Oven cavity structure for bearing various wafers

Abstract

The utility model discloses an oven cavity structure for bearing various wafers, which comprises a cavity main body, and the cavity main body is provided with an inner side wall extending along the axis direction; the bearing table is formed on the inner side wall and at least comprises a plurality of partition grooves which are distributed at intervals in the axis direction; the inner walls of at least two partition grooves are staggered in the direction perpendicular to the axis. According to the oven cavity structure used for bearing various wafers, different types of wafers can be borne, the universality of the oven is improved, the time for unifying bearing forms before baking is shortened, and the overall efficiency of the production process is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, concretely relates to a kind of oven cavity structure for bearing multiple wafers. BACKGROUND

[0002] In the semiconductor manufacturing process, due to the different requirements of different process, the wafer can exist in multiple bearing forms, such as bare wafer form and frame wafer form. These two forms have significant differences in size, support method and handling method, which limits their compatibility in subsequent processes, especially in the baking link that needs to be heat treated. The structure design of the existing oven cavity cannot adapt to two different forms of wafers at the same time, or when the wafer needs to be baked, the operator needs to adjust the bearing table for bearing the wafer, which increases the operation process. The existing oven is usually only suitable for one specification wafer processing, and its commonality becomes a big challenge. Therefore, the wafer bearing form needs to be unified before baking, which increases the complexity and length of the processing process. SUMMARY

[0003] In order to overcome the above shortcomings, the utility model aims to provide an oven cavity structure for bearing multiple wafers, which can bear different types of wafers, improve the versatility of the oven, reduce the time for bearing form unification before baking, and improve the overall efficiency of the production process.

[0004] Technical scheme: The utility model discloses an oven cavity structure for bearing multiple wafers, comprising

[0005] Chamber main body, the chamber main body has inner side wall extending along the axial direction;

[0006] The bearing table formed on the inner side wall, the bearing table at least includes multiple separation grooves arranged along the axial direction;

[0007] The inner wall of at least two separation grooves is staggered along the direction perpendicular to the axis.

[0008] Further, the separation grooves of the bearing table are arranged in steps.

[0009] Further, the bearing table and the inner side wall are integrated structure.

[0010] Further, the depth of the separation groove is at least 5mm.

[0011] Further, the width of the separation groove is at least 5mm.

[0012] Further, the two bearing tables of different heights are at least 20mm apart.

[0013] Further, the groove bottom edge of the groove has a round corner transition structure.

[0014] Further, the side wall of the groove is inclined from bottom to top and from inside to outside.

[0015] Further, the surface roughness of the groove is 3.2um.

[0016] Further, the bottom of the groove is provided with exhaust micro-holes.

[0017] The beneficial effects of the present application are:

[0018] (1) The present application sets a bearing table at the same height, which can bear different types of wafers, improve the versatility of the oven, reduce the time of uniform bearing form before baking, and improve the overall efficiency of the production process.

[0019] (2) The groove is set on the bearing table to realize the adaptation of wafers of different sizes, and improve the versatility of the wafer oven.

[0020] (3) The bearing table and the inner side wall are designed integrally, which reduces the assembly error, improves the strength and stability of the overall structure, and ensures the reliability in high temperature environment.

[0021] (4) The groove bottom edge of the groove adopts round corner transition, which reduces the risk of wafer damage when placing the wafer, and improves the product yield.

[0022] (5) The two side walls of the groove are inclined from bottom to top and from inside to outside, which is convenient for wafer placement and removal, and improves the convenience of operation.

[0023] (6) The exhaust micro-holes are set at the bottom of the groove, which can effectively guide the airflow circulation in the cavity, reduce the airflow disturbance on the wafer surface, and improve the gas exchange efficiency in the baking process. BRIEF DESCRIPTION OF DRAWINGS

[0024] The drawings described herein are only for illustrative purposes, and are not intended to limit the scope of the present application in any way. In addition, the shape and scale of the components in the drawings are only illustrative, and are used to help understand the present application, and are not specific to the shape and scale of the components of the present application. Those skilled in the art can select various possible shapes and scales to implement the present application according to specific circumstances under the guidance of the present application. In the drawings:

[0025] Figure 1 The cross-sectional view of the oven cavity structure for bearing multiple wafers according to the present application.

[0026] In the figure: 1, wafer; 2, chamber body; 21, inner side wall; 3, bearing table; 31, groove. DETAILED DESCRIPTION

[0027] The utility model is further illustrated below in combination with the drawings and specific embodiments.

[0028] In the description of the utility model, it needs to be understood that the orientation or position relation indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like is the orientation or position relation based on the drawings shown, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. For ordinary skilled persons in the art, the specific meanings of the above terms in the utility model can be understood according to the specific circumstances. The embodiments are described below according to the overall structure of the utility model.

[0029] As shown in Figure 1 The utility model discloses a kind of oven cavity structure for carrying multiple wafers, including

[0030] Chamber main body 2, the chamber main body 2 has inner side wall 21 extending along axial direction;

[0031] Carrying platform 3 formed on the inner side wall 21, the carrying platform 3 at least includes multiple interval arrangement of groove 31 along axial direction;

[0032] The inner wall of at least two groove 31 is staggered along perpendicular to axial direction.

[0033] By the above structure, the oven cavity structure of the utility model can adapt to wafers 1 of different sizes by setting carrying platform 3, improve the compatibility and baking efficiency of equipment. Specifically, carrying platform 3 is arranged on the inner side wall 21 of the chamber main body 2 of oven, and several carrying platforms 3 can be arranged on inner side wall 21, and at least two carrying platforms 3 on different inner side wall 21 are located at the same height, to ensure that wafer 1 can be placed horizontally on carrying platform 3, so as to guarantee uniform heating.

[0034] On carrying platform 3, groove 31 is interval arrangement along axial direction and is staggered along perpendicular to axial direction. For example, in a feasible embodiment, groove 31 at least includes first groove and second groove arranged upwards and downwards, wherein first groove is close to inner side wall 21, and is suitable for larger size wafer 1, and second groove is away from inner side wall 21 compared to first groove, and is suitable for smaller size wafer 1, so that the same oven can carry wafers 1 of different specifications, without replacing carrying platform 3 for carrying wafer 1 or adjusting support structure, improve the versatility and production efficiency of equipment.

[0035] In the embodiment, the grooves 31 of the bearing table 3 are arranged in steps, and at least two grooves 31 at the same height can place wafers 1 in the direction perpendicular to the axis, and multiple grooves 31 can place wafers 1 of different specifications.

[0036] In the embodiment, the bearing table 3 and the inner side wall 21 are designed in one body, which improves the overall strength of the structure, avoids deformation caused by long-term use or high-temperature environment, and ensures long-term stable operation of the equipment.

[0037] Preferably, in order to reduce the damage of the wafer 1 in the placing and taking-out process, a round corner transition structure is adopted at the groove bottom edge of the groove 31, so as to avoid the collision of the wafer 1 with the sharp corners of the bearing table 3, thereby reducing the breakage rate. At the same time, the side walls on both sides of the groove 31 are inclined from inside to outside from bottom to top, so that the side walls have an inclined surface, so that the wafer 1 is more smooth when placed and taken out, and accidental damage in the operation process is reduced.

[0038] In the embodiment, the depth of the groove 31 is at least 5mm, the depth provides sufficient support and positioning space for the wafer 1, ensures stable placement of the wafer 1 in the groove, and reduces displacement or tilting caused by vibration or external force. The width of the groove 31 is at least 5mm, which provides a suitable bearing surface for the wafer 1, and facilitates the taking and placing operation of the wafer 1, avoids scratching or damage caused by too narrow groove, and improves the reliability of the whole device. The surface roughness of the groove 31 is 3.2um, which helps to reduce the friction between the wafer 1 and the bearing table 3, reduces the scratching that may be caused by irregular surface, and improves the overall reliability of the device. Preferably, the vertical distance between any two bearing tables 3 at different heights is at least 20mm, which effectively reduces the mutual interference that may exist between the bearing tables 3 due to too close distance, avoids collision of the wafer 1 during handling or placing, and sufficient spacing also ensures that the mechanical hand or other transmission device has enough space for operation, thereby reducing the failure rate of the equipment during operation. At the same time, the distance between the upper and lower bearing tables 3 can ensure sufficient heat dissipation space, the larger spacing is beneficial to the flow of air, improves the heat dissipation efficiency, improves the overall thermal stability, so that the wafer 1 can maintain a stable temperature environment during processing or storage.

[0039] The oven cavity structure for bearing multiple wafers 1 can effectively improve the bearing stability of the wafer 1 by optimizing the depth, width and surface roughness of the groove 31, ensure that wafers 1 of different sizes can be placed stably, avoid shaking or falling, and improve the processing precision. In addition, by setting the surface roughness of the groove 31, the wafer 1 can be prevented from sliding, and accidental situations during processing can be avoided.

[0040] In this embodiment, the exhaust micro-holes are arranged at the bottom of the groove 31, which effectively optimizes the airflow environment in the chamber body 2, reduces the influence of gas retention on the heating uniformity of the wafer 1, thereby improving the uniformity of temperature distribution and reducing the quality defects caused by local overheating or uneven cooling of the wafer 1. In addition, the exhaust micro-holes can also reduce the risk of micro-particle accumulation, reduce pollution, improve product yield, and improve the cleanliness of the chamber body 2, thereby reducing maintenance costs.

[0041] Thus far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the drawings, but those skilled in the art will readily understand that the scope of protection of the present application is obviously not limited to these specific embodiments. Those skilled in the art can make equivalent changes or replacements to the related technical features without deviating from the principles of the present application, and the technical solutions after such changes or replacements will all fall within the scope of protection of the present application.

Claims

1. An oven cavity structure for carrying multiple wafers, characterized in that, include A chamber body having an inner wall extending along an axial direction; A support platform formed on the inner sidewall, the support platform comprising at least a plurality of partitions spaced apart along the axial direction; The inner walls of at least two of the partitions are offset in a direction perpendicular to the axis.

2. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The partitions of the support platform are arranged in a stepped manner.

3. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The support platform and the inner sidewall are an integrated structure.

4. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The depth of the groove is at least 5 mm.

5. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The width of the groove is at least 5 mm.

6. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The two support platforms of different heights shall be at least 20mm apart.

7. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The bottom edge of the partition groove has a rounded corner transition structure.

8. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The sidewalls of the partition groove slope from bottom to top and from inside to outside.

9. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The surface roughness of the groove is 3.2 μm.

10. The oven cavity structure for carrying multiple wafers according to claim 1, characterized in that, The bottom of the partition is provided with exhaust micropores.

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