Heat dissipation device and electronic equipment
By employing a combination of structures with different thermal conductivity and fin structures in the heat dissipation device, the problem of high cost of traditional aluminum materials is solved, achieving uniform and efficient heat dissipation, reducing costs and improving heat dissipation efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-04-10
AI Technical Summary
Traditional heat dissipation devices use aluminum, which is expensive and cannot effectively meet the heat dissipation needs of heat-generating components.
The first heat dissipation part and the second heat dissipation part are arranged at intervals. The first heat dissipation part includes a first structure and a second structure connected together, and the second heat dissipation part includes a third structure. They have different thermal conductivity. The heat dissipation element is accommodated through the space formed by the two, and the contact effect is improved by using thermal pads and fasteners. The heat dissipation area is increased by combining the fin structure.
It achieves uniform and efficient heat dissipation, reduces raw material and processing costs, improves heat dissipation efficiency, and avoids the formation of local hot spots.
Smart Images
Figure CN224111501U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic equipment heat dissipation, and in particular to a heat dissipation device and electronic equipment. BACKGROUND
[0002] With the rapid development of science and technology, the performance of electronic equipment is improved, accompanied by the increase of power consumption of internal heating elements, and the resulting heat dissipation problem is increasingly concerned by people. The traditional heat dissipation device uses sheet-shaped aluminum material to form a heat dissipation fin to dissipate heat from the heating element. Although the aluminum material provides good heat dissipation performance, the raw material and processing cost of the aluminum material are relatively high. How to meet the heat dissipation demand of the heating element at a lower cost becomes a problem to be solved. CONTENT OF THE INVENTION
[0003] The purpose of the present application is to provide a heat dissipation device and electronic equipment, and the technical solution is as follows:
[0004] The present application provides a heat dissipation device, comprising:
[0005] The first heat dissipation part and the second heat dissipation part are arranged at intervals, and a containing space is formed between the first heat dissipation part and the second heat dissipation part. The containing space is used for containing the heating element, and the first heat dissipation part and the second heat dissipation part both satisfy a contact relationship with the heating element.
[0006] The first heat dissipation part comprises a first structure and a second structure connected to each other, and the first structure at least partially wraps the second structure. The second heat dissipation part comprises a third structure. The thermal conductivity coefficients of the first structure and the third structure are both less than the thermal conductivity coefficient of the second structure. The thermal conductivity coefficients of the first structure and the third structure are the same or different.
[0007] In some embodiments, the heat dissipation device described above, wherein the first structure and the second structure are detachably connected; or, the first structure and the second structure are integrally formed.
[0008] In some embodiments, the heat dissipation device described above, wherein the opposite sides of the first heat dissipation part and the second heat dissipation part are both provided with a heat conduction gasket, and the heat conduction gasket satisfies a contact relationship with the heating element.
[0009] In some embodiments, the heat dissipation device described above, wherein the second heat dissipation part further comprises a fourth structure. The fourth structure is arranged on the third structure in a protruding manner towards the first heat dissipation part. At least part of the fourth structure satisfies a contact relationship with the first structure to limit the first structure.
[0010] In some embodiments, the heat dissipation device described above, wherein the material strength of the fourth structure is greater than the material strength of the third structure. The fourth structure and the third structure are integrally formed, or the fourth structure and the third structure are detachably connected.
[0011] In some embodiments, the heat dissipation device as described above, further comprising: a fastener, two ends of the fastener are connected to the first heat dissipation part and the second heat dissipation part respectively, the fastener applies a fastening force to the first heat dissipation part and the second heat dissipation part, and the fastening force is directed towards the heat generating element.
[0012] In some embodiments, the heat dissipation device as described above, wherein a side of the first structure body away from the third structure body is provided with a first fin structure, a side of the third structure body away from the first structure body is provided with a second fin structure, the first fin structure comprises a plurality of first fins arranged at intervals, the plurality of first fins protrude towards the side away from the third structure body, and the second fin structure comprises a plurality of second fins arranged at intervals, the plurality of second fins protrude towards the side away from the first structure body.
[0013] In some embodiments, the heat dissipation device as described above, wherein the thermal conductivity coefficients of the first fin structure and the second fin structure are both less than the thermal conductivity coefficient of the second structure body, the first fin structure is integrally formed with the first structure body, and the second fin structure is integrally formed with the third structure body.
[0014] The second aspect of the present application provides an electronic device, comprising:
[0015] a heat generating element;
[0016] a first heat dissipation part and a second heat dissipation part arranged at intervals, a containing space is formed between the first heat dissipation part and the second heat dissipation part, the containing space is used for containing the heat generating element, and the first heat dissipation part and the second heat dissipation part both satisfy a contact relationship with the heat generating element;
[0017] The first heat dissipation part comprises a first structure body and a second structure body connected to each other, the first structure body at least partially wraps the second structure body, the second heat dissipation part comprises a third structure body, the thermal conductivity coefficients of the first structure body and the third structure body are both less than the thermal conductivity coefficient of the second structure body, and the thermal conductivity coefficients of the first structure body and the third structure body are the same or different.
[0018] In some embodiments, the electronic device as described above, wherein the heat generating element has at least one heat generating area, the first structure body is provided with at least one heat conduction area corresponding to the at least one heat generating area, and the second structure body is provided with at least one heat conduction area corresponding to the at least one heat generating area.
[0019] The above description is only a summary of the technical solutions of the present application. In order to more clearly understand the technical means of the present application, and to implement the content of the description, the following will be described in detail with the preferred embodiments of the present application and with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to make the technical solutions in the embodiments of the present disclosure or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained without creative effort based on these drawings.
[0021] Figure 1 A perspective structural schematic diagram of a heat dissipation device is schematically shown;
[0022] Figure 2 A perspective structural schematic diagram of another heat dissipation device is schematically shown;
[0023] Figure 3 An exploded perspective structural schematic diagram of a first heat dissipation part of a heat dissipation device is schematically shown;
[0024] Figure 4 A perspective structural schematic diagram of a second heat dissipation part of a heat dissipation device is schematically shown.
[0025] Explanation of reference signs:
[0026] 1. first heat dissipation part; 11. first structure; 12. second structure; 111. first fin structure;
[0027] 2. second heat dissipation part; 21. third structure; 22. fourth structure; 211. second fin structure;
[0028] 3. accommodating space;
[0029] 4. heat-conducting gasket;
[0030] 5. fastener. DETAILED DESCRIPTION
[0031] The embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. The detailed description and drawings of the following embodiments are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0032] The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully express the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these embodiments should be interpreted as merely exemplary, and not as a limitation.
[0033] It should be noted that in the description of the present disclosure, unless otherwise specified and limited, the meaning of "a plurality of" is greater than or equal to two; The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0034] In addition, "first", "second", and similar words used in the present disclosure do not indicate any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.
[0035] It should also be noted that in the description of the present disclosure, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixedly connected, It can also be detachably connected, or integrally connected; It can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between a first device and a second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.
[0036] All terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or extremely formalized sense, unless specifically defined here.
[0037] Techniques, methods and equipment known to those skilled in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the specification.
[0038] Embodiment one
[0039] As Figure 1 And Figure 3As shown, the first aspect of the present application provides a heat dissipation device, comprising: a first heat dissipation part 1 and a second heat dissipation part 2 arranged at intervals, a containing space 3 is formed between the first heat dissipation part 1 and the second heat dissipation part 2, the containing space 3 is used for containing a heating element, and the first heat dissipation part 1 and the second heat dissipation part 2 both satisfy a contact relationship with the heating element; the first heat dissipation part 1 comprises a first structure 11 and a second structure 12 connected, the first structure 11 at least partially wraps the second structure 12, the second heat dissipation part 2 comprises a third structure 21, the thermal conductivity coefficients of the first structure 11 and the third structure 21 are both less than the thermal conductivity coefficient of the second structure 12, and the thermal conductivity coefficients of the first structure 11 and the third structure 21 are the same or different.
[0040] Specifically, the heat dissipation device of the present application is provided with a first heat dissipation part 1 and a second heat dissipation part 2 arranged at intervals, so as to form a containing space 3 between the first heat dissipation part 1 and the second heat dissipation part 2, which is used for containing a heating element (not shown in the figure). The heating element can be a CPU (Central Processing Unit) of an electronic device, a GPU (Graphics Processing Unit), a hard disk, a U disk, a memory, etc., and is not particularly limited, as long as it generates heat during the operation of the electronic device and has a heat dissipation requirement. The first heat dissipation part 1 and the second heat dissipation part 2 both satisfy a contact relationship with the heating element, so as to provide two heat conduction paths, so as to realize the conduction heat dissipation of the heat generated by the heating element on both sides of the heating element. The structural forms of the first heat dissipation part 1 and the second heat dissipation part 2 can both be plate type, fin type, etc., so as to provide a certain heat dissipation surface area to meet the heat dissipation requirement of the heating element, while meeting the compact setting of the electronic device.
[0041] The first heat dissipation part 1 of the present application comprises a first structure 11 and a second structure 12 connected, the first structure 11 at least partially wraps the second structure 12, the second heat dissipation part 2 comprises a third structure 21, the thermal conductivity coefficients of the first structure 11 and the third structure 21 are both less than the thermal conductivity coefficient of the second structure 12, so that in the heat dissipation process, the second structure 12 with a higher thermal conductivity coefficient can efficiently absorb heat from the heating element, while the first structure 11 at least partially wrapping the second structure 12, although the thermal conductivity coefficient is less than that of the second structure 12, can realize the uniform distribution of the heat absorbed by the second structure 12, thereby avoiding the formation of local hot spots in the first heat dissipation part 1, improving the heat dissipation efficiency of the first heat dissipation part 1, and the third structure 21 with a thermal conductivity coefficient less than that of the second structure 12 is arranged on the other side of the heating element away from the first heat dissipation part 1, which also plays a role in the uniform heat conduction of the heating element, thereby through the arrangement that the thermal conductivity coefficients of the first structure 11 and the third structure 21 are both less than the thermal conductivity coefficient of the second structure 12, the heat dissipation device can realize the uniform heat conduction of the heat generated by the heating element, thereby improving the overall heat dissipation efficiency of the heat dissipation device.
[0042] The thermal conductivities of the first structure 11 and the third structure 21 are both less than that of the second structure 12. In some embodiments, the second structure 12 in the present application can be made of an aluminum heat pipe or a metal heat-conducting material such as aluminum or silver. The first structure 11 and the third structure 21 can be made of a heat-conducting plastic material such as polycarbonate, epoxy resin, or polyurethane. Alternatively, the first structure 11 and the third structure 21 can be made of a composite heat-conducting material filled with metal powder such as aluminum oxide, aluminum nitride, copper powder, or aluminum powder. The specific material is not limited, as long as the thermal conductivities of the first structure 11 and the third structure 21 are both less than that of the second structure 12 to achieve uniform heat conduction of the heat-generating element and avoid the formation of local hot spots.
[0043] In some embodiments, when the second structure 12 in the present application is an aluminum heat pipe, the aluminum heat pipe includes an outer shell and an internal hollow capillary structure, which can be in the form of a copper mesh or fiber felt, and is filled with a working medium such as water, ethanol, or acetone. When the heat generated by the heat-generating element is conducted to the working medium through the outer shell on the side of the aluminum heat pipe close to the heat-generating element, the working medium absorbs the heat and rapidly vaporizes into steam. The generated steam condenses into liquid on the side of the aluminum heat pipe away from the heat-generating element. Due to the capillary force provided by the hollow capillary structure, the attractive force between liquid molecules and solid molecules is greater than the cohesive force between liquid molecules, so that the condensed liquid returns to the side of the aluminum heat pipe close to the heat-generating element along the hollow capillary structure, forming a phase change heat transfer cycle in the aluminum heat pipe.
[0044] The thermal conductivities of the first structure 11 and the third structure 21 can be the same or different. That is, the first structure 11 and the third structure 21 in the present application can be made of the same heat-conducting plastic material such as polycarbonate, epoxy resin, or polyurethane, or the same composite heat-conducting plastic material filled with metal powder such as aluminum oxide, aluminum nitride, copper powder, or aluminum powder. Alternatively, the first structure 11 and the third structure 21 can be made of different materials, as long as the thermal conductivities of the first structure 11 and the third structure 21 are both less than that of the second structure 12.
[0045] In some embodiments, the application can also set the thermal expansion coefficients of the first structure 11 and the second structure 12 to satisfy the same condition, i.e. the thermal expansion coefficients of the first structure 11 and the second structure 12 are the same or similar. Since the second structure 12 is at least partially wrapped in the first structure 11, the first structure 11 and the second structure 12 will expand or contract at a similar rate during the process of the first heat dissipation part 1 conducting the heat generated by the heat generating element. At the same time, since the wrapping of the first structure 11 on the second structure 12 plays a restraining role on the second structure 12, it reduces the deviation of the deformation amount between the second structure 12 and the first structure 11, thereby reducing the stress concentration at the contact section between the second structure 12 and the first structure 11, preventing the occurrence of adverse conditions such as delamination, cracking, and gaps between the first structure 11 and the second structure 12, and also helping to maintain the integrity and stability of the overall structure of the first heat dissipation part 1, avoiding the local deformation of the first heat dissipation part 1 under the action of stress concentration and the generation of gaps with the heat generating element, so as to achieve the close connection between the first heat dissipation part 1 and the contacted heat generating element.
[0046] The first aspect of the present application provides a heat dissipation device, comprising: a first heat dissipation part 1 and a second heat dissipation part 2 arranged at intervals, a containing space 3 is formed between the first heat dissipation part 1 and the second heat dissipation part 2, the containing space 3 is used for containing a heat generating element, and the first heat dissipation part 1 and the second heat dissipation part 2 both satisfy a contact relationship with the heat generating element; the first heat dissipation part 1 comprises a first structure 11 and a second structure 12 connected, the first structure 11 at least partially wraps the second structure 12, the second heat dissipation part 2 comprises a third structure 21, the thermal conductivity coefficients of the first structure 11 and the third structure 21 are both less than the thermal conductivity coefficient of the second structure 12, and the thermal conductivity coefficients of the first structure 11 and the third structure 21 are the same or different. The present application is arranged at intervals by the first heat dissipation part 1 and the second heat dissipation part 2, so that the two heat dissipation parts can both satisfy a contact relationship with the heat generating element to provide two heat conduction paths, so as to realize the conduction heat dissipation of the heat generated by the heat generating element on both sides of the heat generating element, wherein the second structure 12 included in the first heat dissipation part 1 has a higher thermal conductivity coefficient to be able to efficiently absorb heat from the heat generating element, and the first structure 11 at least partially wrapping the second structure 12 can realize the uniform distribution of the heat absorbed by the second structure 12 although the thermal conductivity coefficient is less than that of the second structure 12, thereby avoiding the formation of local hot spots in the first heat dissipation part 1, improving the heat dissipation efficiency of the first heat dissipation part 1, and the third structure 21 with a thermal conductivity coefficient less than that of the second structure 12 is arranged on the other side of the heat generating element away from the first heat dissipation part 1, which can also play a role in uniform heat conduction of the heat generating element. The heat dissipation device of the present application uses structures with different thermal conductivity coefficients to realize uniform and efficient heat conduction of the heat generated by the heat generating element, and by using the second structure made of metal heat conduction material, the first structure and the third structure made of composite heat conduction material made of heat conductive plastic material or heat conductive plastic material added with metal powder, compared with the traditional high-cost technical solution of using single aluminum material to meet the heat dissipation demand, the raw material and processing cost are saved. Through the application of the present application, the problem of how to meet the heat dissipation demand of the heat generating element at a lower cost is solved.
[0047] In some embodiments, the first structure 11 and the second structure 12 are detachably connected; or, the first structure 11 and the second structure 12 are integrally formed.
[0048] Specifically, the first structure 11 and the second structure 12 can be detachably connected to facilitate the assembly, disassembly and maintenance of the first heat dissipation part 1. The first structure 11 can be provided with a clamping groove, and the second structure 12 is clamped in the clamping groove to achieve connection. Alternatively, the first structure 11 and the second structure 12 can be provided with positioning holes, and the two are connected through a latch. Alternatively, the first structure 11 and the second structure 12 can be clamped through a clamp. The specific mode is not limited. The first structure 11 and the second structure 12 can also be integrally formed to improve the stability and reliability of the structure cooperation between the two, optimize the heat conduction path. The integrally formed mode can use 3D (three-dimensional) printing technology, insert molding technology, ultrasonic welding technology, etc. When the second structure 12 is an aluminum heat pipe and the first structure 11 is a heat-conducting plastic material, a plastic-coated heat pipe process can also be used to achieve the integrally formed of the first structure 11 and the second structure 12. The specific mode is not limited.
[0049] As shown in Figure 2 , the opposite sides of the first heat dissipation part 1 and the second heat dissipation part 2 are provided with heat-conducting gaskets 4, and the heat-conducting gaskets 4 satisfy a contact relationship with the heat-generating element.
[0050] Specifically, in order to improve the heat conduction effect between the heat-generating element and the first heat dissipation part 1 and the second heat dissipation part 2, the opposite sides of the first heat dissipation part 1 and the second heat dissipation part 2 are provided with heat-conducting gaskets 4 to fill the small gaps and uneven areas between the first heat dissipation part 1 and the heat-generating element and between the second heat dissipation part 2 and the heat-generating element through the heat-conducting gaskets 4, enhance the interface contact, and improve the heat conduction efficiency. The heat-conducting gaskets 4 can be silica gel gaskets, graphite gaskets, etc. The specific mode is not limited.
[0051] As shown in Figure 4 , in some embodiments, the second heat dissipation part 2 further includes a fourth structure 22, the fourth structure 22 is protrudingly arranged on the third structure 21 towards the first heat dissipation part 1, and at least part of the fourth structure 22 satisfies a contact relationship with the first structure 11 to limit the first structure 11.
[0052] Specifically, in order to improve the stability of the whole heat dissipation device, the second heat dissipation part 2 of the present application further includes a fourth structure 22, the fourth structure 22 is protrudingly arranged towards the first heat dissipation part 1, and at least part of the fourth structure 22 satisfies a contact relationship with the first structure 11 to limit the first structure 11 and the heat-generating element in the accommodation space 3, avoid the first structure 11 from being deviated or loosened during the use of the electronic equipment or the heat dissipation device, so as to ensure that the structure, the second structure 12 of the first heat dissipation part 1 and the heat-generating element always maintain a good contact interface, and guarantee the stability of heat conduction.
[0053] In some embodiments, the fourth structure 22 has a material strength greater than that of the third structure 21, the fourth structure 22 is integrally formed with the third structure 21, or the fourth structure 22 is detachably connected with the third structure 21.
[0054] Specifically, in order to improve the structural strength of the fourth structure 22 and the heat dissipation device as a whole, the material strength of the fourth structure 22 is greater than that of the third structure 21, so as to provide a stable and reliable limiting effect in the process of limiting the first structure 11. The fourth structure 22 can be made of polyamide, carbon fiber, glass fiber material, etc., and the specific material is not limited as long as it can provide a material strength greater than that of the third structure 21.
[0055] The fourth structure 22 can be integrally formed with the third structure 21, and can be realized by 3D (three-dimensional) printing technology, double injection molding technology, welding technology, etc. The fourth structure 22 can also be detachably connected with the third structure 21, and can be realized by screwing, pinning, clamping, etc. in different forms, and the specific form is not limited.
[0056] As shown in Figure 1 In some embodiments, the heat dissipation device further comprises a fastener 5, both ends of the fastener 5 are connected with the first heat dissipation part 1 and the second heat dissipation part 2 respectively, and the fastener 5 applies a fastening force towards the heat generating element to both the first heat dissipation part 1 and the second heat dissipation part 2.
[0057] Specifically, in order to realize the close contact between the first heat dissipation part 1 and the second heat dissipation part 2 and the heat generating element, guarantee a stable and reliable contact section, and improve the heat dissipation efficiency, the heat dissipation device of the present application further comprises a fastener 5. Both ends of the fastener 5 are connected with the first heat dissipation part 1 and the second heat dissipation part 2 respectively, so as to apply a fastening force towards the heat generating element to both of them, so that the first heat dissipation part 1 and the second heat dissipation part 2 maintain close contact with the heat generating element, reduce the existence of gap, and reduce the contact thermal resistance. At the same time, the arrangement of the fastener 5 can improve the stability and reliability of the structure of the heat dissipation device as a whole, and the application of the fastening force can effectively limit the deviation or loosening of the first heat dissipation part 1 and the second heat dissipation part 2 during the use of the electronic equipment, and enhance the anti-vibration ability of the heat dissipation device as a whole. The fastener 5 can be a spring clip, a pressing plate, a spring wire, etc., and the specific form is not limited as long as it can be connected with the first heat dissipation part 1 and the second heat dissipation part 2 respectively and apply a fastening force towards the heat generating element.
[0058] As shown in Figure 3 and Figure 4As shown, in some embodiments, the first structure 11 is provided with a first fin structure 111 on the side facing away from the third structure 21, and the third structure 21 is provided with a second fin structure 211 on the side facing away from the first structure 11. The first fin structure 111 includes a plurality of first fins arranged at intervals, and the plurality of first fins protrude towards the side facing away from the third structure 21. The second fin structure 211 includes a plurality of second fins arranged at intervals, and the plurality of second fins protrude towards the side facing away from the first structure 11.
[0059] Specifically, in order to increase the heat dissipation area of the first heat dissipation part 1 and the second heat dissipation part 2, the first structure 11 is provided with a first fin structure 111 on the side facing away from the third structure 21. The first fin structure 111 includes a plurality of first fins arranged at intervals, and the plurality of first fins protrude towards the side facing away from the third structure 21. In this way, the first heat dissipation part 1 has a larger surface area on the side facing away from the heat generating element for heat dissipation. Similarly, the third structure 21 is provided with a second fin structure 211 on the side facing away from the first structure 11. The second fin structure 211 includes a plurality of second fins arranged at intervals, and the plurality of second fins protrude towards the side facing away from the first structure 11. In this way, the second heat dissipation part 2 has a larger surface area on the side facing away from the heat generating element for heat dissipation.
[0060] In some embodiments, the thermal conductivity of the first fin structure 111 and the second fin structure 211 is less than the thermal conductivity of the second structure 12. The first fin structure 111 is integrally formed with the first structure 11, and the second fin structure 211 is integrally formed with the third structure 21.
[0061] Specifically, the thermal conductivity of the first fin structure 111 is less than the thermal conductivity of the second structure 12. The first fin structure 111 can be made of the same material as the first structure 11, or can be made of a different material. Specifically, the thermal conductivity of the first fin structure 111 is less than the thermal conductivity of the second structure 12, so that the first fin structure 111 can uniformly distribute the heat absorbed by the second structure 12 together with the first structure 11, thereby avoiding the formation of local hot spots in the first heat dissipation part 1 and improving the heat dissipation efficiency of the first heat dissipation part 1. The first fin structure 111 is integrally formed with the first structure 11. The integrally formed manner can use 3D (three-dimensional) printing technology, injection molding technology, ultrasonic welding technology, etc., without limitation.
[0062] The second fin structure 211 has a thermal conductivity less than that of the second structure 12. The second fin structure 211 can be made of the same material as the third structure 21 or a different material. The specific material is not limited as long as the thermal conductivity of the second fin structure 211 is less than that of the second structure 12. The second fin structure 211 and the third structure 21 can uniformly distribute the heat absorbed by the second structure 12, thereby avoiding the formation of local hot spots in the second heat dissipation part 2 and improving the heat dissipation efficiency of the second heat dissipation part 2. The second fin structure 211 and the third structure 21 are integrally formed. The integral forming can be achieved by 3D (three-dimensional) printing technology, injection molding technology, ultrasonic welding technology, etc.
[0063] Embodiment Two
[0064] The second aspect of the application provides an electronic device, which includes a heat generating element, a first heat dissipation part 1 and a second heat dissipation part 2 arranged at intervals; a containing space 3 is formed between the first heat dissipation part 1 and the second heat dissipation part 2, the containing space 3 is used to contain the heat generating element, and the first heat dissipation part 1 and the second heat dissipation part 2 both satisfy a contact relationship with the heat generating element; the first heat dissipation part 1 includes a first structure 11 and a second structure 12 connected to each other, the first structure 11 at least partially wraps the second structure 12, the second heat dissipation part 2 includes a third structure 21, the thermal conductivities of the first structure 11 and the third structure 21 are both less than that of the second structure 12, and the thermal conductivities of the first structure 11 and the third structure 21 are the same or different.
[0065] Specifically, the heat-generating element can be a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a hard disk, a U disk, a memory, etc. of an electronic device, and is not particularly limited as long as it generates heat during operation of the electronic device and has a heat dissipation requirement. The first heat dissipation part 1 and the second heat dissipation part 2 are arranged at intervals, so that both heat dissipation parts can be in contact with the heat-generating element to provide two heat conduction paths to conduct and dissipate heat generated by the heat-generating element on both sides of the heat-generating element. The second structure 12 included in the first heat dissipation part 1 has a higher thermal conductivity to efficiently absorb heat from the heat-generating element. The first structure 11 at least partially wrapping the second structure 12 can conduct the heat absorbed by the second structure 12 uniformly, although the thermal conductivity of the first structure 11 is less than that of the second structure 12. This avoids the formation of local hot spots in the first heat dissipation part 1, improves the heat dissipation efficiency of the first heat dissipation part 1, and the third structure 21 with a thermal conductivity less than that of the second structure 12 is arranged on the other side of the heat-generating element away from the first heat dissipation part 1, which also plays a role in uniformly conducting heat from the heat-generating element. By arranging the thermal conductivities of the first structure 11 and the third structure 21 to be less than that of the second structure 12, the heat dissipation device can uniformly conduct heat generated by the heat-generating element, thereby improving the overall heat dissipation efficiency of the heat dissipation device.
[0066] The second aspect of the present application provides an electronic device, comprising: a heat generating element, a first heat dissipation part 1 and a second heat dissipation part 2 arranged in a spaced manner; a containing space 3 is formed between the first heat dissipation part 1 and the second heat dissipation part 2, the containing space 3 is used for containing the heat generating element, and the first heat dissipation part 1 and the second heat dissipation part 2 both satisfy a contact relationship with the heat generating element; the first heat dissipation part 1 comprises a first structure 11 and a second structure 12 connected, the first structure 11 at least partially wraps the second structure 12, the second heat dissipation part 2 comprises a third structure 21, the thermal conductivity coefficients of the first structure 11 and the third structure 21 are both smaller than the thermal conductivity coefficient of the second structure 12, and the thermal conductivity coefficients of the first structure 11 and the third structure 21 are the same or different. The present application is arranged in a spaced manner by the first heat dissipation part 1 and the second heat dissipation part 2, so that the two heat dissipation parts can both satisfy a contact relationship with the heat generating element to provide two heat conduction paths, so as to realize the conduction heat dissipation of the heat generated by the heat generating element on both sides of the heat generating element, wherein the second structure 12 included in the first heat dissipation part 1 has a higher thermal conductivity coefficient to be able to efficiently absorb heat from the heat generating element, and the first structure 11 at least partially wrapping the second structure 12 can realize the uniform distribution of the heat absorbed by the second structure 12 although the thermal conductivity coefficient is smaller than that of the second structure 12, thereby avoiding the formation of local hot spots in the first heat dissipation part 1, improving the heat dissipation efficiency of the first heat dissipation part 1, and the third structure 21 having a thermal conductivity coefficient smaller than that of the second structure 12 is arranged on the other side of the heat generating element away from the first heat dissipation part 1, which can also play a role in uniform heat conduction of the heat generating element. In the heat dissipation device of the present application, the structures with different thermal conductivity coefficients are used to realize the uniform and efficient conduction of the heat generated by the heat generating element, and the second structure made of metal heat conduction material, the first structure and the third structure made of composite heat conduction material made of heat conductive plastic material or heat conductive plastic material added with metal powder, compared with the high-cost technical solution of meeting the heat dissipation demand by using single aluminum material, save the raw material and processing cost. Through the application of the present application, the problem of how to meet the heat dissipation demand of the heat generating element at a lower cost is solved.
[0067] In some embodiments, the heat generating element has at least one heat generating area, the first structure 11 is provided with at least one heat conduction area corresponding to the at least one heat generating area, and the second structure 12 is provided corresponding to the at least one heat conduction area.
[0068] Specifically, in order to improve the heat dissipation efficiency of the heat dissipation device, the first structure 11 is provided with at least one heat conduction area corresponding to at least one heat generating area of the heat generating element, that is, when the heat generating element has one heat generating area, the first structure 11 is provided with one heat conduction area, when the heat generating element has two heat generating areas, the first structure 11 is provided with two heat conduction areas, and the rest are the same, and the second structure 12 with high thermal conductivity is provided corresponding to the heat conduction area, that is, when the heat conduction area is one, one second structure 12 is provided in the first heat dissipation part 1, when the heat conduction area is two, two second structures 12 are provided in the first heat dissipation part 1, and the rest are the same. Through the above setting mode, the second structure 12 and the heat generating area of the heat generating element can be accurately positioned and set, so that the heat generated by the heat generating element can be efficiently conducted to the second structure 12, reducing unnecessary heat transfer loss and improving the overall heat dissipation efficiency of the heat dissipation device and the electronic equipment.
[0069] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.
[0070] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be replaced equivalently without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.
Claims
1. A heat dissipating device, characterized by, Comprising: The first heat dissipation part and the second heat dissipation part are arranged at intervals, and a containing space for containing a heat generating element is formed between the first heat dissipation part and the second heat dissipation part, and the first heat dissipation part and the second heat dissipation part both satisfy a contact relationship with the heat generating element; The first heat dissipation part comprises a first structure and a second structure connected, and the first structure at least partially wraps the second structure, and the second heat dissipation part comprises a third structure, and the thermal conductivity coefficients of the first structure and the third structure are both less than the thermal conductivity coefficient of the second structure, and the thermal conductivity coefficients of the first structure and the third structure are the same or different.
2. The heat dissipation device according to claim 1, wherein: The first structure and the second structure are detachably connected; or, The first structure and the second structure are integrally formed.
3. The heat dissipation device according to claim 1, wherein: The first heat dissipation part and the second heat dissipation part are both provided with a heat conduction gasket on the opposite side, and the heat conduction gasket satisfies a contact relationship with the heat generating element.
4. The heat dissipation device according to claim 1, wherein: The second heat dissipation part further comprises a fourth structure, and the fourth structure is arranged on the third structure protruding towards the first heat dissipation part, and at least part of the fourth structure satisfies a contact relationship with the first structure to limit the first structure.
5. The heat dissipation device according to claim 4, wherein: The material strength of the fourth structure is greater than the material strength of the third structure, and the fourth structure and the third structure are integrally formed, or the fourth structure and the third structure are detachably connected.
6. The heat dissipating device of claim 1, wherein Further comprising: A fastener, both ends of the fastener are connected with the first heat dissipation part and the second heat dissipation part respectively, and the fastener applies a fastening force towards the heat generating element to the first heat dissipation part and the second heat dissipation part.
7. The heat dissipation device according to claim 1, wherein: A first fin structure is arranged on the side of the first structure away from the third structure, a second fin structure is arranged on the side of the third structure away from the first structure, the first fin structure comprises a plurality of first fins arranged at intervals, and a plurality of first fins protrude away from the third structure, and the second fin structure comprises a plurality of second fins arranged at intervals, and a plurality of second fins protrude away from the first structure.
8. The heat dissipation device according to claim 7, wherein: The thermal conductivity coefficients of the first fin structure and the second fin structure are both less than the thermal conductivity coefficient of the second structure, the first fin structure is integrally formed with the first structure, and the second fin structure is integrally formed with the third structure.
9. An electronic device, comprising: Comprising: A heat generating element; The first heat dissipation part and the second heat dissipation part are arranged at intervals, a containing space is formed between the first heat dissipation part and the second heat dissipation part, the heat generating element is arranged in the containing space, and the first heat dissipation part and the second heat dissipation part both satisfy a contact relationship with the heat generating element, so that the first heat dissipation part, the heat generating element and the second heat dissipation part are arranged in a stack; The first heat dissipation part comprises a first structure and a second structure connected to each other, the first structure at least partially wraps the second structure, the second heat dissipation part comprises a third structure, the thermal conductivity coefficients of the first structure and the third structure are both less than the thermal conductivity coefficient of the second structure, and the thermal conductivity coefficients of the first structure and the third structure are the same or different.
10. The electronic device of claim 9, wherein The heat generating element has at least one heat generating area, the first structure is provided with at least one heat conduction area corresponding to at least one heat generating area, and the second structure is provided corresponding to at least one heat conduction area.