Ceramic substrate with high thermal conductivity
By setting beveled and through-hole structures on the ceramic substrate, combined with a heat dissipation motherboard and side plate, the problem of insufficient thermal conductivity of the ceramic substrate is solved, achieving efficient heat dissipation and ensuring the stability and extended lifespan of electronic components in high-temperature environments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2026-04-07
AI Technical Summary
The thermal conductivity of existing ceramic substrates is insufficient, which leads to a shortened lifespan and unstable performance of electronic components under high heat loads, and makes it difficult to maintain stable physical and chemical properties in high-temperature environments.
A ceramic substrate with high thermal conductivity was designed. By setting a 30-degree angle, circular through holes and heat dissipation main board array on the front ceramic plate, combined with through holes and lines on the back ceramic plate, the heat dissipation path is increased, and heat is dissipated by heat dissipation side plate.
It improves the heat dissipation efficiency of ceramic substrates, avoids heat accumulation, ensures stable operation of electronic components in high-temperature environments, extends service life, and maintains stable performance.
Smart Images
Figure CN224097903U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of ceramic substrate technology, and more specifically, to a ceramic substrate with high thermal conductivity. Background Technology
[0002] Ceramic substrates are a high-performance electronic material widely used in many key fields due to their excellent thermal conductivity, superior electrical insulation, high mechanical strength, and outstanding high-temperature resistance. In power electronic devices, ceramic substrates can effectively dissipate heat, ensuring that high-power components such as IGBT modules and MOSFETs remain stable under high loads, thereby improving the overall efficiency and reliability of the system.
[0003] Currently, the ceramic substrates on the market are mainly made of alumina, with a thermal conductivity between 20-35 W / m·K. This type of ceramic substrate has good electrical insulation, moderate mechanical strength, and relatively low cost. When this type of ceramic substrate is used in the LED lighting industry, LEDs will generate a lot of heat when outputting high brightness. When used in IGBT modules and MOSFETs, a lot of heat will be generated when operating at high power. Heat dissipation is achieved by simply changing the material of the ceramic substrate.
[0004] If the ceramic substrate fails to effectively dissipate heat from electronic components, it can lead to a shortened lifespan and overheating damage. Overheated electronic components may experience thermal stress concentration, causing uneven thermal expansion of the packaging material and resulting in mechanical damage and deformation. If the ceramic substrate cannot adequately handle the heat dissipated by the electronic components, the performance of the components may become unstable. Temperature fluctuations can cause a decline in the performance of electronic components, and in some special high-temperature environments, ceramic substrates with poor heat dissipation performance may struggle to maintain stable physical and chemical properties. Utility Model Content
[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a ceramic substrate with high thermal conductivity.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] A ceramic substrate with high thermal conductivity includes a front ceramic unit and a back ceramic unit mounted below the front ceramic unit.
[0008] The front ceramic unit includes a front ceramic plate. A front first through hole is provided on one side of the front ceramic plate. The front first through hole is four equidistant holes that penetrate the front ceramic plate. The front first through hole is circular in shape. The upper part of the front first through hole is chamfered, and the lower part of the front first through hole is cylindrical.
[0009] The present invention is further configured such that: the shape of the front ceramic plate is rectangular, and a front oblique angle is provided at one corner of the front ceramic plate, the angle of the front oblique angle being 30 degrees.
[0010] By adopting the above technical solution, a front bevel is set at one corner of the front ceramic panel, and the angle of the front bevel is set to 30 degrees, which makes it easier to identify the installation direction.
[0011] The present invention is further configured such that: a second through hole is provided on the other side of the front ceramic plate, the second through hole is four equidistant holes, the second through hole penetrates the front ceramic plate, an RF chip is installed in the middle of the front ceramic plate, the RF chip is four rectangular plates, and a front circuit is installed in the middle of the four rectangular plates of the RF chip.
[0012] The present invention is further configured such that: a heat dissipation main board is provided below the front ceramic plate, the heat dissipation main board is arranged in a circular array, and heat dissipation side plates are installed at equal intervals on all four sides of the heat dissipation main board. The heat dissipation main board and the heat dissipation side plates are installed in the middle position between the front ceramic plate and the back ceramic unit.
[0013] By adopting the above technical solution, a circular array of heat dissipation motherboards is set up, with heat dissipation side plates around the heat dissipation motherboards. This achieves the effect of preventing the heat from being transferred back after the temperature on the heat dissipation motherboards reaches a threshold and dissipating the heat on the heat dissipation motherboards through the heat dissipation side plates.
[0014] The present invention is further configured such that: the back ceramic unit includes a back ceramic plate, four first lines are equidistantly arranged on one side of the back ceramic plate, the first lines being rectangular in shape, and four second lines are equidistantly arranged on the other side of the back ceramic plate, the second lines having the same shape as the first lines.
[0015] The present invention is further configured such that: four circular reverse second through holes are equidistantly arranged on one side of the first line, four circular reverse first through holes are equidistantly arranged on one side of the second line, a back bevel is provided at one corner of the back ceramic plate, and a main board is provided between the first line and the back bevel.
[0016] By adopting the above technical solution, by setting the first through hole on the reverse side to cooperate with the first through hole on the front side, and by setting the second through hole on the reverse side to cooperate with the second through hole on the front side, the heat dissipation path is increased, which helps heat to be conducted from the internal circuit to the external heat sink or environment.
[0017] In summary, this application includes at least one of the following beneficial technical effects:
[0018] 1. By setting a bevel angle at one corner of the front ceramic panel and setting the angle of the bevel angle to 30 degrees, the installation direction can be easily identified.
[0019] 2. By setting up a circular array of heat dissipation motherboards and placing heat dissipation side panels around the heat dissipation motherboards, the heat dissipation motherboards are prevented from being heated back to the starting point after reaching a certain temperature threshold, and the heat is dissipated through the heat dissipation side panels.
[0020] 3. By setting the first through hole on the reverse side to cooperate with the first through hole on the front side, and the second through hole on the reverse side to cooperate with the second through hole on the front side, the heat dissipation path is increased, which helps heat to be conducted from the internal circuit to the external heat sink or environment. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of a high thermal conductivity ceramic substrate according to the present invention.
[0022] Figure 2 This is a schematic diagram of the overall structure of the front ceramic unit in this utility model.
[0023] Figure 3 This is a schematic diagram of the cooperative structure of the heat dissipation main board and the heat dissipation side plate in this utility model.
[0024] Figure 4 This is a schematic diagram of the overall structure of the ceramic unit on the back side in this utility model.
[0025] Explanation of reference numerals in the attached diagram: 1. Front ceramic unit; 11. Front ceramic plate; 12. First through hole on the front; 13. Second through hole on the front; 14. RF chip; 15. Front bevel; 16. Front circuitry; 17. Heat sink motherboard; 18. Heat sink side plate;
[0026] 2. Rear ceramic unit; 21. Rear ceramic plate; 22. First through hole on the reverse side; 23. Second through hole on the reverse side; 24. First circuit; 25. Rear bevel; 26. Second circuit; 27. Circuit board. Detailed Implementation
[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0028] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0029] Example 1, please refer to Figures 1-4 The present invention provides the following technical solution:
[0030] If the ceramic substrate fails to effectively dissipate heat from electronic components, it can lead to a shortened lifespan and overheating damage. Overheated electronic components may experience thermal stress concentration, causing uneven thermal expansion of the packaging material and resulting in mechanical damage and deformation. If the ceramic substrate cannot adequately handle the heat dissipated by the electronic components, the performance of the components may become unstable. Temperature fluctuations can cause a decline in the performance of electronic components, and in some special high-temperature environments, ceramic substrates with poor heat dissipation performance may struggle to maintain stable physical and chemical properties.
[0031] See Figure 1 A high thermal conductivity ceramic substrate includes a front ceramic unit 1 and a back ceramic unit 2 mounted below the front ceramic unit 1. The front ceramic unit 1 and the back ceramic unit 2 form a complete ceramic substrate. The front ceramic unit 1 and the back ceramic unit 2 are used to mount electronic components and conduct heat dissipated by the electronic components.
[0032] See Figure 2 The front ceramic unit 1 includes a front ceramic plate 11. A front first through hole 12 is provided on one side of the front ceramic plate 11. The front first through hole 12 is arranged in four equidistant positions and penetrates the front ceramic plate 11. The front first through hole 12 is circular in shape and has a chamfered upper position at a 45-degree angle. The lower part of the front first through hole 12 is cylindrical. The front first through hole 12 is used to connect the circuits between different layers. The cylindrical arrangement realizes the vertical electrical connection and ensures the transmission of signals and power.
[0033] See Figure 2 The front ceramic plate 11 is rectangular in shape, and a front bevel angle 15 is provided at one corner of the front ceramic plate 11. The angle of the front bevel angle 15 is 30 degrees, and the angle of the front bevel angle 15 makes it easy for the ceramic substrate to identify the installation direction.
[0034] By setting a front bevel angle 15 at one corner of the front ceramic plate 11 and setting the angle of the front bevel angle 15 to 30 degrees, the installation direction can be easily identified.
[0035] See Figure 2 On the other side of the front ceramic plate 11, there is a front second through hole 13. There are four equidistant front second through holes 13 that penetrate the front ceramic plate 11. An RF chip 14 is installed in the middle of the front ceramic plate 11. The RF chip 14 consists of four rectangular plates and is used to process and transmit radio frequency. A front circuit 16 is installed in the middle of the four rectangular plates of the RF chip 14. When the RF chip 14 transmits electrical signals to the outside or runs through the front circuit 16, it will cause the ceramic substrate to heat up as a whole.
[0036] See Figure 3 A heat dissipation main board 17 is arranged below the front ceramic plate 11. The heat dissipation main board 17 is arranged in a circular array. Heat dissipation side plates 18 are installed at equal intervals on all four sides of the heat dissipation main board 17. The heat dissipation main board 17 and the heat dissipation side plates 18 are installed in the middle of the front ceramic plate 11 and the rear ceramic unit 2. The circular array arrangement of the heat dissipation main board 17 can conduct heat out of the center of the ceramic substrate, avoiding overheating in the middle. The heat dissipation side plates 18 are arranged around the heat dissipation main board 17 to prevent the heat from being transferred back after the temperature on the heat dissipation main board 17 reaches the threshold. The heat dissipation side plates 18 conduct heat out of the heat dissipation main board 17.
[0037] By setting up a circular array of heat dissipation motherboards 17 and heat dissipation side plates 18 around the heat dissipation motherboards 17, the problem of reverse heat transfer after the temperature on the heat dissipation motherboards 17 reaches the threshold and the heat dissipation side plates 18 are avoided, thereby improving the heat dissipation efficiency of the ceramic substrate.
[0038] See Figure 3 The back ceramic unit 2 includes a back ceramic plate 21. Four first lines 24 are equidistantly arranged on one side of the back ceramic plate 21. The shape of the first lines 24 is rectangular. Four second lines 26 are equidistantly arranged on the other side of the back ceramic plate 21. The shape of the second lines 26 is the same as that of the first lines 24.
[0039] See Figure 3 Four circular reverse second through holes 23 are equidistantly arranged on one side of the first line 24, and four circular reverse first through holes 22 are equidistantly arranged on one side of the second line 26. A back chamfer 25 is provided at one corner of the back ceramic plate 21. The angle of the back chamfer 25 is the same as the size of the front chamfer 15. A circuit main board 27 is provided between the first line 24 and the back chamfer 25. The first line 24, the second line 26 and the circuit main board 27 are used to connect and install electronic components, and heat will be dissipated during transmission.
[0040] See Figure 3The heat dissipation side plate 18 and the heat dissipation main board 17 are installed between the front ceramic plate 11 and the back ceramic plate 21. The shape of the first through hole 22 on the reverse side matches the shape of the first through hole 12 on the front side, and the shape of the second through hole 23 on the reverse side matches the shape of the second through hole 13 on the front side. By setting the first through hole 22 on the reverse side to match the first through hole 12 on the front side, and the second through hole 23 on the reverse side to match the second through hole 13 on the front side, the heat dissipation path is increased, which helps heat to be conducted from the internal circuit to the external heat sink or environment.
[0041] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
Claims
1. A ceramic substrate with high thermal conductivity, characterized in that: It includes a front ceramic unit (1), and a back ceramic unit (2) is installed below the front ceramic unit (1); The front ceramic unit (1) includes a front ceramic plate (11). A front first through hole (12) is provided on one side of the front ceramic plate (11). The front first through hole (12) is four equidistant holes. The front first through hole (12) penetrates the front ceramic plate (11). The shape of the front first through hole (12) is circular. The upper part of the front first through hole (12) is chamfered. The lower part of the front first through hole (12) is cylindrical.
2. The high thermal conductivity ceramic substrate according to claim 1, characterized in that: The front ceramic plate (11) is rectangular in shape, and a front oblique angle (15) is provided at one corner of the front ceramic plate (11), with the angle of the front oblique angle (15) being 30 degrees.
3. The high thermal conductivity ceramic substrate according to claim 2, characterized in that: A second through hole (13) is provided on the other side of the front ceramic plate (11). The second through hole (13) is four equidistant holes. The second through hole (13) penetrates the front ceramic plate (11). An RF chip (14) is installed in the middle of the front ceramic plate (11). The RF chip (14) is four rectangular plates. A front circuit (16) is installed in the middle of the four rectangular plates of the RF chip (14).
4. A ceramic substrate with high thermal conductivity according to claim 3, characterized in that: A heat dissipation main board (17) is provided below the front ceramic plate (11). The heat dissipation main board (17) is arranged in a circular array. Heat dissipation side plates (18) are installed at equal intervals on all four sides of the heat dissipation main board (17). The heat dissipation main board (17) and the heat dissipation side plates (18) are installed in the middle of the front ceramic plate (11) and the rear ceramic unit (2).
5. A high thermal conductivity ceramic substrate according to claim 1, characterized in that: The back ceramic unit (2) includes a back ceramic plate (21). Four first lines (24) are equidistantly arranged on one side of the back ceramic plate (21). The shape of the first lines (24) is rectangular. Four second lines (26) are equidistantly arranged on the other side of the back ceramic plate (21). The shape of the second lines (26) is the same as that of the first lines (24).
6. A ceramic substrate with high thermal conductivity according to claim 5, characterized in that: Four circular reverse second through holes (23) are equidistantly arranged on one side of the first line (24), and four circular reverse first through holes (22) are equidistantly arranged on one side of the second line (26). A back chamfer (25) is provided at one corner of the back ceramic plate (21), and a circuit main board (27) is provided between the first line (24) and the back chamfer (25).