Accurate positioning device for wafer processing

Abstract

The utility model relates to the technical field of wafer processing, and discloses an accurate positioning device for wafer processing, which comprises a workbench and a laser cutting machine, the top of the workbench is connected with a mounting assembly, and the bottom of the workbench is connected with a vacuum adsorption assembly; the vacuum adsorption assembly comprises a vacuum pump, a mounting frame and a spacer, one end of the mounting frame is fixedly connected to the bottom of the workbench, and the vacuum pump is connected into the mounting frame; compared with the prior art, the accurate positioning device for wafer processing has the advantages that a wafer can be fixed with uniform adsorption force, the damage to the wafer caused by overlarge local stress is avoided, the defects of microcracks, deformation and the like of the wafer in the processing process are reduced, and the processing quality of the accurate positioning device for wafer processing is improved; the shock insulator damaged by abrasion and aging is convenient to replace, the damaged shock insulator is prevented from influencing the vacuum adsorption effect, and the maintenance convenience of the wafer processing accurate positioning device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field especially relates to a wafer processing accurate positioning device. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuit, because its shape is round, is called wafer. It is the basic material of manufacturing semiconductor chip, has extremely important position in electronic information industry. The existing wafer processing accurate positioning device can not be fixed with uniform adsorption force wafer, leading to wafer to be easily damaged due to local excessive stress, reduce the processing quality, and the spacer damaged due to wear and aging is inconvenient to replace, leading to the influence of vacuum adsorption effect, and the maintenance convenience is lower. UTILITY MODEL CONTENT

[0003] The utility model aims at solving the shortcomings in the prior art and provides a wafer processing accurate positioning device.

[0004] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a wafer processing accurate positioning device, including workbench and laser cutting machine, the workbench top is connected with the installation assembly that is convenient for replacing the spacer, the workbench bottom is connected with the vacuum adsorption assembly that improves the processing quality;

[0005] The vacuum adsorption assembly includes a vacuum pump, a mounting bracket and a spacer, one end of the mounting bracket is fixedly connected to the bottom of the workbench, the vacuum pump is connected inside the mounting bracket, a connecting pipe is fixedly connected to the air inlet of the mounting bracket, one end of the connecting pipe is fixedly connected with a vacuum box, the vacuum box is fixedly connected to the bottom of the workbench, the spacer is located above the workbench, and adsorption holes are formed in the spacer and the workbench.

[0006] As a further description of the above technical scheme:

[0007] The vacuum adsorption assembly further includes a pressure sensor and a controller, the pressure sensor is connected inside the vacuum box, the controller is connected outside the mounting bracket, and the pressure sensor, the controller and the vacuum pump are electrically connected.

[0008] As a further description of the above technical scheme:

[0009] The installation assembly includes a fixed block, one end of the fixed block is fixedly connected to the top of the workbench, the other end of the fixed block is fixedly connected with a threaded rod, and the threaded rod is externally threaded with a nut.

[0010] As a further description of the above technical scheme:

[0011] The mounting assembly further comprises a positioning plate, one end of the positioning plate is fixedly connected to the top of the partition pad, a positioning hole is formed in the other end of the positioning plate, and the threaded rod slides in the positioning hole.

[0012] As a further description of the above technical solution:

[0013] The top of the workbench is fixedly connected with a fixing frame, and the laser cutting machine is connected to the top end in the fixing frame.

[0014] As a further description of the above technical solution:

[0015] The bottom of the workbench is fixedly connected with two groups of support frames.

[0016] As a further description of the above technical solution:

[0017] The partition pad is made of ceramic fiber material.

[0018] The utility model has the advantages of the following beneficial effects:

[0019] 1、The utility model discloses a vacuum adsorption assembly can fix the wafer with uniform adsorption force, avoids the damage of wafer caused by excessive local stress, reduces the microcrack, deformation and other defects of wafer in the processing, and improves the processing quality of wafer processing accurate positioning device.

[0020] 2、The utility model discloses an installation assembly, which is convenient for replacing damaged partition pad due to wear and aging, avoids the influence of damaged partition pad on the vacuum adsorption effect, and improves the maintenance convenience of wafer processing accurate positioning device. DRAWINGS

[0021] Figure 1 The utility model provides a kind of whole structure schematic of wafer processing accurate positioning device Figure One .

[0022] Figure 2 The utility model provides a kind of whole structure schematic of wafer processing accurate positioning device Figure Two .

[0023] Figure 3 The utility model provides a kind of partial structure schematic of wafer processing accurate positioning device Figure One .

[0024] Figure 4 The utility model provides a kind of partial structure schematic of wafer processing accurate positioning device Figure Two .

[0025] LEGEND:

[0026] 1, workbench; 2, laser cutting machine; 3, vacuum adsorption assembly; 4, vacuum pump; 5, mounting bracket; 6, connecting pipe; 7, vacuum box; 8, spacer; 9, adsorption hole; 10, pressure sensor; 11, controller; 12, mounting assembly; 13, fixed block; 14, threaded rod; 15, nut; 16, positioning plate; 17, positioning hole; 18, support frame; 19, fixed frame. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0028] Referring to Figures 1-4 An embodiment provided by the utility model: a wafer processing precision positioning device, comprising workbench 1 and laser cutting machine 2, workbench 1 top is connected with mounting assembly 12 for replacing spacer 8 conveniently, workbench 1 bottom is connected with vacuum adsorption assembly 3 for improving processing quality;

[0029] Vacuum adsorption assembly 3 includes vacuum pump 4, mounting bracket 5 and spacer 8, one end of mounting bracket 5 is fixedly connected at workbench 1 bottom, vacuum pump 4 is connected and arranged in mounting bracket 5, the air inlet of mounting bracket 5 is fixedly connected with connecting pipe 6, one end of connecting pipe 6 is fixedly connected with vacuum box 7, vacuum box 7 is fixedly connected at workbench 1 bottom, spacer 8 is located above workbench 1, and adsorption hole 9 is formed in spacer 8 and workbench 1.

[0030] Vacuum adsorption assembly 3 further includes pressure sensor 10 and controller 11, pressure sensor 10 is connected and arranged in the inner side of vacuum box 7, controller 11 is connected and arranged at the outer side of fixed frame 19, pressure sensor 10, controller 11 and vacuum pump 4 are electrically connected, mounting assembly 12 includes fixed block 13, one end of fixed block 13 is fixedly connected at workbench 1 top, the other end of fixed block 13 is fixedly connected with threaded rod 14, threaded rod 14 is externally threadedly connected with nut 15, so as to facilitate quick dismounting and mounting, mounting assembly 12 further includes positioning plate 16, one end of positioning plate 16 is fixedly connected at the top of spacer 8, the other end of positioning plate 16 is internally provided with positioning hole 17, threaded rod 14 slides in positioning hole 17, so as to ensure mounting accuracy, workbench 1 top is fixedly connected with fixed frame 19, laser cutting machine 2 is connected and arranged at the inner top end of fixed frame 19, workbench 1 bottom is fixedly connected with two groups of support frames 18, and spacer 8 is made of ceramic fiber material.

[0031] Working principle: the wafer is placed on the spacer 8, by starting the vacuum pump 4, the vacuum pump 4 through the connecting pipe 6, the air inside the vacuum box 7 is pumped out, the air enters the vacuum box 7 through the adsorption hole 9, the suction force generated can fix the wafer on the spacer 8, and the pressure change in the vacuum box 7 is monitored in real time through the pressure sensor 10, the pressure signal is converted into an electric signal and transmitted to the controller 11, the controller 11 controls the power of the vacuum pump 4, so as to fix the wafer with uniform adsorption force, improve the processing quality; then when the spacer 8 is damaged, rotate the nut 15, and take the nut 15 out from the outside of the threaded rod 14, then move the spacer 8 upwards, the spacer 8 drives the positioning plate 16 to slide out of the threaded rod 14, so that the damaged spacer 8 can be taken out, improving the maintenance convenience.

[0032] The electrical components appearing in the text are all connected with the main controller and 220V mains through electrical connection, and the main controller can be a conventional known device such as a computer, and the specific embodiments of the present disclosure omit the detailed description of known functions and known components. In order to ensure the compatibility of the device, the operation means adopted are consistent with the parameters of the market appliances.

[0033] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for the purpose of limiting the present application, although the foregoing detailed description of the present application is made with reference to the foregoing embodiments, for the person skilled in the art, it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for some technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer processing precision positioning device, comprising a workbench (1) and a laser cutting machine (2), characterized in that: The top of the workbench (1) is connected with an installation assembly (12), and the bottom of the workbench (1) is connected with a vacuum adsorption assembly (3); The vacuum adsorption assembly (3) comprises a vacuum pump (4), a mounting frame (5) and a spacer (8), one end of the mounting frame (5) is fixedly connected to the bottom of the workbench (1), the vacuum pump (4) is connected inside the mounting frame (5), a connecting pipe (6) is fixedly connected to the air inlet of the mounting frame (5), one end of the connecting pipe (6) is fixedly connected with a vacuum box (7), the vacuum box (7) is fixedly connected to the bottom of the workbench (1), and the spacer (8) is located above the workbench (1), and adsorption holes (9) are formed in the spacer (8) and the workbench (1).

2. The wafer processing precision positioning device of claim 1, wherein: The vacuum adsorption assembly (3) further comprises a pressure sensor (10) and a controller (11), the pressure sensor (10) is connected to the inside of the vacuum box (7), and the controller (11) is connected to the outside of the mounting frame (19).

3. The wafer processing precision positioning device of claim 1, wherein: The installation assembly (12) comprises a fixed block (13), one end of the fixed block (13) is fixedly connected to the top of the workbench (1), the other end of the fixed block (13) is fixedly connected with a threaded rod (14), and the threaded rod (14) is externally threaded connected with a nut (15).

4. The wafer processing precision positioning device of claim 3, wherein: The installation assembly (12) further comprises a positioning plate (16), one end of the positioning plate (16) is fixedly connected to the top of the spacer (8), the other end of the positioning plate (16) is internally provided with a positioning hole (17), and the threaded rod (14) slides in the positioning hole (17).

5. The wafer processing precision positioning device of claim 1, wherein: The top of the workbench (1) is fixedly connected with a fixed frame (19), and the laser cutting machine (2) is connected to the inner top end of the fixed frame (19).

6. The wafer processing precision positioning device of claim 1, wherein: The bottom of the workbench (1) is fixedly connected with two groups of supporting frames (18).

7. The wafer processing precision positioning device of claim 1, wherein: The spacer (8) is made of ceramic fiber material.

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