Double-sided grinding machine for semiconductor silicon wafer processing

Abstract

The utility model discloses a double-sided grinding machine for semiconductor silicon wafer processing, which relates to the technical field of semiconductor silicon wafer processing and comprises a base and two lower grinding discs, the two lower grinding discs are fixedly arranged on two sides of the upper surface of the base, and a grinding mechanism is arranged in each lower grinding disc. An upper grinding disc is arranged above the lower grinding disc on one side, a pressing disc is rotationally connected to the upper side of the upper grinding disc, vertical plates are fixedly arranged on the two sides of the upper surface of the base correspondingly, a cross rod is fixedly arranged between the upper ends of the vertical plates, a U-shaped plate is arranged on the lower side of the cross rod, and through holes are formed in the two ends of the U-shaped plate correspondingly; and the two ends of the cross rod penetrate through the corresponding through holes, and a first transmission mechanism for driving the upper grinding disc to rotate is arranged on the lower side of the U-shaped plate. By the adoption of the double-station design, grinding machining and material changing work can be carried out at the same time, the shutdown time of equipment can be shortened, and the machining efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor silicon wafer processing, and particularly relates to a double-sided grinding machine for semiconductor silicon wafer processing. BACKGROUND

[0002] In the processing of semiconductor silicon wafers, double-sided grinding is an important process, and the purpose is to obtain high-precision wafer surface flatness and smoothness. The traditional double-sided grinding machine for semiconductor silicon wafer processing usually adopts a single-station design, that is, the wafer loading, grinding, and unloading operations are completed in one station. This single-station design has obvious drawbacks. When the wafer to be ground needs to be replaced, the equipment must be stopped, which results in the equipment being idle during the replacement process, greatly wasting time and reducing the overall processing efficiency. Moreover, frequent start-stop of the equipment can adversely affect the stability and service life of the equipment. SUMMARY

[0003] In view of the above-mentioned problems of the existing double-sided grinding machine for semiconductor silicon wafer processing, the utility model is proposed.

[0004] Therefore, the utility model aims to provide a double-sided grinding machine for semiconductor silicon wafer processing, which solves the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A double-sided grinding machine for semiconductor silicon wafer processing includes a base and a lower grinding disc. Two lower grinding discs are fixedly arranged on the upper surface of the base on both sides. The inside of the lower grinding disc is provided with a grinding mechanism. An upper grinding disc is arranged above one side of the lower grinding disc. A pressure plate is rotatably connected to the upper side of the upper grinding disc. Vertical plates are fixedly arranged on both sides of the upper surface of the base. A horizontal bar is fixedly arranged between the upper ends of the vertical plates. A U-shaped plate is arranged on the lower side of the horizontal bar. Through holes are formed in both ends of the U-shaped plate. The ends of the horizontal bar pass through the corresponding through holes. A first transmission mechanism is arranged on the lower side of the U-shaped plate to drive the rotation of the upper grinding disc. Second transmission mechanisms are arranged on both sides of the base to drive the movement of the pressure plate.

[0007] Preferably, the grinding mechanism includes a spur gear and an internal gear ring. A rotating rod is rotatably arranged in the middle of the lower grinding disc. The spur gear is fixedly sleeved on the upper end of the rotating rod. The internal gear ring is fixedly sleeved on the inner wall of the lower grinding disc. A planetary gear is arranged between the spur gear and the internal gear ring. A plurality of wafer placement holes are formed in the surface of the planetary gear. First motors are fixedly arranged on both sides of the lower surface of the base. The output end of the first motor is fixedly connected to the lower end of the rotating rod.

[0008] Preferably, the first transmission mechanism comprises a square tube and a square rod, the square tube is rotationally arranged on the lower surface of the U-shaped plate, the square rod is matched with the sliding groove and is arranged in the interior of the square tube, the upper surface of the pressing disc is provided with an avoiding hole in the middle, the lower end of the square rod passes through the avoiding hole and is fixedly connected with the upper grinding disc, the upper surface of the U-shaped plate is fixedly provided with a second motor, and the output end of the second motor is fixedly connected with one end of the square tube.

[0009] Preferably, the second transmission mechanism comprises a lever and a round pin, the middle portion of the base is rotationally provided with a transmission rod on both sides, the lower surface of the base is fixedly provided with a double-shaft motor in the middle portion, the two output ends of the double-shaft motor are fixedly connected with one end of the corresponding transmission rod, the two levers are fixedly sleeved on both ends of the transmission rod, and the two round pins are fixedly arranged on both sides of the pressing disc.

[0010] Preferably, the rod wall of the round pin and located on the side away from the pressing disc is fixedly sleeved with an anti-falling ring.

[0011] Preferably, the longitudinal section of the cross rod and the through hole is rectangular.

[0012] In the above technical scheme, the technical effects and advantages of the utility model are provided:

[0013] 1. The utility model discloses a double-station design, two lower grinding discs are respectively located on both sides of the base, and different operations can be carried out simultaneously, when the upper grinding disc above one side lower grinding disc and the pressing disc grind and process the silicon wafer, the other side lower grinding disc can carry out the feeding or discharging work of the silicon wafer synchronously, greatly reduce the equipment downtime, and significantly improve the processing efficiency.

[0014] 2. The utility model discloses a unique grinding mechanism, a rotating rod is driven to rotate by a first motor, a spur gear on the rotating rod drives the planetary gear to make planetary motion in the internal tooth ring, so that the silicon wafer placed in the silicon wafer placing hole of the planetary gear can receive grinding force in multiple directions, and the uniformity of silicon wafer grinding and the surface quality are effectively improved.

[0015] 3. The utility model discloses a flexible transmission mechanism design, a square tube is driven to rotate by a second motor, and then the square rod drives the upper grinding disc to rotate, realizes the grinding of the silicon wafer, a transmission rod is driven to rotate by a double-shaft motor, and the lever on the transmission rod is matched with the round pin on both sides of the pressing disc through the strip-shaped opening, can accurately control the movement of the pressing disc, makes the upper grinding disc and the lower grinding disc closely cooperate, and ensures that the grinding work is stably carried out. DRAWINGS

[0016] In order to make the technical personnel in the art better understand the technical scheme of the present application, the following will be further described in detail with reference to the drawings.

[0017] Figure 1 A structure schematic view of a double-sided grinding machine for semiconductor silicon wafer processing is provided in the present application.

[0018] Figure 2 A structure schematic view of a double-sided grinding machine for semiconductor silicon wafer processing is provided in the present application. Figure 1 A structure schematic view of a double-sided grinding machine for semiconductor silicon wafer processing is provided in the present application.

[0019] Figure 3 A structure schematic view of a double-sided grinding machine for semiconductor silicon wafer processing is provided in the present application. Figure 1 A structure schematic view of a double-sided grinding machine for semiconductor silicon wafer processing is provided in the present application.

[0020] Figure 4 A structure schematic view of a double-sided grinding machine for semiconductor silicon wafer processing is provided in the present application. Figure 1 A structure schematic view of a double-sided grinding machine for semiconductor silicon wafer processing is provided in the present application.

[0021] Explanation of reference signs:

[0022] 1, base; 2, vertical plate; 3, cross bar; 4, U-shaped plate; 5, square tube; 6, second motor; 7, square rod; 8, pressure plate; 9, upper grinding disc; 10, lower grinding disc; 11, transmission rod; 12, push rod; 13, round pin; 14, first motor; 15, inner gear ring; 16, straight gear; 17, planetary gear; 18, first motor; 19, double-shaft motor. DETAILED DESCRIPTION

[0023] In order to make the technical personnel in the art better understand the technical scheme of the present application, the following will be further described in detail with reference to the drawings.

[0024] The embodiment of the present application discloses a double-sided grinding machine for semiconductor silicon wafer processing.

[0025] Embodiment one

[0026] Referring to Figures 1-4 A double-sided grinding machine for semiconductor silicon wafer processing, including base 1 and lower grinding disc 10, two lower grinding discs 10 are fixedly arranged on the upper surface of base 1 both sides, the upper side of one side lower grinding disc 10 is provided with upper grinding disc 9, the upper side of upper grinding disc 9 is rotatably connected with pressure plate 8, the upper surface of base 1 both sides are fixedly provided with vertical plate 2, the upper end between vertical plate 2 is fixedly provided with cross bar 3, the lower side of cross bar 3 is provided with U-shaped plate 4, both ends of U-shaped plate 4 are provided with through hole, both ends of cross bar 3 pass through corresponding through hole, the longitudinal section of cross bar 3 and through hole are all rectangular, so that U-shaped plate 4 cannot rotate, that is, can stably slide.

[0027] Embodiment two

[0028] With reference to Figures 1-4 , the inner part of the lower grinding disc 10 is provided with a grinding mechanism, the grinding mechanism comprises a spur gear 16 and an inner tooth ring 15, the middle part of the lower grinding disc 10 is rotatably provided with a rotating rod, the spur gear 16 is fixedly sleeved on the upper end of the rotating rod, the inner tooth ring 15 is fixedly sleeved on the inner wall of the lower grinding disc 10, a planet gear 17 is meshingly arranged between the spur gear 16 and the inner tooth ring 15, a plurality of silicon wafer placing holes are formed in the surface of the planet gear 17, the lower surface of the base 1 is fixedly provided with a first motor 14 on both sides, and the output end of the first motor 14 is fixedly connected with the lower end of the rotating rod.

[0029] Embodiment three

[0030] With reference to Figures 1-4 , the lower side of the U-shaped plate 4 is provided with a first transmission mechanism for driving the upper grinding disc 9 to rotate, the first transmission mechanism comprises a square tube 5 and a square rod 7, the square tube 5 is rotatably arranged on the lower surface of the U-shaped plate 4, the square rod 7 is matchedly sleeved in the inner part of the square tube 5, the upper surface of the pressing disc 8 is provided with an avoiding hole in the middle part, the lower end of the square rod 7 passes through the avoiding hole and is fixedly connected with the upper grinding disc 9, the upper surface of the U-shaped plate 4 is fixedly provided with a second motor 6, and the output end of the second motor 6 is fixedly connected with one end of the square tube 5.

[0031] Embodiment four

[0032] With reference to Figures 1-4 , the two sides of the base 1 are provided with a second transmission mechanism for driving the pressing disc 8 to move, the second transmission mechanism comprises a lever 12 and a round pin 13, the middle part of the base 1 is rotatably provided with a transmission rod 11 on both sides, the lower surface of the base 1 is fixedly provided with a double-shaft motor 19 in the middle part, the two output ends of the double-shaft motor 19 are fixedly connected with one end of the corresponding transmission rod 11, the two levers 12 are fixedly sleeved on the two ends of the transmission rod 11, the two round pins 13 are fixedly arranged on the two sides of the pressing disc 8, the surface of the lever 12 is provided with a strip-shaped hole, the ends, away from the pressing disc 8, of the two round pins 13 all pass through the corresponding strip-shaped holes, and the rod wall of the round pin 13 and the side, away from the pressing disc 8, of the lever 12 are fixedly sleeved with anti-falling rings, so as to prevent the round pin 13 from sliding out of the strip-shaped hole.

[0033] In the utility model, firstly, the double-shaft motor 19 is started, the two output ends of the double-shaft motor 19 drive the transmission rods 11 on the two sides to rotate, when the transmission rods 11 rotate, the levers 12 fixedly sleeved on the two ends thereof rotate, the levers 12 are matched with the round pins 13 through the strip-shaped holes on the surfaces thereof, the pressing disc 8 is driven to move away from the lower grinding disc 10, space is left for the feeding operation, at the moment, the silicon wafer to be ground is placed in the silicon wafer placing hole of the planet gear 17 in the one side lower grinding disc 10, and meanwhile, the silicon wafer after grinding can be taken out and replaced with a new silicon wafer to be ground;

[0034] Then, the double-shaft motor 19 is started again, the pressing plate 8 is moved to the direction of approaching the lower grinding plate 10, until the pressing plate 8 is tightly attached to the upper grinding plate 9, and a certain pressure is applied to the silicon wafer below the upper grinding plate 9, then the first motor 14 is started, the output end of the first motor 14 drives the rotating rod to rotate, the rotating rod drives the spur gear 16 to rotate, the spur gear 16 drives the planetary gear 17 to do planetary motion in the internal tooth ring 15, so as to grind the silicon wafer, at the same time, the second motor 6 is started, the output end of the second motor 6 drives the square tube 5 to rotate, the square tube 5 drives the upper grinding plate 9 to rotate through the square rod 7, and the grinding effect of the silicon wafer is further improved; during the grinding process, the operator can adjust the rotating speed of the first motor 14, the second motor 6 and the double-shaft motor 19 according to the material, thickness and required grinding precision of the silicon wafer and other factors, so as to optimize the grinding parameters, and ensure that the silicon wafer can reach the ideal grinding quality, when the grinding of one side of the silicon wafer is completed, the above operation is repeated, the silicon wafer that has been ground is taken out, and a new silicon wafer to be ground is put in, at the same time, the grinding work of the other side continues, so as to realize the efficient double-face grinding processing of the semiconductor silicon wafer.

[0035] The above only describes some exemplary embodiments of the utility model by way of illustration, without doubt, for ordinary skilled in the art, under the condition that the spirit and scope of the utility model are not deviated, the described embodiments can be modified in various different ways, therefore, the above drawings and description are illustrative in nature, should not be understood as the limitation of the utility model claim protection scope.

Claims

1. A double-sided polishing machine for processing a semiconductor silicon wafer, comprising a base (1) and a lower polishing plate (10), characterized in that, Two said lower grinding disc (10) fixedly arranged on the upper surface of the base (1) two sides, the lower grinding disc (10) is provided with grinding mechanism inside, one side of the lower grinding disc (10) is provided with upper grinding disc (9) above, the upper side of the upper grinding disc (9) is rotatably connected with the pressure plate (8), the upper surface of the base (1) is fixedly provided with vertical plate (2) on both sides, the upper end of the vertical plate (2) is fixedly provided with cross bar (3) between, the lower side of the cross bar (3) is provided with U-shaped plate (4), the both ends of the U-shaped plate (4) are provided with through hole, the both ends of the cross bar (3) are penetrated through the corresponding through hole, the lower side of the U-shaped plate (4) is provided with the first transmission mechanism for driving the upper grinding disc (9) to rotate, the both sides of the base (1) are provided with the second transmission mechanism for driving the pressure plate (8) to move.

2. The double-sided polishing machine for processing a semiconductor silicon wafer according to claim 1, wherein The grinding mechanism comprises a spur gear (16) and an internal gear ring (15), the middle part of the lower grinding disc (10) is rotatably provided with a rotating rod, the spur gear (16) is fixedly sleeved on the upper end of the rotating rod, the internal gear ring (15) is fixedly sleeved on the inner wall of the lower grinding disc (10), the spur gear (16) and the internal gear ring (15) are engaged with the planet gear (17) therebetween, a plurality of silicon wafer placing holes are formed in the surface of the planet gear (17), the lower surface of the base (1) is fixedly provided with a first motor (14) on both sides, and the output end of the first motor (14) is fixedly connected with the lower end of the rotating rod.

3. The double-sided polishing machine for processing a semiconductor silicon wafer according to Claim 1, wherein The first transmission mechanism comprises a square tube (5) and a square rod (7), the square tube (5) is rotatably arranged on the lower surface of the U-shaped plate (4), the square rod (7) is matched with the sliding groove and is sleeved in the square tube (5), the upper surface of the pressure plate (8) is provided with an avoiding hole in the middle part, the lower end of the square rod (7) penetrates through the avoiding hole and is fixedly connected with the upper grinding disc (9), the upper surface of the U-shaped plate (4) is fixedly provided with a second motor (6), and the output end of the second motor (6) is fixedly connected with one end of the square tube (5).

4. The double-sided polishing machine for processing a semiconductor silicon wafer according to Claim 1, wherein The second transmission mechanism comprises a lever (12) and a round pin (13), the middle part of the base (1) is rotatably provided with a transmission rod (11) on both sides, the lower surface of the base (1) is fixedly provided with a double shaft motor (19) in the middle part, the two output ends of the double shaft motor (19) are fixedly connected with one end of the corresponding transmission rod (11), the two levers (12) are fixedly sleeved on the two ends of the transmission rod (11), the two round pins (13) are fixedly arranged on the two sides of the pressure plate (8), and the surface of the lever (12) is provided with a strip-shaped hole, and the ends of the two round pins (13) away from the pressure plate (8) penetrate through the corresponding strip-shaped hole.

5. The double-sided polishing machine for processing a semiconductor silicon wafer according to claim 4, wherein The rod wall of the round pin (13) and the side away from the pressure plate (8) of the lever (12) are fixedly sleeved with an anti-off ring.

6. The double-sided semiconductor silicon wafer polishing machine of claim 1, wherein, The longitudinal section of the cross bar (3) and the through hole is rectangular.

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