Chip testing device
By introducing a spring floating mechanism into the chip testing device, the problem of unevenness or misalignment between the probe module and the chip contact surface was solved, achieving stable and accurate chip testing, improving yield, and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-04-14
AI Technical Summary
In the existing technology for testing BGA chips, unevenness or misalignment between the probe module and the chip contact surface leads to unstable and inaccurate testing, affecting the test results.
A chip testing device was designed, comprising a base, a top cover, a probe module, and a spring floating mechanism. The top cover can be flipped through a hinge mechanism, and the spring floating mechanism contacts the chip when the top cover is closed, providing a horizontal floating range to compensate for unevenness or misalignment of the contact surface and ensure stable contact between the probe module and the chip.
It improves the reliability and accuracy of chip testing, reduces testing errors, is applicable to chips of different sizes and specifications, increases yield, and reduces production costs.
Smart Images
Figure CN224122623U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of automation equipment technology, and in particular to a chip testing device. Background Technology
[0002] BGA, short for Ball Grid Array, is a widely used packaging technology in the integrated circuit field. It uses an organic substrate as the packaging material. BGA packaging technology has several significant advantages: First, it effectively reduces the package area, making electronic devices more compact and lightweight; second, BGA packaging technology enhances chip functionality, significantly increasing the number of pins to meet the needs of complex circuit designs; third, during PCB soldering, BGA packages can self-center, facilitating soldering and improving production efficiency and soldering quality; furthermore, BGA packaging offers high reliability, excellent electrical performance, and lower overall cost, making it highly favored in electronic product manufacturing.
[0003] The chip manufacturing process mainly includes multiple stages such as chip design, wafer fabrication, packaging, and testing. Although smart chips are widely used in various fields, improvements in yield and production capacity have not seen a significant leap. Chip testing, as a crucial step in the manufacturing process, aims to comprehensively test the chip's performance, reliability, and other indicators, obtaining a series of key data to improve and optimize the chip manufacturing process, thereby increasing yield.
[0004] However, in the current testing process of BGA chips using testing equipment, various factors, such as manufacturing tolerances, assembly errors, and thermal expansion during testing, may cause slight unevenness or misalignment on the contact surface between the probe module and the BGA chip under test. In such cases, the probe may not be able to make stable and accurate contact with the test points of the BGA chip, thus adversely affecting the test results.
[0005] Therefore, in response to the aforementioned problems in current BGA chip testing technology, it is urgent to make necessary improvements and optimizations to enhance the stability and accuracy of testing, ensure the reliability of chip test results, and provide strong support for improving chip production quality.
[0006] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content
[0007] This invention provides a chip testing device to solve the problems existing in the prior art.
[0008] To achieve the above objectives, this utility model provides the following technical solution:
[0009] A chip testing apparatus includes a base, a top cover, a probe module, and a spring floating mechanism; wherein,
[0010] The upper cover is mounted on the base in a hinged manner;
[0011] The probe module is disposed on the base; the probe module is provided with a receiving slot for placing the chip, and can contact the chip placed in the receiving slot to establish an electrical connection.
[0012] The spring-floating mechanism is located on the side of the upper cover facing the base when the upper cover is closed on the base, and can contact the chip to be tested when the upper cover is closed on the base, so as to allow the chip to float in the horizontal direction.
[0013] Furthermore, in the chip testing device, the spring floating mechanism includes a floating support base, a floating spring, and a floating block;
[0014] The floating support is disposed on the side facing the base when the upper cover is closed on the base;
[0015] A sliding groove is provided on the floating support base;
[0016] The floating spring is disposed in the groove, with one end abutting against the bottom of the groove and the other end abutting against the floating block.
[0017] Furthermore, in the chip testing device, the floating block is a heat sink;
[0018] The floating block can contact the chip when the upper cover is closed on the base to dissipate heat from the chip.
[0019] Furthermore, in the chip testing device, a thermally conductive layer is attached to the surface of the floating block that contacts the chip.
[0020] Furthermore, in the chip testing device, the interior of the floating block is hollow, and at least two sides of the floating block are provided with a plurality of heat dissipation fins, the gaps between the heat dissipation fins communicating with the interior of the floating block.
[0021] Furthermore, in the chip testing device, the upper cover includes a cover body, a rotating handle, and a stud;
[0022] The cover is provided with threaded holes;
[0023] The stud passes through the threaded hole, and its upper end is fixedly connected to the rotating handle, while its lower end is connected to the spring floating mechanism.
[0024] By rotating the rotary handle, the stud can be moved up and down in the threaded hole, thereby driving the spring floating mechanism to move up and down.
[0025] Furthermore, in the chip testing device, a handle limiting post is provided at the top of the stud;
[0026] There are two handle limiting posts, which are used to limit the rotation angle of the rotary handle in two directions.
[0027] Furthermore, in the chip testing device, a guide pin hole is provided on the side of the upper cover facing the base when the upper cover is closed on the base;
[0028] The base is provided with a guide pin that can mate with the guide pin hole.
[0029] Furthermore, in the chip testing device, the upper cover and the base are locked together by a fastening mechanism after being closed;
[0030] The fastening mechanism includes a hook and a fastener;
[0031] The hook is provided on the upper cover;
[0032] The fastener is mounted on the base and can be adapted to engage with the hook.
[0033] Furthermore, in the chip testing device, the formula for the torque of the rotating handle is:
[0034] ;
[0035] The formula for the force applied to the rotary handle is:
[0036] ;
[0037] Where T is the torque of the rotating handle; d is the nominal diameter of the stud, in mm; F1 is the downward force, in N; d2 is the pitch diameter of the stud, in mm; Φ is the thread helix angle; ρ v ρ is the equivalent friction angle of the thread. v= arctanμ v μ v D is the equivalent friction coefficient of the thread; μ is the friction coefficient between the nut and the supporting surface of the connected part; w d0 is the major diameter of the nut support surface; d0 is the diameter of the threaded hole; K is the tightening torque coefficient; F2 is the force applied to the rotary handle; and L1 is the lever arm.
[0038] Compared with the prior art, the present invention has the following beneficial effects:
[0039] This invention provides a chip testing device that utilizes a spring-floating mechanism on the side of the upper cover facing the base when the upper cover is closed. This mechanism allows the chip under test to contact the chip when the upper cover is closed, providing a small floating range to allow the chip to float horizontally. This compensates for minor unevenness or misalignment of the contact surface between the probe module and the chip, ensuring stable and accurate contact between the probe module and the chip's test points. This reduces testing errors and misjudgments caused by poor contact, thereby improving the reliability of test results. Furthermore, it has good adaptability, suitable for BGA chips of different sizes and specifications, further enhancing its application value in actual production. In practical applications, this improvement is expected to increase chip production yield, reduce production costs, and drive the entire integrated circuit industry towards higher quality and higher efficiency.
[0040] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description
[0041] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0042] Figure 1 This is a schematic diagram of the structure of a chip testing device (unlocked) provided in an embodiment of this utility model;
[0043] Figure 2 This is a schematic diagram of the structure of a chip testing device (locking) provided in an embodiment of this utility model;
[0044] Figure 3 This is a schematic diagram of the structure of a chip testing device (with a separate top cover and base) provided in an embodiment of this utility model;
[0045] Figure 4 This is a schematic diagram of the structure of the top cover provided in an embodiment of this utility model;
[0046] Figure 5This is a schematic diagram of the structure of the base and chip provided in this embodiment of the utility model;
[0047] Figure 6 This is a schematic diagram of the structure of the base and probe module provided in this embodiment of the utility model;
[0048] Figure 7 This is a schematic diagram (side sectional view) of a chip testing device provided in an embodiment of the present invention;
[0049] Figure 8 This is a schematic diagram of the structure of the floating block provided in an embodiment of this utility model.
[0050] Figure label:
[0051] 1. Base, 2. Top cover, 3. Probe module, 4. Spring floating mechanism, 5. Guide pin, 6. Guide pin hole, 7. Hook, 8. Buckle, 9. Chip, 10. Receiving slot.
[0052] Cover 201, rotating handle 202, stud 203, handle limit post 204;
[0053] Floating support base 401, floating spring 402, floating block 403, slide groove 404, heat dissipation fins 405. Detailed Implementation
[0054] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.
[0055] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.
[0056] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.
[0057] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.
[0058] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.
[0059] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.
[0060] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.
[0061] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0062] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0063] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.
[0064] Please refer to Figure 1-8 This utility model provides a chip testing device. The device is carefully designed and includes core components such as a base 1, a top cover 2, a probe module 3, and a spring floating mechanism 4. The structure and functional characteristics of each component will be described in detail below.
[0065] First, the upper cover 2 is connected to the base 1 via a precise hinge mechanism, achieving a flip-up design. This design not only facilitates chip loading and unloading for operators but also ensures a tight fit between the upper cover and the base during testing, providing a stable environment for subsequent testing.
[0066] Secondly, the probe module 3 is cleverly placed on the base 1, and its interior is specially provided with a receiving slot 4 for accommodating the chip 9. When the chip 9 is placed in the receiving slot 4, the probe module 3 can achieve an effective electrical connection with the chip 9, which is a key step in chip performance testing.
[0067] Of particular note is that the spring-floating mechanism 4 in this embodiment is carefully positioned on the side of the upper cover 2 facing the base 1 when it is closed. The ingenious design of this mechanism allows the spring-floating mechanism 4 to contact the chip 9 under test when the upper cover 2 is in place, providing it with a small horizontal floating range. This floating mechanism greatly compensates for any minor unevenness or misalignment that may exist between the probe module 3 and the chip 9, thus ensuring that the probe module 3 can establish a stable and accurate connection with the test points of the chip 9.
[0068] This design not only effectively reduces testing errors and misjudgments caused by poor contact, but also significantly improves the reliability and accuracy of test results. Furthermore, this chip testing device demonstrates excellent adaptability, easily handling the testing needs of chips of different sizes and specifications, which undoubtedly further enhances its application value in real-world production environments.
[0069] From a broader perspective, the implementation of this innovative design is expected to have a profound impact on the chip manufacturing industry. It will not only improve chip yield and reduce production cost waste caused by inaccurate testing, but also potentially propel the entire integrated circuit industry towards a higher quality and more efficient development path.
[0070] In conclusion, the chip testing device provided in this embodiment, with its unique design concept and excellent performance, will undoubtedly play a pivotal role in the future field of chip testing.
[0071] Please refer to this again. Figure 4 and 7 To gain a more detailed understanding of one specific implementation of this embodiment, the spring floating mechanism 4 is carefully designed to include three key components: a floating support 401, a floating spring 402, and a floating block 403. Its structural layout and functional characteristics will be described in detail below.
[0072] First, the floating support 401 is securely mounted on the side of the upper cover 2 facing the base 1 when the upper cover 2 is closed on the base 1. This position ensures that when the upper cover 2 is closed with the base 1, the floating support 401 can be accurately positioned and support the subsequent floating mechanism, providing a stable support foundation for the chip 9 testing.
[0073] A groove 404 is specially designed on the floating support 401. This groove not only provides a sliding track for the floating block 403, but also restricts its direction and range of movement, ensuring that the floating block 403 can move smoothly along a predetermined path when subjected to force.
[0074] Next, the floating spring 402 is cleverly placed within the groove 404. One end of the floating spring 402 is in close contact with the bottom of the groove 404, while the other end abuts against the floating block 403. This design allows the floating spring 402 to provide corresponding elastic force according to the deformation of the floating block 403 when it is subjected to external force, thereby enabling the floating block 403 to float slightly in the horizontal direction.
[0075] In summary, the spring floating mechanism 4 in this embodiment, through the ingenious combination of the floating support 401, the floating spring 402, and the floating block 403, achieves slight horizontal floating support for the chip 9. This design not only effectively compensates for minor unevenness or misalignment between the contact surfaces of the probe module 3 and the chip 9, but also ensures that the probe module 3 can stably and accurately contact the test points of the chip 9, further improving the reliability and accuracy of chip testing.
[0076] In one specific embodiment of this invention, the floating block 403 in the spring floating mechanism 4 is specially designed and innovated, and is configured to function as a heat dissipation block. This design will be described in detail below:
[0077] In this embodiment, the floating block 403 not only provides floating support but also has a heat dissipation function. This means that, while maintaining its original floating characteristics, the material selection and structural design of the floating block 403 take into account the heat dissipation requirements.
[0078] When the top cover 2 is closed on the base 1, the floating block 403 will make close contact with the chip 9. This contact not only ensures that the probe module can stably and accurately contact the test points of the chip 9, but also provides an effective heat dissipation path for the chip 9. Through the heat dissipation design of the floating block 403, the chip 9 can dissipate the heat generated during the test, thereby avoiding the impact of overheating on chip performance and ensuring the accuracy and reliability of the test results.
[0079] In summary, the floating block 403 in this embodiment, designed as a heat sink, not only supports the slight horizontal floating of the chip 9 but also provides heat dissipation, further enhancing the performance and practicality of the chip testing device. This innovative design helps improve the efficiency and accuracy of chip testing, providing strong support for the production and testing of integrated circuits.
[0080] In a specific and detailed embodiment of this invention, to further enhance the functional effect of the floating block 403 as a heat sink, a thermally conductive layer is specially attached to the surface of the floating block 403 that contacts the chip 9. The following is a detailed description of this design:
[0081] The floating block 403, as an important component of the spring floating mechanism 4, needs to provide stable floating support and effectively help the chip 9 dissipate heat when it comes into contact with the chip 9. To achieve this goal, a layer of material with high thermal conductivity, namely a thermally conductive layer, is attached to the surface of the floating block 403 that is in direct contact with the chip 9.
[0082] The selection and design of this thermal conductive layer took into account several factors, including its thermal conductivity, heat resistance, and compatibility with the chip and floating block materials. The high thermal conductivity of the thermal conductive layer ensures that the heat generated by the chip 9 can be quickly and effectively transferred to the floating block 403, and then dissipated into the surrounding environment through the floating block 403.
[0083] By attaching a thermally conductive layer, the heat dissipation capability of the floating block 403 is further enhanced, enabling chip 9 to remain within a relatively stable temperature range during chip testing, thus avoiding performance degradation or testing errors caused by overheating. At the same time, this design also improves the reliability and durability of the chip testing device, providing strong support for long-term, continuous testing operations.
[0084] In summary, the design of attaching a thermally conductive layer to the contact surface between the floating block 403 and the chip 9 in this embodiment is a practical and innovative solution that effectively improves the heat dissipation performance of the chip testing device.
[0085] Please refer to this again. Figure 8 To gain a deeper understanding of another innovative design in this embodiment. In this embodiment, the structure of the floating block 403 is further optimized; specifically, its interior is designed as a hollow structure, and at least two sides are provided with a plurality of heat dissipation fins 405. The following is a detailed description of this design:
[0086] The floating block 403, as a key component in the spring floating mechanism 4, not only provides floating support and heat dissipation, but also enhances its heat dissipation effect through its hollow internal design and heat dissipation fins 405 on the side.
[0087] The hollow design of the floating block 403 provides it with a larger space for heat conduction and convection. When the heat generated by the chip 9 is transferred to the floating block 403 through the thermal conductive layer, this heat can diffuse and conduct more freely within the internal space of the floating block 403.
[0088] The floating block 403 has several heat dissipation fins 405 on at least two sides, which further increase its contact area with the surrounding air and improve the efficiency of heat exchange. The gaps between these heat dissipation fins 405 are connected to the interior of the floating block 403, forming an effective heat dissipation channel. When air flows through these gaps, it can carry away the heat inside the floating block 403, thereby accelerating heat dissipation.
[0089] This design not only improves the heat dissipation capacity of the floating block 403, but also enables the entire chip testing device to maintain stable performance during long-term, high-load testing. At the same time, the addition of heat dissipation fins 405 does not affect the floating characteristics of the floating block 403; it can still provide stable floating support for the chip 9 under the action of the spring floating mechanism 4.
[0090] In summary, the design of the floating block 403 in this embodiment, which has a hollow interior and heat dissipation fins 405 on its sides, is a highly efficient and innovative heat dissipation solution. It fully utilizes the structural characteristics of the floating block 403, improving heat dissipation efficiency by increasing the paths for heat conduction and convection.
[0091] Please refer to this again. Figure 3 This document provides a detailed understanding of the specific structural design and functional characteristics of the upper cover 2 in this embodiment. In this embodiment, the upper cover 2 is meticulously designed to include three main components: a cover body 201, a rotating handle 202, and a stud 203. The structural layout and working principle of these components will be described in detail below.
[0092] The cover 201, as the main body of the upper cover 2, is structurally robust and stable, providing necessary cover and protection when it is fitted onto the base 1. Threaded holes are specially provided on the cover 201, providing a basis for the subsequent installation and adjustment of the studs 203.
[0093] The rotary handle 202 is fixedly connected to the upper end of the stud 203. The rotary handle 202 is designed with ergonomic principles in mind, and its shape and size are convenient for the operator to grip and rotate. By rotating the handle 202, the operator can easily control the up and down movement of the stud 203.
[0094] The stud 203, as a key component connecting the rotary handle 202 and the spring floating mechanism 4, passes through a threaded hole on the cover 201 and forms a threaded engagement with the threaded hole. This threaded engagement allows the stud 203 to move up and down within the threaded hole under the action of the rotary handle 202. The lower end of the stud 203 is connected to the spring floating mechanism 4; therefore, when the stud 203 moves up and down, it drives the spring floating mechanism 4 to move up and down as well.
[0095] By rotating the rotary handle 202, the operator can precisely control the up and down position of the spring floating mechanism 4. This design not only facilitates the debugging and maintenance of the chip testing device, but also allows the spring floating mechanism 4 to be adjusted in up and down position according to different testing requirements, thereby ensuring that the probe module 3 can stably and accurately contact the test points of the chip 9.
[0096] In summary, the upper cover 2 in this embodiment achieves vertical position adjustment of the spring floating mechanism 4 through the ingenious combination of the cover body 201, the rotating handle 202, and the stud 203. This design not only improves the flexibility and practicality of the chip testing device but also provides operators with a more convenient and efficient testing experience.
[0097] Please refer to this again. Figure 1 To further understand the detailed design of the upper cover 2 structure in this embodiment. In this embodiment, a handle limiting post 204 is specially provided at the top of the stud 203. This design precisely limits the rotation angle of the rotating handle 202. The following is a detailed explanation of this design:
[0098] The stud 203, as a key component connecting the rotary handle 202 and the spring floating mechanism 4, has two additional handle limiting posts 204 on its top. The position and shape of these two limiting posts 204 are carefully designed to ensure that they can effectively limit the rotation angle of the rotary handle 202.
[0099] Specifically, two handle limiting posts 204 are located on either side of the top of the stud 203, and they engage with corresponding parts of the rotary handle 202. When the rotary handle 202 rotates to a certain angle, it contacts one of the limiting posts 204, thus preventing it from rotating further. In this way, the rotation angle of the rotary handle 202 in both directions is limited to a defined range.
[0100] The advantage of this design is that it effectively prevents the rotary handle 202 from rotating excessively, thereby affecting the stability and accuracy of the spring floating mechanism 4. At the same time, the limited rotation angle also allows the operator to more easily and accurately control the vertical movement distance of the stud 203 when rotating the rotary handle 202.
[0101] In summary, the design of setting a handle limiting post 204 on the top of the stud 203 in this embodiment is a practical and innovative solution.
[0102] Please refer to this again. Figure 3-4 This is to gain a deeper understanding of the connection and positioning method between the upper cover 2 and the base 1 in this embodiment. In this embodiment, to ensure that the upper cover 2 can be accurately and stably positioned when it is closed on the base 1, a guide pin hole 6 is provided on the side of the upper cover 2 facing the base 1, and a guide pin 5 that can cooperate with the guide pin hole 6 is correspondingly provided on the base 1. The following is a detailed description of this design:
[0103] When the upper cover 2 is closed onto the base 1, its side facing the base 1 is carefully designed to include guide pin holes 6. The position, size, and shape of these guide pin holes 6 are precisely calculated to ensure that they can perfectly match the guide pins 5 on the base 1.
[0104] The base 1, as the foundation of the chip testing device, has guide pins 5 arranged in its structure corresponding to the guide pin holes 6 of the upper cover 2. The positions of these guide pins 5 on the base 1 correspond one-to-one with the guide pin holes 6 of the upper cover 2. When the upper cover 2 is closed on the base 1, the guide pins 5 will be accurately inserted into the guide pin holes 6.
[0105] With the cooperation of guide pin 5 and guide pin hole 6, the upper cover 2 can be accurately positioned when it is closed on the base 1. This positioning method not only ensures a tight connection between the upper cover 2 and the base 1, but also prevents the upper cover 2 from shaking or shifting during the test, thereby ensuring the stability and accuracy of the chip testing device.
[0106] Furthermore, the cooperation between the guide pin 5 and the guide pin hole 6 makes the closing process of the upper cover 2 smoother and more convenient. The operator only needs to align the upper cover 2 with the base 1 and then press it down gently. The guide pin 5 will then naturally insert into the guide pin hole 6, completing the closing of the upper cover 2 and the base 1.
[0107] In summary, the design of the guide pin hole 6 on the upper cover 2 and the guide pin 5 on the base 1 in this embodiment is a practical and innovative connection and positioning method. It not only improves the stability and accuracy of the chip testing device but also provides operators with a more convenient and efficient closing experience.
[0108] Please refer to this again. Figure 3-4 Sections 7 and 8 are provided for a detailed understanding of the locking mechanism between the upper cover 2 and the base 1 in this embodiment. In this embodiment, to ensure that the upper cover 2 and the base 1 are securely locked together after being closed, a latching mechanism is specifically designed, which includes a hook 7 and a latch 8. The following is a detailed description of this design:
[0109] When the upper cover 2 is closed onto the base 1, it is provided with latching elements 7 at its edges or specific locations. These latching elements 7 typically have a certain degree of elasticity and toughness, allowing them to deform under external force and return to their original shape after the external force is removed. The shape and size of the latching elements 7 are carefully designed to ensure that they can perfectly fit with the fasteners 8 on the base 1.
[0110] The base 1, serving as the supporting foundation for the chip testing device, has a latching element 8 positioned corresponding to the hook 7 on the upper cover 2. The latching element 8 typically has one or more grooves or protrusions that match the shape of the hook 7 on the upper cover 2, enabling a tight engagement.
[0111] When the upper cover 2 is placed on the base 1, the operator only needs to align the upper cover 2 with the base 1 and apply a certain pressure. The hook 7 will deform under the pressure and slide smoothly into the groove or protrusion of the fastener 8. Once the hook 7 and the fastener 8 are engaged, the upper cover 2 and the base 1 will be firmly locked together and will not be easily separated.
[0112] This locking mechanism design not only ensures a tight connection between the top cover 2 and the base 1, but also improves the overall stability and durability of the chip testing device. At the same time, the locking mechanism is very simple and convenient to operate; operators can easily close and lock the top cover 2 to the base 1 without using any tools or additional fasteners.
[0113] In summary, the design of the upper cover 2 and the base 1 locked together by a fastening mechanism in this embodiment is a practical and innovative connection method. It not only improves the stability and durability of the chip testing device, but also provides operators with a more convenient and efficient experience in closing and locking the cover.
[0114] In one embodiment of this example, the torque of the rotating handle 202 and the calculation formula of the force applied to the rotating handle 202 are explained in detail to explain why this structure of pressing down by rotating the handle 202 is a labor-saving design.
[0115] First, the formula for the torque of the rotating handle 202 is:
[0116] ;
[0117] Next, the formula for the force applied to the rotating handle 202 is:
[0118] ;
[0119] Where T is the torque of the rotating handle 202; d is the nominal diameter of the stud 203, in mm; F1 is the downward force, in N; d2 is the mean diameter of the stud 203, in mm; Φ is the thread helix angle; ρ v ρ is the equivalent friction angle of the thread. v= arctan μ v μ v D is the equivalent friction coefficient of the thread; μ is the friction coefficient between the nut and the supporting surface of the connected part; w d0 is the major diameter of the nut support surface; d0 is the diameter of the threaded hole; K is the tightening torque coefficient; F2 is the force applied to the rotating handle 202; and L1 is the lever arm.
[0120] Understandably, this design saves effort primarily because it utilizes the lever principle. By increasing the length of the lever arm L1, the force F2 applied to the rotating handle 202 can be significantly reduced while maintaining the same torque T. Thus, the operator only needs to use a smaller force to rotate the handle 202, thereby moving the stud 203 up and down, which in turn drives the spring floating mechanism 4 to press down or lift.
[0121] In summary, the rotary handle 202 design in this embodiment achieves a labor-saving structure through reasonable torque and force calculation formulas and the use of the lever principle. This design not only allows operators to more easily control the up-and-down movement of the spring floating mechanism, but also improves work efficiency and comfort.
[0122] Although this application frequently uses terms such as "base" and "top cover," the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.
[0123] This invention provides a chip testing device that, when the upper cover is closed on the base, features a spring-floating mechanism on the side facing the base. This mechanism allows the chip under test to contact the chip when the upper cover is closed, providing a small floating range to allow the chip to float horizontally. This compensates for minor unevenness or misalignment of the contact surface between the probe module and the chip, ensuring stable and accurate contact between the probe module and the chip's test points. This reduces testing errors and misjudgments caused by poor contact, thereby improving the reliability of test results. Furthermore, it has good adaptability, suitable for chips of different sizes and specifications, further enhancing its application value in actual production. In practical applications, this improvement is expected to increase chip production yield, reduce production costs, and drive the entire integrated circuit industry towards higher quality and higher efficiency.
[0124] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.
Claims
1. A chip testing device, characterized in that, The device includes a base (1), a top cover (2), a probe module (3), and a spring floating mechanism (4); wherein, The upper cover (2) is mounted on the base (1) in a flip-close manner via a hinge mechanism; The probe module (3) is disposed on the base (1); the probe module (3) is provided with a receiving slot (10) for placing the chip (9), and can contact the chip (9) placed in the receiving slot (10) to establish an electrical connection. The spring floating mechanism (4) is located on the side of the upper cover (2) facing the base (1) when the upper cover (2) is closed on the base (1), and can contact the chip (9) to be tested when the upper cover (2) is closed on the base (1) to allow the chip (9) to float in the horizontal direction.
2. The chip testing apparatus according to claim 1, characterized in that, The spring floating mechanism (4) includes a floating support (401), a floating spring (402), and a floating block (403). The floating support (401) is disposed on the side facing the base (1) when the upper cover (2) is closed on the base (1); A groove (404) is provided on the floating support (401). The floating spring (402) is disposed in the groove (404), with one end abutting against the bottom of the groove (404) and the other end abutting against the floating block (403).
3. The chip testing apparatus according to claim 2, characterized in that, The floating block (403) is a heat dissipation block; The floating block (403) can contact the chip (9) when the upper cover (2) is closed on the base (1) to dissipate heat from the chip (9).
4. The chip testing apparatus according to claim 3, characterized in that, A thermally conductive layer is attached to the surface of the floating block (403) that contacts the chip (9).
5. The chip testing apparatus according to claim 3, characterized in that, The interior of the floating block (403) is hollow, and at least two sides of the floating block (403) are provided with a plurality of heat dissipation fins (405), and the gaps between the heat dissipation fins (405) communicate with the interior of the floating block (403).
6. The chip testing apparatus according to claim 1, characterized in that, The upper cover (2) includes a cover body (201), a rotating handle (202), and a stud (203); The cover (201) is provided with threaded holes; The stud (203) passes through the threaded hole, and its upper end is fixedly connected to the rotating handle (202), and its lower end is connected to the spring floating mechanism (4); By rotating the rotary handle (202), the stud (203) can be moved up and down in the threaded hole, thereby driving the spring floating mechanism (4) to move up and down.
7. The chip testing apparatus according to claim 6, characterized in that, The top of the stud (203) is provided with a handle limiting post (204). There are two handle limiting posts (204), which are used to limit the rotation angle of the rotary handle (202) in two directions.
8. The chip testing apparatus according to claim 1, characterized in that, When the upper cover (2) is closed on the base (1), a guide pin hole (6) is provided on the side facing the base (1). The base (1) is provided with a guide pin (5) that can cooperate with the guide pin hole (6).
9. The chip testing apparatus according to claim 1, characterized in that, After the upper cover (2) is closed with the base (1), it is locked by a fastening mechanism; The fastening mechanism includes a hook (7) and a fastener (8); The hook (7) is provided on the upper cover (2); The buckle (8) is disposed on the base (1) and can be adapted to engage with the hook (7).
10. The chip testing apparatus according to claim 6, characterized in that, The formula for the torque of the rotating handle is: ； The formula for the force applied to the rotary handle is: ； Where T is the torque of the rotating handle; d is the nominal diameter of the stud (203) in mm; F1 is the downward force in N; d2 is the mean diameter of the stud (203) in mm; Φ is the thread helix angle; ρ v ρ is the equivalent friction angle of the thread. v= arctan μ v μ v D is the equivalent friction coefficient of the thread; μ is the friction coefficient between the nut and the supporting surface of the connected part; w d0 is the major diameter of the nut support surface; d0 is the diameter of the threaded hole; K is the tightening torque coefficient; F2 is the force applied to the rotary handle; and L1 is the lever arm.