Chip transfer mechanism and die bonder

Abstract

The utility model relates to the technical field of chip packaging, and specifically discloses a chip transfer mechanism and a die bonder. The mechanism comprises a stand column and a transferring assembly. The transferring assembly is movably connected to the stand column, the transferring assembly comprises an assembly base and two taking and placing units arranged on the assembly base, one taking and placing unit is located at a crystal taking position, the other taking and placing unit is located at a crystal placing position, and the assembly base can drive the two taking and placing units to move so as to exchange the positions of the two taking and placing units; the pick-and-place unit located at the crystal pick-and-place position is used for pick-and-place of chips, and the pick-and-place unit located at the crystal placing position is used for release of chips. According to the mechanism, parallel execution of crystal taking-transferring and crystal placing-resetting actions of the two taking and placing units is achieved, the serial process of traditional single-station operation is compressed into parallel circulation, the symmetrical station switching design avoids time loss of no-load return in the crystal taking and placing process of the single taking and placing unit, the carrying period is shortened, and the working efficiency is improved. The continuity of the carrying process is enhanced, and the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field especially, relates to chip transfer mechanism and die bonder. BACKGROUND

[0002] In the chip processing or assembly process, chip transfer is a key operation step, and its efficiency and accuracy directly affect the quality and cost of the whole chip production process. With the development of semiconductor technology, chip size is becoming miniaturized, while the substrate size is expanding. The traditional die bonder faces double challenges in the transfer and die bonding link: on the one hand, the smaller the chip, the higher the requirement for the position accuracy and angle accuracy of die bonding; on the other hand, high-density chip arrangement in unit area puts forward higher requirements on equipment productivity.

[0003] The traditional chip transfer mechanism usually adopts a serial process of single-station operation, that is, a single pick-and-place unit needs to complete the actions of picking up, transferring, placing, and resetting in turn. This way has obvious disadvantages: during the picking and placing process, the empty return of the pick-and-place unit will cause a lot of time loss, resulting in long chip handling cycle and low efficiency, which is difficult to meet the productivity demand of high-density chip array. In addition, the traditional rotary handling mode is prone to positioning errors due to inertia, which cannot meet the stringent requirements of micro-chip on precision and thermal expansion coefficient matching.

[0004] At the same time, the existing equipment structure is complex, and the components move collaboratively, which causes the module for supplying / placing chips to interfere with the transfer mechanism. This not only increases the equipment floor space and maintenance cost, but also is more prone to positioning deviation in the micro-chip scenario due to complex mechanical path. The above problems highlight the urgent need for a new die bonder: to ensure micron-level positioning accuracy while increasing the number of chips transferred per unit time through parallel operation and symmetric station design, to match the dual standards of high precision and high throughput in modern semiconductor production. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing chip transfer mechanism and die bonder, which compresses the traditional single-station operation serial process into parallel circulation, and the design of symmetric station switching avoids the time loss of empty return of the single pick-and-place unit during the picking and placing process, shortens the handling cycle, enhances the continuity of the handling process, and improves the work efficiency.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] The chip transfer mechanism is used for carrying a chip, and comprises a column and a transfer assembly; the transfer assembly is movably connected to the column, and comprises an assembly base and two pick-and-place units arranged on the assembly base, one of the pick-and-place units is located at a wafer picking position, and the other pick-and-place unit is located at a wafer placing position; the assembly base can drive the two pick-and-place units to move so as to switch the positions of the two pick-and-place units; the pick-and-place unit at the wafer picking position is used for picking the chip, and the pick-and-place unit at the wafer placing position is used for releasing the chip.

[0008] As an optional technical solution of the chip transfer mechanism, the assembly base can rotate relative to the column about an axis of the assembly base, the axis of the assembly base extends in a vertical direction, and the two pick-and-place units are symmetrically arranged about the axis of the assembly base.

[0009] As an optional technical solution of the chip transfer mechanism, the pick-and-place unit is slidably arranged on the assembly base in the vertical direction.

[0010] As an optional technical solution of the chip transfer mechanism, the pick-and-place unit comprises a swing arm and a suction nozzle arranged on the swing arm, and the suction nozzle can adsorb and release the chip.

[0011] As an optional technical solution of the chip transfer mechanism, the chip transfer mechanism further comprises a gas supply assembly, and the gas supply assembly is used for providing positive pressure and / or negative pressure to the suction nozzle.

[0012] As an optional technical solution of the chip transfer mechanism, the suction nozzle can rotate relative to the swing arm about an axis of the suction nozzle, and the axis of the suction nozzle extends in the vertical direction.

[0013] As an optional technical solution of the chip transfer mechanism, the transfer assembly further comprises two self-rotation driving units and two synchronous wheel synchronous belts, the self-rotation driving units are fixedly arranged on the assembly base, and the output ends of the self-rotation driving units are in transmission cooperation with the suction nozzles through the synchronous wheel synchronous belts.

[0014] As an optional technical solution of the chip transfer mechanism, a movement track of the pick-and-place unit between the wafer picking position and the wafer placing position is a semicircular arc, the movement track passes through a snapshot position, the column is provided with two visual snapshot units, each of the visual snapshot units corresponds to one of the pick-and-place units, and each of the visual snapshot units is used for shooting the pick-and-place unit located at the snapshot position.

[0015] The chip transfer mechanism is provided with an assembly seat and two taking and placing units, the positions of the two taking and placing units are adjusted through the assembly seat, one taking and placing unit can place a chip at the same time, and the other taking and placing unit can take a chip synchronously, the parallel execution of the "crystal taking-transferring" and "crystal placing-resetting" actions of the two taking and placing units is realized, the serial process of traditional single-station operation is compressed into parallel circulation, the design of symmetrical station switching avoids the time loss of the traditional single taking and placing unit in the crystal taking and placing process, the cycle time of chip carrying is greatly shortened, the continuity of the chip carrying process is significantly enhanced, and the overall work efficiency is improved.

[0016] As an optional technical solution of the die bonder, the die bonder is provided with two die bonder modules, the carrying mechanism in one die bonder module is used for taking or releasing the substrate at a first stop position, and the carrying mechanism in the other die bonder module is used for taking or releasing the substrate at a second stop position, and the in-out line body can drive the substrate to pass through the first stop position and the second stop position in sequence.

[0017] The chip transfer mechanism is provided with an assembly seat and two taking and placing units, the positions of the two taking and placing units are adjusted through the assembly seat, one taking and placing unit can place a chip at the same time, and the other taking and placing unit can take a chip synchronously, the parallel execution of the "crystal taking-transferring" and "crystal placing-resetting" actions of the two taking and placing units is realized, the serial process of traditional single-station operation is compressed into parallel circulation, the design of symmetrical station switching avoids the time loss of the traditional single taking and placing unit in the crystal taking and placing process, the cycle time of chip carrying is greatly shortened, the continuity of the chip carrying process is significantly enhanced, and the overall work efficiency is improved.

[0018] The chip transfer mechanism is provided with an assembly seat and two taking and placing units, the positions of the two taking and placing units are adjusted through the assembly seat, one taking and placing unit can place a chip at the same time, and the other taking and placing unit can take a chip synchronously, the parallel execution of the "crystal taking-transferring" and "crystal placing-resetting" actions of the two taking and placing units is realized, the serial process of traditional single-station operation is compressed into parallel circulation, the design of symmetrical station switching avoids the time loss of the traditional single taking and placing unit in the crystal taking and placing process, the cycle time of chip carrying is greatly shortened, the continuity of the chip carrying process is significantly enhanced, and the overall work efficiency is improved.

[0019] This die bonder integrates multiple components, including an infeed / outfeed line, a transport mechanism, a substrate platform, a chip loading mechanism, a mother-daughter ring loading / unloading assembly, and a chip transfer mechanism. These components work collaboratively: the mother-daughter ring loading / unloading assembly transports the mother and daughter rings; the transport mechanism transports the substrates; and the chip transfer mechanism transports the chips. This enables automatic loading / unloading of substrates and mother-daughter rings, automatic chip transfer from the mother-daughter rings to the substrate, and die bonding operations, automating the chip assembly process. The multi-mechanism linkage reduces manual intervention, enhances the production line's intelligence level, improves production efficiency, and ensures both production efficiency and die bonding quality, meeting diverse die bonding production needs. Simultaneously, the transport mechanism works in conjunction with the infeed / outfeed line to support continuous substrate feeding and unloading after processing; the mother-daughter ring loading / unloading assembly works in conjunction with the chip loading mechanism to support continuous feeding of mother and daughter rings and the recovery of empty mother-daughter rings, improving production line utilization. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the chip transfer mechanism provided in this embodiment of the utility model;

[0021] Figure 2 This is a top view schematic diagram of the chip transfer mechanism, substrate, and mother-daughter ring provided in an embodiment of the present utility model;

[0022] Figure 3 This is a cross-sectional view of the chip transfer mechanism provided in an embodiment of the present utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the die bonder provided in this embodiment of the utility model;

[0024] Figure 5 This is a schematic diagram of the chip loading mechanism provided in this embodiment of the utility model;

[0025] Figure 6 yes Figure 5 A partial cross-sectional view of section A;

[0026] Figure 7 yes Figure 5 A magnified view of part B in the image;

[0027] Figure 8 This is a front view schematic diagram of the feeding and discharging line provided in this embodiment of the utility model;

[0028] Figure 9 This is a schematic diagram of the structure of the feeding and discharging line provided in this embodiment of the utility model;

[0029] Figure 10 This is a schematic diagram of the structure of the first blocking unit provided in this embodiment of the utility model;

[0030] Figure 11Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0031] Figure 12 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0032] Figure 13 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0033] Figure 14 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0034] Figure 15 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0035] Figure 16 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0036] Figure 17 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0037] Figure 18 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0038] Figure 19 Is Figure 18 The partial close -up view of C in;

[0039] Figure 20 Is Figure 18 The partial close -up view of D in;

[0040] Figure 21 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0041] Figure 22 Is the structure schematic view of the carrying device provided by the embodiment of the utility model;

[0042] Figure 23 Is the structure schematic view of the carrying device provided by the embodiment of the utility model.

[0043] In the figure:

[0044] X, first direction, Y, second direction, Z, vertical direction;

[0045] 100, the table board;

[0046] 200, chip transfer mechanism; 201, post; 202, swing arm; 204, first visual monitoring unit; 205, second visual monitoring unit; 206, first visual snapshot unit; 207, second visual snapshot unit; 208, rotation driving unit; 209, assembly seat; 210, voice coil driving unit; 211, guide rail; 212, self-rotation driving unit; 213, synchronous wheel synchronous belt; 214, air pipe rotary joint; 215, suction nozzle; 216, first negative pressure electromagnetic valve; 217, second negative pressure electromagnetic valve; 218, first positive pressure electromagnetic valve; 219, second positive pressure electromagnetic valve; 220, swing arm gas path mounting seat; 221, ion fan; 222, wafer taking position; 223, wafer placing position; 224, first track; 225, second track;

[0047] 300, base;

[0048] 400, substrate carrying platform; 401, platform seat; 402, first rolling guide rail; 403, first platform linear motor stator; 404, first platform linear motor mover; 405, platform motor mounting plate; 406, first grating reader; 407, second rolling guide rail; 408, second platform linear motor stator; 409, second platform linear motor mover; 410, jig mounting seat; 411, second grating reader; 412, substrate jig; 413, first air cylinder; 414, second air cylinder;

[0049] 500, chip feeding mechanism; 501, mechanism seat; 502, first mechanism guide rail; 503, first mechanism linear motor stator; 504, first mechanism linear motor mover; 505, mechanism motor mounting plate; 506, third grating reader; 507, second mechanism guide rail; 508, second mechanism linear motor stator; 509, second mechanism linear motor mover; 510, upper mounting plate; 511, fourth grating reader; 512, wafer ring mounting plate; 513, rotation driving unit; 514, mounting ring synchronous belt; 515, reciprocating driving unit; 516, clamp; 517, primary-secondary ring positioning strip; 518, bearing; 519, mounting ring; 520, primary-secondary ring; 521, first driving unit shaft; 522, second driving unit shaft; 523, third driving unit shaft; 524, fifth grating reader; 525, adsorption cap; 526, film vacuumizing device; 527, thimble; 528, film adsorption air hole; 530, primary-secondary ring movement area;

[0050] 600, material in-out line body; 601, motor mounting plate; 602, support plate; 607, code scanning gun; 611, width adjustment driving unit; 612, width adjustment synchronous belt; 613, screw rod; 615, guide shaft; 617, guide block; 621, first material rolling driving unit; 622, third material rolling driving unit; 623, first transmission synchronous belt; 624, third transmission synchronous belt; 628, first material rolling fixed side; 629, second material rolling fixed side; 638, first material rolling movable side; 639, second material rolling movable side; 64, first blocking unit; 641, first control driving unit; 642, first area in-place sensor; 643, first mounting block; 65, second blocking unit; 66, third blocking unit; 670, lower material position sensor; 680, feeding unit; 691, first area; 692, second area; 693, third area; 694, fourth area; 695, first conveying member; 696, second conveying member; 697, third conveying member; 698, fourth conveying member;

[0051] 700, carrying device; 701, device stand; 702, display; 703, translation linear module; 704, lifting linear module; 71, substrate clamping jaw; 705, clamping jaw bottom plate; 706, clamping jaw rolling guide rail; 707, first clamping jaw driving unit; 708, second clamping jaw driving unit; 709, clamping jaw in-place sensor; 710, clamping jaw seat; 711, clamping jaw body;

[0052] 800, sub-mother ring feeding and discharging assembly; 801, support column; 802, clamping jaw carrying track; 803, carrying lifting driving unit; 804, carrying clamping driving unit; 805, sub-mother ring clamping jaw; 806, material box lifting track; 807, sub-mother ring material box; 8071, support strip; 8072, stop block; 80721, guide surface; 80722, pressing surface; 8073, top block; 8074, top block elastic member; 8075, material box frame; 8076, linear bearing; 8077, guide rod; 8078, handle; 808, first position sensor; 809, material box clamping driving unit; 810, pressing block; 811, second position sensor;

[0053] 900, substrate; 901, platform movement area. DETAILED DESCRIPTION

[0054] The technical solutions of the present application will be described clearly and completely in combination with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0055] In the description of the utility model, it needs to explain, the term "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indicate the orientation or position relation based on the orientation or position relation shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, a particular orientation and operation, therefore, it cannot be understood as the limitation of the utility model. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature is "above", "above" and "above" of the second feature, which includes the first feature above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature is "below", "below" and "below" of the second feature, which includes the first feature below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0056] In the description of the utility model, it needs to explain, unless otherwise specified and limited, the terms "installation", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0057] The embodiments of the utility model are described in detail below, the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and cannot be understood as the limitation of the utility model.

[0058] As Figures 1 to 3 shown, the utility model provides chip transfer mechanism 200 for handling chip, chip transfer mechanism 200 includes stand 201 and transfer assembly;Transfer assembly is movably connected to stand 201, and the transfer assembly includes assembly seat 209 and two pick-and-place units provided on the assembly seat 209, one pick-and-place unit is located at wafer picking position 222, and the other pick-and-place unit is located at wafer releasing position 223, and the assembly seat 209 can drive the two pick-and-place units to move to adjust the position where the two pick-and-place units are located;The pick-and-place unit at wafer picking position 222 is used to pick up the chip, and the pick-and-place unit at wafer releasing position 223 is used to release the chip.

[0059] The chip transfer mechanism 200 is provided with an assembly seat 209 and two pick-and-place units. By adjusting the positions of the two pick-and-place units through the assembly seat 209, the chip can be picked up by one pick-and-place unit while the other pick-and-place unit can pick up a chip at the same time, realizing the parallel execution of the "chip picking-transferring" and "chip placing-resetting" actions of the two pick-and-place units. The serial process of the traditional single-station operation is compressed into parallel circulation, and the design of symmetrical station switching avoids the time loss of the traditional single pick-and-place unit in the process of picking and placing chips. Therefore, the cycle time of chip handling is greatly shortened, the continuity of chip handling process is significantly enhanced, and the overall work efficiency is improved. In addition, the symmetrical layout of the two pick-and-place units ensures the dynamic balance of the mechanism during switching, avoiding the positioning error caused by inertia in the traditional rotary handling, and is suitable for continuous transfer scenarios of high-density chip arrays. The above structure limits the compact layout and clear division of labor of each component of the chip transfer mechanism 200, and the components for supplying and placing chips can be independent of the chip transfer mechanism 200, thereby helping to reduce the mutual influence between die bonding equipment, simplifying the path of mechanical movement of the pick-and-place unit, avoiding complex coordinated movement of multiple components, improving the smoothness of the entire chip processing or assembly process, realizing the simplified design of specific mechanisms, making the chip handling process more orderly, reducing the complexity and floor space of the mechanism, and reducing equipment cost and maintenance difficulty.

[0060] In this embodiment, the chip is taken as a Mini LED chip, and the chip transfer mechanism 200 is used to assemble the Mini LED chip on the substrate 900.

[0061] In this embodiment, the assembly seat 209 can rotate relative to the stand 201 about the axis of the assembly seat 209, the axis of the assembly seat 209 extends along the vertical direction Z, and the two pick-and-place units are symmetrically arranged about the axis of the assembly seat 209.

[0062] The two pick-and-place units are symmetrically arranged about the axis of the assembly seat 209, which simplifies the position switching path of the pick-and-place unit, optimizes the action cycle, ensures the position accuracy of the pick-and-place unit when switching between the chip picking position 222 and the chip placing position 223, and ensures the accurate picking and releasing of the chip. The rotation of the assembly seat 209 about the vertical axis makes the center of gravity of the mechanism stable when the pick-and-place unit rotates to adjust the position, the movement is more stable, the shaking and error are reduced, the risk of chip damage is reduced, the movement of the pick-and-place unit between the chip picking position 222 and the chip placing position 223 has good repeatability and consistency, which is conducive to improving the stability of chip handling. The symmetrically distributed pick-and-place units form an inertia offset effect through rotation, reduce the load fluctuation of the driving part, and the symmetrical structure is convenient for mechanical design and control, reducing the deviation in the movement process. Moreover, the vertical direction Z layout reduces the space required for horizontal movement, is suitable for high-density production lines, and adapts to compact equipment structure.

[0063] Further, the pick-and-place unit is slid along the vertical direction Z on the assembly seat 209.

[0064] The pick-and-place unit is slid along the vertical direction Z on the assembly seat 209, so that the height difference between the pick-and-place unit and the substrate 900 can be adjusted, the height of the pick-and-place unit can be flexibly adjusted, the pick-and-place unit can be controlled to be close to the substrate 900 when picking and placing the chip, and the pick-and-place unit can be controlled to be away from the substrate 900 after the picking and placing is completed, so that the picking and placing trajectory is optimized through the cooperation of the sliding lifting and rotating actions, and the position conflict between the chip and the substrate 900 can be avoided.

[0065] In the embodiment, the pick-and-place unit includes a swing arm 202 and a suction nozzle 215 arranged on the swing arm 202, and the suction nozzle 215 can adsorb and release the chip.

[0066] The pick-and-place unit adopts the structure of the swing arm 202 and the suction nozzle 215, the suction nozzle 215 can adsorb and release the chip, the adsorption type picking and placing mode can provide reliable adsorption force, the chip can be easily grabbed and released, the damage to the chip is reduced, the integrity and quality of the chip are ensured, and the transfer of the chip can be accurately completed through the control of the adsorption and release actions of the suction nozzle 215. The combination structure of the swing arm 202 and the suction nozzle 215 provides a flexible radial movement range, the swing path of the swing arm 202 is controllable, and the accurate positioning is helpful to reach the wafer picking position 222 and the wafer placing position 223.

[0067] In the embodiment, a voice coil driving unit 210 and a guide rail 211 extending along the vertical direction Z are installed on the assembly seat 209, a sliding member is arranged on the swing arm 202, the sliding member is slidably connected with the guide rail 211, and an output end of the voice coil driving unit 210 is connected to the sliding member, so as to drive the swing arm 202 to move along the vertical direction Z. Specifically, the voice coil driving unit 210 is a motor.

[0068] In one embodiment of the embodiment, the chip transfer mechanism 200 further includes a gas supply assembly, which is used to provide positive pressure and negative pressure to the suction nozzle 215.

[0069] The gas supply assembly provides positive pressure and negative pressure to the suction nozzle 215, the negative pressure can adsorb the chip, the positive pressure can be used to assist in releasing the chip, which is helpful to shorten the cycle of single operation, ensure the smooth operation of the adsorption and release actions of the chip by the suction nozzle 215, ensure the stability and reliability of the chip transfer process, reduce the chip falling rate, and improve the work efficiency and accuracy.

[0070] In another embodiment of the present application, the air supply assembly is only used to provide positive pressure to the suction nozzles 215, and the chip transfer mechanism 200 is assisted by other components to release the chips, or no components are provided to assist the release of the chips.

[0071] In the present application, the chip transfer mechanism 200 further comprises a swing arm air path mounting seat 220, which is fixed relative to the column 201. The swing arm air path mounting seat 220 is located below the assembly seat 209, and has a first air path, a second air path, a third air path and a fourth air path. The first air path passes through the first positive pressure electromagnetic valve 218 to the first negative pressure electromagnetic valve 216 and is connected to the suction nozzle 215 on one swing arm 202 to provide positive pressure to the suction nozzle 215. The second air path passes through the second negative pressure electromagnetic valve 217 to provide negative pressure to the suction nozzle 215 on the swing arm 202. The third air path passes through the second positive pressure electromagnetic valve 219 to the second negative pressure electromagnetic valve 217 and is connected to the suction nozzle 215 on another swing arm 202 to provide positive pressure to the suction nozzle 215. The fourth air path passes through the second positive pressure electromagnetic valve 219 to provide negative pressure to the suction nozzle 215.

[0072] The assembly seat 209 is provided with an air pipe rotary joint 214, and all the air paths pass through the air pipe rotary joint 214.

[0073] The components for absorbing and assisting in releasing the chips are conventional in the art, and their specific structure and working principle are well known in the art. They can be set according to the prior art, which is not the focus of the present application and will not be described in detail.

[0074] Exemplarily, the suction nozzle 215 can rotate relative to the swing arm 202 about the axis of the suction nozzle 215, which extends in the vertical direction Z.

[0075] The suction nozzle 215 can rotate relative to the swing arm 202 about its vertical axis, and the rotation adjustment cooperates with the movement of the swing arm 202 to realize multi-dimensional attitude control, so that the orientation of the chip can be accurately adjusted after picking up the chip during the carrying process according to the angle requirement of the chip mounting on the substrate 900. Thus, the influence of the swing angle of the swing arm 202 can be avoided, and the demand for different placement angles during chip assembly can be met, so that the chip can be accurately mounted on the substrate 900, thereby improving the quality of die bonding.

[0076] Further, the transfer assembly further comprises two self-rotation driving units 212 and two synchronous wheel synchronous belts 213, and the self-rotation driving units 212 are fixedly arranged on the assembly seat 209. The output end of each self-rotation driving unit 212 is in transmission cooperation with one suction nozzle 215 through one synchronous wheel synchronous belt 213.

[0077] The rotation driving unit 212 in the transfer assembly is in transmission cooperation with the suction nozzle 215 through the synchronous wheel synchronous belt 213, can accurately control the rotation angle and speed of the suction nozzle 215, can correct the deviation according to the deviation rotation in the process of the swing arm 202 rotation, ensure the precision of the chip angle adjustment, ensure the accuracy of the chip angle adjustment, and further improve the reliability of die bonding. At the same time, the driving mode of the synchronous wheel synchronous belt 213 can reduce the influence caused by the movement of the pick-and-place unit along the vertical direction Z as much as possible, ensure that the rotation driving unit 212 can drive the suction nozzle 215 to rotate accurately according to the demand while the pick-and-place unit is lifting. Specifically, the rotation driving unit 212 is a motor.

[0078] In the embodiment, the movement trajectory of the pick-and-place unit between the die picking position 222 and the die releasing position 223 is a semicircular arc, the movement trajectory passes through the snapshot position, and the stand column 201 is provided with two visual snapshot units, each of which corresponds to a pick-and-place unit and is used for shooting the pick-and-place unit located at the snapshot position. Specifically, the movement trajectory of the center of the suction nozzle 215 provided on one pick-and-place unit is a first trajectory 224, and the movement trajectory of the center of the suction nozzle 215 provided on the other pick-and-place unit is a second trajectory 225.

[0079] The pick-and-place unit moves in a semicircular arc between the die picking position 222 and the die releasing position 223, and the movement trajectory passes through the snapshot position, and the stand column 201 is provided with a visual snapshot unit corresponding to the pick-and-place unit. The visual snapshot unit can shoot the pick-and-place unit located at the snapshot position in real time, accurately obtain the position and attitude information of the chip, and provide accurate data support for the subsequent pick-and-place operation and the rotation operation of the suction nozzle 215, so as to accurately adjust the movement of the pick-and-place unit, realize the accurate positioning of the chip in the handling process, improve the precision of the chip handling, and achieve the purpose of correcting deviation in the chip transfer process. In addition to monitoring the position and posture, the visual snapshot unit can also detect the appearance of the chip, and timely find defects or damage on the surface of the chip. If a problem chip is detected, it can be fed back to the control system in time, so as to take timely measures for adjustment or processing, and improve the quality and yield of the product.

[0080] The above structure embeds the visual detection node into the transfer path through trajectory planning, avoids additional stopping time, shortens the chip attitude detection and position correction time, and improves the trajectory detection efficiency. The synchronous matching mechanism of the double visual snapshot units and the movement trajectory can capture the chip deviation in real time and dynamically correct the release position through the feedback system, so as to ensure that the alignment accuracy of the chip release meets the packaging requirements.

[0081] Specifically, the visual capture units are positioned above the transfer assembly, and the two visual capture units are a first visual capture unit 206 and a second visual capture unit 207. The capture position of the first visual capture unit 206 is set on the first trajectory 224, and the angle between the line connecting this capture position and the rotation center and the second direction Y is θ°. The capture position of the second visual capture unit 207 is set on the second trajectory 225, and the angle between the line connecting this capture position and the rotation center and the second direction Y is β°.

[0082] In this embodiment, a plurality of die-bonding pads are provided on the substrate 900, and each die-bonding pad is adapted to a chip. The pick-and-place unit located at the die placement position 223 can release the chip to the corresponding die-bonding pad.

[0083] Furthermore, the column 201 is also equipped with a first visual monitoring unit 204 and a second visual monitoring unit 205. The first visual monitoring unit 204 is used to photograph the chip adsorbed by the pick-and-place unit located at the chip picking position 222, and complete the image recognition and positioning coordinates of the chip. The second visual monitoring unit 205 is used to photograph the die bonding pads corresponding to the chip on the pick-and-place unit located at the die placement position 223, and complete the image recognition and positioning coordinates of the die bonding pads, as well as the chip detection after die bonding.

[0084] The first visual monitoring unit 204 and the second visual monitoring unit 205 are both disposed above the transfer assembly. Specifically, both the first visual monitoring unit 204 and the second visual monitoring unit 205 are cameras.

[0085] The chip transfer mechanism 200 also includes a rotation drive unit 208, which is mounted on the column 201 and its output end is fixed to the component base 209; specifically, the rotation drive unit 208 is a motor.

[0086] like Figures 1 to 23 As shown, this embodiment also provides a die bonder for assembling chips onto a substrate 900. The die bonder includes an infeed / outfeed line 600 and at least one die bonder module. The die bonder module includes a transport mechanism, a substrate platform 400, a chip loading mechanism 500, a mother-daughter ring loading / unloading assembly 800, and the aforementioned chip transfer mechanism 200. The transport mechanism is used to transport the substrate 900 between the infeed / outfeed line 600 and the substrate platform 400. The substrate platform 400 can carry and drive the substrate 900 to move. A mother-daughter ring 520 is detachably mounted on the chip loading mechanism 500. The mother-daughter ring 520 carries a chip and can carry and drive the mother-daughter ring 520 to move. A mother-daughter ring cassette 807 is detachably mounted on the mother-daughter ring loading / unloading assembly 800. The mother-daughter ring loading / unloading assembly 800 is used to transport the mother-daughter ring 520 between the mother-daughter ring cassette 807 and the chip loading mechanism 500.

[0087] The die bonder integrates the in-out material line body 600, the carrying mechanism, the substrate carrying platform 400, the chip feeding mechanism 500, the sub-mother ring feeding assembly 800 and the chip transfer mechanism 200 and other components, and each component works cooperatively. The sub-mother ring feeding assembly 800 realizes the carrying of the sub-mother ring 520, the carrying mechanism realizes the carrying of the substrate 900, and the chip transfer mechanism 200 realizes the carrying of the chip. The die bonder can realize the feeding and discharging functions of the substrate 900 and the sub-mother ring 520, the automatic transfer of the chip from the sub-mother ring 520 to the substrate 900 and the die bonding operation, realize the automatic process of chip assembly, reduce manual intervention through multi-mechanism linkage, improve the intelligent level of the production line, improve the production efficiency, guarantee the production efficiency and die bonding quality, and meet various needs of die bonding production. At the same time, the carrying mechanism cooperates with the in-out material line body 600 to support the continuous feeding of the substrate 900 and the discharging of the substrate 900 after processing is completed; the sub-mother ring feeding assembly 800 cooperates with the chip feeding mechanism 500 to support the continuous feeding of the sub-mother ring 520 and the recycling of the empty sub-mother ring 520, and improve the production line operation rate.

[0088] Specifically, the chip feeding mechanism 500 is used to carry the sub-mother ring 520, the chip feeding mechanism 500 can position the position of the chip according to the system algorithm, and drive the sub-mother ring 520 to move within the range of the sub-mother ring movement area 530 in the horizontal plane; the substrate carrying platform 400 is used to carry the substrate 900, and the substrate carrying platform 400 can accurately position the position of the substrate 900 according to the program and image recognition information.

[0089] The chip transfer mechanism 200 further comprises an ion fan 221, which is arranged on the column 201 and faces the sub-mother ring 520, and is used to eliminate the static electricity of the chip on the sub-mother ring 520.

[0090] As shown in Figure 2 , Figure 4 and Figure 12 , the substrate carrying platform 400 is used to place the substrate 900, and the substrate carrying platform 400 can accurately position the position of the die bonding pad on the substrate 900 according to the program and image recognition information obtained by the second visual monitoring unit 205.

[0091] The substrate carrier platform 400 comprises a platform base 401, a platform motor mounting plate 405, a jig mounting base 410 and two first rolling guides 402 arranged on the platform base 401 and extending along a first direction X; the bottom of the platform motor mounting plate 405 is provided with a plurality of platform sliding blocks, the first rolling guides 402 are in sliding cooperation with the platform sliding blocks, and the platform motor mounting plate 405 can move relative to the platform base 401 along the first direction X; a first platform linear motor stator 403 is arranged on the platform base 401 and located between the two first rolling guides 402, and a first platform linear motor rotor 404 is arranged below the platform motor mounting plate 405, the first platform linear motor rotor 404 is in rotary cooperation with the first platform linear motor stator 403, and is used to drive the platform motor mounting plate 405 to move along the first direction X; the platform base 401 is fixedly provided with a first grating reader 406, and the first grating reader 406 is used to feed back the position information of the platform motor mounting plate 405.

[0092] The top of the platform motor mounting plate 405 is provided with two second rolling guides 407 extending along a second direction Y, and the bottom of the jig mounting base 410 is provided with a mounting base sliding block, the second rolling guides 407 are in sliding cooperation with the mounting base sliding block, and the second rolling guides 407 can move relative to the platform motor mounting plate 405 along the second direction Y; a second platform linear motor stator 408 is arranged on the platform motor mounting plate 405 and located between the two second rolling guides 407, and a second platform linear motor rotor 409 is arranged below the jig mounting base 410, the second platform linear motor rotor 409 is in rotary cooperation with the second platform linear motor stator 408, and is used to drive the jig mounting base 410 to move along the second direction Y; the platform motor mounting plate 405 is fixedly provided with a second grating reader 411, and the second grating reader 411 is used to feed back the position information of the platform motor mounting plate 405.

[0093] The jig mounting base 410 is mounted with a substrate jig 412, the substrate jig 412 is provided with a plurality of jig adsorption air holes, the bottom end of the jig adsorption air hole is communicated with a jig vacuumizing device, and the jig vacuumizing device is used to adsorb the substrate 900. The jig vacuumizing device can provide vacuum conduction for the substrate jig 412, so that the substrate 900 is tightly adsorbed on the upper surface of the substrate jig 412. The substrate jig 412 is also provided with a first air cylinder 413 and a second air cylinder 414, the first air cylinder 413 is used to drive two opposite first clamping pieces to selectively clamp the substrate 900 along the first direction X, and the second air cylinder 414 is used to drive two opposite second clamping pieces to selectively clamp the substrate 900 along the second direction Y.

[0094] In the embodiment, the first direction X and the second direction Y are perpendicular to each other, and both are perpendicular to the vertical direction Z.

[0095] As Figures 17 to 20As shown, the sub-ring and parent-ring material box 807 is used to carry the sub-ring and parent-ring 520, and the sub-ring and parent-ring material box 807 comprises a material box frame 8075 having a plurality of receiving spaces uniformly distributed along the vertical direction Z, each receiving space being used to receive one sub-ring and parent-ring 520, and each receiving space being provided with a support unit and a top block 8073, the support unit being used to horizontally carry the sub-ring and parent-ring 520, one end of the support unit being fixedly connected to the material box frame 8075, the other end being provided with a stop block 8072, and the top block 8073 being elastically connected to the material box frame 8075 through a top block elastic element 8074, the top block 8073 being capable of moving towards or away from the stop block 8072 along a movement direction, the movement direction being parallel to the horizontal plane, the top block elastic element 8074 being used to push the top block 8073 to move towards the stop block 8072, and the sub-ring and parent-ring 520 placed in the receiving space being clamped between the stop block 8072 and the top block 8073. Specifically, the movement direction is parallel to the first direction X.

[0096] The material box frame 8075 of the sub-ring and parent-ring material box 807 has a plurality of receiving spaces uniformly distributed along the vertical direction Z, and is capable of orderly receiving a plurality of sub-ring and parent-rings 520 in a limited space, achieving efficient storage of the sub-ring and parent-rings 520, fully utilizing the vertical space, improving the space utilization rate, and facilitating batch management of the sub-ring and parent-rings 520. The support unit is used to horizontally carry the sub-ring and parent-ring 520, ensuring that the sub-ring and parent-ring 520 maintains a stable horizontal state in the receiving space, reducing the risk of damage caused by shaking or tilting, and ensuring the storage safety of the sub-ring and parent-ring 520. Through the stop block 8072 and the movable top block 8073, the sub-ring and parent-ring 520 can be clamped between the two, preventing the sub-ring and parent-ring 520 from shifting or shaking in the material box, and ensuring the stability of storage. The top block 8073 is elastically connected to the material box frame 8075 through the top block elastic element 8074, and reciprocally moves along the movement direction, clamping the sub-ring and parent-ring 520 between the stop block 8072 and the top block 8073, and achieving reliable fixation of the sub-ring and parent-ring 520. When the sub-ring and parent-ring 520 is clamped and placed, the top block elastic element 8074 can play a buffering role, avoiding hard damage to the sub-ring and parent-ring 520.

[0097] Specifically, the top end of the material box frame 8075 is provided with a handle 8078 for easy gripping.

[0098] In this embodiment, the side of the stop block 8072 facing the top block 8073 is provided with a connected abutting surface 80722 and a guide surface 80721, the abutting surface 80722 being used to abut against the side wall of the sub-ring and parent-ring 520, the guide surface 80721 being located above the abutting surface 80722, and the guide surface 80721 being arranged at an angle with the abutting surface 80722.

[0099] The abutting surface 80722 of the stop block 8072 is in close contact with the side wall of the sub-mother ring 520, which can more accurately limit the movement of the sub-mother ring 520 in the horizontal direction, improve the positioning accuracy of the sub-mother ring 520 in the storage space, ensure the positional accuracy of the sub-mother ring 520 in the storage space, and facilitate the accuracy of subsequent clamping and use operations. The guide surface 80721 is located above the abutting surface 80722 and is arranged at an angle with the abutting surface 80722, which provides a guiding effect for the operation of placing the sub-mother ring 520 into the storage space, makes the sub-mother ring 520 more easily and accurately reach the corresponding position in the storage space, reduces the operation difficulty, and improves the convenience and efficiency of placing the sub-mother ring 520.

[0100] Further, along the vertical direction Z from top to bottom, the guide surface 80721 is arranged inclinedly away from the top block 8073.

[0101] The guide surface 80721 is arranged inclinedly away from the top block 8073 along the vertical direction Z from top to bottom, and when the sub-mother ring 520 is placed into the storage space from top to bottom, the guide surface 80721 can guide the sub-mother ring 520 to smoothly slide to the abutting surface 80722, so that the sub-mother ring 520 can be more smoothly slid into the storage space when placed into the storage space, thereby further optimizing the process of placing the sub-mother ring 520 into the storage space, reducing the jamming and obstruction in the placement process, and improving the smoothness and efficiency of the operation of taking and placing the sub-mother ring 520.

[0102] In the embodiment, the support unit includes at least two support bars 8071 arranged at intervals in the second direction Y, the support bars 8071 extend along the first direction X, and each support bar 8071 is fixedly connected with a stop block 8072. Specifically, the support bar 8071 is provided with two.

[0103] The design of the support unit composed of the support bars 8071 arranged at intervals can support the sub-mother ring 520 from multiple positions, ensure the stability of the support of the sub-mother ring 520 in the horizontal direction, and avoid the inclination or shaking of the sub-mother ring 520 due to single-point support.

[0104] Exemplarily, the top block 8073 is fixedly connected with a guide rod 8077 at an end away from the stop block 8072, the guide rod 8077 is movably connected to the box frame 8075, the guide rod 8077 passes through the top block elastic member 8074, and is coaxial with the top block elastic member 8074.

[0105] The top block 8073 is fixed with a guide rod 8077 away from one end of the stop block 8072, the guide rod 8077 is movably connected to the magazine frame 8075 and passes through the top block elastic element 8074 and is coaxial with it, which provides accurate guidance for the movement of the top block 8073, ensures the movement accuracy of the top block 8073 in the horizontal direction, ensures the reciprocating movement of the top block 8073 in the active direction more stable and accurate, avoids the deviation of the top block 8073 during movement, and ensures the action accuracy of clamping and releasing the primary and secondary rings 520.

[0106] Further, the magazine frame 8075 is fixed with a linear bearing 8076, and the number of linear bearings 8076 is the same as that of the guide rods 8077. Each linear bearing 8076 is in sliding fit with a guide rod 8077.

[0107] The magazine frame 8075 is fixed with a linear bearing 8076, and the linear bearing 8076 is in sliding fit with the guide rod 8077, which can effectively reduce the friction when the guide rod 8077 moves, making the movement of the top block 8073 more smooth and flexible, while also reducing the wear of the components, improving the operation efficiency and service life of the entire mechanism.

[0108] As shown in the drawings, Figures 13 to 16 The primary and secondary ring feeding and discharging assembly 800 is used to carry the primary and secondary rings 520 in different storage spaces in the primary and secondary ring magazine 807 to the chip feeding mechanism 500, and can also carry the primary and secondary rings 520 in the chip feeding mechanism 500 out and place them in different storage spaces in the primary and secondary ring magazine 807. The primary and secondary ring feeding and discharging assembly 800 includes a gripper carrying module, a magazine lifting module, and the above-mentioned primary and secondary ring magazine 807. The magazine lifting module is used to drive the primary and secondary ring magazine 807 to move along the vertical direction Z, and the gripper carrying module can extend into the primary and secondary ring magazine 807 to take and place the primary and secondary rings 520.

[0109] The primary and secondary ring feeding and discharging assembly 800 includes a gripper carrying module, a magazine lifting module, and a primary and secondary ring magazine 807. The magazine lifting module can drive the primary and secondary ring magazine 807 to move along the vertical direction Z, and the gripper carrying module can extend into the primary and secondary ring magazine 807 to take and place the primary and secondary rings 520, realizing automatic operation of the primary and secondary ring feeding and discharging, improving the flexibility and production efficiency of feeding and discharging, and adapting to different production needs.

[0110] Further, the gripper carrying module includes a gripper carrying track 802, a carrying lifting driving unit 803, a carrying clamping driving unit 804, and two primary and secondary ring grippers 805. The carrying lifting driving unit 803 can move relative to the gripper carrying track 802 in the horizontal plane, and the carrying lifting driving unit 803 is used to drive the carrying clamping driving unit 804 to move along the vertical direction Z. The carrying clamping driving unit 804 can drive the two primary and secondary ring grippers 805 to approach or move away from each other to clamp or release the primary and secondary rings 520.

[0111] The carrying lifting driving unit 803 of the gripper carrying module can move in the horizontal plane relative to the gripper carrying track 802, and can also drive the carrying gripper driving unit 804 to move in the vertical direction Z. The carrying gripper driving unit 804 can drive the two sub-mother ring grippers 805 to approach or move away from each other. Through the coordinated work of each driving unit on the gripper carrying module, multi-dimensional flexible operation of the sub-mother ring 520 clamping and carrying is realized, which adapts to the taking and placing requirements of the sub-mother ring 520 at different positions and heights, and improves the accuracy and stability of the operation.

[0112] Exemplarily, the magazine lifting module includes a magazine lifting track 806, a magazine clamping driving unit 809, and at least one pair of pressing blocks 810. The magazine clamping driving unit 809 can move in the vertical direction Z relative to the magazine lifting track 806. The pressing blocks 810 are connected to the output end of the magazine clamping driving unit 809. The magazine clamping driving unit 809 is used to drive each pair of pressing blocks 810 to approach or move away from each other, so as to clamp or release the sub-mother ring magazine 807.

[0113] The magazine clamping driving unit 809 of the magazine lifting module can drive each pair of pressing blocks 810 to approach or move away from each other, so as to clamp or release the sub-mother ring magazine 807, thereby ensuring the stability of the sub-mother ring magazine 807 during lifting, preventing the sub-mother ring magazine 807 from shaking or falling, and ensuring the safety and stability of the feeding and discharging process.

[0114] Specifically, the magazine lifting module further includes a first position sensor 808 and a second position sensor 811. The first position sensor 808 is arranged on the magazine clamping driving unit 809 and is used to monitor whether the sub-mother ring 520 is accommodated in each accommodation space. The second position sensor 811 is arranged on the magazine lifting track 806 and is used to monitor whether the sub-mother ring magazine 807 is currently installed on the magazine lifting module, so as to ensure the monitoring ability of the magazine lifting module to the sub-mother ring magazine 807 during the automatic movement process.

[0115] When the sub-mother ring 520 is taken out of the sub-mother ring magazine 807, the following procedures are included: the target accommodation space is adjusted to the corresponding taking position by the magazine lifting module, it is detected by the first position sensor 808 that the current accommodation space has the sub-mother ring 520, then the sub-mother ring gripper 805 is moved to the position, the sub-mother ring gripper 805 is clamped to the sub-mother ring 520 by the carrying gripper driving unit 804, the sub-mother ring gripper 805 is controlled to move a predetermined distance towards the top block 8073, until the top block 8073 is pushed to the compression position, so as to avoid the position conflict between the sub-mother ring 520 and the guide surface 80721, then the sub-mother ring magazine 807 is controlled to descend, so that the sub-mother ring 520 is located at the opening of the target accommodation space and is spaced apart from the stop block 8072, and finally the gripper carrying module takes out the sub-mother ring 520.

[0116] When the empty sub-ring 520 is placed into the sub-ring magazine 807, the following procedures are included: the target storage space is adjusted to the corresponding feeding position by the magazine lifting module, the first position sensor 808 detects that the current storage space does not have the sub-ring 520, the clamping jaw carrying module drives the sub-ring clamping jaw 805 clamping the sub-ring 520, passes through the opening of the target storage space and enters the sub-ring magazine 807, and pushes the top block 8073 to the compressed position to avoid the position conflict between the sub-ring 520 and the guide surface 80721, then controls the sub-ring magazine 807 to rise to make the sub-ring 520 contact with the support bar 8071, and the carrying clamping driving unit 804 drives the sub-ring clamping jaw 805 to release the sub-ring 520; the top block elastic element 8074 drives the top block 8073 to move towards the stop block 8072, and pushes the sub-ring 520 to contact with the pressing surface 80722.

[0117] In this embodiment, the chip feeding mechanism 500 is used to place the sub-ring 520, and the chip feeding mechanism 500 can accurately position the position of the chip on the sub-ring 520 according to the program and image recognition information obtained by the first visual monitoring unit 204.

[0118] As shown in Figures 5 to 7 The chip feeding mechanism 500 is detachably installed with the sub-ring 520, the sub-ring 520 includes a ring main body and an elastic blue film, the blue film is configured to close the opening of the ring main body, and the blue film is used to carry the chip, the chip feeding mechanism 500 includes a mechanism seat 501, a crystal ring positioning unit, a mounting ring 519 and a suction cap 525; the crystal ring positioning unit is movably connected to the mechanism seat 501, and the crystal ring positioning unit can move in the horizontal plane relative to the mechanism seat 501; the mounting ring 519 is rotatably connected to the crystal ring positioning unit, and the mounting ring 519 can rotate relative to the crystal ring positioning unit about the axis of the mounting ring 519, the axis of the mounting ring 519 extends along the vertical direction Z, the mounting ring 519 is used to carry and drive the ring main body to rotate, and the crystal ring positioning unit selectively positions the ring main body on the mounting ring 519; the suction cap 525 is movably connected to the mechanism seat 501, and the suction cap 525 can move in the horizontal plane relative to the mechanism seat 501, the suction cap 525 passes through the crystal ring positioning unit and the mounting ring 519, the top end of the suction cap 525 is provided with a suction surface and a thimble 527, the suction surface selectively suctions the lower surface of the blue film, and the thimble 527 is used to lift the lower surface of the blue film to deform part of the blue film upward.

[0119] The chip loading mechanism 500 can detachably install the primary and secondary rings 520, facilitating replacement and maintenance of the primary and secondary rings 520, providing a stable placement platform for the chip, and improving the use efficiency of the chip loading mechanism 500. The blue film of the primary and secondary rings 520 can carry the chip, and the elastic blue film can adapt to different operations to avoid damage to the chip. The crystal ring positioning unit can move in the horizontal plane, and the mounting ring 519 can rotate around the vertical axis, and the cooperation of the two can accurately adjust the position and angle of the primary and secondary rings 520, facilitating accurate positioning and adjustment of the ring body, improving the accuracy of chip loading, and helping to complete subsequent chip picking and placing operations. The suction cap 525 can move in the horizontal plane, and the suction surface at the top end of the suction cap 525 can adsorb the lower surface of the blue film. The thimble 527 can lift the blue film to deform partially, which helps to separate the chip from the blue film, facilitates chip picking, and facilitates subsequent transfer.

[0120] In this embodiment, the thimble 527 is arranged at the center of the suction surface and extends in a direction perpendicular to the suction surface.

[0121] The thimble 527 is arranged at the center of the suction surface and extends perpendicular to the suction surface, which can more accurately lift the target position on the blue film, making the blue film deform uniformly and stably upward, ensuring that the chip can be stably separated from the blue film, thereby improving the accuracy and stability of chip separation and improving the success rate of chip picking.

[0122] Exemplarily, the chip loading mechanism 500 further comprises a film vacuumizing device 526, and the suction surface is uniformly provided with a plurality of film suction air holes 528, which are communicated with the film vacuumizing device 526. The film vacuumizing device 526 is used to adsorb the blue film.

[0123] The film vacuumizing device 526 adsorbs the blue film through the film suction air holes 528, which can provide stable suction force to ensure that the blue film is tightly attached to the suction surface, preventing the blue film from shaking or shifting during chip separation, and improving the reliability of loading.

[0124] In this embodiment, the chip loading mechanism 500 further comprises a first driving unit shaft 521, a second driving unit shaft 522, and a third driving unit shaft 523. The output end of the first driving unit shaft 521 is fixedly connected to the second driving unit shaft 522, and the first driving unit shaft 521 is used to drive the second driving unit shaft 522 to move reciprocally along the first direction X. The output end of the second driving unit shaft 522 is fixedly connected to the third driving unit shaft 523, and the second driving unit shaft 522 is used to drive the third driving unit shaft 523 to move reciprocally along the second direction Y. The output end of the third driving unit shaft 523 is fixedly connected to the thimble 527, and the third driving unit shaft 523 is used to drive the thimble 527 to move reciprocally along the vertical direction Z. Specifically, the suction cap 525 is fixedly arranged on the third driving unit shaft 523, so that the relative position between the third driving unit shaft 523 and the suction cap 525 is fixed.

[0125] Through the cooperation of the first driving unit shaft 521, the second driving unit shaft 522 and the third driving unit shaft 523, the adsorption cap 525 is driven to move in the first direction X and the second direction Y which are perpendicular to each other, and the plunger 527 is driven to move in the vertical direction Z, so as to realize the flexible movement of the adsorption cap 525 in the horizontal plane, and make the plunger 527 eject the chip as required, thereby ensuring the accurate grabbing and positioning of the chip, so as to accurately reach the target position for chip adsorption operation, which helps to improve the flexibility and accuracy of the feeding.

[0126] Specifically, the fifth grating reader 524 is fixed on the mechanism seat 501, and is used to feedback the position information of the adsorption cap 525.

[0127] Specifically, the fifth grating reader 524 is fixed on the mechanism seat 501, and is used to feedback the position information of the adsorption cap 525.

[0128] The mechanism motor mounting plate 505 and the crystal ring mounting plate 512 of the crystal ring positioning unit reciprocate along the first direction X and the second direction Y which are perpendicular to each other respectively, so as to accurately adjust the positions of the mounting ring 519 and the primary-secondary ring 520 in the horizontal plane, thereby realizing the accurate positioning of the primary-secondary ring 520 and improving the positioning accuracy of the chip feeding.

[0129] Further, the top of the mechanism seat 501 is provided with the first mechanism linear motor stator 503 and two first mechanism guide rails 502, the first mechanism guide rails 502 extend along the first direction X, the first mechanism linear motor stator 503 is arranged between the two first mechanism guide rails 502, the bottom of the mechanism motor mounting plate 505 is provided with the first mechanism linear motor rotor 504 and a plurality of mechanism sliding blocks, the mechanism sliding blocks are in sliding cooperation with the first mechanism guide rails 502, the first mechanism linear motor rotor 504 is in rotational cooperation with the first mechanism linear motor stator 503, and is used to drive the mechanism motor mounting plate 505 to move along the first direction X; the top of the mechanism motor mounting plate 505 is provided with the second mechanism linear motor stator 508 and two second mechanism guide rails 507, the second mechanism guide rails 507 extend along the second direction Y, the second mechanism linear motor stator 508 is arranged between the two second mechanism guide rails 507, the bottom of the crystal ring mounting plate 512 is provided with the second mechanism linear motor rotor 509 and a plurality of mounting plate sliding blocks, the mounting plate sliding blocks are in sliding cooperation with the second mechanism guide rails 507, the second mechanism linear motor rotor 509 is in rotational cooperation with the second mechanism linear motor stator 508, and is used to drive the crystal ring mounting plate 512 to move along the second direction Y.

[0130] The first mechanism linear motor stator 503 and the first mechanism linear motor mover 504 cooperatively drive the mechanism motor mounting plate 505 to move smoothly along the first direction X, ensuring the stability of the crystal ring positioning. Meanwhile, the first mechanism guide rail 502 and the mechanism slide block are in sliding cooperation, ensuring the stability and accuracy of the movement of the mechanism motor mounting plate 505, so that the mechanism motor mounting plate 505 can efficiently move along the first direction X.

[0131] The second mechanism linear motor stator 508 and the second mechanism linear motor mover 509 cooperatively drive the crystal ring mounting plate 512 to move smoothly along the second direction Y, ensuring the stability of the crystal ring positioning. Meanwhile, the second mechanism guide rail 507 and the mounting plate slide block are in sliding cooperation, ensuring the stability and accuracy of the movement of the crystal ring mounting plate 512, so that the crystal ring mounting plate 512 can efficiently move along the second direction Y, further improving the positioning accuracy of the primary and secondary rings 520.

[0132] Specifically, the bottom end of the crystal ring mounting plate 512 is fixedly connected with an upper mounting plate 510, and the mounting plate slide block is arranged on the upper mounting plate 510; the third grating reader 506 is fixedly arranged on the mechanism seat 501, and is used to feedback the position information of the mechanism motor mounting plate 505; and the fourth grating reader 511 is fixedly arranged on the mechanism motor mounting plate 505, and is used to feedback the position information of the crystal ring mounting plate 512.

[0133] In the embodiment, the chip loading mechanism 500 further comprises a primary and secondary ring positioning strip 517 and a clamp 516. The primary and secondary ring positioning strip 517 is fixedly arranged on the crystal ring positioning unit, and is in close contact with the outer sidewall of the ring main body of the primary and secondary rings 520 arranged on the mounting ring 519. The clamp 516 is movably connected to the crystal ring positioning unit, and can approach or move away from the primary and secondary ring positioning strip 517, so as to press against the outer sidewall of the ring main body of the primary and secondary rings 520, and clamp the primary and secondary rings 520 between the clamp 516 and the primary and secondary ring positioning strip 517.

[0134] The primary and secondary ring positioning strip 517 and the clamp 516 cooperatively clamp the primary and secondary rings 520 on the crystal ring positioning unit, preventing the primary and secondary rings 520 from being displaced during rotation or movement, and ensuring the accuracy and stability of the chip loading.

[0135] In the embodiment, the crystal ring mounting plate 512 is provided with a reciprocating driving unit 515, and the output end of the reciprocating driving unit 515 is connected with the clamp 516, so as to drive the clamp 516 to move. Specifically, the reciprocating driving unit 515 is a pneumatic cylinder.

[0136] Further, the clamps 516 are two and symmetrically arranged relative to the moving track of the output end of the reciprocating driving unit 515; the clamps 516 are hinged to the wafer ring mounting plate 512, and the clamps 516 can swing relative to the wafer ring mounting plate 512 between a avoiding position and a pressing position; the clamps 516 in the avoiding position are spaced apart from the mother-daughter ring 520 placed on the mounting ring 519, and the clamps 516 in the pressing position press the mother-daughter ring 520 placed on the mounting ring 519; the clamps 516 are further elastically connected to the wafer ring mounting plate 512 through elastic members, and the elastic members are used to drive the clamps 516 to move to the avoiding position; and the reciprocating driving unit 515 can drive the clamps 516 to move to the pressing position.

[0137] Exemplarily, the wafer ring positioning unit is provided with a rotating driving unit 513, and the mounting ring 519 is rotationally matched with the wafer ring positioning unit through a bearing 518, the bearing 518 provides positioning and guidance for rotation of the mother-daughter ring 520, and the rotating driving unit 513 is in transmission matching with the mounting ring 519 through a mounting ring synchronous belt 514.

[0138] The rotating driving unit 513 is in transmission matching with the mounting ring 519 through the mounting ring synchronous belt 514, so that the mounting ring 519 can be accurately rotated around the axis stably, the angle adjustment of the mother-daughter ring 520 is realized, the demand of loading chips on different chips is met, and reliable guarantee is provided for the circumferential positioning of the chips.

[0139] As shown in Figures 21 to 23 The carrying mechanism includes a device column 701 and a substrate gripper 71, and the substrate gripper 71 can move relative to the device column 701 in a plane perpendicular to the first direction X.

[0140] The carrying mechanism enables the substrate gripper 71 to move relative to the device column 701 in a plane perpendicular to the first direction X, realizes carrying of the substrate 900 in a two-dimensional plane, expands the working space and flexibility of carrying of the substrate 900, and can meet the demand of taking and placing the substrate 900 at different positions. By integrating the substrate gripper 71 and the device column 701 together, the integration degree of the carrying mechanism as a whole is improved, and the floor space is reduced.

[0141] In the embodiment, the carrying mechanism further includes a translation linear module 703 and a lifting linear module 704, the translation linear module 703 is arranged on the device column 701, the output end of the translation linear module 703 is connected to the lifting linear module 704, and the lifting linear module 704 is used to drive the lifting linear module 704 to move along the second direction Y; and the output end of the lifting linear module 704 is connected to the substrate gripper 71, and the substrate gripper 71 is used to drive the substrate gripper 71 to move along the vertical direction Z.

[0142] The translational linear module 703 and the lifting linear module 704 are arranged to enable the substrate gripper 71 to move in the second direction Y and the vertical direction Z, in combination with the substrate gripper 71 driving the substrate 900 in the first direction X, to realize the carrying of the substrate 900 in the three-dimensional space, improve the flexibility and applicability of the carrying, and meet the carrying requirements of the substrate 900 in different positions. Through the precise control of the linear module, the accurate carrying and positioning of the substrate 900 in each direction can be realized.

[0143] Exemplarily, the carrying mechanism further comprises a display 702 arranged on the device column 701, and the display 702 is used to display the moving speed, position information and clamping state of the gripper unit in real time.

[0144] The display 702 can display the moving speed, position information and clamping state of the gripper unit in real time, so that the operator can know the working condition of the gripper in time, and the adjustment and troubleshooting can be facilitated, thereby improving the safety and reliability of the carrying mechanism. Through the real-time monitoring of the state of the gripper unit, potential faults and abnormal conditions can be found in time, and early warning and processing can be performed, thereby improving the reliability and stability of the carrying mechanism.

[0145] As shown in Figure 11 , Figure 21 and Figure 22 , the substrate gripper 71 is used to take and place the substrate 900, and the substrate gripper 71 comprises a gripper bottom plate 705 and two gripper units arranged on the gripper bottom plate 705. The gripper units can slide relative to the gripper bottom plate 705 along the first direction X. One gripper unit can press against the substrate 900 with a first driving force, and the other gripper unit can press against the substrate 900 with a second driving force. The first driving force and the second driving force are opposite in direction, and the absolute value of the first driving force is smaller than that of the second driving force. After the two gripper units clamp the substrate 900, the gripper units and the substrate 900 form an integral whole, and the substrate 900 is driven to slide relative to the gripper bottom plate 705 by the combined driving force of the two gripper units, until reaching the limit position on the gripper bottom plate 705.

[0146] The two gripper units on the substrate gripper 71 can slide relative to the gripper bottom plate 705 along the first direction X, and the force applied is different in size and opposite in direction. This differential design can flexibly adjust the distance between the two gripper units according to the size and position of the substrate 900, so as to realize the stable positioning of different specifications of the substrate 900 and improve the efficiency of the taking and placing operation. After the gripper units clamp the substrate 900 to form an integral whole and slide to the limit position by the combined driving force, the clamping and positioning of the substrate 900 can be quickly and accurately completed, the substrate 900 can be stably fixed in the substrate gripper 71, the shaking and displacement in the carrying process can be reduced, and the overall working efficiency can be improved.

[0147] In the embodiment, the clamping jaw unit comprises a clamping jaw base 710 and two clamping jaw bodies 711, the clamping jaw base 710 is in sliding fit with the clamping jaw bottom plate 705, the clamping jaw bodies 711 are capable of sliding along the second direction Y relative to the clamping jaw base 710, and the clamping jaw bodies 711 are used for clamping the substrate 900.

[0148] The clamping jaw bodies 711 are capable of sliding along the second direction Y relative to the clamping jaw base 710, and the first direction X and the second direction Y are perpendicular to each other, which increases the adjustment dimension of the clamping jaw in the horizontal plane, better adapts to the position and attitude of the substrate 900, improves the clamping precision, and helps to more accurately clamp the substrate 900. Since the clamping jaw bodies 711 have the adjustment capability in two perpendicular directions, the substrate clamping jaw 71 can better adapt to substrates 900 of different shapes and sizes.

[0149] Further, the edge of the clamping jaw body 711 is provided with a clamping through slot, the substrate 900 can be partially matched and inserted into the clamping through slot, and the slot wall of the clamping through slot is provided with an elastic anti-skid layer.

[0150] The design of the clamping through slot at the edge of the clamping jaw body 711 enables the substrate 900 to be partially matched and inserted, thereby increasing the stability of clamping. The setting of the elastic anti-skid layer can avoid damage to the surface of the substrate 900, the elastic anti-skid layer of the slot wall can increase the friction with the substrate 900, prevent the substrate 900 from slipping or falling off during clamping, protect the integrity of the substrate 900, and improve the reliability of clamping.

[0151] Exemplarily, the clamping jaw bottom plate 705 is provided with a clamping jaw rolling guide rail 706 extending along the first direction X, the clamping jaw unit is in movable fit with the clamping jaw rolling guide rail 706, and the clamping jaw bottom plate 705 is provided with a clamping jaw in-place sensor 709, which is used for monitoring the clamping state of the clamping jaw unit.

[0152] The clamping jaw rolling guide rail 706 provides a stable path for the sliding of the clamping jaw unit, enabling the clamping jaw unit to move smoothly, improving the flexibility and response speed of operation, and reducing energy loss. The clamping jaw in-place sensor 709 can monitor the presence or absence of the substrate 900 on the substrate clamping jaw 71 in real time, so as to determine whether the substrate 900 is always kept on the clamping jaw unit during the carrying process of the substrate clamping jaw 71, and also detect whether the substrate 900 is clamped between the two clamping jaw units before the clamping jaw unit clamps the substrate 900, so as to ensure that the clamping jaw unit operates as expected and avoid damage to the equipment due to misoperation; the setting of the clamping jaw in-place sensor 709 facilitates the realization of automatic control, and helps to improve the safety and reliability of the substrate clamping jaw 71.

[0153] In one implementation of the embodiment, the first jaw driving unit 707 is arranged on the jaw bottom plate 705, and the output end of the first jaw driving unit 707 is connected to one jaw unit; and the second jaw driving unit 708 is arranged on the jaw bottom plate 705, and the output end of the second jaw driving unit 708 is connected to the other jaw unit. Specifically, the first jaw driving unit 707 and the second jaw driving unit 708 are both air cylinders, and due to the difference in power, the first driving force and the second driving force have a difference in absolute value.

[0154] The first jaw driving unit 707 and the second jaw driving unit 708 respectively drive two jaw units, and the driving force and the position of the movement of each jaw unit are independently controlled by different driving modes, which facilitates the adjustment of the force and the position of the jaw unit according to actual needs, and further enables more flexible and accurate clamping operations to adapt to different working scenarios.

[0155] In other implementations of the embodiment, only the first jaw driving unit 707 is arranged on the jaw bottom plate 705, and the output end of the first jaw driving unit 707 is connected to one jaw unit, or only the second jaw driving unit 708 is arranged on the jaw bottom plate 705, and the output end of the second jaw driving unit 708 is connected to the other jaw unit.

[0156] In the embodiment, the ratio of the absolute values of the first driving force and the second driving force is 1:N, and N is greater than 1; the direction of the combined driving force of the two jaw units is the same as the direction of the second driving force, and the value of the combined driving force is the difference between the absolute value of the second driving force and the absolute value of the first driving force.

[0157] The ratio of the absolute values of the first driving force and the second driving force and the calculation method of the combined driving force are specified, so that the jaw unit can move at a reasonable speed when clamping the substrate 900, avoiding damage to the substrate 900 due to too high speed or affecting work efficiency due to too low speed, thereby quickly completing the clamping and movement operations of the substrate 900. Precise driving force control helps to quickly adjust the jaw spacing, thereby improving the accuracy of substrate 900 clamping and positioning, and ensuring the stability of the overall movement and the quality of the work.

[0158] Continuing to refer to Figure 4 , two die bonding modules are arranged, the carrying mechanism in one die bonding module is used to take or release the substrate 900 at the first stop position, so as to realize the carrying of the substrate 900 between the in-out feeding line body 600 and the substrate carrying platform 400 in the die bonding module; the carrying mechanism in the other die bonding module is used to take or release the substrate 900 at the second stop position, so as to realize the carrying of the substrate 900 between the in-out feeding line body 600 and the substrate carrying platform 400 in the die bonding module; the in-out feeding line body 600 can drive the substrate 900 to pass through the first stop position and the second stop position in sequence.

[0159] Two die bonding modules are arranged, and the in-out material line body 600 can drive the substrate 900 to pass through the first stop position and the second stop position of the two die bonding modules in sequence, so that different substrates 900 can be simultaneously subjected to die bonding operation, which helps the in-out material line body 600 to control and optimize the substrate 900 flow efficiency in sections, and avoid process congestion. The above improvement realizes parallel work of double modules in a multi-station parallel manner, reduces the waiting time between processes, improves the unit time yield, and improves the production efficiency of the die bonder.

[0160] As shown in Figures 1 to 23 The die bonder further includes a table plate 100 and a base 300. The table plate 100 is installed on the base 300, and all the remaining components are installed on the table plate 100. Specifically, the platform seat 401 is fixedly arranged on the table plate 100, the mechanism seat 501 is fixedly arranged on the table plate 100, the box lifting track 806 is fixedly arranged on the table plate 100, and the gripper carrying track 802 is fixedly arranged on the table plate 100 through the support column 801.

[0161] On the table plate 100, the two die bonding modules are symmetrically arranged about the second direction Y. In the second direction Y, the carrying mechanism and the substrate carrying platform 400 in the same die bonding module are located on one side of the chip transfer mechanism 200, and the in-out material line body 600 is also located on this side; the chip feeding mechanism 500 and the sub-mother ring feeding and discharging assembly 800 in the same die bonding module are located on the other side of the chip transfer mechanism 200.

[0162] In this embodiment, the two carrying mechanisms are arranged on the same device column 701, the device column 701 is fixedly arranged on the table plate 100, and the device column 701 and the two carrying mechanisms form a carrying device 700.

[0163] As shown in Figures 8 to 10As shown, the in-out material line body 600 is used to convey the substrates 900 supplied by the feeding unit 680, the feeding unit 680 outputs M substrates 900 each time, M is an integer greater than one, the in-out material line body 600 includes a first region 691, (M-1) second regions 692, a third region 693 and a fourth region 694 arranged in sequence along the first direction X; the first region 691 is provided with a first conveying member 695 and a first blocking unit 64, the first conveying member 695 is used to receive the substrates 900 output by the feeding unit 680, the first conveying member 695 can drive the substrates 900 to move to the next region, and the first blocking unit 64 selectively blocks the substrates 900 to move to the next region; the second region 692 is provided with a second conveying member 696 and a second blocking unit 65, the second conveying member 696 can drive the substrates 900 to move to the previous region and the next region, and the second blocking unit 65 selectively blocks the substrates 900 to move to the previous region; the third region 693 is provided with a third conveying member 697 and a third blocking unit 66, the third conveying member 697 is used to drive the substrates 900 to move to the next region, and the third blocking unit 66 selectively blocks the substrates 900 to move to the next region; the fourth region 694 is provided with a fourth conveying member 698, and the fourth conveying member 698 is used to convey the substrates 900 out of the in-out material line body 600.

[0164] The in-out material line body 600 can orderly receive, convey and output the batch of substrates 900 through the regional arrangement, improves the transmission efficiency and smoothness of the substrates 900, and adapts to large-scale production requirements. The conveying members and blocking units arranged in each region can selectively block the movement of the substrates 900 according to production requirements, facilitate the control of the stay and movement of the substrates 900 in different regions, realize the accurate control of the conveying rhythm and position of the substrates 900, avoid the accumulation or confusion of the substrates 900, and thus adapt to diversified production processes.

[0165] In the embodiment, the first conveying member 695 in the first region 691 and the second conveying member 696 in the first second region 692 are a first conveying assembly in an integrated structure, the first conveying assembly can drive the substrates 900 to reciprocate along the first direction X; the third conveying member 697 in the third region 693 and the fourth conveying member 698 in the fourth region 694 are a second conveying assembly in an integrated structure, and the second conveying assembly is used to drive the substrates 900 to move away from the first conveying assembly along the first direction X.

[0166] The first conveying assembly and the second conveying assembly adopt an integrated structure, which reduces the number of components and connection points, simplifies the structure of the in-out conveying line body 600, reduces manufacturing costs and maintenance difficulty, reduces the complexity of the in-out conveying line body 600, and enables the substrate 900 to be synchronously and stably conveyed in the assembly, facilitating the installation, debugging and maintenance of the in-out conveying line body 600 and helping to improve the conveying efficiency. The integrated conveying assembly can provide more stable conveying power, ensuring smooth movement of the substrate 900 during conveying and reducing conveying failures caused by structural connection problems. The first conveying assembly can drive the substrate 900 to reciprocate along the first direction X, facilitating flexible movement of the substrate 900 between the first region 691 and the second region 692; the second conveying assembly drives the substrate 900 to move away from the first conveying assembly, realizing orderly output of the substrate 900.

[0167] Further, the first blocking unit 64 is arranged on the first conveying assembly, and the first blocking unit 64 includes a first control driving unit 641 and a first region arrival sensor 642. The first region arrival sensor 642 is used to monitor the first stop position, and the output end of the first control driving unit 641 can extend into or away from the first conveying assembly, so that the substrate 900 moving towards the second conveying assembly can be positioned at the first stop position.

[0168] The first blocking unit 64 monitors the first stop position through the first region arrival sensor 642, and the first control driving unit 641 can accurately stop the substrate 900 at the position, realizing accurate positioning of the substrate 900 in the first region 691 and providing an accurate position basis for subsequent processing or handling operations, thereby improving production precision. With the cooperation of the sensor and the driving unit, automatic control of the positioning of the substrate 900 can be realized, improving the automation degree and production efficiency of production.

[0169] Specifically, the first blocking unit 64 further includes a first mounting block 643, which is fixedly connected to the first conveying assembly, and the first control driving unit 641 and the first region arrival sensor 642 are mounted on the first mounting block 643.

[0170] In this embodiment, the second blocking unit 65 is arranged on the first conveying assembly, and the second blocking unit 65 includes a second control driving unit and a second region arrival sensor. The second region arrival sensor is used to monitor the second stop position, and the output end of the second control driving unit can extend into or away from the first conveying assembly, so that the substrate 900 moving away from the second conveying assembly can be positioned at the second stop position.

[0171] The second blocking unit 65 can monitor the second stop position and position the substrate 900 moving away from the second conveying assembly at the second stop position, thereby meeting the positioning control capability when the substrate 900 is conveyed in reverse, perfecting the positioning control of the substrate 900 in the first conveying assembly, facilitating better connection with the operation of the front and rear areas, and also ensuring the accurate position of the substrate 900 in the second area 692, meeting the needs of different production processes, making the conveying control of the in-out material line body 600 more flexible and comprehensive, and improving the coherence of the overall production process.

[0172] Specifically, the second blocking unit 65 further includes a second mounting block fixedly connected to the first conveying assembly, and the second control driving unit and the second area in-position sensor are mounted on the second mounting block.

[0173] Illustratively, the third blocking unit 66 is arranged on the second conveying assembly, and the third blocking unit 66 includes a third control driving unit and a third area in-position sensor. The third area in-position sensor is used to monitor the third stop position, and the output end of the third control driving unit can extend into or away from the second conveying assembly, so that the substrate 900 moving away from the first conveying assembly can be positioned at the third stop position.

[0174] The third blocking unit 66 can monitor the third stop position and position the substrate 900 moving away from the first conveying assembly at the third stop position, thereby ensuring the accurate position of the substrate 900 in the third area 693, providing protection for the smooth outfeed of the substrate 900, and providing accurate position information for subsequent handling or processing operations. The above improvements refine the control of the in-out material line body 600 on the conveying process of the substrate 900, and improve the degree of refinement of the production process.

[0175] Specifically, the third blocking unit 66 further includes a third mounting block fixedly connected to the second conveying assembly, and the third control driving unit and the third area in-position sensor are mounted on the third mounting block.

[0176] In one embodiment of the present embodiment, the first conveying assembly has a first rolling fixed side 628 extending along the first direction X and a first rolling movable side 638. The first rolling fixed side 628 is rotatably connected with a first transmission synchronous belt 623, and the first rolling movable side 638 is rotatably connected with a second transmission synchronous belt. The first transmission synchronous belt 623 and the second transmission synchronous belt are used to carry and convey the substrate 900. The second conveying assembly has a second rolling fixed side 629 extending along the first direction X and a second rolling movable side 639. The second rolling fixed side 629 is rotatably connected with a third transmission synchronous belt 624, and the second rolling movable side 639 is rotatably connected with a fourth transmission synchronous belt. The third transmission synchronous belt 624 and the fourth transmission synchronous belt are used to carry and convey the substrate 900.

[0177] The first conveying assembly and the second conveying assembly carry and convey the substrate 900 through the transmission synchronous belts. The rotary connection mode of the synchronous belts can provide stable conveying power, has the advantages of stable transmission and low noise, and can reliably realize the conveying function of the substrate 900. The arrangement of the plurality of transmission synchronous belts can adapt to substrates 900 of different sizes and specifications, and improve the versatility and adaptability of the in-out material line body 600.

[0178] In other embodiments of the present embodiment, only the first conveying assembly is defined as having the first rolling material fixed side 628 extending along the first direction X and the first rolling material movable side 638, the first rolling material fixed side 628 is rotatably connected with the first transmission synchronous belt 623, and the first rolling material movable side 638 is rotatably connected with the second transmission synchronous belt, and the first transmission synchronous belt 623 and the second transmission synchronous belt are used to carry and convey the substrate 900; or only the second conveying assembly is defined as having the second rolling material fixed side 629 extending along the first direction X and the second rolling material movable side 639, the second rolling material fixed side 629 is rotatably connected with the third transmission synchronous belt 624, and the second rolling material movable side 639 is rotatably connected with the fourth transmission synchronous belt, and the third transmission synchronous belt 624 and the fourth transmission synchronous belt are used to carry and convey the substrate 900.

[0179] The motor mounting plate 601 and the support plate 602 are fixedly connected to the table plate 100, the support plate 602 is fixedly connected with the guide shaft 615 extending along the second direction Y, the support plate 602 is rotatably connected with the lead screw 613 extending along the second direction Y, the lead screw 613 can rotate relative to the support plate 602 about the axis of the lead screw 613, the second rolling material fixed side 629 is fixedly connected with the guide block 617, the guide block 617 is in transmission cooperation with the lead screw 613, and the guide block 617 is in transmission cooperation with the guide block 617, so as to achieve the purpose of adjusting the width of the track. The width adjustment driving unit 611 is fixedly connected to the motor mounting plate 601, the output end of the width adjustment driving unit 611 is in transmission cooperation with the lead screw 613 through the width adjustment synchronous belt 612, and is used to drive the lead screw 613 to rotate. The first rolling material fixed side 628 is also provided with the first rolling material driving unit 621, the first rolling material driving unit 621 is used to drive the first transmission synchronous belt 623 to rotate; the first rolling material movable side 638 is also provided with the second rolling material driving unit, the second rolling material driving unit is used to drive the second transmission synchronous belt to rotate; the second rolling material fixed side 629 is also provided with the third rolling material driving unit 622, the third rolling material driving unit 622 is used to drive the third transmission synchronous belt 624 to rotate; and the second rolling material movable side 639 is also provided with the fourth rolling material driving unit, the fourth rolling material driving unit is used to drive the fourth transmission synchronous belt to rotate. Specifically, all the rolling material driving units are air cylinders, and the width adjustment driving unit 611 is an air cylinder.

[0180] Further, the first rolling movable side 638 can approach or move away from the first rolling fixed side 628 along the second direction Y; the second rolling movable side 639 can approach or move away from the second rolling fixed side 629 along the second direction Y.

[0181] The first rolling movable side 638 can approach or move away from the first rolling fixed side 628 along the second direction Y; the second rolling movable side 639 can approach or move away from the second rolling fixed side 629 along the second direction Y, which can adjust the width of the conveying channel according to the width of the substrate 900, enhance the adaptability of the in-out conveying line body 600 to substrates 900 of different widths, improve the flexibility and practicability of the equipment, meet the conveying needs of substrates 900 of different specifications, and enable the in-out conveying line body 600 to be applied to diversified production scenarios, thereby expanding the application range of the in-out conveying line body 600.

[0182] In the present embodiment, a second conveying assembly is provided with a substrate unloading position sensor 670, which is used to monitor the substrate 900 located at the output end of the second conveying assembly.

[0183] The substrate unloading position sensor 670 can monitor the substrate 900 located at the output end of the second conveying assembly in real time, facilitate timely grasp of the unloading condition of the substrate 900, realize effective monitoring and automatic control of the unloading process, provide accurate information for subsequent unloading operations, and facilitate realization of an automatic unloading process. Through timely feedback of the position information of the substrate 900, the time arrangement of the unloading operation can be optimized, the unloading waiting time can be reduced, and the overall production efficiency can be improved.

[0184] Exemplarily, the first conveying assembly is provided with a code scanning gun 607, which is used to scan the workpiece information of the substrate 900 located at the first stop position.

[0185] The code scanning gun 607 provided on the first conveying assembly can automatically scan the workpiece information of the substrate 900 located at the first stop position, realize automatic and rapid and accurate acquisition of the information of the substrate 900, reduce manual intervention, and improve the informatization management level in the production process. Rapid and accurate acquisition of the workpiece information is realized, the production efficiency and accuracy are improved, and subsequent production management and quality tracing are facilitated.

[0186] Through the acquisition of the workpiece information of the substrate 900, the relevant information of the substrate 900 can be associated with each link in the production process, facilitating quality traceability and production process monitoring of the product, and helping to realize automatic management of the production process. Through the acquisition of the workpiece information of the substrate 900, real-time monitoring and management of production progress and product quality can be realized, improving the efficiency and accuracy of production management. According to the workpiece information obtained by scanning, the production link and related parameters of the problem substrate 900 can be quickly located, facilitating quality analysis and improvement, improving product quality, and helping to timely discover and solve problems in the production process.

[0187] Exemplarily, the first conveying assembly and the second conveying assembly are fixedly connected to the table plate 100.

[0188] As shown in Figures 8 to 11 Each carrying mechanism corresponds to one second area 692 or one third area 693, and the carrying mechanism is used to carry the substrate 900 between the substrate carrying platform 400 and the corresponding second area 692 or third area 693.

[0189] The die bonder combines M die bonder modules and the in-out material line body 600, and each component cooperates with each other to simultaneously perform die bonding operation on multiple substrates 900, realizes the automatic assembly process of chips from the primary and secondary rings 520 to the substrate 900, improves the integration and automation degree of production, reduces manual intervention, improves the production efficiency and capacity of the die bonder, and meets the demand of large-scale production. The carrying mechanism can realize rapid carrying of the substrate 900 between different areas and the substrate carrying platform 400, ensuring the continuity of the production process. The above structural improvement reduces the waiting time of each component, and the processing time after an alarm or downtime of a certain die bonder module will not affect the remaining die bonder modules, which helps to improve the work efficiency of the die bonder.

[0190] The embodiment also provides an in-out material method applied to the above in-out material line body 600, which includes the following steps:

[0191] Step one: supplying M substrates 900 to the first area 691 by using the feeding unit 680.

[0192] Step two: transporting the substrates 900 in a direction away from the feeding unit 680 by using the first conveying piece 695, the third conveying piece 697, and all the second conveying pieces 696.

[0193] Step three: control the first blocking unit 64, the third blocking unit 66 and all the second blocking units 65 to work, block the movement of the substrate 900 in the first area 691 by the first blocking unit 64, when there is no substrate 900 in the first second area 692, transfer a substrate 900 to the first second area 692, and then continue to block the movement of the substrate 900, when there is no substrate 900 in the first area 691, control the second transfer member 696 in the first second area 692 to move towards the feeding unit 680, and block by the corresponding second blocking unit 65, when the second transfer member 696 in the upper second area 692 moves towards the feeding unit 680, control the second transfer member 696 in the lower second area 692 to move towards the feeding unit 680, and block by the corresponding second blocking unit 65, when there is a substrate 900 in the third area 693, control the third blocking unit 66 to block the movement of the substrate 900.

[0194] Step four: when all the substrates 900 are processed, control the first transfer member 695, the third transfer member 697, the fourth transfer member 698 and all the second transfer members 696 to transport the substrate 900 away from the feeding unit 680, control all the first blocking units 64, the third blocking unit 66 and all the second blocking units 65 to stop blocking the substrate 900.

[0195] The feeding and discharging method controls the feeding, transferring and blocking units in steps, clearly defines the steps of feeding, transporting, blocking and discharging, and enables the substrate 900 to move in order according to the predetermined process on the feeding and discharging line body 600, avoids confusion and collision of the substrate 900 in the transfer process, and ensures the continuity and efficiency of production. In the processing process, by controlling the blocking unit, the transfer and blocking units can be flexibly controlled according to the state of the substrate 900 in each area to complete the transfer and positioning of the substrate 900, so that the processing and transmission of the substrate 900 are coordinated with each other, the waiting time of the substrate 900 in the transfer process is reduced, the feeding and discharging process is closely matched with the processing procedure, the overall production efficiency is improved, and the production errors caused by improper human operation are also reduced.

[0196] With reference to the above and Figures 1 to 23 , the embodiment also provides a die bonding method applied to the die bonder, which comprises the following steps:

[0197] Step one: use the carrying mechanism to carry the substrate 900 from the feeding and discharging line body 600 to the substrate carrying platform 400, and use the primary and secondary ring feeding and discharging assembly 800 to carry the primary and secondary ring 520 from the primary and secondary ring magazine 807 to the chip feeding mechanism 500.

[0198] Step two: adjust the position of the substrate 900 by using the substrate loading platform 400, and adjust the position of the sub-mother ring 520 by using the chip loading mechanism 500.

[0199] Step three: control the pick-and-place unit at the pick position 222 to pick the chip from the sub-mother ring 520, and control the pick-and-place unit at the drop position 223 to drop the chip on the substrate 900.

[0200] Step four: adjust the positions of the two pick-and-place units by using the component seat 209.

[0201] Step five: determine whether the substrate 900 is assembled, if yes, continue to step six, if not, return to step two.

[0202] Step six: use the carrying mechanism to carry the substrate 900 from the substrate loading platform 400 to the in-out line body 600, and use the in-out line body 600 to convey the substrate 900 out of the die bonder; use the sub-mother ring loading and unloading assembly 800 to carry the sub-mother ring 520 from the chip loading mechanism 500 to the sub-mother ring magazine 807.

[0203] The die bonding method forms a standard and orderly die bonding process through the explicit steps, from the loading of the substrate 900 and the sub-mother ring 520, the position adjustment, the picking and dropping of the chip, the position adjustment of the pick-and-place unit, to the determination of whether the assembly is completed and the final loading and unloading, which is easy to realize automatic control, ensures that the chip can be accurately assembled on the substrate 900, and guarantees the efficient and accurate performance of the die bonding process. Dynamic adjustment of the positions of the sub-mother ring 520 and the substrate 900 can timely adjust the pick position 222 and the drop position 223, avoid the situation that the chip transfer mechanism 200 stops and waits, and realize uninterrupted continuous operation, which helps to improve the working efficiency of the die bonder. The empty tray is automatically recycled, and the substrate 900 is automatically recycled and synchronized with the production rhythm, which improves the overall efficiency of the production line. Through multiple position adjustments and assembly completion determinations, it is ensured that the chip is assembled on the substrate 900, avoiding missed or misassembled, improving the yield and assembly efficiency of the product.

[0204] Obviously, the above embodiments of the present application are only examples for clearly illustrating the present application, and are not a limitation on the embodiments of the present application. For ordinary skilled persons in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and impossible to exhaust all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A chip transfer mechanism for handling a chip, characterized by, The chip transfer mechanism comprises: a column (201); a transfer assembly movably connected to the column (201), the transfer assembly comprising an assembly seat (209) and two pick-and-place units arranged on the assembly seat (209), one of the pick-and-place units being located at a wafer picking position (222) and the other pick-and-place unit being located at a wafer placing position (223), the assembly seat (209) being capable of driving the two pick-and-place units to move so as to switch the positions of the two pick-and-place units, the pick-and-place unit at the wafer picking position (222) being used to pick the chip, and the pick-and-place unit at the wafer placing position (223) being used to release the chip.

2. The die transfer mechanism of claim 1, wherein, The assembly seat (209) is capable of rotating relative to the column (201) about an axis of the assembly seat (209), the axis of the assembly seat (209) extending in a vertical direction (Z), and the two pick-and-place units are symmetrically arranged about the axis of the assembly seat (209).

3. The die transfer mechanism of claim 2, wherein, The pick-and-place unit is slidably arranged on the assembly seat (209) in the vertical direction (Z).

4. The die transfer mechanism of claim 2, wherein, The pick-and-place unit comprises a swing arm (202) and a suction nozzle (215) arranged on the swing arm (202), the suction nozzle (215) being capable of adsorbing and releasing the chip.

5. The die transfer mechanism of claim 4, wherein, The chip transfer mechanism further comprises a gas supply assembly for providing positive pressure and / or negative pressure to the suction nozzle (215).

6. The die transfer mechanism of claim 4, wherein, The suction nozzle (215) is capable of rotating relative to the swing arm (202) about an axis of the suction nozzle (215), the axis of the suction nozzle (215) extending in the vertical direction (Z).

7. The die transfer mechanism of claim 6, wherein, The transfer assembly further comprises two self-rotation driving units (212) and two synchronous wheel synchronous belts (213), the self-rotation driving units (212) being fixedly arranged on the assembly seat (209), and the output end of each self-rotation driving unit (212) being in transmission cooperation with one suction nozzle (215) through one synchronous wheel synchronous belt (213).

8. The die transfer mechanism of claim 2, wherein, The movement track of the pick-and-place unit between the wafer picking position (222) and the wafer placing position (223) is a semicircular arc, the movement track passes through a snapshot position, and the column (201) is provided with two visual snapshot units, each of the visual snapshot units corresponding to one pick-and-place unit and being used to shoot the pick-and-place unit located at the snapshot position.

9. A die bonder for assembling a chip on a substrate (900), characterized by, The die bonder comprises an in-out material line body (600) and at least one die bonder module, the die bonder module comprising a carrying mechanism, a substrate carrying platform (400), a chip feeding mechanism (500), a sub-mother ring feeding and discharging assembly (800) and the chip transfer mechanism of any one of claims 1-8, the carrying mechanism being used for carrying the substrate (900) between the in-out material line body (600) and the substrate carrying platform (400), the substrate carrying platform (400) being capable of carrying and driving the substrate (900) to move, the chip feeding mechanism (500) being detachably provided with a sub-mother ring (520), the sub-mother ring (520) carrying chips, the chip feeding mechanism (500) being capable of carrying and driving the sub-mother ring (520) to move, the sub-mother ring feeding and discharging assembly (800) being detachably provided with a sub-mother ring material box (807), and the sub-mother ring feeding and discharging assembly (800) being used for carrying the sub-mother ring (520) between the sub-mother ring material box (807) and the chip feeding mechanism (500).

10. The die bonder of claim 9, wherein, The die bonder module is provided with two, the carrying mechanism in one of the die bonder modules being used for taking or releasing the substrate (900) at a first stop position, the carrying mechanism in the other of the die bonder modules being used for taking or releasing the substrate (900) at a second stop position, and the in-out material line body (600) being capable of driving the substrate (900) to pass through the first stop position and the second stop position in sequence.

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