240, etc.

[0147] Figure 8b In the package structure 200, the lens assembly 263 is located in the receiving channel 251, and the projection of the lens assembly 263 on the surface of the package 210 is located in the light-transmitting part 240.

[0148] Figure 8b In the example, light can pass through the light-transmitting part 240 and the lens assembly 263 in sequence. The lens assembly 263 can shape the light passing through the light-transmitting part 240 to adapt to different optical path designs.

[0149] Light passing through the light-transmitting part 240 enters the lens assembly 263, which can reshape the light passing through the light-transmitting part 240.

[0150] The embodiments of this application do not limit the structure of the lens assembly 263. For example, the lens assembly 263 may include at least one of a spherical lens, an aspherical lens, a freeform surface lens, an optical focusing element, and a Fresnel prism. For example, the lens assembly 263 may be a collimating lens or a lens array.

[0151] As described above, in some embodiments, the light-transmitting portion 240 may also be connected to the substrate 211 or the top plate 213. The connection method between the light-transmitting portion 240 and the substrate 211 or the connection method between the light-transmitting portion 240 and the top plate 213 is similar to the connection method between the light-transmitting portion 240 and the surrounding plate 214, and can be found in the foregoing description. Figure 7a , Figure 7b , Figure 8a and Figure 8b The description is omitted here.

[0152] The light-transmitting portion 240 allows light emitted from the signal transmission device 20 to pass through, providing a basis for optical communication between the signal transmission device 20 and the optical element. The connection between the optical fiber and the housing encapsulation structure 200 will be described below as an example.

[0153] Figure 9a for Figure 8a Please refer to the schematic diagram showing the connection between the housing package structure 200 and the optical element 207. Figure 8a and Figure 9a The ferrule 206 is fitted onto the optical element 207, and the ferrule 206 extends into the adapter 250 and is connected to the adapter 250.

[0154] Light passing through the light-transmitting part 240 enters the lens assembly 263, and light passing through the lens assembly 263 enters the optical element 207. In this way, optical signal communication is realized between the signal transmission device 20 and the optical element 207.

[0155] The embodiments of this application do not limit the structure of the optical element 207. For example, the optical element 207 can be an optical fiber, an optical cable, or an optical fiber array. The optical element 207 can contain one, two, three, or more fiber cores.

[0156] Figure 9b for Figure 8b The diagram shows the connection structure between the housing package structure 200 and the optical element 207. Figure 9b In this configuration, optical element 207 and optical fiber 205 are connected. Optical signals within optical fiber 205 propagate into optical element 207. For example, optical element 207 and optical fiber 205 can be connected via an optical fiber adapter.

[0157] It is understandable that the connection between the housing 200 and the optical element 207 can be made without the adapter 250 or the optical lead-out assembly 260.

[0158] Figure 9c This is a schematic diagram of a connection structure between the housing package structure 200 and the optical element 207 provided in an embodiment of this application. Please refer to... Figure 9c The optical element 207 and the housing encapsulation structure 200 are directly connected, and the light-transmitting part 240 is opposite to the optical element 207. Light passing through the light-transmitting part 240 directly enters the optical element 207.

[0159] Figure 9c In this configuration, optical element 207 is an optical fiber array. Optical element 207 is located outside the sealed cavity 201, and signals within the light-transmitting part 240 can be output through optical element 207.

[0160] Figure 9d This is a schematic diagram of another connection structure between the housing package structure 200 and the optical element 207 provided in an embodiment of this application. Please refer to... Figure 9d One end of the optical element 207 is located inside the sealed cavity 201, and the other end is located outside the sealed cavity 201. In other words, the optical element 207 penetrates through the light-transmitting portion 240. Thus, optical signals inside the sealed cavity 201 can be transmitted to the outside of the sealed cavity 201 through the optical element 207.

[0161] Figure 9d In the example, optical element 207 is an optical fiber. Similarly, optical element 207 can also be a structure such as an optical cable.

[0162] Figure 9d In this example, the connection method between the optical element 207 and the light-transmitting portion 240 is not limited. Exemplarily, the optical element 207 and the light-transmitting portion 240 are bonded together with an adhesive layer, or the optical element 207 and the light-transmitting portion 240 are soldered together with solder.

[0163] Understandable, Figure 9c and Figure 9b In this example, the optical element 207 can be manufactured and produced together with the light-transmitting part 240. Alternatively, the optical element 207 and the light-transmitting part 240 can be manufactured separately and then assembled.

[0164] This application embodiment does not limit the packaging process of the signal transmission device 20 for the casing structure 200. The following is combined with Figure 10a , Figure 10b and Figure 10c The packaging process of the signal transmission device 20 is described exemplarily.

[0165] For example, Figure 10a For a flowchart illustrating the packaging process of the package structure 200 for the signal transmission device 20 provided in this embodiment, please refer to [link / reference needed]. Figure 10aThe packaging process of the signal transmission device 20 includes:

[0166] S1. As Figure 10b As shown, the signal transmission device 20 is connected to the substrate 211, and the signal transmission device 20 is electrically connected to the electrical connector 230.

[0167] Figure 10b To complete Figure 10a A schematic diagram of the structure after S1. The signal transmission device 20 and the substrate 211 can be bonded or soldered. The signal transmission device 20 and the electrical connector 230 can be electrically connected via bonding wires, or via conductive adhesive.

[0168] S2. For example Figure 10c As shown, the cover 212 and the substrate 211 are connected to form a sealed cavity 201.

[0169] Figure 10c To complete Figure 10a A schematic diagram of the structure after S2. The cover 212 and the substrate 211 can be joined by welding or bonding.

[0170] In some embodiments, to avoid the deformation of the heat-conducting part 220 affecting the mechanical properties of the housing encapsulation structure 200, the heat-conducting part 220 does not directly contact the cover 212 and the signal transmission device 20.

[0171] In embodiments where the enclosure 214 and the top plate 213 are connected as a single molded part, the enclosure 214 and the base plate 211 can be directly connected.

[0172] In embodiments where the enclosure 214 and the top plate 213 are separate components, the enclosure 214 and the base plate 211 can be connected first, and then the enclosure 214 and the top plate 213 can be connected to form a sealed cavity 201. Alternatively, the enclosure 214 and the top plate 213 can be connected first, and then the enclosure 214 and the base plate 211 can be connected to form a sealed cavity 201.

[0173] This application embodiment does not limit the gas inside the sealed cavity 201; for example, it can be an inert gas such as nitrogen or argon. For example, the above S2 can be performed in an inert gas atmosphere, that is, the sealed cavity 201 can be filled with inert gas.

[0174] The casing structure 200 provided in this embodiment has excellent thermal conductivity, providing a better operating temperature for the signal transmission device 20. This can extend the reliability of the signal transmission device 20. Furthermore, the thermally conductive part 220 provides excellent thermal conductivity, so the casing 210 does not necessarily need to be made of a material with good thermal conductivity. For example, it can be made of a material that provides good support for the signal transmission device 20, or a material with a thermal conductivity close to that of the signal transmission device 20 can be used to reduce the thermal stress on the signal transmission device 20 and the casing 210. This can improve the problem of poor contact between the signal transmission device 20 and the electrical connector 230, and extend the reliability of the signal transmission device 20.

[0175] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A tubular encapsulation structure, characterized in that, The casing package structure is used to encapsulate a signal transmission device, and the casing package structure includes: A packaging shell, the packaging shell comprising a substrate and a cover, the cover being located on one side of the substrate and connected to the substrate; A thermally conductive portion, wherein the encapsulation shell is connected to the thermally conductive portion to form a sealed cavity, the sealed cavity being used to accommodate the signal transmission device, and the thermal conductivity of the thermally conductive portion is greater than that of the encapsulation shell; and An electrical connector that penetrates the substrate, with one end of the connector for electrical connection to the signal transmission device and the other end located outside the sealed cavity; The light-transmitting part is connected to the packaging shell as an integrally formed part; The casing structure further includes a first wiring layer, which is connected to the surface of the substrate facing or away from the sealing cavity, and is electrically connected to the electrical connector.

2. The tubular encapsulation structure according to claim 1, characterized in that, The light-transmitting part is a curved mirror.

3. The tubular encapsulation structure according to claim 1, characterized in that, The material of the light-transmitting part includes glass.

4. The tubular encapsulation structure according to claim 1, characterized in that, The material of the cover includes glass, and the light-transmitting part is integrally formed with the cover.

5. The tubular encapsulation structure according to claim 1, characterized in that, The heat-conducting part is connected to the substrate; the thermal conductivity of the heat-conducting part is greater than that of the substrate.

6. The casing encapsulation structure according to any one of claims 1-5, characterized in that, The tube-shell packaging structure is also used to connect optical elements. The tube-shell packaging structure further includes an adapter, which is used to connect the optical elements. The adapter is connected to the packaging shell, and the projection of the adapter on the surface of the packaging shell is located in the area of ​​the light-transmitting part.

7. The tubular encapsulation structure according to claim 6, characterized in that, The adapter is made of glass.

8. The tube-shell packaging structure according to claim 6, characterized in that, The adapter and the encapsulation shell are connected as a single molded part; Alternatively, the adapter can be connected to the housing via a connector.

9. The casing encapsulation structure according to any one of claims 1-5, characterized in that, The tube-shell encapsulation structure is also used to connect optical elements. The tube-shell encapsulation structure further includes an optical extraction assembly, which includes a sleeve, an optical fiber, and a fixing member. The optical fiber is used to connect the optical element. The fixing member is sleeved on the optical fiber. The sleeve has a receiving channel. The fixing member is located in the receiving channel and connected to the sleeve. The projection of the optical fiber on the surface of the encapsulation shell is located in the area of ​​the light-transmitting part.

10. The tubular encapsulation structure according to claim 9, characterized in that, Both the sleeve and the fastener are made of glass.

11. The tubular encapsulation structure according to claim 9, characterized in that, The tube casing structure further includes a lens assembly, which is located between the light-transmitting part and the fixing member, and is connected to the sleeve.

12. The casing encapsulation structure according to any one of claims 1-5, characterized in that, The light-transmitting part is connected to the optical fiber element, and the light-transmitting part is connected to the optical element through the optical fiber element.

13. The tube-shell packaging structure according to claim 12, characterized in that, The optical fiber element is located inside the sealed cavity.

14. The casing encapsulation structure according to any one of claims 1-5, characterized in that, A heat-conducting hole is formed on the substrate, and the heat-conducting part is located inside the heat-conducting hole.

15. The casing encapsulation structure according to any one of claims 1-5, characterized in that, The first wiring layer and the electrical connector are connected as a single molded part.

16. The casing encapsulation structure according to any one of claims 1-5, characterized in that, The casing structure further includes a second wiring layer. The substrate includes multiple support layers stacked together. A second wiring layer is provided between two adjacent support layers. The electrical connector penetrates each support layer. The second wiring layer is electrically connected to the electrical connector.

17. The casing encapsulation structure according to any one of claims 1-5, characterized in that, The substrate material includes glass, AlN, Al2O3, SiC, AlSiC, or Kovar alloy.

18. The casing encapsulation structure according to any one of claims 1-5, characterized in that, The material of the heat-conducting part includes metallic materials or AlN.

19. The casing encapsulation structure according to claim 18, characterized in that, The metallic material includes copper or a copper-tungsten alloy.

20. The casing encapsulation structure according to any one of claims 1-5, characterized in that, The electrical connector is formed by electroplating, electroless plating, sputtering, or curing a conductive paste.

21. A packaging component, characterized in that, The encapsulation component includes: Signal transmission devices; and According to any one of claims 1-20, the tube-shell packaging structure, the signal transmission device is located inside the sealed cavity, and the signal transmission device is electrically connected to the electrical connector.

22. The packaging component according to claim 21, characterized in that, The signal transmission device includes at least one of the following: a light source, a receiver, a modulator, a chip, and a microelectromechanical system (MEMS) device.

23. An electronic device, characterized in that, The electronic device includes: a body and a packaging assembly as described in claim 21 or 22, wherein the packaging shell is connected to the body, and one end of the electrical connector located outside the sealed cavity is electrically connected to the body.

24. The electronic device according to claim 23, characterized in that, The main body includes a power supply, a collimating lens, and an optical element. The power supply and the signal transmission device are electrically connected, and the light emitted by the signal transmission device passes through the collimating lens and is transmitted to the optical element.

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