High-stability temperature and pressure integrated sensor

Abstract

The utility model provides a high-stability temperature and pressure integrated sensor, and relates to the technical field of sensors, and the high-stability temperature and pressure integrated sensor comprises a connecting piece; the shell is provided with an inner cavity, the opening end of the inner cavity of the shell is connected with the connecting piece, and the other end, away from the opening end of the inner cavity, of the shell is provided with a first channel and a second channel which are communicated with the inner cavity and are independent of each other; one end of the protection tube is located in the first channel; the pressure sensing piece is arranged in the inner cavity, the pressure sensing piece is communicated with the second channel, and a through hole is formed in the pressure sensing piece; one end of the temperature sensing piece is located in the protection tube, and the other end of the temperature sensing piece passes through the through hole through the first channel; and the circuit board is located on the pressure sensing piece, and the temperature and pressure integrated sensor effectively improves the precision and the reliability of a product.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, specifically to a highly stable integrated temperature and pressure sensor. Background Technology

[0002] With the continuous development of the automotive industry and industrial technology, the demand for system stability and safety is increasing, making high-precision, high-reliability, and low-cost sensors particularly important. In automotive control systems, sensors collect temperature and pressure data from the monitored area and feed it back to the processing unit. The data processing unit processes the collected data and issues commands to the actuators to achieve the stable operation of the automotive control system. Current integrated temperature and pressure sensors have the following problems:

[0003] In existing technologies, temperature sensors are mostly thermistors, while pressure sensors are ceramic capacitors. Temperature and pressure sensors integrate temperature and pressure acquisition functions using both thermistors and ceramic capacitors. However, these two functional areas need to be independently distinguished in the sensor structure, and appropriate sealing is required. Current temperature and pressure sensors add a temperature sensor base to increase internal space and achieve relative independence between the two functional areas. This addition of the temperature sensor base inevitably leads to increased cost, additional sealing requirements, and interference with pressure accuracy, among other problems. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a highly stable integrated temperature and pressure sensor that ensures the relative independence of temperature and pressure regions, while also greatly increasing product stability and achieving the goal of low-cost products.

[0005] To achieve the above and other objectives, this utility model proposes a solution to remove the temperature sensor base based on existing technology. It also optimizes the structure of the pressure sensor and adds an independent bearing channel for the temperature sensor to meet the requirements of sensor sealing and functional area independence.

[0006] This utility model is achieved through the following technical solution: This utility model provides a high-stability temperature and pressure integrated sensor, the high-stability temperature and pressure integrated sensor comprising:

[0007] A connector; a housing having an inner cavity, the opening end of the inner cavity of the housing being connected to the connector, the housing having a first channel and a second channel communicating with and independent of the inner cavity at the other end away from the opening end of the inner cavity; a protective tube, one end of the protective tube being located in the first channel, and the other end of the protective tube extending out of the first channel; a pressure sensor placed in the inner cavity, the pressure sensor communicating with the second channel, the pressure sensor having a through hole; a temperature sensor, one end of the temperature sensor being located in the protective tube, and the other end of the temperature sensor passing through the first channel. A channel passes through the through hole; and a circuit board is placed in the inner cavity and located on the pressure sensor. One end of the circuit board is electrically connected to the connector, and the other end of the circuit board is electrically connected to the temperature sensor and the pressure sensor. The bottom of the inner cavity has a groove communicating with the second channel. A first sealing ring is provided in the groove. The first sealing ring, the groove, and the pressure sensor form a pressure-sensing cavity. The through hole is an eccentrically arranged waist-shaped hole or a round hole. The edge of the pressure sensor has a positioning surface, and the bottom of the inner cavity has a positioning platform that matches the positioning surface.

[0008] In one embodiment, the circuit board has a first connecting hole that mates with the circular hole, the diameter of the first connecting hole being smaller than the diameter of the circular hole.

[0009] In one embodiment, the pressure sensing element is provided with a positioning hole, and the bottom of the inner cavity has a positioning pin that matches the positioning hole.

[0010] In one embodiment, the circuit board is a flexible circuit board or a rigid circuit board.

[0011] In one embodiment, the pressure sensing element is a ceramic capacitor, and the temperature sensing element is a thermistor.

[0012] In one embodiment, the connector includes a connector body and a conductive element located within the connector body.

[0013] In one embodiment, the conductive element and the circuit board are welded together or connected by an elastic element.

[0014] This utility model has the following beneficial effects:

[0015] 1. This utility model forms a pressure sensing area by directly contacting the pressure sensing element and the housing. It does not use the temperature sensing element base that is usually set in the inner cavity of the existing technology, which can avoid the deformation problem caused by the temperature of the base. Eliminating this part not only saves costs but also greatly improves the stability of product quality control and reduces quality risks.

[0016] 2. In existing technologies, when using a temperature sensor base, it is difficult to avoid sealing between the temperature sensor base and the pressure sensor, as well as between the temperature sensor base and the housing. Removing the temperature sensor base and allowing the pressure sensor to directly contact the housing eliminates the need for sealing only between the pressure sensor and the housing. This reduces the number of sealing steps, significantly lowers the risk of seal failure, saves on the cost of sealing rings, and increases production cycle time. The reduced sealing risk also greatly improves the stability of product pressure data collection.

[0017] 3. The pressure sensing chamber in the existing pressure acquisition area is formed by the temperature sensor base, the pressure sensor, and the housing. Due to the thermal expansion and contraction of the temperature sensor base material, the actual pressure sensing area of ​​the pressure region is constantly changing, which seriously affects the accuracy and reliability of pressure data acquisition. Eliminating the temperature sensor base and allowing the pressure sensor to directly form the pressure sensing area with the housing effectively improves the accuracy and reliability of the product.

[0018] 4. In existing technologies, temperature sensors need to be soldered to a base and connected to the circuit board via the base. In this invention, the pressure sensor provides a dedicated channel for the temperature sensor through a separate through-hole, allowing direct connection between the temperature sensor and the circuit board. This reduces the number of soldering operations in product manufacturing and assembly from two to one, significantly improving the product's cycle time and the stability of circuit power supply. Attached Figure Description

[0019] Figure 1 The diagram shown is a structural schematic of a high-stability temperature and pressure integrated sensor according to an embodiment of the present invention.

[0020] Figure 2 The image shown is a cross-sectional view of a high-stability temperature and pressure integrated sensor according to an embodiment of the present invention.

[0021] Figure 3 The image shown is a cross-sectional view of a high-stability temperature and pressure integrated sensor according to an embodiment of the present invention.

[0022] Figure 4 The diagram shown is an exploded view of a high-stability temperature and pressure integrated sensor according to an embodiment of the present invention.

[0023] Figure 5 The image shown is a top view of the housing in one embodiment of this utility model;

[0024] Figure 6 The image shown is a cross-sectional view of a high-stability temperature and pressure integrated sensor according to another embodiment of the present invention.

[0025] Figure 7The image shown is a top view of a pressure sensing element according to an embodiment of the present invention.

[0026] Figure 8 The diagram shown is a structural schematic of the circuit board and pressure sensor in one embodiment of the present invention.

[0027] Figure 9 The image shown is a top view of the housing in another embodiment of this utility model;

[0028] The following labels are used in the diagram: 1-Connector, 11-Connector body, 11a-Cavity, 12-Conductive element, 2-Housing, 21-Inner cavity, 22-First channel, 22a-Stepped groove, 23-Second channel, 24-Groove, 24a-Pressure sensing chamber, 25-Positioning stage, 3-Protective tube, 31-Raised edge, 4-Temperature sensor, 5-First sealing ring, 6-Pressure sensor, 61-Diaphragm, 62-Substrate, 63-Through hole, 64-Positioning surface, 65-Positioning hole, 7-Circuit board, 71-First connecting hole, 72-Second connecting hole, 8-Positioning pin, 9-Elastic element, 100-Sealant, 200-Second sealing ring. Detailed Implementation

[0029] Please see Figures 1 to 9 The following specific examples illustrate the implementation of this utility model.

[0030] like Figure 1 As shown, this utility model provides a highly stable temperature and pressure integrated sensor. The integrated sensor includes a connector 1, which can electrically connect the sensor's signal to a monitoring and reading device such as a computer.

[0031] like Figure 4 As shown, in some embodiments, the connector 1 includes a connector body 11 and a conductor 12 located within the connector body 11.

[0032] like Figure 2 and Figure 4 As shown, the high-stability temperature and pressure integrated sensor includes a housing 2, which may be a metal housing. The housing 2 has an inner cavity 21, the open end of which can be connected to one end of the connector 1. At the other end of the housing 2 away from the open end, there is a first channel 22 and a second channel 23 communicating with the inner cavity 21. The first channel 22 is a temperature sensing channel, and the second channel 23 is a pressure sensing channel.

[0033] like Figure 2 and Figure 4As shown, the first channel 22 has a protective tube 3 at one end away from the inner cavity 21. One end of the protective tube 3 is located inside the first channel 22, and the other end of the protective tube 3 extends out of the first channel 22 by a certain distance. The protective tube 3 can be made of stainless steel.

[0034] like Figure 2 As shown, the high-stability temperature and pressure integrated sensor includes a temperature sensing element 4. One end of the temperature sensing element 4 is disposed inside the protective tube 3, and the other end of the temperature sensing element 4 passes through the first channel 22. The temperature sensing element 4 can be an NTC thermistor, and thermally conductive adhesive is also disposed between the temperature sensing element 4 and the protective tube 3.

[0035] like Figure 2 and Figure 4 As shown, a groove 24 is provided at the bottom of the inner cavity 21. The groove 24 communicates with the second channel 23. The groove 24 is located on one side of the first channel 22. A first sealing ring 5 is provided in the groove 24. The first sealing ring 5, the pressure sensing element 6, and the groove 24 can form a pressure-sensing cavity 24a.

[0036] like Figure 6 As shown, the bottom end of the first channel 22 is provided with a stepped groove 22a that matches the protective tube 3, and the outer wall of the protective tube 3 is provided with a protrusion 31. The protrusion 31 and the stepped groove 22a are formed into a sealing surface by interference compression.

[0037] like Figure 2 As shown, a pressure sensing element 6 is also provided in the inner cavity 21. The pressure sensing element 6 can be a ceramic pressure-sensitive core, such as a ceramic capacitor, or more specifically, a circular ceramic capacitor.

[0038] like Figure 3 As shown, the bottom of the connector 1 can be disposed on and supported on the pressure sensor 6, and the bottom of the connector 1 has a cavity 11a, in which the circuit board 7 can be accommodated.

[0039] like Figure 4 As shown, in one embodiment, the pressure sensing element 6 includes a substrate 62 and a diaphragm 61. The diaphragm 61 can be an elastic diaphragm, which can generate different deformations by the compression of the medium to be measured, thereby converting it into a pressure electrical signal.

[0040] like Figure 2 and Figure 7 As shown, a through hole 63 is provided at a non-axial position of the pressure sensor 6, and the top of the temperature sensor 4 can pass through the through hole 63 to achieve an electrical connection with the circuit board 7.

[0041] like Figure 2 As shown, a circuit board 7 is also provided inside the inner cavity 21. The circuit board 7 is disposed on the pressure sensor 6. One end of the circuit board 7 can be electrically connected to the output end of the pressure sensor 6 and the top of the temperature sensor 4. The other end of the circuit board 7 can be electrically connected to the conductive element 12 in the connector 1.

[0042] The circuit board 7 can be either a flexible circuit board or a rigid circuit board.

[0043] like Figure 2 As shown, when a flexible circuit board is used, the circuit board 7 can be welded to the conductive element 12.

[0044] like Figure 6 As shown, when a rigid circuit board is used, the circuit board 7 can be connected to the conductive member 12 by an elastic member 9, which can be a spring.

[0045] like Figure 5 and Figure 7 As shown, in one embodiment, the circuit board 7 is a flexible circuit board. In this case, the through hole 63 on the pressure sensor 6 can be an eccentrically designed waist-shaped hole. The waist-shaped hole can weld the temperature sensor 4 onto the flexible circuit board and provide sufficient positional tolerance space, greatly improving the high precision requirements and stability of product quality. One edge of the pressure sensor 6 can be provided with a positioning surface 64, and the bottom of the inner cavity 21 is provided with a positioning platform 25 that matches the positioning surface 64. Using a pressure sensor 6 with an irregular structure having a positioning surface 64 to match the housing 2 can effectively prevent misalignment caused by radial rotation of the pressure sensor 6.

[0046] like Figure 6 and Figure 8As shown, in one embodiment, the circuit board 7 is a rigid circuit board. In this case, the through hole 63 on the pressure sensor 6 can be a double-hole structure. The circuit board 7 has a first connecting hole 71 that matches the through hole 63, and the diameter of the through hole 63 is larger than the diameter of the first connecting hole 71. In the rigid circuit board solution, the through hole 63 on the pressure sensor 6 has a double-circular hole structure. Correspondingly, there are two first connecting holes 71 on the circuit board 7. The diameter of the through hole 63 is larger than the diameter of the first connecting hole 71. This difference in diameter forms a conical pagoda-shaped guiding mechanism, which can quickly and effectively guide the top pins of the temperature sensor 4, enabling rapid soldering and saving installation time. The pressure sensor 6 has a positioning hole 65 on one side of the through hole 63. The positioning hole 65 can accommodate a positioning pin 8. Specifically, the positioning pin 8 can be disposed in the inner cavity 21. The circuit board 7 has a second connecting hole 72 on one side of the first connecting hole 71. The second connecting hole 72 can be connected to the electrical signal output terminal of the pressure sensor 6. Using a locating pin 8 to match the housing 2 can effectively prevent misalignment caused by radial rotation of the pressure sensor 6.

[0047] like Figure 2 As shown, the assembly process of the sensor of this utility model using a flexible circuit board is exemplified below. During the assembly of the sensor of this utility model, the circuit board 7, the pressure sensing element 6, and the conductive element 12 can be connected together by soldering to form a data transmission circuit. The pressure sensing element 6 is in direct contact with the housing 2, and the positioning surface 64 of the pressure sensing element 6 is correspondingly matched with the positioning platform 25 inside the housing 2 for positioning. A sealed pressure-sensing cavity 24a is formed by the first sealing ring 5. The temperature sensing element 4 enters through the first channel 22 and through hole 63 on the housing 2 and is soldered to the circuit board 7 to form a temperature-sensitive acquisition unit. The protective tube 3 is filled with thermally conductive adhesive and then pressed into the bottom of the first channel 22. After the top edge of the housing 2 is rolled, it is fixed to the connecting element 1 by riveting. Sealant 100 is applied to the connecting edge to isolate it from the external environment. The second sealing ring 200 of the sensor installed at the client forms a sealed area with the installation body that needs to detect temperature and pressure, such as a pipeline, to prevent leakage of the measured medium.

[0048] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value. The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit this utility model. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A highly stable integrated temperature and pressure sensor, characterized in that: The high-stability temperature and pressure integrated sensor includes: Connectors; The housing has an inner cavity, the opening end of the inner cavity of the housing is connected to the connector, and the housing has a first channel and a second channel that communicate with the inner cavity and are independent of each other at the other end of the housing away from the opening end of the inner cavity; A protective tube, one end of which is located inside the first channel, and the other end of which extends out of the first channel; A pressure sensor is placed in the inner cavity, the pressure sensor is connected to the second channel, and the pressure sensor is provided with a through hole; A temperature sensor, one end of which is located inside the protective tube, and the other end of which passes through the through hole via the first channel; And a circuit board, placed in the inner cavity and located on the pressure sensor, one end of the circuit board is electrically connected to the connector, and the other end of the circuit board is electrically connected to the temperature sensor and the pressure sensor. The bottom of the inner cavity has a groove communicating with the second channel. A first sealing ring is provided in the groove. The first sealing ring, the groove, and the pressure sensing element form a pressure-sensing cavity. The through hole is an eccentrically arranged waist-shaped hole or a round hole. The edge of the pressure sensing element has a positioning surface. The bottom of the inner cavity has a positioning platform that matches the positioning surface.

2. The high-stability temperature and pressure integrated sensor according to claim 1, characterized in that: The circuit board has a first connecting hole that mates with the circular hole, and the diameter of the first connecting hole is smaller than the diameter of the circular hole.

3. The high-stability temperature and pressure integrated sensor according to claim 1, characterized in that: The pressure sensor is provided with a positioning hole, and the bottom of the inner cavity has a positioning pin that matches the positioning hole.

4. The high-stability temperature and pressure integrated sensor according to claim 1, characterized in that: The circuit board is either a flexible circuit board or a rigid circuit board.

5. The high-stability temperature and pressure integrated sensor according to claim 1, characterized in that: The pressure sensing element is a ceramic capacitor, and the temperature sensing element is a thermistor.

6. The high-stability temperature and pressure integrated sensor according to claim 1, characterized in that: The connector includes a connector body and a conductive element located within the connector body.

7. The high-stability temperature and pressure integrated sensor according to claim 6, characterized in that: The conductive element is welded to the circuit board or connected by an elastic element.

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