Control node for intelligent equipment integration platform

Abstract

The utility model discloses a control node for an intelligent equipment integration platform. The control node comprises a shell, a core control board, a plurality of functional module control boards, a plurality of IO control boards and a flat cable, the core control board, the function module control board and the IO control board are provided with a plurality of connectors, and the function module control board and the IO control board are connected to the core control board through flat cables and connecting lines. The control circuit board is divided into the core control board, the function module control board and the IO control board, flexible configuration of the core control board with different function module control boards and IO control boards can be realized according to project requirements, research and development and deployment cost is reduced, project period is shortened, integration efficiency and adaptive capacity of an automatic system are remarkably improved, and reliability of the system is improved. The method is especially suitable for the requirements of an efficient and dynamic response automation system in a complex industrial environment.

Description

TECHNICAL FIELD

[0001] The utility model relates to automatic equipment control technical field, concretely is a control node for intelligent equipment integrated platform. BACKGROUND

[0002] Automatic equipment integration is a process of integrating multiple automation equipment, systems or technologies into a unified, collaborative whole solution. It is widely used in industry, manufacturing, logistics, medical care, energy and other fields, aiming to improve production efficiency, reduce cost, improve product quality and reliability.

[0003] The control node in the application is a node controller responsible for local data transmission, collaborative control and other functions of one or more automation equipment in the automatic equipment integrated system. The main functions of the control node include local control and task allocation, data acquisition and communication, fault diagnosis and fault tolerance, and coordination of collaborative work, so as to realize an efficient, dynamic response automation system and meet the diversified needs in complex industrial environments.

[0004] In actual practice, there are various types of automation equipment, even for the same industry. Different automation equipment on production lines of different enterprises has thousands of differences in types, manufacturers and controllers, so the control node needs to be adjusted to adapt to different equipment. However, if the bottom circuit and PCB of the control node need to be redesigned for a certain scene, it will make the project cycle longer, the cost of node research and development and manufacturing higher, and it is beneficial to the rapid deployment and implementation of the project. SUMMARY

[0005] The utility model aims at providing a control node for intelligent equipment integrated platform to solve the problems in the prior art.

[0006] In order to realize the above-mentioned purpose, the technical scheme of the utility model provides a control node for intelligent equipment integrated platform, which comprises a shell, a core control board, a plurality of function module control boards, a plurality of IO control boards and a wire harness.

[0007] Further, each IO control board is provided with any one of digital input / output interface, analog input / output interface, serial communication interface, Ethernet interface, field bus interface, IO-Link interface, USB interface and wiring terminal, as well as the corresponding data preprocessing components and the connector connected with the core control board.

[0008] Further, the function module control board and the IO control board are arranged on both sides of the core control board.

[0009] Further, the functional module control board is single-layer or double-layer PCB board structure.

[0010] Further, the control node further comprises a plurality of electromagnetic compatibility shielding cavities; the electromagnetic compatibility shielding cavity is a cavity structure with an open lower part, which is arranged on the upper part of the core control board and / or the functional module control board.

[0011] Further, a heat dissipation structure is arranged on the shell below the electromagnetic compatibility shielding cavity, and the heat dissipation structure is a heat dissipation grid opening or a heat dissipation fin.

[0012] Further, the electromagnetic compatibility shielding cavity is provided with an opening for the connector to leak out, and a shielding rubber ring is arranged at the opening.

[0013] Further, a downward bending wall is arranged at the opening, a plurality of through grooves are arranged on the bending wall, and a plurality of positioning protrusions matched with the through grooves are arranged outside the shielding rubber ring.

[0014] Further, the through grooves extend to the upper surface of the electromagnetic compatibility shielding cavity; and a sealing cover is arranged on the upper part of the shielding rubber ring.

[0015] Further, the shielding rubber ring comprises a plurality of silica gel rubber layers and a metal wire mesh layer.

[0016] The control node for the intelligent equipment integrated platform adopts a modular design, divides the control circuit board into a core control board, a functional module control board and an IO control board, can realize flexible configuration of the core control board with different functional module control boards and IO control boards according to project needs, reduces the research and development and deployment costs, shortens the project cycle, significantly improves the integration efficiency and adaptability of the automatic system, and is especially suitable for the demand of the automatic system for high efficiency and dynamic response in a complex industrial environment. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic diagram of the whole scheme of the control node of the utility model.

[0018] Figure 2 is a schematic diagram of the internal structure of the control node of the utility model.

[0019] Figure 3 is a schematic diagram of the internal structure of the control node of the utility model from another angle.

[0020] Figure 4 is a schematic diagram of the electromagnetic compatibility shielding cavity of an embodiment of the utility model.

[0021] Figure 5 is an enlarged schematic diagram of the opening area of the electromagnetic compatibility shielding cavity of an embodiment of the utility model. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] As attached Figures 1-5 As shown, the control node of the intelligent device integration platform involved in this utility model includes a shell 1, a core control board 2, several functional module control boards 3, several IO control boards 4, and ribbon cables (not shown).

[0024] The core control board 2, the functional module control board 3, and the IO control board 4 are housed inside the outer casing 1.

[0025] The core control board 2, the functional module control board 3, and the IO control board 4 are PCB boards with components installed. Each of the core control board 2, the functional module control board 3, and the IO control board 4 is equipped with several connectors L.

[0026] Specifically, each IO control board 4 is equipped with any one of the following IO interfaces: digital input / output interface, analog input / output interface, serial communication interface, Ethernet interface, fieldbus interface, IO-Link interface, USB interface, and terminal block, as well as the corresponding data preprocessing components and connectors connected to the core control board 2.

[0027] Each functional module control board 3 is equipped with pre-set components and circuits for a specific function, as well as connectors that connect to the core control board 2. For example, a separate functional module control board can be set up for the data compilation or extraction unit function of a specific controller.

[0028] Functional module control board 3 and IO control board 4 are connected to core control board 2 via ribbon cables and connecting cables.

[0029] Appendix Figure 2 , 3 As shown, the functional module control board 3 and several IO control boards 4 are arranged on both sides of the core control board 2 to facilitate the connection between the functional module control board 3, the IO control boards 4 and the core control board 2.

[0030] The layered architecture of its core control board, functional module control board, and IO control board achieves high flexibility and scalability, enabling rapid customization and expansion of functional modules according to different scenarios to meet diverse industrial needs. The rich interface types (such as digital / analog I / O, Ethernet, fieldbus, etc.) and functional module units ensure seamless connection and efficient communication with various automation devices, enhancing the compatibility and versatility of the system. In addition, the modular layout facilitates installation, maintenance, and upgrades, reducing research and deployment costs and shortening project cycles, significantly improving the integration efficiency and adaptability of automation systems, especially for complex industrial environments requiring efficient and dynamic response automation systems.

[0031] To adapt to the size of the shell 1, the functional module control board 3 can be as shown in the double-layer PCB structure of the A functional module control board 31 in the attached Figure 2 、 3 .

[0032] The above structure will produce various combinations according to the needs of the field in use, and electromagnetic compatibility problems may occur in actual operation. To optimize this problem, shielded wires are preferred for wiring, and sufficient optimization design is performed for grounding and electromagnetic compatibility of each board itself in the circuit setting of the core control board 2, the functional module control board 3, and the IO control board 4.

[0033] At the same time, as shown in the attached Figure 4 、 5 , the application also includes an electromagnetic compatibility shielding cavity 5. The electromagnetic compatibility shielding cavity 5 is a cavity structure with an open lower part, which is arranged on the upper part of the core control board 2 and / or the functional module control board 3. To avoid the impact of the electromagnetic compatibility shielding cavity 5 on heat dissipation, a heat dissipation structure 11 is arranged on the shell 1 below the electromagnetic compatibility shielding cavity 5. The heat dissipation structure can be a heat dissipation grid opening, or can be a heat dissipation fin.

[0034] The electromagnetic compatibility shielding cavity 5 is provided with an opening 51 for the connector on the core control board 2 to leak out.

[0035] Due to the existence of a certain offset of the connector during the production of the circuit board, the opening 51 cannot be designed to tightly contact the connector, so as to solve the electromagnetic compatibility problem that may be caused by the gap between the connector and the opening 51.

[0036] A downward bending wall 511 is arranged at the opening 51, a plurality of through slots 512 are arranged on the bending wall 511, a shielding rubber ring 52 is arranged at the opening 51, the shielding rubber ring 52 is a silica gel rubber, a metal wire mesh layer a is arranged in the silica gel rubber to provide its electromagnetic shielding effect, and a plurality of positioning protrusions 521 are arranged on the outer side of the shielding rubber ring 52 to cooperate with the through slots 512. In use, the shielding rubber ring 52 is inserted into the gap between the connector l and the bending wall 511.

[0037] In order to facilitate operation, the through slot 512 extends to the upper surface of the electromagnetic compatibility shielding cavity 5. The upper part of the shielding rubber ring 52 is provided with a sealing cover 522, which can completely cover the through slot 512.

[0038] It should be noted that unless otherwise explicitly specified and limited, the terms such as "mounting", "connecting", "connecting", "fixing", "providing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

Claims

1. A control node for an intelligent device integration platform, characterized by The control node comprises a shell, a core control board, a plurality of function module control boards, a plurality of IO control boards and a plurality of wires.

2. The control node for an intelligent device integration platform of claim 1, wherein, Each IO control board is provided with any one of digital input / output interface, analog input / output interface, serial communication interface, Ethernet interface, field bus interface, IO-Link interface, USB interface and wiring terminal, and a connector connected to the core control board.

3. The control node for an intelligent device integration platform of claim 1, wherein, The function module control boards and the IO control boards are arranged on both sides of the core control board.

4. The control node for an intelligent device integration platform of claim 1, wherein, The function module control board is a single-layer or double-layer PCB structure.

5. The control node for an intelligent device integration platform of claim 1, wherein, The control node further comprises a plurality of electromagnetic compatibility shielding cavities, which are cavity structures with open lower parts and arranged on the upper parts of the core control board and / or the function module control board.

6. The control node for an intelligent device integration platform of claim 5, wherein, A heat dissipation structure is arranged on the shell below the electromagnetic compatibility shielding cavity, which is a heat dissipation grid or a heat dissipation fin.

7. The control node for an intelligent device integration platform of claim 5, wherein, The electromagnetic compatibility shielding cavity is provided with an opening for the connector to leak out, and a shielding rubber ring is arranged at the opening.

8. The control node for an intelligent device integration platform of claim 7, wherein, A downwardly bent wall is arranged at the opening, a plurality of through grooves are arranged on the bent wall, and a plurality of positioning protrusions matched with the through grooves are arranged outside the shielding rubber ring.

9. The control node for an intelligent device integration platform of claim 8, wherein, The through grooves extend to the upper surface of the electromagnetic compatibility shielding cavity, and a sealing cover is arranged on the upper part of the shielding rubber ring.

10. The control node for an intelligent device integration platform of claim 7, wherein, The shielding rubber ring comprises a plurality of silica gel rubber layers and a metal wire mesh layer.

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