Automatic chip testing and sorting equipment

Abstract

The utility model relates to the technical field of automation equipment, and discloses automatic chip testing and sorting equipment, which is characterized in that an empty Tray transfer manipulator is additionally arranged, and the empty Tray transfer manipulator is designed to move in an empty Tray recovery area and a sorting blanking area, so that an empty Tray after a chip is transferred can be transferred to the empty Tray recovery area by the empty Tray transfer manipulator, and the empty Tray can be transferred to the sorting blanking area by the empty Tray transfer manipulator. The empty Tray recovery area is used for carrying out recovery and storage, and the empty Tray with the transferred chip is transferred to the sorting and discharging area so as to load the tested chip, so that the recovery and circulation automation of the empty Tray are realized, the production efficiency is improved, the labor cost is reduced, the manual participation is reduced, and the production efficiency is improved. Therefore, the automation level and the efficiency of the whole chip testing and sorting process are further improved.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to an automatic chip testing and sorting device. Background Technology

[0002] The quality testing stage of a chip, as a core component of the chip production line, occupies a pivotal position and plays an indispensable role. This stage not only bears the significant responsibility of comprehensively, thoroughly, and meticulously inspecting the quality of chip products, accurately and effectively providing feedback on various quality indicators and information, offering production personnel detailed and comprehensive data support; but it also provides production personnel with a convenient and effective means to understand and grasp the actual operating status of each production stage in a timely and accurate manner, rapidly identifying and promptly handling any anomalies or deviations that may occur during production, thereby ensuring the smooth and orderly progress of the entire chip production process. Therefore, the importance of quality testing technology in the chip production line is increasingly prominent, and its significance in ensuring chip product quality and improving production efficiency is self-evident, making it an indispensable key link in the chip manufacturing process.

[0003] In current chip testing practices, chip loading and unloading primarily rely on trays. Specifically, trays carry the chips, which are then loaded onto the testing equipment. A robotic arm precisely picks up the chips from the trays and transfers them to the testing area. After testing, the robotic arm again precisely picks up the tested chips and transfers them to the corresponding trays for good or defective chips based on the test results. This process involves the recovery of empty trays after chip transfer and the loading of trays for good or defective chips. Currently, these operations are mainly performed manually, which not only consumes significant labor costs but also has relatively low efficiency, failing to meet the demands of modern chip production lines for high-efficiency and automated production.

[0004] Therefore, in response to the problems and shortcomings in the existing technology, there is an urgent need to improve and optimize the relevant technologies to increase the automation level of chip quality testing, reduce labor costs, and improve testing efficiency, thereby further ensuring the quality and production efficiency of chip products.

[0005] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0006] This invention provides an automatic chip testing and sorting device to solve the problems existing in the prior art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] An automated chip testing and sorting device includes a workbench, which is divided into an empty Tray recovery area, a sorting and unloading area, and an empty Tray transfer robot according to the processing area.

[0009] The empty Tray recycling area is used to recycle the empty Tray after the chips have been transferred;

[0010] The sorting and unloading area is used to store several empty trays, some of which are used to load chips that have passed the test and are good, and others are used to load chips that have failed the test.

[0011] The empty Tray transfer robot can move within the empty Tray recycling area and the sorting and unloading area, for transferring the empty Tray after the transferred chip to the empty Tray recycling area; and for transferring the empty Tray after the transferred chip to the sorting and unloading area.

[0012] Furthermore, in the chip automatic testing and sorting equipment, the workbench is further divided into a full tray loading area and a testing area according to the processing area;

[0013] The full tray loading area is used to store several trays loaded with chips to be tested;

[0014] A chip transfer robot is provided between the full tray loading area and the testing area. The chip transfer robot is used to transfer the chip in the tray to the testing area.

[0015] The test area is used to test the transferred chips;

[0016] A sorting robot is provided between the testing area and the sorting and unloading area. The sorting robot is used to transfer the tested chips to the sorting and unloading area.

[0017] The empty Tray transfer robot can move within the full Tray loading area to grab the empty Tray after the transferred chip from the full Tray loading area.

[0018] Furthermore, in the automatic chip testing and sorting equipment, the full tray loading area includes a loading device and a gripping and waiting device;

[0019] The feeding device is used to store a plurality of trays loaded with chips to be tested, and the plurality of trays are stacked; and to provide the trays to the gripping and waiting device;

[0020] The gripping and waiting device is used to store the tray provided by the feeding device and to position the tray by pushing it laterally, so as to wait for the chip transfer robot to transfer the chip in the tray to the test area.

[0021] Furthermore, in the automatic chip testing and sorting equipment, the feeding device includes a first conveying mechanism, a lifting mechanism, a storage slot, and a clamping mechanism;

[0022] The storage slot is used to store a plurality of stacked Tray disks;

[0023] The lifting mechanism is located at the bottom of the storage slot and is used to move up and down through the storage slot to lift or lower the tray inside the storage slot.

[0024] The clamping mechanism is located on both sides of the storage slot and is used to extend out when the lifting mechanism lifts the Tray disk in the storage slot to clamp the remaining Tray disks except for the bottommost Tray disk.

[0025] The lifting mechanism is also used to lower the bottommost tray and place it onto the first conveying mechanism when the clamping mechanism clamps the trays other than the bottommost tray.

[0026] The first conveying mechanism is used to convey the tray placed thereon to the grasping waiting device.

[0027] Furthermore, in the chip automatic testing and sorting equipment, the grasping and waiting device includes a second conveying mechanism, a side pushing mechanism, and a blocking mechanism;

[0028] The second transmission mechanism is connected to the first transmission mechanism and is used to continue transmitting the Tray disk coming from the first transmission mechanism;

[0029] The side-pushing mechanism is located on one side of the second conveying mechanism and is used to push the tray laterally from the side of the tray to position the tray in the lateral direction, so as to wait for the chip transfer robot to transfer the chip in the tray to the test area.

[0030] The blocking mechanism is located at the end of the second transmission mechanism and is used to prevent the second transmission mechanism from continuing to transmit the tray.

[0031] Furthermore, in the automatic chip testing and sorting equipment, the gripping and waiting device also includes a positioning gripper mechanism;

[0032] The positioning gripper mechanism is disposed on both sides of the second conveying mechanism and is used to hold the tray disk positioned in the lateral direction.

[0033] Furthermore, in the automatic chip testing and sorting equipment, the sorting and unloading area includes a good product unloading area and a defective product unloading area;

[0034] The defective product unloading area is divided into several classification areas according to the defect type of the chip. Each classification area corresponds to an empty tray for loading chips of different defect types.

[0035] Furthermore, in the chip automatic testing and sorting equipment, the chip transfer robot, the sorting robot, and the empty Tray transfer robot are all robots with suction head pitch adjustment function.

[0036] Compared with the prior art, the present invention has the following beneficial effects:

[0037] This utility model provides an automated chip testing and sorting device. By adding an empty tray transfer robot, and designing the empty tray transfer robot to move within the empty tray recycling area and the sorting and unloading area, the empty trays after the transferred chips are transferred can be moved by the empty tray transfer robot to the empty tray recycling area for recycling and storage, and then moved to the sorting and unloading area to load the tested chips. This not only automates the recycling and transfer of empty trays, improving production efficiency, but also reduces labor costs and human intervention, thereby further improving the automation level and efficiency of the entire chip testing and sorting process.

[0038] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a top view structural diagram of an automatic chip testing and sorting device provided in an embodiment of the present invention;

[0041] Figure 2 This is one of the (three-dimensional) structural schematic diagrams of an automatic chip testing and sorting device provided in this utility model embodiment;

[0042] Figure 3 This is the second (three-dimensional) structural schematic diagram of an automatic chip testing and sorting device provided in this embodiment of the present invention;

[0043] Figure 4 This is one of the (three-dimensional) structural schematic diagrams of the full Tray loading area, empty Tray recycling area, sorting and unloading area and empty Tray transfer robot provided in this embodiment of the utility model;

[0044] Figure 5 This is the second (three-dimensional) structural schematic diagram of the full Tray loading area, empty Tray recycling area, sorting and unloading area and empty Tray transfer robot provided in this embodiment of the utility model;

[0045] Figure 6 This is a top view structural diagram of the full Tray loading area, empty Tray recycling area, sorting and unloading area, and empty Tray transfer robot provided in this embodiment of the utility model;

[0046] Figure 7 This is a three-dimensional structural diagram of the Tray loading area provided in this embodiment of the utility model;

[0047] Figure 8 This is a three-dimensional structural diagram of the feeding device provided in this embodiment of the utility model;

[0048] Figure 9 This is a (partial) structural schematic diagram of the feeding device provided in an embodiment of the present utility model;

[0049] Figure 10 This is a (partial) structural schematic diagram of the feeding device provided in an embodiment of the present utility model;

[0050] Figure 11 This is one of the (three-dimensional) structural schematic diagrams of the grasping and waiting device provided in this embodiment of the utility model;

[0051] Figure 12 This is the second (three-dimensional) structural schematic diagram of the grasping and waiting device provided in this embodiment of the utility model.

[0052] Figure label:

[0053] Workbench 1, Full Tray Loading Area 2, Empty Tray Recycling Area 3, Testing Area 4, Sorting and Unloading Area 5, Chip Transfer Robot 6, Sorting Robot 7, Tray Tray 8, Empty Tray Transfer Robot 9;

[0054] Feeding device 201, gripping and waiting device 202;

[0055] First conveying mechanism 2011, lifting mechanism 2012, storage slot 2013, clamping mechanism 2014, second photoelectric sensing module 2015;

[0056] Second conveying mechanism 2021, side pushing mechanism 2022, blocking mechanism 2023, positioning claw mechanism 2024;

[0057] Good product unloading area 501, defective product unloading area 502. Detailed Implementation

[0058] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0059] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0060] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0061] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0062] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order between these entities or operations.

[0063] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0064] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0065] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0066] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0067] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0068] Please refer to Figure 1-6 This utility model provides an automatic chip testing and sorting device, including a workbench 1. The workbench 1 is divided into an empty Tray recycling area 3, a sorting and unloading area 5, and an empty Tray transfer robot 9 according to the processing area.

[0069] The empty Tray recycling area 3, as an important area in the equipment responsible for recycling and processing, mainly functions to receive and store the empty Tray disks 8 after the chip transfer operation is completed. These empty Tray disks 8 are sent to the empty Tray recycling area 3 after the chips are transferred away, so as to carry out subsequent recycling and reuse, thereby effectively saving resources and reducing production costs.

[0070] The sorting and unloading area 5 is another key area in the equipment used for storing and preparing empty trays 8. In this area, a number of empty trays 8 are pre-placed, divided into two parts: one part is used to load chips that have passed testing and are deemed good, and the other part is used to load chips that have failed testing. This design not only facilitates the classification, storage, and management of chips but also improves the organization and efficiency of the entire testing and sorting process.

[0071] The empty tray transfer robot 9 is a major highlight and innovation of this embodiment. This robot is designed to move freely between the empty tray recycling area 3 and the sorting and unloading area 5, exhibiting high flexibility and accuracy. Its specific functions include: transferring the empty trays 8 after the chips have been transferred from their original positions to the empty tray recycling area 3 for unified recycling and storage; simultaneously, it can also transfer empty trays 8 from the recycling area or other locations to the sorting and unloading area 5 as needed to load tested chips.

[0072] By adding an empty tray transfer robot 9 and carefully designing its motion trajectory and functions, this embodiment of the invention successfully automates the recycling and transfer process of empty trays 8. This innovation not only greatly improves production efficiency, making the entire chip testing and sorting process smoother and more efficient, but also significantly reduces labor costs and the degree and frequency of human intervention. In this way, it not only improves the automation level of the entire production process, but also further enhances production efficiency and product quality, bringing new technological innovations and development opportunities to the chip manufacturing industry.

[0073] Please refer to this again. Figure 1-6 In one embodiment of this invention, the processing area of ​​the workbench 1 is divided into more detailed and functionally distinct sections, with the addition of a full Tray loading area 2 and a testing area 4. Together with the previously mentioned empty Tray recycling area 3 and sorting and unloading area 5, these form the working area of ​​a complete automatic chip testing and sorting device.

[0074] The full tray loading area 2 serves as the starting point for chip testing in the equipment. Its main function is to store several trays 8 containing chips to be tested. After processing and handling in the previous process, the chips in these trays 8 are neatly arranged in the trays, waiting to be sent to the testing area for further testing.

[0075] A chip transfer robot 6 is specially installed between the full tray loading area 2 and the testing area 4. This robot has high precision and stability, and its main responsibility is to transfer the chips from the trays 8 in the full tray loading area 2 one by one or in batches to the testing area 4. The precise operation of the chip transfer robot 6 ensures the safety and accuracy of the chips during the transfer process, avoiding chip damage or testing errors caused by human operation or mechanical failure.

[0076] Test area 4 is one of the most crucial areas of the equipment, responsible for comprehensively testing the chips transferred from the full tray loading area 2. Test area 4 is equipped with advanced testing equipment and instruments, enabling precise measurement and evaluation of various chip performance indicators to determine whether the chips meet quality standards.

[0077] A sorting robot 7 is installed between testing area 4 and sorting / unloading area 5. The robot's task is to transfer the tested chips from testing area 4 to sorting / unloading area 5. Based on the test results, the sorting robot 7 places the chips into the corresponding good or defective trays for subsequent sorting and packaging.

[0078] Furthermore, the previously mentioned empty tray transfer robot 9 also plays a crucial role in this embodiment. It can move not only between the empty tray recycling area 3 and the sorting and unloading area 5, but also extend into the full tray loading area 2. In the full tray loading area 2, the empty tray transfer robot 9 is responsible for grabbing the trays 8 that have become empty after the chip transfer robot 6 has removed the chips, and transferring them to the empty tray recycling area 3 and the sorting and unloading area 5 for recycling and reuse.

[0079] This design enables full automation and intelligence in the chip testing and sorting process. From chip loading, transfer, and testing to sorting and recycling, each step is completed by a precision robotic arm, greatly improving production efficiency and product quality while reducing labor costs and operational risks.

[0080] Please refer to Figure 7-12 In one embodiment of this example, the full tray loading area 2 includes a loading device 201 and a gripping and waiting device 202; these two parts work together to achieve efficient and automated operation of the chip loading process.

[0081] The loading device 201 is one of the core components of the full tray loading area 2, and it undertakes the important task of storing and providing trays 8 loaded with chips to be tested. Specifically, the loading device 201 is designed to accommodate multiple stacked trays 8. This design greatly improves loading efficiency, reduces the frequency of manual tray replenishment, and makes the entire loading process more continuous and smooth. When a tray 8 needs to be provided to the gripping waiting device 202, the loading device 201 can quickly and accurately deliver the bottom tray 8, preparing for subsequent chip transfer.

[0082] The gripping waiting device 202 is another key component of the full tray loading area 2. It follows immediately after the loading device 201 and is used to store the trays 8 provided by the loading device 201. The gripping waiting device 202 not only stores the trays 8 but also provides lateral positioning for them. This function is designed to ensure the stability and accuracy of the trays 8 during the gripping waiting process, so that the chip transfer robot 6 can accurately and without error grasp the chips in the trays 8. Through the precise positioning of the gripping waiting device 202, the success rate of the chip transfer robot 6 is significantly improved, thereby further enhancing the efficiency and stability of the entire chip testing process.

[0083] In summary, the full tray loading area 2 in this embodiment achieves efficient and automated chip loading through the ingenious design of the loading device 201 and the gripping and waiting device 202. The loading device 201 can accommodate multiple stacked trays 8, improving loading efficiency; while the gripping and waiting device 202 ensures accurate gripping of the chip transfer robot 6 by precisely positioning the trays 8. The coordinated work of these two parts not only improves the efficiency and stability of the entire chip testing process but also increases the success rate of transfer.

[0084] In one specific embodiment of this invention, the feeding device 201 is carefully designed to include four main components: a first conveying mechanism 2011, a lifting mechanism 2012, a storage slot 2013, and a clamping mechanism 2014. These four parts work together to achieve automatic separation and conveying of the Tray 8, significantly improving feeding efficiency and stability.

[0085] The storage slot 2013 is a basic component of the feeding device 201, used to store several stacked trays 8. The size of the storage slot 2013 matches the size of the trays 8, ensuring that it can stably accommodate multiple stacked trays 8 and prevent them from shaking or slipping during storage.

[0086] The lifting mechanism 2012, located at the bottom of the storage slot 2013, is a key component for the automatic separation of the tray 8. The lifting mechanism 2012 can move up and down through the storage slot 2013 to lift or lower the tray 8 within it. Specifically, the lifting mechanism 2012 can be a cylinder- or motor-driven lifting platform, capable of precisely controlling the lifting height to ensure the tray 8 remains stable during lifting or lowering.

[0087] The clamping mechanism 2014 is located on both sides of the storage slot 2013. It extends when the lifting mechanism 2012 lifts the tray 8 into the storage slot 2013 to clamp the trays 8 except for the bottom tray 8. The clamping mechanism 2014 can be a pneumatic gripper with adjustable clamping force, which can firmly clamp the trays 8 and prevent them from slipping or tilting during the lifting process.

[0088] While the clamping mechanism 2014 clamps all the trays 8 except the bottom one, the lifting mechanism 2012 continues to lower the bottom tray 8, separating it from the stacked trays 8 and placing it on the first conveying mechanism 2011. This cooperative working method ensures the smooth separation of the trays 8, avoiding collisions or damage during the separation process.

[0089] The first conveying mechanism 2011 is responsible for conveying the tray 8 placed on it to the grasping waiting device 202. The first conveying mechanism 2011 can adopt a belt conveyor structure, and its conveying speed is adjustable, which can smoothly convey the tray 8 to the designated position.

[0090] In summary, the feeding device 201 in this embodiment, through the ingenious design of the storage slot 2013, lifting mechanism 2012, clamping mechanism 2014, and first conveying mechanism 2011, achieves automatic separation and conveying of the Tray disk 8. This structural design not only improves feeding efficiency and stability but also provides reliable assurance for subsequent chip testing processes.

[0091] In one specific embodiment of this example, the feeding device 201 cleverly incorporates a second photoelectric sensing module 2015 on the basis of its original structure. This addition greatly enhances the intelligence and automation level of the device.

[0092] The second photoelectric sensing module 2015 is carefully positioned at the top of the storage slot 2013, and its location ensures accurate and reliable sensing of the stacking height of the trays 8 within the storage slot 2013. Photoelectric sensing technology, with its high sensitivity and non-contact measurement capabilities, plays a crucial role in this application.

[0093] Specifically, the second photoelectric sensing module 2015 monitors the stacking status of the trays 8 in the storage slot 2013 in real time by emitting and receiving light signals. When the stacking height of the trays 8 changes, such as when a tray 8 is added or removed, the photoelectric sensing module can quickly detect this change and transmit the signal to the control system.

[0094] Based on the received signals, the control system can adjust the working status of the lifting mechanism 2012 in real time to ensure that the lifting height matches the current stacking height of the trays 8. This not only avoids collisions or damage to the trays 8 that may be caused by improper lifting height, but also improves the stability and reliability of the entire loading process.

[0095] In summary, the feeding device 201 in this embodiment, by incorporating a second photoelectric sensing module 2015, achieves real-time monitoring and intelligent adjustment of the stacking height of the Tray disks 8.

[0096] In one embodiment of this invention, the grasping waiting device 202 is carefully designed to include three main components: a second conveying mechanism 2021, a side-pushing mechanism 2022, and a blocking mechanism 2023. These three parts work together to achieve precise positioning of the Tray 8, providing a stable and reliable foundation for the grasping operation of the chip transfer robot 6.

[0097] The second conveying mechanism 2021 is the starting part of the gripping and waiting device 202, and is connected to the first conveying mechanism 2011 to continue conveying the tray 8 from the first conveying mechanism 2011. To ensure the smoothness of the tray 8 during the conveying process, the second conveying mechanism 2021 can adopt the same conveying structure as the first conveying mechanism 2011, such as a belt conveyor structure. This design not only ensures the smooth conveying of the tray 8, but also simplifies the maintenance and operation of the equipment.

[0098] The side-pushing mechanism 2022, located on one side of the second conveying mechanism 2021, is a key component for achieving precise positioning of the tray 8. The side-pushing mechanism 2022 is used to push the tray 8 laterally from its side to position it in the lateral direction. Specifically, the side-pushing mechanism 2022 can employ a cylinder-driven pusher plate. By precisely controlling the stroke and thrust of the cylinder, the tray 8 can be pushed to a precise position. This design ensures that the chip transfer robot 6 can accurately align the chip in the tray 8 when grasping the chip, improving the success rate and stability of the grasping process.

[0099] A blocking mechanism 2023 is located at the end of the second conveying mechanism 2021 to prevent the second conveying mechanism 2021 from continuing to convey the tray 8. In this embodiment, the blocking mechanism 2023 can be designed as a baffle that is always raised to ensure that the tray 8 can stay stably after reaching the designated position. Of course, depending on actual needs, the blocking mechanism 2023 can also adopt a cylinder-driven baffle design so that it can be raised to block the tray 8 when needed and lowered to allow the tray 8 to pass when not needed. This flexible design meets the needs of different production scenarios.

[0100] In summary, the grasping and waiting device 202 in this embodiment achieves precise positioning and stable dwell of the Tray 8 through the ingenious design of the second conveying mechanism 2021, the side pushing mechanism 2022, and the blocking mechanism 2023. This structural design not only provides a reliable foundation for the grasping operation of the chip transfer robot 6, but also improves the efficiency and stability of the entire chip testing process.

[0101] In one specific embodiment of this example, the gripping waiting device 202 adds a positioning gripper mechanism 2024 to the original structure. This addition greatly improves the stability and accuracy of the Tray disk 8 during the positioning process.

[0102] The positioning gripper mechanism 2024 is carefully positioned on both sides of the second conveying mechanism 2021, and its position selection ensures accurate and effective gripping of the Tray disk 8, which is positioned in the lateral direction. Cylinder drive technology, with its fast response speed and high control precision, plays an important role in this application.

[0103] Specifically, the positioning gripper mechanism 2024 can adopt a cylinder-driven gripper design. When the tray 8 is pushed to the lateral positioning position by the side-pushing mechanism 2022, the cylinder of the positioning gripper mechanism 2024 is activated, driving the grippers to press down simultaneously or sequentially from both sides of the tray 8, firmly pressing it onto the second conveying mechanism 2021. This holding method not only improves the stability of the tray 8 during the positioning process but also further ensures the accuracy of its position.

[0104] By adding a positioning gripper mechanism 2024, the gripping waiting device 202 in this embodiment achieves a more secure positioning of the tray 8. This design ensures that the tray 8 remains absolutely stable when the chip transfer robot 6 grips the chip, and will not undergo slight displacement due to external factors (such as airflow, vibration, etc.), thereby improving the success rate and accuracy of gripping.

[0105] In summary, the gripping waiting device 202 in this embodiment achieves more secure and precise positioning of the Tray disk 8 by adding a positioning gripper mechanism 2024.

[0106] In one embodiment of this example, the sorting and unloading area 5 is carefully divided into two main areas: a good product unloading area 501 and a defective product unloading area 502. This design aims to achieve efficient and orderly sorting and unloading of chips.

[0107] The Good Product Unloading Area 501, as the name suggests, is a dedicated area for storing chips that have passed testing and been determined to be good products. Here, the good chips are neatly arranged and stored, ready for subsequent packaging, shipping, or further processing.

[0108] The defective product unloading area 502 embodies a more detailed and professional classification concept. Considering that different defect types of chips may require different processing methods and subsequent processes, the defective product unloading area 502 is further subdivided into several classification areas. Each classification area corresponds to a specific type or category of chip defect, such as poor electrical performance, cosmetic damage, or dimensional mismatch.

[0109] Within these classification areas, empty trays 8 are pre-placed. These trays 8 are designed to securely support the chips, preventing displacement or damage during transportation or storage. When the testing facility identifies a defect in a chip, the system automatically or manually places the chip into the tray 8 within the classification area corresponding to the defect type.

[0110] This design allows for the effective classification and management of defective chips. It not only facilitates subsequent quality analysis, problem tracing, and the development of improvement measures, but also improves production efficiency and resource utilization. Simultaneously, the pre-set empty Tray 8 ensures smooth sorting and unloading, avoiding delays or chaos caused by a lack of support tools.

[0111] In summary, the sorting and unloading area 5 in this embodiment is reasonably designed and fully functional. It not only achieves effective separation of good and defective products, but also provides detailed classification and management of defective products, which provides strong support for the smooth operation of the chip production process and the continuous improvement of product quality.

[0112] In one specific embodiment of this example, the key equipment in the chip transfer process has been innovatively designed, namely, the chip transfer robot 6, the sorting robot 7, and the empty Tray transfer robot 9 are all given the function of adjusting the suction head pitch.

[0113] The introduction of this design concept greatly enhances the flexibility and adaptability of the robotic arm. In traditional chip transfer processes, robotic arms typically only have a fixed nozzle-to-pickup distance, which limits their ability to handle chips of different sizes or arrangements. However, the robotic arm in this embodiment achieves adjustable nozzle-to-pickup distance through a variable nozzle-to-pickup distance adjustment function, thus easily handling various chip transfer requirements.

[0114] Specifically, the chip transfer robot 6 is responsible for transferring chips between the testing area and the unloading area. Since different batches of chips may have different sizes or arrangements, the suction head pitch adjustment function allows the robot to adjust the spacing of the suction heads as needed, ensuring the stability and accuracy of the chips during the transfer process.

[0115] The sorting robot 7 is mainly used during the testing process to remove the tested chips from the testing mechanism and place them in a designated location. Similarly, the adjustable suction head allows the sorting robot 7 to adapt to chips of different sizes, improving sorting efficiency and accuracy.

[0116] The empty tray transfer robot 9 is responsible for transferring empty trays from the storage area to the unloading area for loading defective products or chips awaiting processing. The adjustable suction head position allows the robot to adjust the position and spacing of the suction heads as needed, ensuring stable transfer and accurate placement of the trays.

[0117] In summary, the chip transfer robot 6, sorting robot 7, and empty tray transfer robot 9 in this embodiment all have the function of adjusting the suction head pitch. This innovative design not only improves the flexibility and adaptability of the robot, but also enhances the efficiency and accuracy of the chip transfer process.

[0118] Although this application uses terms such as "workbench" and "robotic arm" frequently, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0119] This utility model provides an automated chip testing and sorting device. By adding an empty tray transfer robot, and designing the empty tray transfer robot to move within the empty tray recycling area and the sorting and unloading area, the empty trays after the transferred chips are transferred can be moved by the empty tray transfer robot to the empty tray recycling area for recycling and storage, and then moved to the sorting and unloading area to load the tested chips. This not only automates the recycling and transfer of empty trays, improving production efficiency, but also reduces labor costs and human intervention, thereby further improving the automation level and efficiency of the entire chip testing and sorting process.

[0120] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. An automatic chip testing and sorting device, characterized in that, Includes a workbench (1), which is divided into an empty Tray recovery area (3), a sorting and unloading area (5), and an empty Tray transfer robot (9) according to the processing area; The empty Tray recycling area (3) is used to recycle the empty Tray disk (8) after the transferred chip is removed; The sorting and unloading area (5) is used to store several empty Trays (8), some of which are empty Trays (8) are used to load chips that have passed the test and are of good quality, and other empty Trays (8) are used to load chips that have failed the test. The empty Tray transfer robot (9) can move within the empty Tray recycling area (3) and the sorting and unloading area (5) to transfer the empty Tray disk (8) after the transferred chip to the empty Tray recycling area (3); and to transfer the empty Tray disk (8) after the transferred chip to the sorting and unloading area (5).

2. The automatic chip testing and sorting equipment according to claim 1, characterized in that, The workbench (1) is further divided into a full tray loading area (2) and a testing area (4) according to the processing area. The full Tray loading area (2) is used to store several Tray disks (8) loaded with chips to be tested. A chip transfer robot (6) is provided between the full tray loading area (2) and the test area (4). The chip transfer robot (6) is used to transfer the chip in the tray (8) to the test area (4). The test area (4) is used to test the transferred chip; A sorting robot (7) is provided between the test area (4) and the sorting and unloading area (5). The sorting robot (7) is used to transfer the tested chips to the sorting and unloading area (5). The empty Tray transfer robot (9) can move within the full Tray loading area (2) to grab the empty Tray disk (8) after the transferred chip from the full Tray loading area (2).

3. The automatic chip testing and sorting equipment according to claim 2, characterized in that, The full tray loading area (2) includes a loading device (201) and a gripping and waiting device (202). The loading device (201) is used to store a plurality of trays (8) loaded with chips to be tested, the plurality of trays (8) being stacked; and to provide the trays (8) to the gripping waiting device (202). The gripping waiting device (202) is used to store the tray (8) provided by the feeding device (201) and to perform side-push positioning on the tray (8) to wait for the chip transfer robot (6) to transfer the chip in the tray (8) to the test area (4).

4. The automatic chip testing and sorting equipment according to claim 3, characterized in that, The feeding device (201) includes a first conveying mechanism (2011), a lifting mechanism (2012), a storage tank (2013), and a clamping mechanism (2014). The storage slot (2013) is used to store several stacked Tray disks (8); The lifting mechanism (2012) is located at the bottom of the storage slot (2013) and is used to move up and down through the storage slot (2013) to lift or lower the tray (8) in the storage slot (2013); The clamping mechanism (2014) is located on both sides of the storage slot (2013) and is used to extend out when the lifting mechanism (2012) lifts the Tray disk (8) in the storage slot (2013) to clamp the remaining Tray disks (8) except for the bottommost Tray disk (8); The lifting mechanism (2012) is also used to lower the bottom Tray disk (8) to place it onto the first conveying mechanism (2011) when the clamping mechanism (2014) clamps the remaining Tray disks (8) except for the bottommost Tray disk (8). The first conveying mechanism (2011) is used to convey the Tray (8) placed thereon to the grab waiting device (202).

5. The automatic chip testing and sorting equipment according to claim 4, characterized in that, The grabbing waiting device (202) includes a second conveying mechanism (2021), a side pushing mechanism (2022), and a blocking mechanism (2023). The second transmission mechanism (2021) is connected to the first transmission mechanism (2011) and is used to continue transmitting the Tray disk (8) from the first transmission mechanism (2011). The side-pushing mechanism (2022) is located on one side of the second conveying mechanism (2021) and is used to push the Tray (8) laterally from the side of the Tray (8) to position the Tray (8) in the lateral direction so as to wait for the chip transfer robot (6) to transfer the chip in the Tray (8) to the test area (4). The blocking mechanism (2023) is located at the end of the second transmission mechanism (2021) and is used to block the second transmission mechanism (2021) from continuing to transmit the Tray disk (8).

6. The automatic chip testing and sorting equipment according to claim 5, characterized in that, The grasping waiting device (202) also includes a positioning pressure claw mechanism (2024). The positioning gripper mechanism (2024) is disposed on both sides of the second conveying mechanism (2021) and is used to press the Tray disk (8) positioned in the lateral direction.

7. The automatic chip testing and sorting equipment according to claim 1, characterized in that, The sorting and unloading area (5) includes a good product unloading area (501) and a defective product unloading area (502); The defective product unloading area (502) is divided into several classification areas according to the defect type of the chip. Each classification area corresponds to an empty tray (8) for loading chips of different defect types.

8. The automatic chip testing and sorting equipment according to claim 2, characterized in that, The chip transfer robot (6), sorting robot (7) and empty tray transfer robot (9) are all robots with suction head pitch adjustment function.

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