Cleaning and blow-drying device

Abstract

The utility model relates to a cleaning and blow-drying device. Comprising a bottom assembly and a top assembly. The bottom assembly comprises a base, a carrier, a rotating mechanism and a cleaning mechanism. Wherein the carrier is used for carrying materials to be cleaned; the rotating mechanism comprises a driver, the execution end of the driver and the carrier are coaxial and directly fixed, and the driver is used for driving the carrier to rotate around a vertical axis; the cleaning mechanism is arranged corresponding to the carrier and comprises a nozzle and a cleaning driver for driving the nozzle to move; the top assembly comprises a drying mechanism and a rear enclosure; wherein the drying mechanism comprises a fan suspended at the top of the carrier through a top mounting seat; the fence is driven by the jacking mechanism to ascend and descend, a channel is provided for taking and placing materials on the carrier, or the space where the cleaning mechanism and the carrier are located is closed during cleaning operation. According to the cleaning device, the enclosure is arranged, the enclosure is driven by the jacking mechanism to form a closed space during cleaning, and liquid splashing is effectively prevented; and the wafer can be automatically lifted after operation, so that the wafer can be conveniently taken and placed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor processing equipment, especially relates to a cleaning and blow-drying device. BACKGROUND

[0002] The common wafer cleaning methods in the market mainly include ultrasonic cleaning, chemical soaking cleaning and spray cleaning. These methods have advantages and disadvantages, for example, ultrasonic cleaning can effectively remove micrometer-level particles, but has limited effect on nanometer-level pollutants; chemical soaking cleaning can completely remove pollutants, but has the risk of chemical reagent residue; spray cleaning is widely used because of its simple operation, but the cleaning effect is greatly affected by nozzle layout and cleaning liquid flow.

[0003] However, the above-mentioned technology at least has the following technical problems:

[0004] Firstly, the waterway and the airway are separated during the cleaning process, resulting in poor cleaning effect and incomplete removal of residues on the wafer surface, which not only affects the subsequent process, but also may cause product yield to decrease. SUMMARY

[0005] The utility model aims at providing a cleaning and blow-drying device to solve the problem of poor cleaning effect of wafer cleaning equipment in the prior art.

[0006] The technical scheme of the utility model is a cleaning and blow-drying device, comprising a bottom assembly and a top assembly.

[0007] The bottom assembly comprises:

[0008] a base;

[0009] a carrier for carrying materials to be cleaned;

[0010] a rotating mechanism comprising a driver, the driving end of the driver is coaxial with the carrier and is directly fixed, for driving the carrier to rotate around a vertical axis; and

[0011] a cleaning mechanism corresponding to the carrier, comprising a spray head and a cleaning driver for driving the spray head to move;

[0012] The top assembly comprises:

[0013] a drying mechanism comprising a fan suspended on the top of the carrier through a top mounting seat; and

[0014] a fence, driven by the lifting mechanism, for providing a channel for taking and placing materials on the carrier, or for closing the space between the cleaning mechanism and the carrier during cleaning operation.

[0015] Preferably, the top assembly comprises a guide mechanism, the guide mechanism comprising a guide wheel and a guide rod;

[0016] The guide wheel is fixed on the base, and the guide wheels are arranged in pairs and configured in at least two pairs in the vertical direction, and the guide rods are inserted into the gaps between any pair of guide wheels; the top end of the guide rod is fixed with the enclosure, and the other end is in sliding fit with the two pairs of guide wheels.

[0017] Preferably, the carrier comprises a bottom plate, a cover plate is arranged on the bottom plate, and an adsorption channel is arranged on the bottom plate;

[0018] The cover plate is configured to have a plurality of microporous structures, one end of the adsorption channel is connected with a negative pressure device, and the other end is connected with the cover plate.

[0019] Preferably, the cleaning mechanism comprises a cleaning support, one end of the cleaning support penetrates through the base and is fixed with a cleaning driver, and the other end extends upward and carries a nozzle.

[0020] Preferably, a flow detector is arranged near the nozzle, and the flow detector dynamically adjusts the cleaning parameters of the cleaning mechanism by real-time monitoring.

[0021] Preferably, a ventilation groove is arranged on the top mounting seat, and the fan is mounted on the ventilation groove.

[0022] Compared with the prior art, the advantages of the utility model are:

[0023] (1) The drying mechanism is integrated, so that the wafer can be dried without transferring the station after being cleaned by the cleaning mechanism, and the cleaning efficiency of the wafer is improved.

[0024] (2) The enclosure is arranged, and the enclosure forms a closed space under the driving of the jacking mechanism during cleaning, effectively preventing liquid splashing; and the enclosure is automatically raised after operation to facilitate taking and placing the wafer.

[0025] (3) The carrier is driven to rotate at high speed by the rotating driving motor, and the cleaning liquid uniformly covers the surface of the wafer by the centrifugal force, avoiding local cleaning blind area. The nozzle can swing with the cleaning support, so that the position of the nozzle for spraying and cleaning on the wafer can be adjusted, and the cleaning effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] The utility model will be further described in connection with the drawings and examples:

[0027] Figure 1 A structure diagram of the cleaning and drying device is shown in the utility model;

[0028] Figure 2 A schematic diagram of the enclosure rising is shown in the utility model;

[0029] Figure 3 This is a structural diagram of the vehicle described in this utility model;

[0030] Figure 4 This is a structural diagram of the cleaning mechanism described in this utility model;

[0031] The components are: 1. base, 2. carrier, 21. bottom plate, 22. negative pressure channel, 23. cover plate, 3. cleaning mechanism, 31. cleaning bracket, 32. cleaning driver, 33. air pipe, 34. nozzle, 35. first interface, 36. second interface, 4. rotating mechanism, 5. drying mechanism, 51. top mounting base, 52. fan, 6. lifting mechanism, 7. enclosure, 8. guide mechanism, 81. guide wheel, 82. guide rod. Detailed Implementation

[0032] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] The present invention will be further described in detail below with reference to specific embodiments:

[0034] like Figure 1 As shown, a cleaning and drying device includes a bottom assembly and a top assembly.

[0035] The bottom assembly includes a base 1 and a carrier 2. The carrier 2 is used to hold the wafer to be cleaned. The base 1 is provided with a rotating mechanism 4 and a cleaning mechanism 3. The rotating mechanism 4 is connected to the carrier 2 and is used to drive the carrier 2 to rotate when the cleaning mechanism 3 is working, so as to use centrifugal force to evenly coat the entire wafer with the cleaning liquid sprayed by the cleaning mechanism 3.

[0036] Specifically, the rotating mechanism 4 includes a rotating drive motor located below the base 1. The actuator of the rotating drive motor passes through the base 1 and is coaxially fixed with the carrier 2, thereby driving the carrier 2 to rotate at high speed around its own axis.

[0037] like Figure 3 As shown, the carrier 2 includes a base plate 21, on which a negative pressure channel 22 is formed, connecting its upper and lower surfaces. An external negative pressure device is connected to the lower surface of the base plate 21. The negative pressure device generates negative pressure, which is transmitted to the upper surface of the base plate 21 via the negative pressure channel 22.

[0038] Further, the bottom plate 21 is provided with a cover plate 23, and the wafer is loaded on the cover plate 23. The cover plate 23 is made of porous ceramic and has a plurality of micro-holes. The negative pressure on the upper surface of the bottom plate 21 is further dispersed through the holes on the cover plate 23, so that the adsorption of the carrier 2 to the wafer is more uniform.

[0039] As shown in Figure 4 , the cleaning mechanism 3 includes a cleaning support 31, the bottom end of the cleaning support 31 penetrates the base 1 and is fixed with the cleaning driver 32, the other end extends upward in the vertical direction and is connected with the horizontally arranged air pipe 33, the end of the air pipe 33 away from the cleaning support 31 extends toward the upper side of the carrier 2 and is installed with the nozzle 34, the first interface 35 and the second interface 36. The base 1 stores cleaning liquid, and the cleaning liquid is connected with the nozzle 34 through the first interface 35, and the second interface 36 is communicated with the air source outside, so that the nozzle 34 can spray the cleaning liquid on the carrier 2. And, the flow detector is arranged near the nozzle 34, which dynamically adjusts the cleaning parameters of the cleaning mechanism 3 by real-time monitoring. The cleaning driver 32 can drive the cleaning support 31 to swing in the horizontal plane, so as to drive the nozzle 34 to clean different positions on the wafer in the carrier 2.

[0040] As shown in Figure 1 , the top assembly includes a drying mechanism 5, a jacking mechanism 6 and a fence 7.

[0041] The drying mechanism 5 is used to dry the wafer after the wafer is cleaned by the cleaning mechanism 3. The drying mechanism 5 includes a top mounting seat 51, which is connected with the base 1 in the bottom assembly through the jacking mechanism 6, and a ventilation slot is formed in the middle of the top mounting seat 51, and a fan 52 is installed on the ventilation slot. The wind power generated by the fan 52 blows into the wafer loaded on the carrier 2 through the ventilation slot.

[0042] One end of the jacking mechanism 6 is fixed on the base 1, and the execution end is fixed with the bottom end of the fence 7, which is used to drive the fence 7 to move up and down relative to the base 1.

[0043] As shown in Figure 2 , when the cleaning operation starts, the jacking mechanism 6 drives the fence 7 to rise, so that the fence 7 cooperates with the base 1 to close the space where the cleaning mechanism 3 and the carrier 2 are located, thereby avoiding the cleaning liquid from splashing outside the equipment during the cleaning operation. After the cleaning operation is completed, as shown in Figure 1 , the jacking mechanism 6 drives the fence 7 to descend, providing a channel for the operator to take out the wafer on the carrier 2.

[0044] In the preferred embodiment of the present application, the top assembly is further provided with a guiding mechanism 8 for enhancing the stability during the lifting action, which includes guiding rods 82 and guiding wheels 81. Among them, the guiding wheels 81 are arranged in pairs and fixed on the base 1, and are arranged as at least two pairs in the vertical direction, and there is a gap between any pair of guiding wheels 81, which can be inserted into the guiding rod 82 and make the guiding rod 82 and the guiding wheel 81 closely slide fit.

[0045] The top end of the guiding rod 82 is fixed with the enclosure 7, and the bottom end is in sliding fit with the guiding wheel 81, and the two pairs of guiding wheels 81 can make the guiding rod 82 not appear skew during lifting, thereby providing guidance for the movement of the enclosure 7.

[0046] The above examples are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present application, therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application.

Claims

1. A cleaning and drying apparatus, characterized by, The cleaning device comprises a bottom assembly and a top assembly; The bottom assembly comprises: a base (1); a carrier (2) for carrying materials to be cleaned; a rotating mechanism (4) comprising a driver coaxial with the carrier (2) and directly fixed thereto, for driving the carrier (2) to rotate around a vertical axis; and a cleaning mechanism (3) corresponding to the carrier (2) and comprising a spray head and a cleaning driver (32) for driving the spray head to move; The top assembly comprises: a drying mechanism (5) comprising a fan (52) suspended on the top of the carrier (2) through a top mounting seat (51); and an enclosure (7) driven by a lifting mechanism (6) to be lifted and lowered, so as to provide a channel for taking and placing materials on the carrier (2), or to close the space where the cleaning mechanism (3) and the carrier (2) are located during cleaning operation.

2. A cleaning and drying apparatus as claimed in claim 1, wherein The top assembly comprises a guide mechanism (8) comprising guide wheels (81) and guide rods (82); The guide wheels (81) are fixed on the base (1), and the guide wheels (81) are arranged in pairs and at least two pairs in the vertical direction, and the guide rods (82) are inserted between any pair of guide wheels (81); the top end of the guide rod (82) is fixed with the enclosure (7), and the other end is in sliding fit with the two pairs of guide wheels (81).

3. The cleaning and drying apparatus of claim 1, wherein The carrier (2) comprises a bottom plate (21), and a cover plate (23) is arranged on the bottom plate (21), and an adsorption channel is formed in the bottom plate (21); The cover plate (23) is configured to have a plurality of microporous structures, one end of the adsorption channel is connected with a negative pressure device, and the other end is connected with the cover plate (23).

4. The cleaning and drying apparatus of claim 1, wherein The cleaning mechanism (3) comprises a cleaning support (31), one end of the cleaning support (31) penetrates the base (1) and is fixed with the cleaning driver (32), and the other end extends upward and carries a nozzle (34).

5. A cleaning and drying apparatus as claimed in claim 4, wherein A flow detector is arranged near the nozzle (34), which dynamically adjusts the cleaning parameters of the cleaning mechanism (3) by real-time monitoring.

6. The cleaning and drying apparatus of claim 1, wherein, The top mounting seat (51) is provided with a ventilation groove, and the fan (52) is mounted on the ventilation groove.

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