Overlay alignment piece

Abstract

The utility model provides an overlay alignment member, the overlay alignment member comprises an overlay alignment body and a vent hole, the top surface of the overlay alignment body is recessed inwards to form a bearing groove, and the bearing groove is communicated with the vent hole. The bearing groove comprises a bearing area and a ventilation track, the ventilation track is communicated with the ventilation hole, the bearing area is used for bearing a first wafer, and the first wafer comprises a main cleavage edge and an auxiliary cleavage edge. The distance between the bearing area and the top surface of the overlay alignment body is smaller than the distance between the bottom of the ventilation track and the top surface of the overlay alignment body. The bearing groove comprises a first alignment side wall and a second alignment side wall, the first alignment side wall corresponds to the main cleavage edge, and the second alignment side wall corresponds to the auxiliary cleavage edge. When the alignment operation is carried out on the overlay alignment piece and the mask plate, the main cleavage edge of the first wafer can be horizontally and parallelly aligned with the mask plate only by aligning the first alignment side wall of the bearing groove with the horizontal edge of the mask plate, so that the alignment precision and efficiency are greatly improved.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an overlay alignment component. Background Technology

[0002] In the InP laser chip manufacturing process, the waveguide fabrication has very strict requirements on the crystal phase of the InP material. Therefore, when making the alignment marks (i.e. the second alignment marks of the mask) on the InP wafer, the mask needs to be perfectly parallel and aligned with the main cleavage edge of the InP wafer in the lateral direction.

[0003] Place the Inp wafer on the overlay alignment piece, observe and adjust the main cleavage edge of the Inp wafer and the lateral edge of the mask through a microscope, so that the main cleavage edge of the Inp wafer and the lateral edge of the mask remain parallel and aligned.

[0004] When using a contact lithography machine for overlay alignment without the aid of complex technical means, deviations are unavoidable during the alignment of the main cleavage edge of the Inp wafer with the lateral edge of the mask. In addition, since the alignment efficiency is relatively low because the main cleavage edge of the Inp wafer is identified by human eyes, there may be significant deviations between different operators. Utility Model Content

[0005] This disclosure provides an overlay alignment component that improves alignment accuracy and efficiency.

[0006] In some embodiments, an overlay alignment member is provided, comprising:

[0007] Align the engraving with the main body;

[0008] A vent extends downward from the top surface of the alignment body to the bottom surface of the alignment body.

[0009] The top surface of the overlay alignment body is recessed inward to form:

[0010] The bearing groove is connected to the vent hole;

[0011] The bearing groove includes:

[0012] The bearing region is used to support the first wafer; the first wafer includes a main cleavage edge and a secondary cleavage edge;

[0013] A ventilation track is connected to the ventilation hole; the distance between the bearing area and the top surface of the overlay alignment body is less than the distance between the bottom of the ventilation track and the top surface of the overlay alignment body.

[0014] The first alignment sidewall is horizontally set along the width direction of the alignment body and is set corresponding to the main cleavage edge;

[0015] The second alignment sidewall is vertically arranged along the length direction of the alignment body and is arranged corresponding to the secondary cleavage edge.

[0016] The above technical solution has the following beneficial effects: This disclosure provides an overlay alignment component, which includes an overlay alignment body and a vent hole. The vent hole extends downward from the top surface of the overlay alignment body to the bottom surface of the overlay alignment body. Air in the vent hole can be drawn away, creating a pressure difference between the front and back surfaces of the structural component covering the vent hole. The force generated by the pressure difference presses the structural component tightly onto the overlay alignment body. The top surface of the overlay alignment body is recessed inward to form a support groove, which is connected to the vent hole. Air in the support groove can flow out through the vent hole. The support groove includes a support area for supporting a first wafer, which includes a main cleavage edge and a secondary cleavage edge. The support groove also includes a venting track, which is connected to the vent hole. Air in the venting track can flow out through the vent hole. The distance between the support area and the top surface of the overlay alignment body is less than the distance between the bottom of the venting track and the top surface of the overlay alignment body. A first wafer is placed in the support area, with a gap between the first wafer and the bottom of the venting track containing air. This means the venting track contains air. The air in the venting track can flow out through vent holes, creating a pressure difference between the front and back sides of the first wafer. The force generated by this pressure difference presses the first wafer tightly against the support area. The support groove includes a first alignment sidewall and a second alignment sidewall. The first alignment sidewall is horizontally positioned along the width direction of the overlay alignment body and corresponds to the principal cleavage edge of the first wafer, ensuring that the first alignment sidewall and the principal cleavage edge of the first wafer are parallel. The second alignment sidewall is vertically positioned along the length direction of the overlay alignment body and corresponds to the secondary cleavage edge of the first wafer, ensuring that the second alignment sidewall and the secondary cleavage edge of the first wafer are parallel. When aligning the alignment component with the mask, simply aligning the first alignment sidewall of the carrier groove with the lateral edge of the mask achieves parallel alignment of the main cleavage edge of the first wafer with the lateral edge of the mask, greatly improving the accuracy and efficiency of the alignment.

[0017] In some embodiments, an overlay alignment member is provided, further comprising:

[0018] Alignment marks are provided on the top surface of the overlay alignment body, located between the bearing groove and the edge of the overlay alignment body.

[0019] The above technical solution has the following beneficial effects: the overlay alignment component also includes alignment marks, which can be set to correspond with the first alignment mark of the mask.

[0020] The alignment mark is located between the bearing groove and the edge of the overlay alignment body, so that the alignment mark corresponds to the first alignment mark of the mask. The alignment mark is set on the top surface of the overlay alignment body, making it easy to observe whether the alignment mark is aligned with the first alignment mark of the mask.

[0021] In some embodiments, an overlay alignment member is provided, wherein the ventilation track includes:

[0022] The first sub-ventilation track is a circular ventilation track;

[0023] The second sub-ventilation track is connected to the first sub-ventilation track at both ends and to the vent in the middle;

[0024] The third sub-ventilation track is connected to the first sub-ventilation track at both ends and to the vent in the middle.

[0025] The above technical solution has the following beneficial effects: The ventilation track includes a first sub-ventilation track, a second sub-ventilation track, and a third sub-ventilation track. The first sub-ventilation track is a ring-shaped ventilation track. The two ends of the second sub-ventilation track are connected to the first sub-ventilation track, and the middle of the second sub-ventilation track is connected to a vent, so that air in the first sub-ventilation track enters the vent through the second sub-ventilation track and then flows out through the vent. The two ends of the third sub-ventilation track are connected to the first sub-ventilation track, and the middle of the third sub-ventilation track is connected to a vent, so that air in the first sub-ventilation track enters the vent through the third sub-ventilation track and then flows out through the vent.

[0026] In some embodiments, an overlay alignment member is provided, and the ventilation track further includes:

[0027] The fourth sub-ventilation track is located within the first sub-ventilation track and is connected to the second sub-ventilation track and the third sub-ventilation track.

[0028] The above technical solution has the following beneficial effects: the ventilation track also includes a fourth sub-ventilation track, which is connected to the second and third sub-ventilation tracks. This allows air from the fourth sub-ventilation track to enter the ventilation hole through the second and third sub-ventilation tracks and then flow out through the ventilation hole. The fourth sub-ventilation track is located within the first sub-ventilation track and extends along the inner wall of the first sub-ventilation track, forming a nested structure to optimize the airflow path.

[0029] In some embodiments, an overlay alignment member is provided, wherein the distance between the bearing area and the top surface of the overlay alignment body is greater than or equal to the thickness of the first wafer.

[0030] The above technical solution has the following beneficial effects: the distance between the carrier area and the top surface of the overlay alignment body is greater than the thickness of the first wafer, ensuring that the first wafer can be placed stably on the carrier area without friction or collision with the top surface of the overlay alignment body. This design protects the first wafer from damage and ensures the accuracy of overlay alignment. The distance between the carrier area and the top surface of the overlay alignment body is equal to the thickness of the first wafer, ensuring the quality of the mask pattern on the photoresist after exposure.

[0031] In some embodiments, an overlay alignment member is provided, wherein the number of alignment marks is at least one, wherein two of the alignment marks are arranged along a first diagonal and the remaining two of the alignment marks are arranged along a second diagonal, the first diagonal and the second diagonal being perpendicular to each other.

[0032] The above technical solution has the following beneficial effects: the number of alignment marks is at least one, of which two alignment marks are set along the first diagonal and the remaining two alignment marks are set along the second diagonal. The first diagonal and the second diagonal are perpendicular to each other, so that the alignment marks are set to correspond with the first alignment mark of the mask, thereby improving the accuracy of alignment.

[0033] In some embodiments, an overlay alignment member is provided, wherein the alignment mark is a cross-shaped mark.

[0034] The above technical solution has the following beneficial effects: the alignment mark is a cross-shaped mark, which makes the alignment mark have an inclined contour under the microscope, making it easier for the alignment system of the photolithography equipment to identify and capture it.

[0035] In some embodiments, an overlay alignment member is provided, wherein the sidewall of the bearing groove is connected to the bearing area, and a first sub-ventilation track is formed between the sidewall of the bearing groove and the bearing area; or, the sidewall of the bearing groove is connected to the bearing area, and a first sub-ventilation track is formed between two adjacent bearing areas.

[0036] The above technical solution has the following beneficial effects: the sidewall of the support groove is not connected to the support area, and a first sub-ventilation track is formed between the sidewall of the support groove and the support area, so that the edge of the first wafer is suspended above the first sub-ventilation track. Alternatively, the sidewall of the support groove is connected to the support area, and a first sub-ventilation track is formed between two adjacent support areas, so that the edge of the first wafer is positioned on the support area. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;

[0039] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0040] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0041] Figure 4 An exploded view of an optical module according to some embodiments;

[0042] Figure 5 This is a structural diagram of a light emitting component according to some embodiments;

[0043] Figure 6 This is an exploded view of a light emitting component provided according to some embodiments;

[0044] Figure 7 This is a cross-sectional view of a light emitting component provided according to some embodiments;

[0045] Figure 8 This is a structural diagram of a laser chip according to some embodiments;

[0046] Figure 9 This is a structural diagram of an overlay alignment member according to some embodiments;

[0047] Figure 10 This is a front view of an overlay alignment member provided according to some embodiments;

[0048] Figure 11 This is a front view of another overlay alignment member provided according to some embodiments;

[0049] Figure 12 This is a structural diagram of a ventilation track according to some embodiments. Detailed Implementation

[0050] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0051] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0052] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0053] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0054] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into an optical signal and transmits the second optical signal to the optical fiber.

[0055] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0056] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0057] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0058] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0059] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0060] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0061] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0062] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into an optical signal and transmits the optical signal to the optical fiber 101. The optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0063] In some embodiments, the optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the optical signal into a first electrical signal and transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000.

[0064] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0065] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0066] Figure 2This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0067] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0068] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0069] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0070] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0071] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0072] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0073] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0074] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0075] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0076] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0077] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0078] like Figure 3 and Figure 4As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0079] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0080] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0081] In some embodiments, the circuit board further includes gold fingers formed on its end surfaces, the gold fingers consisting of a plurality of independent pins. (Circuit board 300VS circuit board; reference numerals are strongly indicative and should be consistent with the form shown in the figures. If the concept has more embodiments, it is not recommended to introduce reference numerals; in relation to the attached figures...) Figure 1 In the embodiments described herein, it is recommended to introduce reference numerals.

[0082] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0083] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0084] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0085] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0086] In some embodiments, the optical module includes a light emitting component 400, such as... Figure 3 and Figure 4 As shown. The light emitting component 400 is used to emit light signals.

[0087] In some embodiments, the optical module includes an optical receiving component 500, such as... Figure 3 and Figure 4 As shown. The optical receiving unit 500 is used to receive optical signals and convert them into electrical signals.

[0088] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0089] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0090] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or on the side of the circuit board 300. Figure 4As shown, the circuit board 300 may be provided with an insertion port 310. The light emitting component 400 may be placed in the insertion port 310.

[0091] In some embodiments, a DSP chip 320 may be disposed on the upper surface of the circuit board 300. The DSP chip 320 may be connected to the light emitting component 400 so that the light emitting component 400 can receive the electrical signals transmitted by the DSP chip 320 and emit light signals according to the electrical signals. The DSP chip 320 may be connected to the light receiving component 500 so that the DSP chip 320 can receive the electrical signals transmitted by the light receiving component 500 and process the electrical signals.

[0092] Figure 5 This is a structural diagram of a light emitting component according to some embodiments. Figure 6 This is an exploded view of a light emitting component provided according to some embodiments. Figure 7 This is a cross-sectional view of a light-emitting component according to some embodiments. Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, the light emitting component 400 may include a first housing 420. The first housing 420 may have an opening facing the upper housing 201. A first end of the first housing 420 may be provided with a second socket 421. An optical connector 470 may be inserted into the second socket 421 to connect the optical connector 470 to the first housing 420. A second end of the first housing 420 may be provided with a first socket 422. An electrical connector 430 may be inserted into the first socket 422 to connect the electrical connector 430 to the first housing 420.

[0093] In some embodiments, the light emitting component 400 may include a cover 410. The cover 410 closes to the opening of the first housing 420 to provide a sealed connection between the cover 410 and the first housing 420.

[0094] In some embodiments, a laser array 440 may be disposed within the first housing 420. The laser array 440 may include at least one laser chip 441, which can emit optical signals, so that the laser array 440 can emit at least one optical signal.

[0095] The laser chip 441 can be connected to one end of the electrical connector 430 by wire bonding, and the other end of the electrical connector 430 can be connected to the circuit board 300 by wire bonding, so that the laser chip 441 can receive the electrical signal transmitted by the electrical connector 430 and emit a light signal under the action of the electrical signal.

[0096] In some embodiments, a lens array 450 may be disposed within the first housing 420. The lens array 450 may be located in the light emission direction of the laser array 440 to receive the optical signal emitted by the laser array 440. The lens array 450 may be a collimating lens array so that the lens array 450 can collimate the received optical signal. The lens array 450 may include at least one first lens 451, which may be located in the light emission direction of the laser chip 441.

[0097] In some embodiments, a first optical multiplexer 460 may be disposed within the first housing 420. The first optical multiplexer 460 may be located in the collimation direction of the lens array 450. The first optical multiplexer 460 can combine multiple optical signals of different wavelengths into a single optical signal comprising multiple different wavelengths.

[0098] In some embodiments, one end of the optical connector 470 can be inserted into the second jack 421 to seal the optical connector 470 to the first housing 420. A second lens, which is a converging lens, can be placed in the middle of the optical connector 470. The second lens can be located in the light-emitting direction of the first optical multiplexer 460 to converge the optical signal emitted from the first optical multiplexer 460. The other end of the optical connector 470 can hold an optical fiber ferrule, which can be located in the direction of the second lens to converge the optical signal to the optical fiber ferrule 4742 via the second lens.

[0099] Figure 8 This is a structural diagram of a laser chip according to some embodiments. Figure 8 As shown, in some embodiments, the laser chip 441 may include a first semiconductor layer 4411. The material of the first semiconductor layer 4411 may be n-type doped InP (indium phosphide).

[0100] In some embodiments, the laser chip 441 may include an active layer 4412. The active layer 4412 may be located above and connected to the first semiconductor layer 4411. The active layer 4412 may emit light signals of a specific wavelength. The material of the active layer 4412 may be InGaAsP (indium gallium arsenide phosphide) / AlGaInAs (aluminum gallium arsenide phosphide).

[0101] In some embodiments, the laser chip 441 may include a second semiconductor layer 4413. The second semiconductor layer 4413 may be located above and in contact with the active layer 4412. For example, the second semiconductor layer 4413 may be a p-type semiconductor layer. The material of the second semiconductor layer 4413 may be p-type doped InP (indium phosphide).

[0102] In some embodiments, the laser chip 441 may include a first electrode layer 4414. The first electrode layer 4414 may be located above and in contact with the second semiconductor layer 4413. For example, the first electrode layer 4414 may be a P-type electrode layer.

[0103] In some embodiments, the laser chip 441 may include a second electrode layer 4415. The second electrode layer 4415 may be located below and in contact with the first semiconductor layer 4411. For example, the second electrode layer 4415 may be an N-type electrode layer.

[0104] The second semiconductor layer 4413 forms a PN junction with the first semiconductor layer 4411. By applying a forward bias voltage, electrons are injected into the active layer 4412 from the first electrode layer 4414 through the second semiconductor layer 4413, and holes are injected into the active layer 4412 from the second electrode layer 4415 through the first semiconductor layer 4411. Electrons and holes in the active layer 4412 recombine to generate photons, enabling the laser chip 441 to generate optical signals.

[0105] The first semiconductor layer 4411 is made of n-type doped InP, the active layer 4412 is made of InGaAsP / AlGaInAs, and the second semiconductor layer 4413 is made of p-type doped InP, so that the laser chip 441 is an InP laser chip.

[0106] InP laser chips are fabricated from InP wafers using chip fabrication processes. An InP wafer includes a main cleavage edge and secondary cleavage edges. The main cleavage edge is a long, straight, flat edge at the edge of the InP wafer, indicating the main crystal orientation. The secondary cleavage edge is a shorter, flat edge located to one side of the main cleavage edge, used to supplement the identification of the crystal orientation or distinguish the conductivity type.

[0107] In the InP laser chip manufacturing process, the waveguide fabrication process has very strict requirements on the crystal phase of the InP wafer. Therefore, when fabricating alignment marks (i.e., the second alignment marks of the mask) on the InP wafer, the lateral edge of the mask needs to be completely parallel and aligned with the main cleavage edge of the InP wafer.

[0108] Place the Inp wafer on the overlay alignment piece, observe and adjust the main cleavage edge of the Inp wafer and the lateral edge of the mask through a microscope, so that the main cleavage edge of the Inp wafer and the lateral edge of the mask are kept parallel and aligned.

[0109] This disclosure defines a wafer containing both a primary cleavage edge and a secondary cleavage edge as a first wafer, and other wafers as second wafers. For example, the first wafer may include an Inp wafer.

[0110] When using a contact lithography machine for overlay alignment without complex technical means, deviations are unavoidable during the alignment of the main cleavage edge of the first wafer with the lateral edge of the mask. Furthermore, relying on the human eye to identify the main cleavage edge of the first wafer results in low alignment efficiency, and significant deviations can occur between different operators. To address this issue, in some embodiments, a carrier groove is provided on the upper surface of the overlay alignment member. One side wall of the carrier groove corresponds to the main cleavage edge of the first wafer, and the other side wall corresponds to the secondary cleavage edge of the first wafer, enabling precise positioning of the first wafer within the carrier groove. When aligning the overlay alignment member with the mask, simply aligning the first alignment side wall of the carrier groove with the lateral edge of the mask achieves parallel alignment of the main cleavage edge of the first wafer with the lateral edge of the mask, greatly improving alignment accuracy and efficiency.

[0111] Figure 9 This is a structural diagram of an overlay alignment member provided according to some embodiments. Figure 10 This is a front view of an overlay alignment member provided according to some embodiments. Figure 11 This is a front view of another overlay alignment member provided according to some embodiments. Figure 10 and Figure 11 These are all front views of the aligned parts after being cut along line A-A'. For example... Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, the overlay alignment member 900 includes an overlay alignment body 910. The top surface of the overlay alignment body 910 is recessed inward to form a carrier groove 911, which can be used to carry a wafer.

[0112] The carrier groove 911 and the first wafer can have the same external dimensions to ensure that the first wafer can be stably placed within the carrier groove 911, and that the main cleavage edge of the first wafer can be naturally aligned with one side wall of the carrier groove 911. Thus, when aligning the overlay alignment member 900 with the mask, simply aligning one side wall of the carrier groove 911 with the lateral edge of the mask achieves parallel alignment of the main cleavage edge of the first wafer with the lateral edge of the mask, greatly improving the accuracy and efficiency of the alignment. Simultaneously, because the carrier groove 911 and the first wafer have the same external dimensions, it can effectively prevent the first wafer from shifting or rotating during the photolithography process, further ensuring the accuracy and stability of the photolithography.

[0113] In some embodiments, the carrier groove 911 may include a first alignment sidewall 9111, which may be correspondingly disposed with respect to the main cleavage edge of the first wafer. The size of the first alignment sidewall 9111 of the carrier groove 911 may be equal to the size of the main cleavage edge of the first wafer. The first alignment sidewall 9111 may be horizontally disposed along the width direction of the overlay alignment body. The first alignment sidewall 9111 may be parallel to the main cleavage edge of the first wafer, and the first alignment sidewall 9111 may be in contact with the main cleavage edge of the first wafer to increase the contact area between the first alignment sidewall 9111 and the main cleavage edge of the first wafer, thereby improving the connection stability between the first alignment sidewall 9111 and the main cleavage edge of the first wafer. The first alignment sidewall restricts the main cleavage edge of the first wafer, ensuring that the main cleavage edge of the first wafer is tightly fitted with the first alignment sidewall, and preventing the first wafer from shifting in the direction of the main cleavage edge.

[0114] In some embodiments, the carrier groove 911 may include a second alignment sidewall 9112, which may be disposed corresponding to the secondary cleavage edge of the first wafer. The second alignment sidewall 9112 may be vertically disposed along the length direction of the overlay alignment body. The second alignment sidewall 9112 may be disposed parallel to the secondary cleavage edge of the first wafer, and may be in contact with the secondary cleavage edge of the first wafer to increase the contact area between the second alignment sidewall 9112 and the secondary cleavage edge of the first wafer, thereby improving the connection stability between the second alignment sidewall 9112 and the secondary cleavage edge of the first wafer. The second alignment sidewall restricts the secondary cleavage edge of the first wafer, ensuring that the secondary cleavage edge of the first wafer is tightly fitted with the second alignment sidewall, and preventing the first wafer from shifting in the direction of the secondary cleavage edge.

[0115] The first alignment sidewall 9111 of the carrier groove 911 is arranged parallel to the main cleavage edge of the first wafer, and the size of the first alignment sidewall 9111 of the carrier groove 911 is equal to the size of the main cleavage edge of the first wafer. The second alignment sidewall 9112 of the carrier groove 911 is arranged parallel to the secondary cleavage edge of the first wafer, and the size of the second alignment sidewall 9112 of the carrier groove 911 is equal to the size of the secondary cleavage edge of the first wafer, so that the carrier groove 911 and the wafer have the same shape and size.

[0116] The first and second alignment sidewalls work together to ensure precise alignment of the first wafer within the carrier groove. When aligning the alignment component with the mask, simply aligning the first alignment sidewall of the carrier groove with the lateral edge of the mask achieves parallel alignment of the main cleavage edge of the first wafer with the lateral edge of the mask, greatly improving alignment accuracy and efficiency.

[0117] In some embodiments, an alignment mark 930 may be provided on the top surface of the overlay alignment member 900 to facilitate observation of whether the alignment mark 930 is aligned with the first alignment mark of the mask. The alignment mark 930 may be located between the support groove 911 and the edge of the overlay alignment member 900 so that the alignment mark and the first alignment mark of the mask can be correspondingly set. After the main cleavage edge of the first wafer is aligned with the lateral edge of the mask, the alignment mark 930 and the first alignment mark of the mask can be observed and adjusted using a microscope or other alignment equipment to ensure precise alignment between the alignment mark 930 and the first alignment mark of the mask, further improving the alignment accuracy between the mask and the first wafer. After alignment, exposure and development can be performed to transfer the pattern of the mask onto the first wafer.

[0118] In some embodiments, the number of first alignment marks on the mask may be greater than or equal to the number of alignment marks 930. For example, the number of first alignment marks on the mask is 4, and the number of alignment marks 930 is 1, 2, 3, or 4.

[0119] In some embodiments, the number of alignment marks 930 may be at least one. One alignment mark 930 may be placed between a corner edge of the carrier groove 911 and the overlay alignment member 900. For example, one alignment mark 930 may be placed between the upper left corner edge of the carrier groove 911 and the overlay alignment member 900.

[0120] Two alignment marks 930 can be placed between one corner edge of the carrier groove 911 and the overlay alignment member 900, and the two alignment marks 930 can be arranged along the first diagonal. For example, one alignment mark 930 can be placed between the upper left corner edge of the carrier groove 911 and the overlay alignment member 900, and one alignment mark 930 can be placed between the lower right corner edge of the carrier groove 911 and the overlay alignment member 900, and the two alignment marks 930 are arranged along the diagonal.

[0121] Three alignment marks 930 can be placed between one corner edge of the carrier groove 911 and the overlay alignment member 900, respectively. Two alignment marks 930 can be set along the first diagonal, and the remaining alignment mark 930 can be placed between the remaining corner edge of the carrier groove 911 and the overlay alignment member 900. For example, one alignment mark 930 can be placed between the upper left corner edge of the carrier groove 911 and the overlay alignment member 900, one alignment mark 930 can be placed between the lower right corner edge of the carrier groove 911 and the overlay alignment member 900, and two alignment marks 930 can be set along the diagonal.

[0122] Of the four alignment marks 930, two are set along the first diagonal and the remaining two are set along the second diagonal. The first and second diagonals are perpendicular to each other, so that the alignment marks correspond to the first alignment mark on the mask, improving alignment accuracy. For example, one alignment mark 930 can be placed between the upper left edge of the carrier groove 911 and the overlay alignment member 900, one alignment mark 930 can be placed between the lower right edge of the carrier groove 911 and the overlay alignment member 900, one alignment mark 930 can be placed at the lower right corner of the carrier groove 911 and the overlay alignment member 900, and one alignment mark 930 can be placed between the upper right edge of the carrier groove 911 and the overlay alignment member 900.

[0123] In some embodiments, the alignment mark 930 can be a cross-shaped alignment mark. The design of the cross-shaped alignment mark allows it to have a clear outline under a microscope, facilitating identification and capture by the alignment system of the photolithography equipment. Furthermore, the cross-shaped alignment mark has a stable structure and is not prone to deformation or displacement during photolithography, thus ensuring the accuracy and reliability of alignment. The placement of the alignment mark 930 is carefully considered to ensure precise alignment with the alignment mark on the mask when the first wafer is exposed, thereby effectively improving the positioning accuracy and overlay accuracy of the photolithographic pattern.

[0124] In some embodiments, the overlay alignment member 900 includes a vent 920. The vent 920 extends downward from the top surface of the overlay alignment body 910 to the bottom surface of the overlay alignment body, so that the vent 920 penetrates the overlay alignment body 910. One end of the vent 920 can communicate with the carrier groove 911, and the other end of the vent 920 can communicate with the lower surface of the overlay alignment member 900, so that air between the carrier groove 911 and the first wafer can be drawn away by a vacuum pump through the vent 920, so that the first wafer is tightly mounted in the carrier groove 911.

[0125] In some embodiments, the bottom of the carrier groove 911 may include a carrier region 9113. The carrier region 9113 is used to carry the first wafer. The top surface of the carrier region 9113 may be in contact with the back surface of the first wafer so that the carrier region 9113 can carry the first wafer.

[0126] In some embodiments, the distance d1 between the carrier region 9113 and the top surface of the overlay alignment member 900 is greater than or equal to the first wafer thickness. The distance d1 between the carrier region 9113 and the top surface of the overlay alignment member 900 is equal to the first wafer thickness to ensure the quality of the mask pattern on the photoresist after exposure. The distance d1 between the carrier region 9113 and the top surface of the overlay alignment member 900 is greater than the first wafer thickness, facilitating observation of whether the first alignment sidewall of the carrier groove 911 is aligned with the lateral edge of the mask, greatly improving alignment accuracy and efficiency.

[0127] In some embodiments, the bottom of the support groove 911 may include a ventilation track 9114. The ventilation track 9114 is ventilated. The ventilation track 9114 may be connected to a vent hole 920, and the air in the ventilation track 9114 is drawn away by a vacuum pump through the vent hole 920, so that the first wafer is tightly attached to the support area 9113.

[0128] The ventilation track 9114 can be located between two adjacent support areas 9113, or between the side wall of the support groove 911 and the support area 9113. The distance d1 between the support area 9113 and the top surface of the overlay alignment member 900 is less than the distance d2 between the bottom of the ventilation track 9114 and the top surface of the overlay alignment member 900. When the first wafer is placed on the support area 9113, there is a gap between the first wafer and the bottom of the ventilation track, and air can be present in the gap, i.e., there is air in the ventilation track. When the air in the ventilation track is evacuated, a pressure difference is formed between the front and back sides of the first wafer. The force generated by the pressure difference presses the first wafer tightly onto the support area 9113.

[0129] like Figure 10 As shown, the sidewall of the support groove 911 is connected to the support area 9113, and a ventilation track 9114 is formed between two adjacent support areas 9113, so that the edge of the first wafer is set on the support area 9113.

[0130] like Figure 11 As shown, the sidewall of the support groove 911 is not connected to the support area 9113, and a ventilation track 9114 is formed between the sidewall of the support groove 911 and the support area 9113, so that the edge of the first wafer is suspended above the ventilation track 9114.

[0131] Figure 12 This is a structural diagram of a ventilation track according to some embodiments. For example... Figure 12 As shown, in some embodiments, the ventilation track 9114 may include a first sub-ventilation track 91141. The first sub-ventilation track 91141 is an annular ventilation track. The annular shape may include a closed shape such as a circle or rectangle.

[0132] Ventilation track 9114 may include a second sub-ventilation track 91142. The two ends of the second sub-ventilation track 91142 may be connected to the first sub-ventilation track 91141, and the middle of the second sub-ventilation track 91142 may be connected to the vent hole 920, so that the air in the second sub-ventilation track 91142 can enter the vent hole 920 through the first sub-ventilation track 91141, and then be output from the vent hole 920.

[0133] Ventilation track 9114 may include a third sub-ventilation track 91143. The two ends of the third sub-ventilation track 91143 can be connected to the first sub-ventilation track 91141 respectively, and the middle of the third sub-ventilation track 91143 can be connected to the vent hole 920, so that the air in the third sub-ventilation track 91143 can enter the vent hole 920 through the first sub-ventilation track 91141 and then be output from the vent hole 920.

[0134] Ventilation track 9114 may include a fourth sub-ventilation track 91144. The fourth sub-ventilation track 91144 is connected to the second sub-ventilation track 91142 and the third sub-ventilation track 91143, allowing air from the fourth sub-ventilation track 91144 to enter the vent through the second and third sub-ventilation tracks 91142 and then exit through the vent 920. The fourth sub-ventilation track 91144 may be located within the first sub-ventilation track 91141 and extend along the inner wall of the first sub-ventilation track 91141, forming a nested structure to optimize the airflow path.

[0135] The process of exposing the first wafer using the overlay alignment component disclosed herein is as follows: (1) Fix the mask on the contact exposure machine; (2) Pull the overlay alignment component out from inside the contact exposure machine and place the first wafer to be exposed in the carrier tank; (3) Adjust the first wafer to be exposed so that the main cleavage edge of the first wafer is in contact with the first alignment sidewall of the carrier tank and the secondary cleavage edge of the first wafer is in contact with the second alignment sidewall of the carrier tank; (4) Turn on the vacuum pump and the air in the ventilation track flows out through the ventilation hole, so that the first wafer is tightly attached to the carrier tank; (5) Push the overlay alignment component into the contact exposure machine; (6) Adjust the overlay alignment component under the microscope of the exposure machine so that the first alignment mark of the mask is aligned with the alignment mark on the overlay alignment component; (7) After alignment, click the exposure button to complete the exposure.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A type of alignment tool, characterized in that, include: Align the engraving with the main body; A vent extends downward from the top surface of the alignment body to the bottom surface of the alignment body. The top surface of the overlay alignment body is recessed inward to form: The bearing groove is connected to the vent hole; The bearing groove includes: The bearing region is used to support the first wafer; the first wafer includes a main cleavage edge and a secondary cleavage edge; A ventilation track is connected to the ventilation hole; the distance between the bearing area and the top surface of the overlay alignment body is less than the distance between the ventilation track and the top surface of the overlay alignment body. The first alignment sidewall is horizontally set along the width direction of the alignment body and is set corresponding to the main cleavage edge; The second alignment sidewall is vertically arranged along the length direction of the alignment body and is arranged corresponding to the secondary cleavage edge.

2. The alignment component according to claim 1, characterized in that, The ventilation track includes: The first sub-ventilation track is a circular ventilation track; The second sub-ventilation track is connected to the first sub-ventilation track at both ends and to the vent in the middle; The third sub-ventilation track is connected to the first sub-ventilation track at both ends and to the vent in the middle.

3. The alignment component according to claim 1, characterized in that, Also includes: Alignment marks are provided on the top surface of the overlay alignment body, located between the bearing groove and the edge of the overlay alignment body.

4. The alignment component according to claim 2, characterized in that, The ventilation track also includes: The fourth sub-ventilation track is located within the first sub-ventilation track and is connected to the second sub-ventilation track and the third sub-ventilation track.

5. The alignment component according to claim 1, characterized in that, The distance between the bearing area and the top surface of the overlay alignment body is greater than or equal to the thickness of the first wafer.

6. The alignment component according to claim 3, characterized in that, The number of alignment marks is at least one, with two alignment marks arranged along the first diagonal and the remaining two alignment marks arranged along the second diagonal, the first diagonal and the second diagonal being perpendicular to each other.

7. The alignment component according to claim 6, characterized in that, The alignment mark is a cross-shaped mark.

8. The alignment component according to claim 2, characterized in that, The sidewall of the bearing groove is not connected to the bearing area, and the first sub-ventilation track is formed between the sidewall of the bearing groove and the bearing area; or, the sidewall of the bearing groove is connected to the bearing area, and the first sub-ventilation track is formed between two adjacent bearing areas.

Images