Chip grinding jig
By setting a suitable chip fixing groove on the chip grinding fixture, the problems of inconsistent chip grinding and low efficiency in the prior art are solved, and a highly efficient and precise chip grinding effect is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2026-04-10
AI Technical Summary
In existing technologies, the flatness is difficult to control when grinding by hand. Using an adjustable crystal back grinding fixture requires readjusting the chip's fixed size, resulting in low work efficiency and an inability to guarantee the consistent grinding quality of a large number of samples of the same size and specifications.
Design a chip grinding fixture, including setting a chip fixing groove on the main body of the fixture with a width adapted to the chip plane size, and setting the depth of the chip fixing groove to the target thickness for grinding and thinning, to ensure that the chip is fixed in the horizontal direction, and to perform precise grinding by pressing the fixture onto the grinding machine by hand.
This achieved consistent grinding quality for a large number of samples of the same size and specifications, improved operational convenience and efficiency, avoided over- or under-grinding, and ensured chip stability and high precision.
Smart Images
Figure CN224102663U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip manufacturing technical field, in particular to a chip grinding jig. BACKGROUND
[0002] Since the birth of semiconductor technology, it has been the core force of promoting modern scientific and technological revolution and the development of information society. With the continuous progress of integrated circuit technology, the integration of semiconductor devices is getting higher and higher, the performance is getting more and more powerful, and the application field is also getting more and more extensive. However, with the development and application of technology, the failure problem of semiconductor devices is increasingly prominent, which has become one of the important factors restricting the development of semiconductor industry, and the difficulty of failure analysis is increasing, so it is necessary to continuously update and improve the analysis method to improve the accuracy and efficiency of analysis.
[0003] For chip scale package (CSP, Chip Scale Package) sample, failure analysis needs to perform thermal positioning analysis, because the sample wafer back is too thick, the thermal positioning equipment cannot detect thermal radiation, such as through wafer back thinning (less than 100um thickness), thermal positioning detection can accurately locate the fault point, through jig customization, wafer back thinning can provide high reliability grinding thinning benefit, so that the subsequent hot spot positioning can play its function, increase the experimental efficiency and reduce the wafer back thinning time cost.
[0004] At present, CSP chip level package executes grinding wafer back analysis by using adhesive tape on the finger grinding, or using adjustable wafer back grinding jig, using different mesh sandpaper for grinding on the grinding machine, when a large number of same size samples are pressed by hand, the flatness is not easy to control, the adjustable wafer back grinding jig needs to be re-adjusted for the fixed size of the chip, which consumes time and affects the work efficiency, and the grinding quality consistency of a large number of same size samples cannot be guaranteed. UTILITY MODEL CONTENTS
[0005] In view of the above-mentioned defects of the prior art, the purpose of the utility model is to provide a chip grinding jig, which is used to solve the problem that in the prior art, for a large number of same size samples, the flatness is not easy to control when pressing by hand, the adjustable wafer back grinding jig needs to be re-adjusted for the fixed size of the chip, which consumes time and affects the work efficiency, and the grinding quality consistency of a large number of same size samples cannot be guaranteed.
[0006] To achieve the above-mentioned purpose and other related purposes, the utility model provides a chip grinding jig, the jig includes a jig main body, the jig main body includes a plurality of flat surfaces, at least one of the flat surfaces is provided with a chip fixing groove, the width of the chip fixing groove is matched with the plane size of the chip to be ground and thinned, and the depth of the chip fixing groove is equal to the target thickness of the chip grinding and thinning.
[0007] Optionally, the jig body is a cuboid structure, and the chip fixing grooves are arranged on part of the surfaces of the jig body.
[0008] Optionally, the jig body is a cuboid structure, and the chip fixing grooves are arranged on all the surfaces of the jig body.
[0009] Further, the chip fixing grooves include first chip fixing grooves and second chip fixing grooves, the upper surface and the lower surface of the jig body are provided with the first chip fixing grooves, the side surface of the jig body is provided with the second chip fixing grooves, and the chip fixing grooves extend along one side of the surface to the opposite side.
[0010] Further, the length extension directions of all the second chip fixing grooves are perpendicular to the height direction of the jig body, and the length extension directions of all the first chip fixing grooves are parallel to each other.
[0011] Further, the first chip fixing grooves are arranged at the middle positions of the upper surface and the lower surface of the jig body, and the second chip fixing grooves are arranged at the middle position heights of the side surfaces of the jig body.
[0012] Optionally, the chip to be thinned by grinding is a CSP chip.
[0013] As described above, the chip grinding jig has the following beneficial effects: by arranging the chip fixing grooves on at least one flat surface of the jig body, and the width of the chip fixing grooves is matched with the planar size of the chip to be thinned by grinding, the chip can be fixed in the chip fixing groove of the jig in the horizontal direction, so that a large number of samples of the same size specification can maintain consistent grinding quality during grinding, and the chip loading and unloading are convenient and the operation is convenient. In addition, by arranging the depth of the chip fixing groove to be equal to the target thickness of the chip grinding and thinning, when the jig is used to grind and thin the chip, the front surface of the chip is fixed in the chip fixing groove, so that part of the substrate on the back surface of the chip protrudes from the surface of the jig body, then the jig is held and pressed on the grinding machine for grinding, until the back surface of the ground chip is flush with the surface of the jig body, so that the grinding process can be accurately controlled, and over-grinding or insufficient grinding is avoided. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 The overall structure of the chip grinding jig of the present application is shown.
[0015] Figure 2 The side surface structure of the chip grinding jig of the present application is shown.
[0016] Figure 3 A schematic diagram showing the chip fixing groove of the chip grinding jig of the present application is coated with hot melt adhesive.
[0017] Figure 4 A schematic diagram showing the chip fixing groove of the chip grinding jig of the present application is coated with hot melt adhesive and the chip is fixed.
[0018] Figure 5 A schematic diagram showing the chip grinding jig of the present application is used to grind and thin the chip.
[0019] Element number explanation
[0020] 10 Jig body
[0021] 11 First chip fixing groove
[0022] 12 Second chip fixing groove
[0023] 13 Hot melt adhesive
[0024] 14 Chip
[0025] 15 Grinder DETAILED DESCRIPTION
[0026] The embodiments of the present application will be described in detail by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification.
[0027] Please refer to Figures 1 to 5 It should be understood that the structure, proportion, size, etc. shown in the drawings attached to the specification are only used to cooperate with the content disclosed in the specification for understanding and reading by those skilled in the art, and do not define the limiting conditions for the implementation of the present application, so they do not have technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "up", "down", "left", "right", "middle" and "one" in the specification are only for the convenience of clear understanding of the description, and are not used to limit the scope of the present application. The change or adjustment of the relative relationship without substantial change of the technical content is also considered as the scope of the present application.
[0028] As Figures 1 to 2As shown, the utility model provides a kind of chip grinding jig, the jig includes jig main body 10, the jig main body 10 includes several flat surfaces, at least one flat the surface of which is provided with chip fixed groove, the width of the chip fixed groove is adapted to the plane size of chip 14 to be ground and thinned, the depth of the chip fixed groove is equal to the target thickness of the chip grinding and thinning.
[0029] The chip grinding jig of the embodiment, by setting chip fixed groove on at least one flat surface of jig main body, and the width of the chip fixed groove is adapted to the plane size of chip to be ground and thinned, so that the chip can be fixed in the chip fixed groove of jig along the horizontal direction, so that a large number of samples of the same size specification can maintain consistent grinding quality when grinding, and the chip loading and unloading is convenient, and the operation is convenient.In addition, by setting the depth of the chip fixed groove equal to the target thickness of the chip grinding and thinning, when the jig is used to grind and thin the chip, the front surface of the chip is fixed in the chip fixed groove, so that part of the substrate on the back surface of the chip protrudes from the surface of the jig main body, then the jig is held and pressed on the grinding machine for grinding until the back surface of the ground chip is flush with the surface of the chip main body, so that the grinding process can be accurately controlled to avoid excessive grinding or insufficient grinding.
[0030] As an example, the chip 14 to be ground and thinned is a CSP chip, which usually has small size and high integration, and has very high grinding accuracy requirement, and the chip fixed groove adapted to the size of the CSP chip can ensure that the CSP chip remains stable during grinding and reduces uneven grinding caused by vibration or uneven stress.
[0031] As an example, the jig main body 10 is a cuboid structure, and the chip fixed groove is provided on part of the surface of the jig main body 10, which can only play the role of fixing the chip 14 for grinding.Preferably, as shown in Figure 1 and Figure 2 As shown in the embodiment, the jig main body 10 is a cuboid structure, and the chip fixed groove is provided on all the surfaces of the jig main body 10, which can switch the chip fixed groove of different surfaces to fix the chip 14, which not only can effectively fix the chip 14 for grinding, but also can improve the convenience of operation and prolong the service life of the jig, while ensuring high precision and high efficiency of the grinding process.
[0032] As a further example, as shown in Figure 1 and Figure 2As shown, the chip fixing groove includes a plurality of first chip fixing grooves 11 and a plurality of second chip fixing grooves 12. The upper surface and the lower surface of the jig body 10 are provided with the first chip fixing grooves 11, and the side surface of the jig body 10 is provided with the second chip fixing grooves 12. The chip fixing groove extends from one side of the surface to the opposite side, so that the wafer 14 can be fixed on any position in the chip fixing groove, and the hot melt adhesive 13 can be easily coated and removed, further improving the convenience of operation.
[0033] As a further example, as shown in Figure 1 and Figure 2 The length extension direction of all the second chip fixing grooves 12 is perpendicular to the height direction of the jig body 10, and the length extension direction of all the first chip fixing grooves is parallel to each other. All the second chip fixing grooves 12 on the side surface of the jig body 10 "surround" the jig body 10. The "surrounding" arrangement allows each side surface of the jig body 10 to be used uniformly, reduces local wear and tear, prolongs the service life of the jig, and reduces the frequency of replacing the jig.
[0034] As a further example, as shown in Figure 1 and Figure 2 The first chip fixing groove 11 is arranged at the middle position of the upper surface and the lower surface of the jig body 10, and the second chip fixing groove 12 is arranged at the middle position height of the side surface of the jig body 10. This arrangement reduces the structural deformation or damage of the jig body 10 caused by excessive local stress during hand-held jig grinding, improves the overall stability and reliability of the jig, and makes the jig more stable during grinding. It can reduce the influence on grinding accuracy and damage to the structure of the jig caused by vibration or uneven stress, thereby prolonging the service life of the jig and improving the grinding accuracy.
[0035] As an example, as shown in Figure 3 and Figure 4 The method for grinding and thinning the chip 14 using the chip grinding jig of the present embodiment includes the following steps:
[0036] S1, place the jig on a heating platform for heating. The heating temperature can be adjusted according to the softening characteristics of the actual hot melt adhesive 13 used, and is usually heated to the softening point temperature of the hot melt adhesive 13 to ensure that the hot melt adhesive 13 can be uniformly softened. The temperature should be kept stable during heating to avoid temperature fluctuations affecting the performance of the hot melt adhesive 13.
[0037] S2, as shown in Figure 3As shown, the hot melt adhesive 13 is evenly applied in the chip fixing groove of the jig body 10, so that the hot melt adhesive 13 is evenly and smoothly covered on the bottom of the chip fixing groove after being softened by heat. It should be noted that the thickness of the hot melt adhesive 13 is usually very thin, and the depth of the chip fixing groove can be considered as equal to the target thickness of the chip 14 after grinding and thinning.
[0038] S3, as shown, the chip 14 to be ground and thinned is placed in the chip fixing groove with the front face upward, and the chip 14 is pressed to ensure that there is no air bubble between the chip 14 and the hot melt adhesive 13, which may cause the chip 14 to be displaced or unevenly ground in the subsequent grinding process. When the chip 14 is pressed, uniform force should be applied to avoid damaging the chip 14. Figure 4
[0039] S4, the X-ray device is used to detect whether the chip 14 is smoothly fixed on the jig. If it is found that there is unevenness or air bubble between the chip 14 and the jig, the position of the chip 14 should be adjusted to ensure that it is smoothly fixed.
[0040] S5, as shown, the jig is held and the side of the jig with the chip 14 fixed thereon is pressed onto the grinder 15 for grinding until the surface of the ground chip 14 is flush with the surface of the chip body 10, so that the grinding process can be accurately controlled to avoid overgrinding or insufficient grinding. Figure 5
[0041] In summary, the chip grinding jig of the utility model has the advantages that the chip fixing groove is arranged on the surface of the jig body, and the width of the chip fixing groove is matched with the planar size of the chip to be ground and thinned, so that the chip can be fixed in the chip fixing groove of the jig in the horizontal direction, a large number of samples with the same size can be ground to have consistent grinding quality, and the chip is convenient to load and unload. In addition, the depth of the chip fixing groove is equal to the target thickness of the chip after grinding and thinning, so that the front face of the chip is fixed in the chip fixing groove when the chip is ground and thinned by using the jig, part of the substrate on the back face of the chip protrudes from the surface of the jig body, and then the jig is held and pressed on the grinder for grinding until the back face of the ground chip is flush with the surface of the chip body, so that the grinding process can be accurately controlled to avoid overgrinding or insufficient grinding. Therefore, the utility model effectively overcomes the shortcomings of the prior art and has high industrial utilization value.
[0042] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.
Claims
1. A chip grinding jig, characterized by: The jig comprises a jig body comprising several flat surfaces, wherein at least one flat surface is provided with a chip fixing groove, the width of the chip fixing groove is adapted to the planar size of the chip to be thinned by grinding, and the depth of the chip fixing groove is equal to the target thickness of the chip to be thinned by grinding.
2. The chip grinding jig according to claim 1, wherein: The jig body is a cuboid structure, and the chip fixing groove is provided on part of the surfaces of the jig body.
3. The chip grinding jig of claim 1, wherein: The jig body is a cuboid structure, and the chip fixing groove is provided on all the surfaces of the jig body.
4. The chip grinding jig of claim 3, wherein: The chip fixing groove comprises first chip fixing grooves and second chip fixing grooves, the upper surface and the lower surface of the jig body are provided with the first chip fixing grooves, the side surfaces of the jig body are provided with the second chip fixing grooves, and the chip fixing grooves extend along one side of the surface to the opposite side.
5. The chip grinding jig of claim 4, wherein: The length extension directions of all the second chip fixing grooves are perpendicular to the height direction of the jig body, and the length extension directions of all the first chip fixing grooves are parallel to each other.
6. The chip grinding jig of claim 5, wherein: The first chip fixing grooves are arranged at the middle positions of the upper surface and the lower surface of the jig body, and the second chip fixing grooves are arranged at the middle height positions of the side surfaces of the jig body.
7. The chip grinding jig of claim 1, wherein: The chip to be thinned by grinding is a CSP chip.