Encapsulated inductor module

Abstract

The utility model discloses a potting type inductor module which comprises an aluminum shell arranged on a base, a partition plate is arranged in the aluminum shell and used for dividing the interior of the aluminum shell into a first containing cavity and a second containing cavity which are not communicated with each other, the first containing cavity is communicated with a first glue pouring opening, and the second containing cavity is communicated with a second glue pouring opening. A first opening and a second opening are formed in the side, away from the base, of the aluminum shell, the first opening communicates with the first containing cavity, the second opening communicates with the second containing cavity, and the first containing cavity and the second containing cavity are both used for being filled with pouring sealant; the differential mode inductor is arranged in the first accommodating cavity, and the common mode inductor is arranged in the second accommodating cavity; the copper bar is arranged on the side, away from the aluminum shell, of the base, a terminal of the differential mode inductor and a terminal of the common mode inductor are connected with one end of the copper bar, and the other end of the copper bar extends along the side wall of the aluminum shell. According to the embodiment provided by the invention, the production cost can be reduced, and the circuit assembly efficiency can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic information technology, and in particular to a potted inductor module. Background Technology

[0002] In the field of electronic information, differential-mode inductors and common-mode inductors are widely used in various filters and switching power supplies. Common-mode inductors are mainly used to suppress common-mode interference, while differential-mode inductors are used to suppress differential-mode interference.

[0003] Currently, potted inductor modules typically encapsulate a single type of inductor, either differential-mode inductors or common-mode inductors. However, differential-mode and common-mode inductors usually need to be used together. Encapsulating them separately would increase the number of components, occupy more space, affect the compactness and integration of the circuit, and also increase production costs and reduce assembly efficiency. Utility Model Content

[0004] The following is an overview of the subject matter described in detail herein, and this overview is not intended to limit the scope of the claims.

[0005] This application proposes a potted inductor module that can reduce production costs and improve circuit assembly efficiency.

[0006] This application provides a potting encapsulated inductor module, comprising: a base with a first potting port and a second potting port; an aluminum shell disposed on the base, wherein a partition is disposed inside the aluminum shell to divide the interior of the aluminum shell into a first accommodating cavity and a second accommodating cavity that are not interconnected, the first accommodating cavity being connected to the first potting port and the second accommodating cavity being connected to the second potting port; a first opening and a second opening being disposed on the side of the aluminum shell away from the base, the first opening being connected to the first accommodating cavity and the second opening being connected to the second accommodating cavity; both the first accommodating cavity and the second accommodating cavity being used to fill potting compound; a differential-mode inductor and a common-mode inductor, wherein the differential-mode inductor is disposed in the first accommodating cavity and the common-mode inductor is disposed in the second accommodating cavity; and a copper busbar disposed on the side of the base away from the aluminum shell, wherein the terminals of the differential-mode inductor and the terminals of the common-mode inductor are respectively connected to one end of the copper busbar, and the other end of the copper busbar extends along the side wall of the aluminum shell.

[0007] In some embodiments, the axis of the differential mode inductor coil is parallel to the plane of the base, and the axis of the common mode inductor coil is perpendicular to the plane of the base.

[0008] In some embodiments, a first magnetic sheet and a second magnetic sheet are mounted on the first opening, and a gap exists between the first magnetic sheet and the second magnetic sheet.

[0009] In some embodiments, a limiting ring is provided on the side of the base near the aluminum shell, and the limiting ring wraps around the end of the common mode inductor near the base.

[0010] In some embodiments, there are multiple second glue inlets, which are distributed around the limiting ring.

[0011] In some embodiments, the first dispensing port is rectangular in shape, the second dispensing port is circular in shape, and the area of ​​the first dispensing port is larger than the area of ​​the second dispensing port.

[0012] In some embodiments, mounting portions are provided on opposite sides of the aluminum shell, and mounting holes are provided on the mounting portions.

[0013] In some embodiments, the differential mode inductor has a magnetic core housing, a third opening on the side of the magnetic core housing near the first potting port, and a fourth opening on the side of the magnetic core housing near the first opening.

[0014] In some embodiments, there are multiple copper busbars, and the projections of the multiple copper busbars on the sidewall of the aluminum shell are arranged side by side.

[0015] In some embodiments, the end of the common-mode inductor furthest from the base is flush with the second opening.

[0016] The embodiments of this application include at least the following beneficial effects: The base is provided with a first potting port and a second potting port. An aluminum shell is mounted on the base. A partition is provided inside the aluminum shell, dividing the interior of the aluminum shell into a first receiving cavity and a second receiving cavity that are not interconnected. The first receiving cavity is connected to the first potting port, and the second receiving cavity is connected to the second potting port. A first opening and a second opening are provided on the side of the aluminum shell away from the base. The first opening is connected to the first receiving cavity, and the second opening is connected to the second receiving cavity. Therefore, the differential-mode inductor is located in the first receiving cavity, and the common-mode inductor is located in the second receiving cavity. This can suppress the magnetic field leakage of the differential-mode inductor and the common-mode inductor, and block the interference of external magnetic fields, thereby improving the anti-interference capability of the potted inductor module and making the potted inductor module... Enabling normal operation in complex electromagnetic environments enhances the practicality of potted inductor modules. Furthermore, it allows for the encapsulation of differential-mode and common-mode inductors within the same module, improving circuit compactness and integration, thereby reducing production costs and increasing assembly efficiency. The potting compound, filling both the first and second cavities, enhances heat dissipation for both inductors, improving their performance. Additionally, a copper busbar is positioned on the side of the base away from the aluminum shell. The terminals of both the differential-mode and common-mode inductors are connected to one end of the copper busbar, while the other end extends along the sidewall of the aluminum shell, improving ease of use and enhancing the overall practicality of the potted inductor module.

[0017] Other features and advantages of this application will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the description, claims and drawings. Attached Figure Description

[0018] The accompanying drawings are used to provide a further understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0019] Figure 1 This is a schematic diagram of the structure of the potted inductor module provided in the embodiments of this application;

[0020] Figure 2 A bottom view of the potted inductor module provided in an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of the aluminum shell provided in an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the structure of the base provided in an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the differential mode inductor and the magnetic core housing provided in the embodiments of this application. Detailed Implementation

[0024] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0025] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0026] In the description of this application, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0027] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0028] In the field of electronic information, differential-mode inductors and common-mode inductors are widely used in various filters and switching power supplies. Common-mode inductors are mainly used to suppress common-mode interference, while differential-mode inductors are used to suppress differential-mode interference.

[0029] Currently, potted inductor modules typically encapsulate a single type of inductor, either differential-mode inductors or common-mode inductors. However, differential-mode and common-mode inductors usually need to be used together. Encapsulating them separately would increase the number of components, occupy more space, affect the compactness and integration of the circuit, and also increase production costs and reduce assembly efficiency.

[0030] To address the issue of low integration in traditional inductor modules, this application provides a potted inductor module, comprising: a base with a first potting port and a second potting port; an aluminum shell disposed on the base, the interior of which is divided into a first and a second non-communicating cavity by a partition, the first cavity communicating with the first potting port and the second cavity communicating with the second potting port; a first opening and a second opening on the side of the aluminum shell away from the base, the first opening communicating with the first cavity and the second opening communicating with the second cavity, both the first and second cavities being used to fill potting compound; a differential-mode inductor and a common-mode inductor, the differential-mode inductor being disposed in the first cavity and the common-mode inductor being disposed in the second cavity; and a copper busbar disposed on the side of the base away from the aluminum shell, the terminals of the differential-mode inductor and the common-mode inductor being connected to one end of the copper busbar, the other end of which extends along the sidewall of the aluminum shell. According to the solution provided in the embodiments of this application, the base is provided with a first potting port and a second potting port. An aluminum shell is mounted on the base, and a partition is provided inside the aluminum shell, dividing the interior of the aluminum shell into a first receiving cavity and a second receiving cavity that are not interconnected. The first receiving cavity is connected to the first potting port, and the second receiving cavity is connected to the second potting port. A first opening and a second opening are provided on the side of the aluminum shell away from the base. The first opening is connected to the first receiving cavity, and the second opening is connected to the second receiving cavity. Therefore, the differential-mode inductor is located in the first receiving cavity, and the common-mode inductor is located in the second receiving cavity. This can suppress the magnetic field leakage of the differential-mode inductor and the common-mode inductor, and block the interference of external magnetic fields, thereby improving the anti-interference capability of the potted inductor module and enabling the potted inductor module to... This allows the inductor module to operate normally in complex electromagnetic environments, improving its practicality. It also enables the integration of differential-mode and common-mode inductors within the same module, enhancing circuit compactness and integration, reducing production costs, and increasing assembly efficiency. Furthermore, the potting compound in the first and second cavities improves heat dissipation for both inductors, thus enhancing their performance. Additionally, the copper busbar is positioned on the side of the base away from the aluminum shell. The terminals of the differential-mode and common-mode inductors are connected to one end of the copper busbar, while the other end extends along the sidewall of the aluminum shell, improving ease of use and enhancing the overall practicality of the potted inductor module.

[0031] The embodiments of this application will be further described below with reference to the accompanying drawings.

[0032] Reference Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of the potted inductor module provided in the embodiments of this application. Figure 2 This is a bottom view of the potted inductor module provided in an embodiment of this application. Figure 3This is a schematic diagram of the aluminum shell structure provided in an embodiment of this application. This embodiment of the application provides a potted inductor module, including:

[0033] The base 100 is provided with a first glue inlet 110 and a second glue inlet 120;

[0034] An aluminum shell 200 is mounted on a base 100. Inside the aluminum shell 200, there is a partition 210 that divides the interior of the aluminum shell 200 into two non-communicating accommodating cavities: a first accommodating cavity 211 and a second accommodating cavity 212. The first accommodating cavity 211 is connected to the first potting port 110, and the first accommodating cavity 212 is connected to the second potting port 120. On the side of the aluminum shell 200 away from the base 100, there is a first opening 220 and a second opening 230. The first opening 220 is connected to the first accommodating cavity 211, and the second opening 230 is connected to the first accommodating cavity 212. Both the first accommodating cavity 211 and the second accommodating cavity 212 are used to fill potting compound (not shown in the figure).

[0035] Differential mode inductor 240 and common mode inductor 250 are provided. Differential mode inductor 240 is disposed in the first receiving cavity 211 and common mode inductor 250 is disposed in the first receiving cavity 212.

[0036] A copper busbar 300 is located on the side of the base 100 away from the aluminum shell 200. The terminals of the differential mode inductor 240 and the common mode inductor 250 are respectively connected to one end of the copper busbar 300, and the other end of the copper busbar 300 extends along the side wall of the aluminum shell 200.

[0037] The bottom surface of the base 100 can be rectangular, and the aluminum shell 200 can be cuboid. This embodiment of the present disclosure is not limited in this respect.

[0038] The second opening 230 is used to place the common mode inductor 250 into the second receiving cavity 212.

[0039] It should be noted that the differential-mode inductor 240 and common-mode inductor 250 are relatively heavy. When installed vertically or horizontally, the aluminum shell 200 bears most of the weight of the differential-mode inductor 240 and common-mode inductor 250. When installed in an inverted manner, the base 100 bears most of the weight of the differential-mode inductor 240 and common-mode inductor 250. Therefore, the potted inductor module of this application can be installed in an inverted manner, which enables the differential-mode inductor 240 and common-mode inductor 250 to be used in a wider range of scenarios.

[0040] Understandably, the partition in the aluminum shell 200 can separate the differential mode inductor 240 and the common mode inductor 250, and also enhance the structural strength of the aluminum shell 200. Furthermore, due to the high thermal conductivity of aluminum, the heat generated inside the differential mode inductor 240 and the common mode inductor 250 can be quickly transferred to the surface of the shell and then dissipated through air convection or heat sinks.

[0041] It should be noted that during the potting process, high-temperature tape can be applied to the first opening 220 and the second opening 230 to prevent the potting compound from flowing out. The high-temperature tape can also have tiny pores, so the potting compound cannot flow out from the high-temperature tape, while the gas can escape.

[0042] Based on this, the base 100 is provided with a first potting port 110 and a second potting port 120. The aluminum shell 200 is mounted on the base 100. A partition 210 is provided inside the aluminum shell 200, dividing the interior of the aluminum shell 200 into two non-communicating accommodating cavities: a first accommodating cavity 211 and a second accommodating cavity 212. The first accommodating cavity 211 is connected to the first potting port 110, and the first accommodating cavity 212 is connected to the second potting port 120. A first opening 220 and a second opening 230 are provided on the side of the aluminum shell 200 away from the base. The first opening 220 is connected to the first accommodating cavity 211, and the second opening 230 is connected to the first accommodating cavity 212. Therefore, the differential-mode inductor 240 is located in the first accommodating cavity 211, and the common-mode inductor 250 is located in the first accommodating cavity 212. This suppresses magnetic field leakage of the differential-mode inductor 240 and the common-mode inductor 250, and blocks interference from external magnetic fields, thereby improving the anti-interference capability of the potted inductor module. Encapsulated inductor modules can operate normally in complex electromagnetic environments, thus improving their practicality. They also allow differential-mode inductors 240 and common-mode inductors 250 to be encapsulated within the same module, increasing circuit compactness and integration, reducing production costs, and improving assembly efficiency. Furthermore, after filling the first receiving cavities 211 and 212 with potting compound, the heat dissipation capacity of the differential-mode inductors 240 and 250 is improved, enhancing their performance. Additionally, a copper busbar 300 is positioned on the side of the base 100 away from the aluminum shell 200. The terminals of the differential-mode inductor 240 and the common-mode inductor 250 are connected to one end of the copper busbar 300, while the other end extends along the sidewall of the aluminum shell 200. This improves the usability of the differential-mode inductors 240 and 250, enhancing the overall practicality of the encapsulated inductor module.

[0043] Additionally, refer to again Figures 1 to 3 In some embodiments of this application, the axis of the differential mode inductor 240 is parallel to the plane where the base 100 is located, and the axis of the common mode inductor 250 is perpendicular to the plane where the base 100 is located.

[0044] Based on this, since the axis of the differential mode inductor 240 is parallel to the plane where the base 100 is located, and the axis of the common mode inductor 250 is perpendicular to the plane where the base 100 is located, the magnetic field directions generated by the differential mode inductor 240 and the common mode inductor 250 are orthogonal to each other, which can effectively avoid magnetic field coupling and reduce mutual inductance interference.

[0045] Additionally, refer to again Figures 1 to 3 In some embodiments of this application, a first magnetic sheet 260 and a second magnetic sheet 270 are mounted on the first opening 220, and there is a gap between the first magnetic sheet 260 and the second magnetic sheet 270.

[0046] The first opening 220 and the second opening 230 can both be rectangular, and the first magnetic piece 260 and the second magnetic piece 270 can both be rectangular.

[0047] Among them, the projected area of ​​the differential mode inductor 240 in the vertical direction is larger than the area of ​​the first opening 220, and the projected area of ​​the common mode inductor 250 in the vertical direction is smaller than the area of ​​the second opening 230.

[0048] Based on this, the first magnetic sheet 260 and the second magnetic sheet 270 can evenly distribute the magnetic flux density of the differential mode inductor 240, avoiding excessive magnetic field concentration leading to local saturation, thereby improving the stability of the differential mode inductor 240. In addition, the reserved gap can prevent air bubbles from remaining, increase the contact area between the differential mode inductor 240 and the potting compound, and improve the heat dissipation capacity of the differential mode inductor 240.

[0049] Additionally, refer to Figure 4 , Figure 4 The diagram below shows the structure of the base provided in the embodiments of this application. In some embodiments of this application, a limiting ring 130 is provided on the side of the base 100 near the aluminum shell 200, and the limiting ring 130 wraps around the end of the common mode inductor 250 near the base 100.

[0050] Based on this, a limiting ring 130 is provided on the side of the base 100 near the aluminum shell 200. The limiting ring 130 wraps around the end of the common mode inductor 250 near the base 100, so that the limiting ring 130 can prevent the common mode inductor 250 from shifting under equipment vibration or impact conditions, thereby improving the stability of the common mode inductor 250.

[0051] Additionally, refer to again Figure 2 and Figure 4 In some embodiments of this application, there are multiple second glue outlets 120, which are distributed around the limiting ring 130.

[0052] The number of second dispensing ports 120 can be four.

[0053] Based on this, there are multiple second potting ports 120, which are distributed around the limiting ring 130 to improve the uniformity of the potting compound poured into the common mode inductor 250 and improve the potting efficiency.

[0054] Additionally, refer to again Figures 1 to 4 In some embodiments of this application, the first dispensing port 110 is rectangular in shape, the second dispensing port 120 is circular in shape, and the area of ​​the first dispensing port 110 is larger than the area of ​​the second dispensing port 120.

[0055] Based on this, the shape of the first potting port 110 is rectangular, which matches the shape of the differential mode inductor 240 better. The shape of the second potting port 120 is circular, which is more conducive to improving the uniformity of potting at the common mode inductor 250. In addition, the area of ​​the first potting port 110 is larger than the area of ​​the second potting port 120, which can realize the rapid potting of the differential mode inductor 240 and the fine potting of the common mode inductor 250, thereby improving the synergistic effect of the differential mode inductor 240 and the common mode inductor 250.

[0056] Additionally, refer to again Figures 1 to 3 In some embodiments of this application, mounting portions 280 are provided on opposite sides of the aluminum shell 200, and mounting holes 281 are provided on the mounting portions 280.

[0057] The aluminum shell 200 has multiple mounting portions 280 on both sides of its opposite sides.

[0058] It should be noted that the mounting part 280 is located at the end of the side wall of the aluminum shell 200 away from the base 100. When the installation method is inverted, the aluminum shell 200 can be fixed to the circuit board through the mounting hole 281 on the mounting part 280. For example, the aluminum shell 200 can be fixed to the circuit board by passing screws through the mounting hole 281.

[0059] Based on this, mounting portions 280 are provided on both opposite sides of the aluminum shell 200. Mounting holes 281 are provided on the mounting portions 280, which can increase the structural strength of the connection between the aluminum shell 200 and the circuit board, without occupying the internal space of the aluminum shell 200, and also facilitate the disassembly of the aluminum shell 200 and the circuit board, thereby improving the maintenance and replacement efficiency of the potted inductor module.

[0060] Additionally, refer to again Figures 1 to 3 and reference Figure 5 , Figure 5 The diagram below shows the structure of the differential mode inductor and the magnetic core housing provided in the embodiments of this application. In some embodiments of this application, the differential mode inductor 240 has a magnetic core housing 290. The magnetic core housing 290 has a third opening 291 on the side near the first potting port 110 and a fourth opening 292 on the side near the first opening 220.

[0061] The differential mode inductor 240 is located inside the core housing 290, and the two ends of the core of the differential mode inductor 240 are connected to the core housing 290 respectively.

[0062] Based on this, the differential mode inductor 240 has a core housing 290. The core housing 290 has a third opening 291 on the side near the first potting port 110 and a fourth opening 292 on the side near the first opening 220. The potting compound can directly contact the differential mode inductor 240 through the third opening 291 and the fourth opening 292, thereby improving the heat dissipation efficiency of the differential mode inductor 240.

[0063] Additionally, refer to again Figure 1 and Figure 2 In some embodiments of this application, there are multiple copper busbars 300, and the projections of the multiple copper busbars 300 on the sidewall of the aluminum shell 200 are distributed side by side.

[0064] It should be noted that the sum of the number of terminals of the differential mode inductor 240 and the number of terminals of the common mode inductor 250 is equal to the number of copper busbars 300. For example, the number of terminals of the differential mode inductor 240 can be four, the number of terminals of the common mode inductor 250 can be four, and correspondingly, the number of copper busbars 300 is eight.

[0065] Among them, the terminals of the differential mode inductor 240 extend from the potting port toward the copper busbar 300. The terminals of the differential mode inductor 240 can be connected to the terminals of the common mode inductor 250 through the copper busbar 300. The terminals of the common mode inductor 250 can extend to the through hole on the base 100 and connect to the copper busbar 300.

[0066] It is understood that external electronic components can be connected to the differential mode inductor 240 through the terminals of the copper busbar 300 on the side wall of the aluminum shell 200, and the common mode inductor 250 is similar. The embodiments disclosed herein will not be described in detail here.

[0067] Based on this, there are multiple copper busbars 300, and the projections of multiple copper busbars 300 on the side wall of the aluminum shell 200 are distributed side by side, which can provide a standardized connection method for external components, thereby improving the ease of use of differential mode inductor 240 and common mode inductor 250.

[0068] Additionally, refer to again Figure 2 In some embodiments of this application, the end of the common-mode inductor 250 away from the base 100 is flush with the second opening 230.

[0069] Based on this, since the end of the common mode inductor 250 away from the base 100 is flush with the second opening 230, the common mode inductor 250 and the edge of the second opening 230 are seamlessly connected, which can avoid space waste or assembly interference caused by protrusion or recess.

[0070] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A potted inductor module, characterized in that, include: The base is provided with a first glue inlet and a second glue inlet; An aluminum shell is disposed on the base. The interior of the aluminum shell is provided with a partition, which is used to divide the interior of the aluminum shell into a first receiving cavity and a second receiving cavity that are not connected to each other. The first receiving cavity is connected to the first potting port, and the second receiving cavity is connected to the second potting port. The side of the aluminum shell away from the base is provided with a first opening and a second opening. The first opening is connected to the first receiving cavity, and the second opening is connected to the second receiving cavity. Both the first receiving cavity and the second receiving cavity are used to fill potting compound. The differential-mode inductor and the common-mode inductor are provided, wherein the differential-mode inductor is disposed in the first receiving cavity and the common-mode inductor is disposed in the second receiving cavity; A copper busbar is disposed on the side of the base away from the aluminum shell. The terminals of the differential mode inductor and the terminals of the common mode inductor are respectively connected to one end of the copper busbar, and the other end of the copper busbar extends along the side wall of the aluminum shell.

2. The potted inductor module according to claim 1, characterized in that, The axis of the differential mode inductor coil is parallel to the plane of the base, and the axis of the common mode inductor coil is perpendicular to the plane of the base.

3. The potted inductor module according to claim 1, characterized in that, The first opening is fitted with a first magnetic sheet and a second magnetic sheet, and there is a gap between the first magnetic sheet and the second magnetic sheet.

4. A potted inductor module according to claim 1, characterized in that, A limiting ring is provided on the side of the base near the aluminum shell, and the limiting ring wraps around the end of the common mode inductor near the base.

5. A potted inductor module according to claim 4, characterized in that, There are multiple second glue-filling ports, which are distributed around the limiting ring.

6. A potted inductor module according to claim 5, characterized in that, The first dispensing port is rectangular in shape, and the second dispensing port is circular in shape. The area of ​​the first dispensing port is larger than the area of ​​the second dispensing port.

7. A potted inductor module according to claim 1, characterized in that, The aluminum shell has mounting portions on both sides, and each mounting portion has mounting holes.

8. A potted inductor module according to claim 1, characterized in that, The differential mode inductor has a magnetic core housing, a third opening on the side of the magnetic core housing near the first potting port, and a fourth opening on the side of the magnetic core housing near the first opening.

9. A potted inductor module according to claim 1, characterized in that, The number of copper busbars is multiple, and the projections of the multiple copper busbars on the sidewall of the aluminum shell are distributed side by side.

10. A potted inductor module according to claim 1, characterized in that, The end of the common-mode inductor furthest from the base is flush with the second opening.

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