Helmet with temperature adjusting function

Abstract

The utility model relates to a helmet with a temperature adjusting function, which adopts a semiconductor chilling plate to generate cold energy and utilizes a liquid working medium, a pipeline and a circulating pump to transport the cold energy into a helmet shell, and is characterized in that: 1) the semiconductor chilling plate is arranged outside the helmet shell, so that the semiconductor chilling plate is prevented from hurting the head of a wearer when the helmet is impacted; (2) a main power supply required by the semiconductor chilling plate is not mounted on the helmet, so that the refrigeration endurance time is prolonged, a large refrigerating capacity can be obtained, the weight and the size of the helmet are reduced, and the hidden danger of combustion explosion caused by the fact that the helmet is provided with a battery is eliminated; and (3) the refrigerating system adopts a detachable mounting form, so that the load of the helmet can be reduced in seasons without refrigeration, the problem of large-cooling-capacity refrigeration supply during long endurance of the refrigerating helmet is solved, the safety of the refrigerating helmet is improved, the weight of the refrigerating helmet is reduced, and the safety and comfort of a rider wearing the helmet can be improved.

Description

Technical Field

[0001] This utility model relates to a helmet with temperature regulation function, specifically to a helmet that can adjust the internal temperature of the helmet, and more specifically to an adjustable temperature helmet that generates cooling based on the semiconductor thermoelectric effect and generates heat based on heating wires and / or the semiconductor thermoelectric effect to regulate the internal temperature of the helmet. Background Technology

[0002] A helmet is a device used to protect the head of riders in sports vehicles such as electric bikes, motorcycles, racing cars, and boats. However, traditional helmets have long been criticized for their inability to actively regulate temperature. In summer, heat inside the helmet cannot dissipate quickly enough, while in winter, it cannot receive sufficient heat from the body, resulting in a poor wearing experience. Therefore, temperature regulation is a highly desirable feature for many riders. To address this issue, various technological solutions have been proposed. One ideal cooling method utilizes the thermoelectric effect (Peltier effect) of semiconductors to generate cooling energy and reduce heat inside the helmet. This is because thermoelectric cooling devices based on semiconductors offer advantages such as small size, light weight, and no noise, thus minimizing negative impacts on helmet comfort. Consequently, semiconductor-cooled helmets have gained popularity among manufacturers, particularly in the motorcycle industry.

[0003] However, existing technologies for cooling helmets based on thermoelectric coolers still have shortcomings, specifically in the following four aspects: 1) Existing thermoelectric cooler helmets all place the thermoelectric cooler inside the helmet shell. This inevitably creates safety hazards because the substrate of the thermoelectric cooler is made of ceramic. In the event of a riding impact, the sharp edges of these hard ceramic substrates (including sharp fragments generated after the impact) can easily penetrate the foam protective layer and injure the wearer's head. Layouts where the thermoelectric cooler is directly attached to the rider's head pose an even greater risk. 2) Existing thermoelectric cooler helmets place the thermoelectric cooler inside the helmet shell and use air cooling to dissipate heat from the hot side of the thermoelectric cooler. This inevitably results in significant noise inside the helmet, negatively impacting the rider's concentration. While the thermoelectric cooler itself does not generate noise during cooling, the cooling fan on its hot side does. In the enclosed environment inside the helmet shell, this fan noise undoubtedly has a significant impact on the wearer. 3) Existing semiconductor-cooled helmets all directly mount the power supply for the semiconductor cooling chip onto the helmet. This approach has several drawbacks: firstly, the limited battery capacity results in short cooling time, making it difficult to meet the long-term and high-volume cooling demands of long-distance travel; secondly, the excessive weight of the battery leads to rider fatigue and reduced comfort, and the large battery size also negatively impacts the helmet's design. Furthermore, directly mounting the battery, especially a lithium battery, onto the helmet poses a fire and explosion hazard, resulting in poor safety. 4) Existing semiconductor-cooled helmets use a non-removable connection between the main components of the cooling unit and the helmet shell. This hinders user flexibility and maintenance. For example, in spring and autumn when cooling and heating are not needed, this non-removable installation prevents the non-destructive and temporary removal of the cooling system to reduce weight and improve comfort. Additionally, the non-removable installation makes it difficult for users to replace, repair, and maintain the cooling system when necessary.

[0004] In summary, while the approach of using semiconductor cooling chips to generate cooling energy to cool the inside of a helmet is feasible in principle, existing traditional technologies have significant shortcomings. Designing and manufacturing a helmet capable of temperature regulation is therefore essential. Developing a temperature regulation system that can leverage the advantages of semiconductor cooling to regulate the temperature inside the helmet while effectively overcoming the aforementioned drawbacks of existing semiconductor cooling helmets would undoubtedly be an improvement and enhancement of helmet functionality, and thus a meaningful endeavor. Utility Model Content

[0005] This invention addresses the shortcomings of existing semiconductor-cooled helmets in terms of safety, comfort, and cooling duration. It proposes a helmet with temperature regulation capabilities. The main objectives are: to achieve internal temperature regulation based on the thermoelectric effect of semiconductors without compromising the helmet's inherent safety, effectively preventing injury to the wearer's head from the semiconductor cooling chip substrate and its fragments upon impact; to effectively solve the problems of insufficient cooling duration, inadequate cooling capacity, and excessive weight and size associated with existing helmets that have built-in power supplies, while also eliminating the potential fire and explosion hazards caused by the built-in battery; and to effectively address the problem of excessive internal noise caused by the cooling fan required for heat dissipation of the semiconductor cooling chip, thereby improving wearing comfort. Furthermore, this invention also aims to address the issue of existing helmets not allowing for convenient disassembly of the cooling system to reduce weight during seasons when temperature regulation is not required, enabling quick and easy removal to further reduce helmet weight and improve wearing comfort.

[0006] The purpose of this invention is achieved as follows: a helmet with temperature regulation function, comprising a shell and at least one thermoelectric cooler, the thermoelectric cooler comprising a cold surface and a hot surface, characterized in that: the thermoelectric cooler is mounted on the shell of the helmet and disposed outside the shell; the main power supply required for the operation of the thermoelectric cooler is not mounted on the helmet; the helmet is provided with pipes, a liquid working fluid and a circulation pump; the circulation pump can drive the liquid working fluid to flow and can drive the liquid working fluid to flow through the cold surface of the thermoelectric cooler or through a thermally conductive insulating layer attached to the cold surface of the thermoelectric cooler, and can drive the liquid working fluid to flow into and out of the internal space enclosed by the helmet shell through the pipes.

[0007] Furthermore, the helmet is provided with a cold exchange unit connected to a pipeline or / and at least a portion of the pipeline is configured as a cold exchange unit, the cold exchange unit being arranged within the internal space enclosed by the shell, through which the liquid working fluid can flow.

[0008] Furthermore, the helmet has at least one cooling exchange unit or a portion thereof, arranged on the inner wall of the shell or on the inner lining of the shell at locations corresponding to or adjacent to the wearer's forehead, temples, and / or cheeks.

[0009] Furthermore, the helmet is equipped with a heat dissipation unit, which can conduct heat from the hot surface of the semiconductor cooling chip and dissipate it to the atmosphere outside the helmet; the heat dissipation unit is at least one of the following three heat dissipation methods: a), b), and c).

[0010] a) Natural air cooling type, that is, a heat dissipation shell is provided, the heat dissipation shell is provided with air guide slots, the air guide slots can connect the hot surface of the semiconductor cooling chip and / or the heat dissipation fins attached to the hot surface with the outside atmosphere of the helmet.

[0011] b) Forced air cooling, i.e., equipped with a cooling fan, which can drive the outside atmosphere of the helmet to generate cooling air and make the cooling air blow over the hot surface of the semiconductor cooling chip and / or the heat sink attached to the hot surface.

[0012] c) Forced liquid cooling, which is equipped with heat dissipation devices and uses liquid cooling medium and a transport pump to drive the cooling medium to flow through the heat dissipation devices and through the hot surface of the semiconductor cooling chip and / or the heat transfer pipes attached to the hot surface.

[0013] Furthermore, a wind speed sensor is installed on the helmet, and a preset wind speed threshold is provided. v o, the wind speed sensor can achieve the following regulation functions a) and / or b):

[0014] a) When the wind speed sensor detects a wind speed less than or equal to the wind speed threshold v When the wind speed sensor is at o, it can convert and reduce the operating voltage of the thermoelectric cooler, that is, it can regulate the operating voltage of the thermoelectric cooler in the cooling operation mode and adjust it from the original higher operating voltage value to a lower operating voltage value.

[0015] b) When the heat dissipation unit employs a forced air cooling method, the wind speed sensor can regulate the operating condition of the cooling fan configured in the heat dissipation unit. The regulation logic is as follows: if the wind speed sensor detects a wind speed greater than a wind speed threshold... v When the wind speed sensor is 0, it will disconnect the power supply to the cooling fan; otherwise, it will keep its power supply circuit connected.

[0016] Furthermore, the wind speed sensor is a reed structure type, which controls whether the transistor is turned on or off by triggering the control electrode of the transistor, and then controls the operation of the semiconductor cooling chip and / or the cooling fan through the transistor.

[0017] Furthermore, a delay circuit is provided between the wind speed sensor and the transistor. The delay circuit has a preset delay threshold Δτ. The transistor can only be turned on after the contact of the wind speed sensor has been delayed for more than or equal to the delay threshold Δτ from the moment of contact.

[0018] The liquid working fluid flows through the cold surface of the semiconductor refrigeration chip or through the thermally conductive interlayer attached to the cold surface of the semiconductor refrigeration chip in a tortuous and meandering manner. That is, when the liquid working fluid flows through the above-mentioned area, its flow direction changes by more than 90 degrees at least once.

[0019] Furthermore, there are at least two semiconductor refrigeration chips, and at least two semiconductor refrigeration chips are arranged in a cold-to-cold-side layout. A fluid channel is formed between the two semiconductor refrigeration chips arranged in a cold-to-cold-side layout, and the liquid working fluid flows through the fluid channel.

[0020] The helmet is equipped with a first temperature controller, which can directly or indirectly sense the temperature of the liquid working fluid at a first temperature measuring point. The first temperature measuring point is located at or near the outlet of the liquid working fluid flowing out of the cold side of the semiconductor refrigeration chip. When the first temperature controller senses that the temperature of the liquid working fluid at the first temperature measuring point is less than or equal to a first set threshold tc, the first temperature controller can disconnect the power supply to the semiconductor refrigeration chip to stop it from working.

[0021] Furthermore, the liquid working medium is water, and the first set threshold tc has a value range between 1℃ and 10℃.

[0022] The helmet is equipped with a second temperature controller, which can directly or indirectly sense the temperature at the second temperature measuring point. The second temperature measuring point is located on or near the hot surface of the thermoelectric cooler. When the second temperature controller senses that the temperature at the second temperature measuring point is greater than or equal to a second set threshold th, the second temperature controller can disconnect the power supply to the thermoelectric cooler and stop it from working.

[0023] Furthermore, the second set threshold th has a value range between 60°C and 80°C.

[0024] The helmet's semiconductor cooling temperature control system is assembled with the shell in at least one of the following five detachable forms: a), b), c), d), and e).

[0025] a) A complete hole is provided on the body of the housing. The pipeline enters and exits the internal space enclosed by the housing by passing through the hole. The cold exchange unit and the pipeline can be pulled out to the outside of the housing from the hole. The connection between the entire semiconductor refrigeration temperature control system and the housing is a detachable connection structure.

[0026] b) A removable cover is provided on the outside of the housing. After passing through the space between the cover and the housing, the pipeline enters the internal space of the housing from the outside of the housing through the lower edge of the notch in the housing. The connection between the pipeline and the housing of the entire semiconductor refrigeration temperature control system adopts a detachable mating structure.

[0027] c) The housing has a notch-shaped groove at the lower edge of its opening, and the pipeline enters the internal space of the housing from the outside of the housing through the groove. The connection between the pipeline and the housing of the entire semiconductor refrigeration temperature control system adopts a detachable mating structure.

[0028] d) The housing has a notch-shaped groove at the lower edge of its notch, and a detachable insert that matches the groove is provided. When the insert is fitted with the housing, the two of them form a hole in the groove. The pipeline passes through the hole from the outside of the housing into the internal space of the housing. The connection between the entire semiconductor refrigeration temperature control system and the housing adopts a detachable fitting structure.

[0029] e) A complete hole is provided on the body of the housing, and the pipeline is fitted to the housing by passing through the hole. The connection between the semiconductor cooling chip, heat sink, cooling fan and the housing, pipeline and liquid working fluid is a detachable connection structure.

[0030] The helmet is equipped with heating wires, which are laid on the inner lining protective layer and / or the heat exchange unit of the helmet.

[0031] This invention relates to a temperature-regulating helmet that uses a semiconductor cooling chip to generate cooling energy. This cooling energy is then transported to the interior of the helmet shell via a liquid working fluid, piping, and a circulation pump to regulate the helmet's temperature. The key advantages of this temperature-regulating helmet are: 1) The temperature-regulating semiconductor cooling chip is located on the outside of the shell. Therefore, in the event of an accidental impact, the shell protects the wearer's head from injury by the ceramic semiconductor cooling chip and its fragments, effectively safeguarding the rider's safety; 2) The power supply for the semiconductor cooling chip is not mounted on the helmet. This significantly increases the cooling duration and cooling capacity of the chip, while reducing the helmet's weight and size, and completely eliminating the fire and explosion hazards associated with a built-in battery; 3) Furthermore, this temperature-regulating helmet employs specific measures to address the semiconductor cooling chip's... The heat dissipation of the thermoelectric cooling surface, with the cooling fan located outside the helmet shell or even completely eliminating the need for a cooling fan and relying on natural air cooling, effectively reduces the problem of excessive internal noise caused by the thermoelectric cooling chip's heat dissipation. Furthermore, this temperature-regulating helmet adopts a detachable mounting structure for the cooling system and helmet shell, allowing for convenient selection of whether to remove or retain the system as needed. Therefore, the cooling system can be easily removed from the helmet during seasons when temperature regulation is not required (and vice versa), solving the problem of effectively reducing the overall weight of the helmet when temperature regulation is not needed, thus improving helmet wearing comfort. Clearly, this invention not only effectively solves the problem of cooling supply in refrigerated helmets but also effectively achieves multiple goals: long-duration cooling, minimal weight and volume, and no negative impact on wearing safety, thus significantly improving the rider's sense of security and comfort. Attached Figure Description

[0032] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0033] Figure 1 This is an isometric schematic diagram of one embodiment of a helmet with temperature regulation function, in which the heat dissipation of the semiconductor cooling chip hot surface is achieved by natural wind cooling;

[0034] Figure 2 yes Figure 1 The illustrated embodiment shows a side-view orthographic projection of the helmet.

[0035] Figure 3 yes Figure 1 Top view of the embodiment shown;

[0036] Figure 4 yes Figure 1 Rear view of the embodiment shown;

[0037] Figure 5 yes Figure 1 The illustrated embodiment is a full sectional view taken along the helmet's plane of symmetry.

[0038] Figure 6 This is a rear view of an embodiment of a helmet with temperature regulation function, wherein the heat dissipation of the semiconductor cooling chip hot surface is achieved by forced air cooling.

[0039] Figure 7 yes Figure 6 The illustrated embodiment shows a helmet operating under conditions where the cooling fan stops running due to wind speed exceeding a set threshold.

[0040] Figure 8 yes Figure 6 The illustrated embodiment shows a helmet operating under conditions where the wind speed is less than a set threshold, causing the cooling fan to operate.

[0041] Figure 9 This utility model relates to a helmet with temperature regulation function, which is equipped with a spring-type wind speed sensor and a circuit diagram showing how the wind speed sensor regulates the working state of the cooling system under different wind speed conditions.

[0042] Figure 10 This is a schematic diagram of several layout examples of a helmet with temperature regulation function, including its cooling element and liquid working fluid flow channel.

[0043] Figure 11 This is a schematic diagram of an embodiment of a helmet with temperature regulation function, wherein the pipes and cold exchange unit of its cooling system can be inserted and pulled out through the shell holes. Detailed Implementation

[0044] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0045] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0046] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0047] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0048] Reference Figures 1 to 11 This utility model proposes a helmet with temperature regulation function, which includes a shell 1 and at least one semiconductor cooling chip 2, wherein the semiconductor cooling chip 2 includes a cold surface 2a and a hot surface 2b (e.g., Figure 5 , Figure 7 and Figure 8 As shown), the technical principle behind its helmet temperature regulation function is: utilizing the thermoelectric effect (i.e., Peltier effect) of the semiconductor cooling chip 2 to obtain cooling energy and use this cooling energy to reduce the heat inside the helmet, thereby achieving the effect of cooling the helmet wearer's head and ultimately improving helmet wearing comfort in high-temperature riding environments. The most significant feature of this utility model lies in the layout, control, and installation of its cooling system: firstly, the semiconductor cooling chip 2 is installed on the helmet shell 1 and is arranged on the outside of the shell 1 (e.g., Figure 5 , Figure 7 and Figure 8 (See figure); secondly, the main power supply required for the operation of the semiconductor cooling chip 2 is not installed on the helmet, that is, the main power supply for the cooling system to generate cooling capacity is an external power supply outside the helmet; thirdly, it is equipped with a pipeline 3, a liquid working medium 4 and a circulation pump 5, which uses the circulation pump 5 to drive the liquid working medium 4 to flow and drive the liquid working medium 4 to flow through the cold surface 2a of the semiconductor cooling chip 2 or through the thermally conductive insulating layer 6 attached to the cold surface 2a of the semiconductor cooling chip 2 (see figure). Figure 5 , Figure 7 and Figure 8Furthermore, it can drive the liquid working medium 4 to flow into and out of the internal space enclosed by the helmet shell 1 through the pipe 3; fourthly, the semiconductor cooling chip 2, in which it participates in the cooling system, adopts a detachable structural layout relative to the shell 1. Here: 1) The semiconductor cooling chip 2 is installed on the helmet shell 1 and arranged outside the shell 1, which means that the semiconductor cooling chip 2 is fastened to the external area of ​​the shell 1, that is, when the rider wears the helmet, there will be a gap between his head and the semiconductor cooling chip 2 and the body of the shell 1. The advantage of this layout is that in the event of an accidental impact, the substrate of the semiconductor cooling chip 2 and its fragments can be effectively prevented from directly injuring the wearer's head. 2) The main power supply required for the operation of the semiconductor cooling chip 2 is not installed on the helmet. This means that the power supply required for the helmet's cooling system to generate cooling capacity is an external power source, such as a vehicle power source like a motorcycle battery and / or generator, or even a portable power source carried in the rider's bag or on their back. The advantages of this arrangement are: firstly, it solves the power supply problem for long-duration and high-capacity cooling in temperature-regulating helmets; secondly, it significantly reduces the weight and volume of the helmet, improving not only the comfort and flexibility of the helmet's appearance, but also effectively eliminating the safety hazard of battery explosion and combustion due to the helmet's own power source when it is impacted, thus improving safety and reliability. It is particularly important to note here that the main power supply referred to in this invention means... The dominant power source, also known as the main power source, is the power source that maintains the cooling output and operates continuously or frequently, contributing the majority or even all of the power. It not only provides the main power for cooling output but also supplies power for the execution of control command signals. In other words, this invention can include or encompass auxiliary batteries with relatively small capacities mounted on the helmet (these auxiliary batteries are secondary power sources; they are lightweight but can provide power for control signals and, when necessary, can also provide auxiliary or temporary cooling power). Specifically, the main power source described in this invention can be the helmet's sole power source, and it can obtain external power by connecting to an external power source through a connector structure and layout. The optimal connector structure is a plug-in type. Figure 4 and Figure 6The circuit connector 9 shown is an example of this, meaning that the circuit connector 9 has a pre-drilled socket. In this case, simply inserting the plug for connecting to an external power source will provide power. 3) By setting up the pipeline 3, the liquid working fluid 4, and the circulation pump 5, the liquid working fluid 4 and its fluidity can be used to carry and transport the cooling energy generated by the semiconductor cooling chip 2 into the internal space enclosed by the helmet shell 1. This achieves the cooling and temperature regulation function of the helmet, and further eliminates the need for a dedicated fan to cool the hot surface 2b of the semiconductor cooling chip 2 inside the helmet shell 1, thereby reducing noise and improving the comfort of wearing the helmet. It should be noted that the liquid working fluid 4 can obtain cooling directly by flowing through the cold surface 2a of the semiconductor refrigeration chip 2, or indirectly by flowing through the thermally conductive insulating layer 6 attached to the cold surface 2a of the semiconductor refrigeration chip 2. The thermally conductive insulating layer 6 can be various metal components, including but not limited to aluminum sheets, copper sheets, stainless steel sheets, etc. Of course, the thermally conductive insulating layer 6 can also be made of or contain other non-metallic materials with good thermal conductivity, such as plastics, nylon, etc. Furthermore, the thermally conductive insulating layer 6 can also include various thermally conductive fillers or sealants such as silicone, varnish, etc. For example, coating the metal sheet and the cold surface 2a with thermally conductive silicone can effectively eliminate uneven contact between the two and the resulting poor thermal conductivity "air," and can also facilitate the separation of the semiconductor refrigeration chip 2 and the thermally conductive insulating layer 6 when necessary. To enable the disassembly of components of the cooling system as needed, the metal sheet and silicone can together form the so-called thermally conductive insulating layer 6. Furthermore, the circulating pump 5 refers to various fluid pumps driven by an electric motor, including but not limited to peristaltic pumps, diaphragm pumps, plunger pumps, gear pumps, and rotary pumps. Its function is to drive the liquid working fluid 4 through the pipe 3 into and out of the internal space enclosed by the helmet shell 1, and through the semiconductor cooling chip 2 and the heat exchange unit 7 (mentioned below), thereby achieving heat and cold exchange between the helmet cooling system and the human head. Among various fluid pumps, peristaltic pumps and diaphragm pumps are preferred because these two types of pumps are easier to seal and have a smaller size, and they also facilitate the convenient disassembly of the cooling system components. Additionally, the circulating pump 5 can be installed outside the shell 1 (e.g., Figure 5 , Figure 7 and Figure 8The liquid working fluid 4 (as shown) can also be arranged inside the internal space enclosed by the shell 1 (not shown in the figure); furthermore, the pipe 3 can be made of various existing materials and various structural forms, and its main function is to guide and regulate the flow of the liquid working fluid 4. In particular, when necessary, the pipe 3 can also serve as a cold energy exchange unit 7 for heat exchange (for example, the part of the pipe 3 arranged inside the helmet can undertake the function of cold and heat exchange between the cooling system and the human head); in addition, in order to form a space for the liquid working fluid 4 to be held at the cold surface 2a, a cover 4a can be set up; here, there are two better layout designs for the circulation flow scheme of the liquid working fluid 4 in the cooling system: one design is circulation pump 5 → semiconductor cooling chip 2 cold surface 2a or thermally conductive insulating layer 6 → pipe 3 → cold energy exchange unit 7 → pipe 3 → circulation pump 5 (such as Figure 5 , Figure 7 and Figure 8As shown in the figure, another design is: circulation pump 5 → pipeline 3 → cold exchange unit 7 → pipeline 3 → semiconductor refrigeration chip 2 cold surface 2a or thermally conductive insulating layer 6 → pipeline 3 → circulation pump 5 (not shown in the figure). It is particularly important to note that the liquid working medium 4 can be various flowable liquid working media, especially water. As mentioned above, the present invention can be specifically equipped with a cold exchange unit 7 connected to the pipeline 3, or even the pipeline 3 itself can be at least partially configured as a cold exchange unit 7. The cold exchange unit 7 is arranged inside the internal space enclosed by the shell 1, and the liquid working medium 4 can flow through the cold exchange unit 7. Here, the "internal space enclosed by the shell 1" refers to the space enclosed by the body of the shell 1, which corresponds to the space around the head of the rider when wearing the helmet. In addition to the shell 1 and various accessories installed on the shell 1, the helmet of the present invention specifically includes the internal space enclosed by the shell 1. The various components inside, such as the inner protective layer 1a and the lining, are made of lightweight materials such as foam, cotton or other energy-absorbing materials. Its main function is to absorb impact energy to protect the wearer's head from injury. The lining has functions such as improving the contact with the human body (improving comfort), holding accessories (fixing or hanging various accessories), increasing the impact slip rate (allowing the helmet to slip a certain amount relative to the head during impact to achieve load relief protection), etc. In particular, when the pipe 3 performs the function of the heat exchange unit 7, the part of the pipe that exchanges heat with the wearer's head can be attached to the inner surface of the inner protective layer 1a. Furthermore, the helmet of this invention has at least one cold exchange unit 7 or a portion thereof, which is arranged on the inner lining protective layer 1a of the shell 1 or on the inner wall of the shell 1 at or near the areas corresponding to the wearer's forehead, temples, and / or cheeks. These areas are sensitive to human temperature, allowing the wearer to quickly experience a cooling effect. Regarding the "the semiconductor cooling chip 2, in which the cooling system is partially or entirely arranged with respect to the shell 1 in a detachable structure," its layout, function, and advantages will be explained in detail in subsequent preferred embodiments and will not be repeated here. Clearly, this invention not only effectively solves the problem of cold supply in cooling helmets but also effectively achieves multiple goals: long-duration cooling, minimal weight and volume, and no negative impact on wearing safety. Therefore, it significantly improves the rider's sense of security and comfort when wearing the helmet.

[0049] To solve the heat dissipation problem of the hot surface 2b of the semiconductor cooling chip 2, this invention provides a heat dissipation unit A on the helmet. This heat dissipation unit A can conduct heat from the hot surface 2b of the semiconductor cooling chip 2 and dissipate it to the atmosphere outside the helmet. In a preferred embodiment, the heat dissipation unit A can be one of the following three heat dissipation methods (a), (b), and (c), or various combinations thereof:

[0050] a) Natural air cooling type, that is, a heat dissipation shell a1 is provided, the heat dissipation shell a1 is installed on the outside of the shell 1 and has air guide slots a2 (see Figures 1 to 5 The air duct a2 allows the hot surface 2b of the semiconductor cooling chip 2 and / or the heat sink a3 attached to the hot surface 2b to communicate with the outside atmosphere of the helmet. In this case, the heat dissipation unit A includes components or structures such as a heat dissipation shell a1, air duct a2, heat sink a3, and heat dissipation duct a4 (see...). Figure 5 (and the CC section cross-sectional view in the figure), where the heat dissipation shell a1 and / or heat dissipation fins a3 form the heat dissipation air duct a4. When the rider is riding at a certain speed, the air guide slots a2 can use relative speed to introduce air from outside the helmet, and under the guidance of the heat dissipation shell a1, the air is blown and swept over the heat dissipation fins a3 through the heat dissipation air duct a4, and finally through the appropriate air outlet a5 ( Figure 5 The diagram shows one type of air vent (a5) located at the rear of the helmet, from which heat flows out to the outside of the helmet, thereby dissipating the heat from the hot surface 2b of the semiconductor cooling chip 2 into the atmosphere outside the helmet. Here, thermally conductive silicone can be coated between the heat sink a3 and the hot surface 2b, and the heat dissipation unit A will contain this silicone. It should be noted that the air vent slot a2 of this invention can be shared with a traditional vent on the helmet, i.e., the two are integrated (not shown in the figure), or it can be a separate, independent installation (e.g., Figures 1 to 8 As shown in the figure, the number of air guide slots a2 can be one or more.

[0051] b) Forced air cooling, i.e., equipped with a cooling fan b1, which drives the outside atmosphere of the helmet to generate cooling air and blows the cooling air over the hot surface 2b of the semiconductor cooling chip 2 and / or over the heat sink a3 attached to the hot surface 2b (as mentioned above, silicone can be coated between the heat sink a3 and the hot surface 2b). In this case, the heat dissipation unit A includes components or structures such as a heat dissipation shell a1, air guide slots a2, heat dissipation ducts a4, cooling fan b1, heat sink a3, and silicone (see...). Figure 7 and Figure 8 When the cooling fan b1 is powered on and runs (e.g.) Figure 8As shown), it will generate cooling air that blows and sweeps across the heat sink a3 via the heat dissipation duct a4, thereby achieving the purpose of dissipating heat from the hot surface 2b; it should be noted that the cooling air generated by the cooling fan b1 is best in the form of exhaust (e.g. Figure 8 As shown), the cooling airflow path is as follows: outside atmosphere → air duct a2 (the air outlet a5 located at the rear of the helmet can also function as an air inlet) → cooling air duct a4 formed by the heat dissipation shell a1 and heat dissipation fins a3 → cooling fan b1 → outside atmosphere. The advantage of this arrangement is that the cooling air generated by cooling fan b1 does not conflict with the relative natural wind derived from vehicle speed, thus the two can complement each other. It should be noted that when cooling fan b1 loses power and stops operating, the air outlet of cooling fan b1 can become an air inlet (e.g., Figure 7 As shown), in this case, it will, together with the air guide slot a2, form an air inlet that guides external air into the heat dissipation duct a4 (or the air outlet of the cooling fan b1 can also form another air guide slot a2); the cooling fan b1 described in this utility model can be one or multiple, which can be set according to the specific situation. Figures 6 to 8 In the scenario shown, two cooling fans b1 are used.

[0052] c) Forced liquid cooling, which involves the installation of heat dissipation devices and the use of a liquid cooling medium and a transport pump to drive the cooling medium through the heat dissipation devices and through the hot surface 2b of the semiconductor cooling chip 2 and / or the heat transfer pipes attached to the hot surface 2b. In this case, the heat dissipation unit A includes components or structures such as heat dissipation devices, cooling medium, transport pump, and heat transfer pipes (not shown in the figure). The forced liquid cooling method uses the liquid cooling medium to dissipate the heat from the hot surface 2b to the outside atmosphere. The heat dissipation path is: hot surface 2b or heat transfer pipes → cooling medium → heat dissipation devices → outside atmosphere. It should be noted that the best material for the cooling medium is water, and the best type of transport pump is a peristaltic pump. In particular, the transport pump can be interchangeable or shared with the circulation pump 5, that is, the circulation pump 5 is also the transport pump, and vice versa.

[0053] To protect the cooling system, the helmet of this invention can be equipped with a wind speed sensor 8. This wind speed sensor 8 can be designed as a contact switch type device; one of the simplest embodiments is to use a spring-type contact structure (see...). Figure 5 , Figure 7 , Figure 8 and Figure 11 At this point, its control logic is: determined by wind speed. v The generated wind force and the elastic force generated by the reed interact with each other, and the result of their interaction determines the engagement state of their contacts and thus adjusts the operating conditions of the refrigeration system accordingly. Figure 5 , Figure 7 , Figure 9 (a) and Figure 11 The scenario shown illustrates how, when wind force is dominant, it forces the reed k0 to deform sufficiently, causing it to separate from the first contact k1 while simultaneously engaging with the second contact k2. Figure 9 (b) and Figure 9 (c) illustrates a scenario where, when the wind force is weak, it cannot force the reed k0 to deform sufficiently, thus maintaining the reed k0 engaged with the first contact k1 and separated from the second contact k2. Of course, the positions of the first contact k1 and the second contact k2 in the aforementioned reed structure can be interchanged (or their functions can be reversed). In other words, the wind speed sensor 8 can also be designed such that, when the wind force is dominant, the reed k0 engages with the first contact k1 while simultaneously separating from the second contact k2, and conversely, when the wind force is weak, the reed k0 separates from the first contact k1 while simultaneously engaging with the second contact k2 (not shown in the figure). It should be noted that the airflow generated by the cooling fan b1 does not participate in the interaction with the elastic force generated by the reed k0; in other words, the airflow generated by the cooling fan b1 does not contribute to the deformation of the reed k0, just as... Figure 8 As shown in the diagram. Specifically, considering the high requirements for contacts due to large currents (e.g., large overcurrent contact area and prevention of arcing and erosion), the contacts of the reed-type wind speed sensor 8 can be designed to trigger the base b of the transistor G (i.e., the control electrode of transistor G). In this case, transistor G controls the large operating current, while the wind speed sensor 8 merely acts as a "key" to control the on / off state of the transistor G circuit. Figure 9 (c) illustrates this situation, where the first resistor Rt1 and the second Rt2 in the figure fall under the category of adjustable resistors. It should be noted that the transistor G described in this invention includes not only ordinary transistors, but also thyristors and silicon controlled rectifiers capable of handling higher power. The following example, using an NPN transistor G, illustrates how the wind speed sensor 8 controls the current flow in the refrigeration system circuit: 1) The first state is as follows... Figure 9As shown in (c), the current flows from the positive terminal of the helmet circuit connector 9 → the main circuit switch k (which is currently engaged) → the reed k0 of the wind speed sensor 8 engages with the first contact k1 → the first resistor Rt1 → a smaller current reaches the base b (also called the control electrode) of one of the transistors G → the emitter junction of the transistor G is forward biased → a larger current flows from the positive terminal of the circuit connector 9 through the collector c of the transistor G to the emitter e → the external resistor R1 and the fan internal resistance Ro (the sum of which is equivalent to the voltage divider resistor Rh) → the semiconductor cooling chip 2 (the internal resistance of the cooling chip Rr) 1) → Negative terminal of circuit connector 9; 2) The second state is (not shown in the figure): Current flows from the positive terminal of helmet circuit connector 9 → main circuit switch k (at this time in the engaged state) → reed k0 of wind speed sensor 8 engages with the second contact k2 → second resistor Rt2 → a smaller current reaches the base b (also called the control electrode) of another transistor G → the emitter junction of the transistor G is in the forward bias state → then a larger current flows from the positive terminal of circuit connector 9 through the collector c of transistor G to the emitter e → semiconductor cooling chip 2 (internal resistance Rr of the cooling chip) → negative terminal of circuit connector 9. It must be pointed out that the above circuit layout is only a few preferred embodiments listed in this utility model. In addition, circuit designs with the above functions can also be used, which are not listed here. This utility model can preset a wind speed threshold. v o, and based on this wind speed threshold v o, the wind speed sensor 8 is capable of achieving the following regulation functions a) and / or b):

[0054] a) When wind speed sensor 8 senses wind speed v Less than or equal to the wind speed threshold v When the wind speed sensor 8 is at o, it can convert and reduce the operating voltage of the thermoelectric cooler 2, that is, it can regulate the operating voltage of the thermoelectric cooler 2 under cooling conditions and adjust it from a higher operating voltage value to a lower operating voltage value (see [reference]). Figure 9 ); Here, wind speed v Less than or equal to the wind speed threshold v A speed of 'o' indicates a lower riding speed, or in other words, a lower wind speed. As is well known, the cooling efficiency of the thermoelectric cooler 2 is limited by the heat dissipation efficiency of its hot surface 2b. Poor heat dissipation of the hot surface 2b can even lead to the thermoelectric cooler 2 burning out. Therefore, the wind speed... v When the temperature is low, it is necessary to reduce the cooling power of the thermoelectric cooler 2 to prevent it from burning out; a specific embodiment is to reduce the wind speed threshold. v o is set to 1.5 m / s, which is equivalent to the speed of a normal person walking (about 5 km / s). Therefore, when the wind speed... vWhen the speed is greater than 1.5 m / s, the thermoelectric cooler 2 (with an internal resistance Rr) obtains a normal voltage V1 and the normal input power is P1 = (V1). 2 / Rr; and when the wind speed sensor 8 senses the wind speed v When the wind speed is less than or equal to 1.5 m / s, the wind speed sensor 8 will cause the voltage divider resistor Rh to achieve a series connection with the thermoelectric cooler 2, and the operating power of the thermoelectric cooler 2 will be reduced to P2=(V1). 2 Rr / (Rr + Rh); It should be noted that when the cooling system is equipped with a cooling fan b1, the voltage divider resistor Rh can include the internal resistance Ro of the cooling fan b1. In this case, the voltage divider resistor Rh is equivalent to an equivalent resistor and satisfies the relationship Rh = R1 + Ro, where the external resistor R1 is connected in series with the cooling fan b1. Of course, for the pure natural air cooling form without a cooling fan b1, there is naturally no internal resistance Ro. In this case, the voltage divider resistor Rh is equal to the external resistor R1, that is, Rh = R1 (not shown in the figure). The following is a specific example using the working voltage as the operating condition criterion to illustrate the control principle of the wind speed sensor 8: For ease of explanation, it is assumed that the cooling system of this helmet can supply power to the circuit connector 9 set on the helmet (see Figure 4 , Figure 6 and Figure 9 Where is the external power supply voltage V1 obtained, which is 12V, and the wind speed threshold is set? v Given that the wind speed is 1.5 m / s, and assuming that the voltage divider resistor Rh is equal to the internal resistance Rr of the thermoelectric cooler, then when the thermoelectric cooler 2 is at a wind speed of 1.5 m / s... v When the wind speed is greater than 1.5 m / s, the voltage V1 of the cooling operation is 12V. At this time, the reed k0 of the wind speed sensor 8 is engaged with the second contact k2. Figure 9 (a); while when the wind speed v When the wind speed is less than or equal to 1.5 m / s, the voltage V1 for its cooling operation is 6V. In other words, at a wind speed of... v When the wind speed is less than or equal to 1.5 m / s, the thermoelectric cooler 2 will operate at low cooling output power. At this time, the reed k0 of the wind speed sensor 8 is engaged with the first contact k1. (Refer to...) Figure 9 (b) and Figure 9 (c) This can effectively prevent the refrigeration system from burning out due to poor heat dissipation.

[0055] b) When the heat dissipation unit A employs a forced air cooling method, the wind speed sensor 8 can regulate the operating condition of the cooling fan b1 configured in the heat dissipation unit A. The regulation logic is as follows: if the wind speed sensor 8 senses a wind speed... v greater than the wind speed threshold vWhen the time is 0, the wind speed sensor 8 will cut off the power supply to the cooling fan b1, that is, at this time the wind speed sensor 8 is in a state of disconnection from the cooling fan b1, such as Figure 7 and Figure 9 (a) is shown; otherwise, when the wind speed sensor 8 senses the wind speed... v Less than or equal to the wind speed threshold v When o, it will maintain the state of powering the cooling fan b1, such as Figure 8 , 9 As shown in (b) and 9(c); the purpose of this utility model in making such a control arrangement is: when the wind speed sensor 8 senses the wind speed v greater than the wind speed threshold v When the speed is 0, it is highly likely that the rider is driving the motorcycle at a relatively high speed. At this time, the external cooling air, guided by the heat sink cover a1 and the air guide slot a2, can quickly pass over and blow on the heat sink a3. Thus, the cooling air can produce a good cooling effect on the hot surface 2b of the semiconductor cooling chip 2. In other words, the semiconductor cooling chip 2 is safe to operate. At this time, stopping the power supply to the cooling fan b1 can have a positive effect of protecting the cooling fan b1. Conversely, when the wind speed sensor 8 senses the wind speed... v Less than or equal to the wind speed threshold v When the speed is 0, it means that the rider is driving the motorcycle at a relatively slow speed. At this time, the natural wind generated by the speed of the motorcycle is not enough to dissipate the heat of the hot surface 2b of the thermoelectric cooler 2. Therefore, the cooling fan b1 is energized to force heat dissipation on the hot surface 2b of the thermoelectric cooler 2. Figure 8 , 9 The cases shown in (b) and 9(c) are examples of this situation, in which the cooling fan b1 will play a dominant role in cooling.

[0056] This invention aims to prevent the helmet cooling system from being negatively affected by adverse electrical shocks caused by frequent start-ups and shutdowns. For example, the wind speed sensor 8 detects the wind speed... v The effect of extremely brief changes in wind speed, vehicle bumps, or head movements of the wearer on its wind speed threshold can cause this. vTo address the frequent starting and stopping of the cooling system within a small area near the o, a time-series control-based delay circuit (not shown in the figure) can be implemented. This delay circuit is positioned between the wind speed sensor 8 and the transistor G and has a preset delay threshold Δτ. The contacts of the wind speed sensor 8 (reed k0, first contact k1, second contact k2) must delay for more than or equal to this delay threshold Δτ before the transistor G (not shown in the figure) can be turned on. A specific embodiment uses a resistor R and a capacitor C to form a so-called delay circuit (whose time constant is equal to the product of their values). Therefore, by selecting appropriate values ​​for resistor R and capacitor C, a suitable delay threshold Δτ can be designed, and the desired time can be determined accordingly. The transistor G is triggered by a delay. For example, a preset delay threshold Δτ is selected as 3s according to actual needs. Under this condition, the transistor G can only be turned on if the duration of each engagement between the reed k0 and the first contact k1 or the second contact k2 exceeds or equals 3s. This will then connect the circuit containing the semiconductor cooling chip 2 and / or the cooling fan b1, and ultimately enable them to perform their work according to the preset operating logic. It should be noted that if the duration of each engagement between the reed k0 and the first contact k1 or the second contact k2 does not reach the delay threshold Δτ, the cooling system will maintain the previous cycle's work task, clear the original time accumulation, and wait for the next new trigger event to occur.

[0057] Considering the strict space and weight constraints of helmets, the volume and area of ​​the selected semiconductor cooling chip 2 cannot be too large. Under this constraint, in order to enable the liquid working medium 4 to obtain the maximum possible heat exchange from the cold surface 2a of the semiconductor cooling chip 2 within a limited space and time, the layout of the flow channel 10 of the liquid working medium 4 flowing through the cold surface 2a of the semiconductor cooling chip 2 or flowing through the heat-conducting insulating layer 6 attached to the cold surface 2a of the semiconductor cooling chip 2 is adopted in a tortuous manner. That is, when the liquid working medium 4 flows through the above-mentioned area, its flow direction undergoes at least one change of more than or equal to 90 degrees. Figure 10 (a) shows an embodiment in which the liquid working fluid 4 undergoes only one 180-degree turn under the constraint of the flow channel 10 when it flows through the cold surface 2a of the semiconductor cooling chip 2 (wherein, the cover 4a participates in forming the flow channel 10 and thereby participates in constraining the flow direction of the liquid working fluid 4 in the cold surface 2a region, the flow direction is shown by the solid arrow in the figure, the same below). Figure 10 (b) presents a layout embodiment in which the liquid working fluid 4 undergoes two 180-degree turns under the constraint of the flow channel 10 as it flows through the cold surface 2a of the semiconductor refrigeration chip 2; it should be noted that the layout of the flow channel 10 of this utility model is not limited to Figure 10The illustrated scheme can actually include various other layout schemes or forms, such as spiral flow channel 10, multi-channel flow channel 10, etc., where the number of turns and bends in the flow channel 10 can be planned and determined according to actual needs and the area and shape of the semiconductor cooling chip 2. Figure 10 In (a), a monolithic semiconductor cooling chip 2 is used. When the liquid working fluid 4 flows through the thermally conductive insulating layer 6 attached to the cold surface 2a of the semiconductor cooling chip 2, the tortuous and meandering arrangement of its flow channel 10 allows the liquid working fluid 4 a sufficiently long passage time through the thermally conductive insulating layer 6, so that it can easily obtain cooling energy from the cold surface 2a of the semiconductor cooling chip 2; while Figure 10 In (b), two semiconductor cooling wafers 2 are used, arranged with their cold surfaces 2a facing each other. The gaps between them form a tortuous fluid channel, i.e., the flow channel 10 mentioned above. This allows the liquid working fluid 4 to obtain the maximum possible cooling exchange from the cold surfaces 2a of the semiconductor cooling wafers 2 within a limited space and time. Clearly, Figure 10 (b) This layout has fewer restrictions on the planar dimensions of the cold surface 2a, which can not only shorten the length of the semiconductor cooling chip 2, but also enhance the rate of cold exchange between the cold surface 2a and the liquid working fluid 4 per unit time.

[0058] To ensure the proper functioning of the refrigeration system, this invention includes a first temperature controller 11 on the helmet. This first temperature controller 11 can directly or indirectly sense the temperature t of the liquid working fluid 4 at the first temperature measuring point 12. (See [reference]) Figure 10 (b); The first temperature measuring point 12 is located at or near the outlet of the liquid working fluid 4 flowing out of the cold surface 2a of the thermoelectric cooler 2; when the temperature t of the liquid working fluid 4 at the first temperature measuring point 12 is less than or equal to the first set threshold tc, the first temperature controller 11 can disconnect the power supply to the thermoelectric cooler 2 and stop it from working; conversely, when the temperature t of the liquid working fluid 4 at the first temperature measuring point 12 is greater than the first set threshold tc, the first temperature controller 11 will continue to keep the circuit of the thermoelectric cooler 2 connected, such as... Figure 10 As shown in (b). A preferred embodiment of the first thermostat 11 uses a reed tube 13, that is, the reed tube 13 is connected in series with the circuit containing the semiconductor cooling chip 2, see [reference]. Figure 10(b): When the reed tube 13 senses that the temperature t of the liquid working medium 4 at the first temperature measuring point 12 is less than or equal to the first set threshold tc, the contacts of the reed tube 13 separate, thus disconnecting the circuit of the semiconductor cooling chip 2 and stopping its cooling operation; conversely, when the reed tube 13 senses that the temperature t of the liquid working medium 4 at the first temperature measuring point 12 is greater than the first set threshold tc, the contacts of the reed tube 13 engage, thus keeping its circuit connected, in other words, the semiconductor cooling chip 2 can be energized. Furthermore, the liquid working medium 4 described in this invention is water, and the first set threshold tc is in the range of 1℃ to 10℃. This setting is to prevent ice blockage. Ideally, the first set threshold tc should be in the range of 4℃ to 7℃, which can prevent the liquid working medium 4 from freezing and blocking the flow channel 10, while also ensuring that the liquid working medium 4 can carry a sufficient amount of cooling capacity.

[0059] To ensure the proper functioning of the cooling system, this invention also includes a second temperature controller 14 on the helmet. This second temperature controller 14 can directly or indirectly sense the temperature t at the second temperature measuring point 15. (See [reference]) Figure 10 (a) The second temperature measuring point 15 is located at or near the hot surface 2b of the thermoelectric cooler 2. When the second temperature controller 14 senses that the temperature t at the second temperature measuring point 15 is greater than or equal to the second set threshold th, the second temperature controller 15 can disconnect the power supply to the thermoelectric cooler 2, forcing it to stop its cooling operation. Figure 10 As shown in (a); conversely, when the second temperature controller 14 senses that the temperature t at the second temperature measuring point 15 is less than the second set threshold th, the second temperature controller 15 keeps the circuit where the thermoelectric cooler 2 is located closed (not shown in the figure). Furthermore, the second set threshold th has a value range between 60°C and 80°C. This setting is to prevent the thermoelectric cooler 2 from overheating.

[0060] This invention allows for the convenient disassembly of the semiconductor cooling and temperature regulation system in the helmet. Users can choose whether to retain the system depending on the needs of different scenarios. For example, in spring, autumn, and winter, the system can be removed to reduce the helmet's weight, reverting it to a traditional non-cooled helmet. Alternatively, the system can be temporarily removed for easier repair, maintenance, or replacement. Therefore, this invention specifically designs the semiconductor cooling and temperature regulation system as a detachable and separable assembly structure and layout. This means that when needed, parts or even the entire semiconductor cooling and temperature regulation system can be removed from the helmet shell 1. In other words, disassembly and installation can be easily completed with simple tools or even by hand. The semiconductor cooling and temperature regulation system includes essential components such as a semiconductor cooling chip 2, pipes 3, liquid working fluid 4, circulating pump 5, and a cold exchange unit 7. Optional components include a thermally conductive insulating layer 6 and a heat dissipation unit A. To achieve this objective, the present invention can adopt at least one of the following five easily detachable forms for the assembly of the semiconductor cooling temperature control system, or even the entire system, with the helmet shell 1: a), b), c), d), and e).

[0061] a) A complete hole 16 is provided on the body of the housing 1. The pipe 3 enters and exits the internal space enclosed by the housing 1 by passing through the hole 16. The cold exchange unit 7, the pipe 3 (both of which can be made flexible), and the liquid working fluid 4 encapsulated within them can all be inserted into and extracted from the outside of the housing 1 through the hole 16. In this case, the connection between the entire semiconductor refrigeration temperature control system and the housing 1 is a detachable and connectable structure. Figure 11 This is the situation shown below;

[0062] b) A detachable cover 17 is provided on the outside of the housing 1. After the pipe 3 passes through the space between the cover 17 and the housing 1, it enters the internal space of the housing 1 from the outside of the housing 1 through the lower edge of the notch of the housing 1 (not shown in the figure). At this time, the entire semiconductor cooling temperature control system is connected to the housing 1 in a detachable mating structure. The cover 17 can protect the pipe 3 and participate in the appearance of the helmet.

[0063] c) The housing 1 has a notch-shaped groove at the lower edge of its notch, and the pipe 3 enters the internal space of the housing 1 from the outside of the housing 1 through the groove 17 (not shown in the figure). At this time, the entire semiconductor refrigeration temperature control system is connected to the housing 1 in a detachable mating structure.

[0064] d) The housing has a notch-shaped groove at the lower edge of its notch, and a detachable insert that matches the groove is provided. When the insert is mated with the housing 1, the two of them form a hole 16 in the groove. The pipe 3 passes through the hole 16 from the outside of the housing 1 into the internal space of the housing 1 (not shown in the figure). At this time, the connection between the entire semiconductor refrigeration temperature control system and the housing 1 adopts a detachable mating structure.

[0065] e) A complete hole 16 is provided on the body of the shell 1. The pipe 3 is fitted to the shell 1 by passing through the hole 16. The semiconductor cooling chip 2, heat sink a3, cooling fan b1, and their connections with the shell 1, pipe 3, liquid working fluid 4, and circulation pump 5 are in a detachable connection structure. This embodiment is a semi-disassembly method, that is, some components of the semiconductor cooling temperature control system, such as the semiconductor cooling chip 2, heat sink a3, and cooling fan b1, can be removed from the helmet. Even the circulation pump 5 can be removed from the helmet. In particular, this scheme can be used for the design and assembly of circulation pumps 5 such as peristaltic pumps and diaphragm pumps. In this case, the only components of the cooling system remaining on the helmet shell 1 are the pipe 3, liquid working fluid 4, thermally conductive insulation layer 6, and cold exchange unit 7. Thus, the weight of the helmet can be significantly reduced. Figure 5 , Figure 7 and Figure 8 The case shown can be categorized into this situation.

[0066] It should be emphasized that the above five detachable forms can be combined with each other. For example, the b) and c) schemes described above can be combined together, that is, the cover 17 and the groove are used at the same time to form a detachable assembly solution of the semiconductor cooling temperature control system and the helmet shell 1.

[0067] To meet the temperature regulation needs during winter, this invention incorporates a heating wire (not shown in the figure) within the helmet. Furthermore, the heating wire is positioned on the inner lining protective layer 1a and / or the heat exchange unit 7, thus forming the helmet's heating system. This allows the rider to use the heating wire for warmth during winter, improving helmet comfort. It should be noted that the heating wire in this invention is powered externally, not by the helmet itself. In other words, the heating system is powered by an external power source, such as a portable charger carried in the rider's bag or on their back, or even a vehicle-mounted power source like a motorcycle battery or / or generator. It should also be noted that the heating system also includes heat (not shown in the figure) derived from the hot surface 2b of the semiconductor cooling chip 2. In this case, the liquid working fluid 4 simply flows through the hot surface 2b of the semiconductor cooling chip 2 before being transported to the interior of the helmet shell 1; details are omitted here. Additionally, it is worth noting that the heating wire can be flexible and can also be a detachable, connectable structure that can be removed from inside the helmet.

[0068] This invention provides a temperature-regulating helmet with significant advantages over existing technologies: It employs an external semiconductor cooling chip 2 layout, effectively preventing injury to the wearer's head from the semiconductor cooling chip 2 substrate and fragments upon impact; it utilizes an external power supply solution not installed on the helmet, effectively solving the problems of insufficient cooling time, insufficient cooling capacity, and excessive weight and size associated with existing cooling helmets that have built-in power supplies. It also completely eliminates the potential fire and explosion safety hazards of helmets with built-in batteries, and effectively addresses the issue of long-duration helmet heating in winter. Furthermore, this invention abandons the traditional practice of installing a fan inside the shell 1 of cooling helmets, effectively solving the problem of excessive internal noise caused by fan cooling in traditional semiconductor cooling systems, thereby improving helmet wearing comfort; and further, this invention specifically addresses the problem of excessive weight in existing cooling helmets during seasons when temperature regulation is not needed due to the inability to remove the cooling system, allowing for quick and easy removal to reduce helmet weight and further improve wearing comfort.

[0069] The above embodiments are merely some preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Therefore, all equivalent changes made in accordance with the structure, shape and principle of the present utility model should be covered within the scope of protection of the present utility model.

Claims

1. A helmet with temperature regulation function, comprising a shell and at least one semiconductor cooling chip, said semiconductor cooling chip including a cold side and a hot side, characterized in that: The thermoelectric cooler is mounted on the helmet shell and positioned outside the shell; the main power supply for the thermoelectric cooler is not mounted on the helmet; the helmet is equipped with pipes, a liquid working fluid, and a circulation pump; the circulation pump can drive the liquid working fluid to flow and can drive the liquid working fluid to flow through the cold surface of the thermoelectric cooler or through a thermally conductive insulating layer attached to the cold surface of the thermoelectric cooler, and can also drive the liquid working fluid to flow into and out of the internal space enclosed by the helmet shell through the pipes.

2. A helmet with temperature regulation function as described in claim 1, characterized in that: The system is equipped with a cold exchange unit connected to the pipeline, and / or at least a portion of the pipeline is configured as a cold exchange unit, which is located within the internal space enclosed by the housing, through which the liquid working fluid can flow.

3. A helmet with temperature regulation function as described in claim 2, characterized in that: The helmet has at least one cooling exchange unit or a portion thereof, arranged on the inner wall of the shell or on the inner lining of the shell at locations corresponding to or adjacent to the wearer's forehead, temples, and / or cheeks.

4. A helmet with temperature regulation function as described in claim 3, characterized in that: The helmet is equipped with a heat dissipation unit that can conduct heat from the hot surface of the semiconductor cooling chip and dissipate it to the atmosphere outside the helmet; the heat dissipation unit is at least one of the following three heat dissipation methods: a), b), and c). a) Natural air cooling type, that is, a heat dissipation shell is provided, the heat dissipation shell is provided with air guide slots, the air guide slots can connect the hot surface of the semiconductor cooling chip and / or the heat dissipation fins attached to the hot surface with the outside atmosphere of the helmet. b) Forced air cooling, i.e., equipped with a cooling fan, which can drive the outside atmosphere of the helmet to generate cooling air and make the cooling air blow over the hot surface of the semiconductor cooling chip and / or the heat sink attached to the hot surface. c) Forced liquid cooling, which is equipped with heat dissipation devices and uses liquid cooling medium and a transport pump to drive the cooling medium to flow through the heat dissipation devices and through the hot surface of the semiconductor cooling chip and / or the heat transfer pipes attached to the hot surface.

5. The helmet with temperature regulation function as described in claim 4, characterized in that: The helmet is equipped with a wind speed sensor and has a preset wind speed threshold. v o, the wind speed sensor can achieve the following regulation functions a) and / or b): a) When the wind speed sensor detects a wind speed less than or equal to the wind speed threshold v When the wind speed sensor is at o, it can convert and reduce the operating voltage of the thermoelectric cooler, that is, it can regulate the operating voltage of the thermoelectric cooler in the cooling operation mode and adjust it from the original higher operating voltage value to a lower operating voltage value. b) When the heat dissipation unit employs a forced air cooling method, the wind speed sensor can regulate the operating conditions of the cooling fan configured in the heat dissipation unit. The regulation logic is as follows: If the wind speed sensor detects a wind speed greater than the wind speed threshold v When the wind speed sensor is 0, it will disconnect the power supply to the cooling fan; otherwise, it will keep its power supply circuit connected.

6. The helmet with temperature regulation function as described in claim 5, characterized in that: The wind speed sensor is a reed structure type. It controls whether the transistor is turned on or off by triggering the control electrode of the transistor, and then controls the operation of the semiconductor cooling chip and / or the cooling fan through the transistor.

7. The helmet with temperature regulation function as described in claim 6, characterized in that: A delay circuit is provided between the wind speed sensor and the transistor. The delay circuit has a preset delay threshold Δτ. The transistor can only be turned on after the contact of the wind speed sensor has been delayed for more than or equal to the delay threshold Δτ from the moment of contact.

8. The helmet with temperature regulation function as described in any one of claims 1 to 7, characterized in that: The liquid working fluid flows through the cold surface of the semiconductor refrigeration chip or through the thermally conductive interlayer attached to the cold surface of the semiconductor refrigeration chip in a tortuous and meandering manner. That is, when the liquid working fluid flows through the above-mentioned area, its flow direction changes by more than 90 degrees at least once.

9. The helmet with temperature regulation function as described in claim 8, characterized in that: The semiconductor refrigeration chip is at least two pieces, and at least two semiconductor refrigeration chips are arranged in a cold-to-cold-side layout. A fluid channel is formed between the two semiconductor refrigeration chips arranged in a cold-to-cold-side layout, and the liquid working fluid flows through the fluid channel.

10. The helmet with temperature regulation function as described in any one of claims 1 to 7, characterized in that: The helmet is equipped with a first temperature controller, which can directly or indirectly sense the temperature of the liquid working fluid at a first temperature measuring point. The first temperature measuring point is located at or near the outlet of the liquid working fluid flowing out of the cold surface of the semiconductor refrigeration chip. When the first temperature controller senses that the temperature of the liquid working fluid at the first temperature measuring point is less than or equal to a first set threshold tc, the first temperature controller can disconnect the power supply to the semiconductor refrigeration chip to stop it from working.

11. The helmet with temperature regulation function as described in claim 10, characterized in that: The liquid working medium is water, and the first set threshold tc has a value range between 1℃ and 10℃.

12. The helmet with temperature regulation function as described in any one of claims 1 to 7, characterized in that: The helmet is equipped with a second temperature controller, which can directly or indirectly sense the temperature at the second temperature measuring point; the second temperature measuring point is located on or near the hot surface of the semiconductor cooling chip. When the second temperature controller senses that the temperature at the second temperature measuring point is greater than or equal to the second set threshold th, the second temperature controller can disconnect the power supply to the semiconductor cooling chip and stop it from working.

13. The helmet with temperature regulation function as described in claim 12, characterized in that: The second set threshold th has a value range between 60℃ and 80℃.

14. The helmet with temperature regulation function as described in any one of claims 2 to 7, characterized in that: The helmet's semiconductor cooling temperature control system is assembled with the shell in at least one of the following five detachable forms: a), b), c), d), and e). a) A complete hole is provided on the body of the housing. The pipeline enters and exits the internal space enclosed by the housing by passing through the hole. The cold exchange unit and the pipeline can be pulled out to the outside of the housing from the hole. The connection between the entire semiconductor refrigeration temperature control system and the housing is a detachable connection structure. b) A removable cover is provided on the outside of the housing. After passing through the space between the cover and the housing, the pipeline enters the internal space of the housing from the outside of the housing through the lower edge of the notch in the housing. The connection between the pipeline and the housing of the entire semiconductor refrigeration temperature control system adopts a detachable mating structure. c) The housing has a notch-shaped groove at the lower edge of its opening, and the pipeline enters the internal space of the housing from the outside of the housing through the groove. The connection between the pipeline and the housing of the entire semiconductor refrigeration temperature control system adopts a detachable mating structure. d) The housing has a notch-shaped groove at the lower edge of its notch, and a detachable insert that matches the groove is provided. When the insert is fitted with the housing, the two of them form a hole in the groove. The pipeline passes through the hole from the outside of the housing into the internal space of the housing. The connection between the entire semiconductor refrigeration temperature control system and the housing adopts a detachable fitting structure. e) A complete hole is provided on the body of the housing, and the pipeline is fitted to the housing by passing through the hole. The connection between the semiconductor cooling chip, heat sink, cooling fan and the housing, pipeline and liquid working fluid is a detachable connection structure.

15. The helmet with temperature regulation function as described in any one of claims 2 to 7, characterized in that: The helmet is equipped with heating wires, which are laid on the inner lining protective layer and / or the heat exchange unit of the helmet.

Images