Insulating patch for notebook computer

Abstract

The utility model discloses an insulating patch for a notebook computer, which comprises a main base material layer, a metal layer is fixedly arranged on the lower end face of the main base material layer, an adhesive layer connected with the metal layer is arranged on the lower end face of the metal layer, a plurality of positioning grooves are uniformly arranged on the lower end face of the adhesive layer, silica gel heat-conducting fins are arranged in the positioning grooves, and the silica gel heat-conducting fins are arranged on the lower end face of the main base material layer. A breathable ring is mounted on the upper end surface of the main base material layer. Through the synergistic effect of the metal layer, the silica gel heat conduction sheet, the heat conduction copper plate and the heat dissipation fins, heat generated by the notebook computer can be rapidly dissipated, the temperature of electronic components is effectively reduced, and the performance and stability of the notebook computer are improved. The silica gel heat-conducting strip can be accurately installed through the positioning grooves in the adhesive layer, meanwhile, the adhesive layer is made of a flame-retardant adhesive material, so that the firmness of adhesion is guaranteed, and the problem that the insulating patch falls off in the using process is solved.

Description

Technical Field

[0001] This utility model relates to the field of insulating patches, specifically an insulating patch for laptops. Background Technology

[0002] In today's rapidly developing technological world, laptops have become indispensable tools in people's lives and work. As laptop performance continues to improve, the operating speed and processing power of their internal electronic components are also becoming stronger, which leads to the generation of a lot of heat during use.

[0003] Currently, in order to ensure the normal operation of electronic components inside laptops, insulating patches are usually pasted on the surface of the electronic components. On the one hand, this can effectively separate the components and avoid mutual interference. On the other hand, it can shield and protect the components, increasing the safety of electronic component use. During the assembly stage, the patches can be directly pasted at the required locations.

[0004] However, existing insulating pads have many shortcomings. From a heat dissipation perspective, traditional insulating pads have poor heat dissipation performance. Directly attaching them to components causes heat to accumulate, making it difficult for the heat to dissipate quickly and leading to excessively high internal temperatures. Excessively high temperatures can degrade the performance of electronic components, even causing malfunctions and shortening their lifespan.

[0005] Meanwhile, some insulating patches lack adequate electromagnetic shielding. Electromagnetic interference generated by electronic components can affect each other, leading to unstable signal transmission, data loss, image flickering, and other problems, thus impacting the user experience. Utility Model Content

[0006] The purpose of this invention is to provide an insulating patch for laptops, which aims to solve the problems of poor heat dissipation and inability to shield external interference signals in existing laptop insulating patches.

[0007] This utility model is implemented as follows: An insulating patch for laptops includes a main substrate layer, a metal layer fixedly disposed on the lower end face of the main substrate layer, an adhesive layer connected to the lower end face of the metal layer, a plurality of positioning grooves evenly formed on the lower end face of the adhesive layer, a silicone thermal conductive sheet installed in the positioning grooves, a vent ring installed on the upper end face of the main substrate layer, and a plurality of heat dissipation grooves formed on the upper end face of the main substrate layer, the vent ring being adhered and fixed to the main substrate layer, and a secondary substrate layer being adhered and fixed to the upper end face of the vent ring.

[0008] Preferably, the four corners of the inner side of the air-permeable ring are provided with reinforcing corner seats, which are glued and fixed to the air-permeable ring, and the upper and lower ends of the reinforcing corner seats are fixedly connected to the sub-substrate layer and the main substrate layer, respectively.

[0009] Preferably, a heat-conducting copper plate is installed in the heat dissipation groove, the lower end face of the heat-conducting copper plate is in contact with the metal layer, and a plurality of heat dissipation fins are evenly installed on the upper end face of the heat-conducting copper plate, the heat dissipation fins and the heat-conducting copper plate are integrally formed.

[0010] Preferably, a flame-retardant layer is provided on the lower end surface of the main substrate layer, and the flame-retardant layer is formed by spraying flame-retardant material.

[0011] Preferably, the adhesive layer is formed by applying a flame-retardant adhesive material.

[0012] Preferably, both the main substrate layer and the sub-substrate layer are made of PET material.

[0013] Preferably, it also includes a temperature measuring wire, one end of which passes through the vent ring and the heat dissipation groove, and a temperature measuring probe that is in contact with the metal layer is connected to the temperature measuring wire.

[0014] Compared with existing technologies, the beneficial effects of this utility model are as follows: This application, through the synergistic effect of a metal layer, a silicone thermal conductive sheet, a thermally conductive copper plate, and heat dissipation fins, can quickly dissipate the heat generated by the laptop, effectively reducing the temperature of electronic components and improving the performance and stability of the laptop. The positioning grooves on the adhesive layer allow for accurate installation of the silicone thermal conductive sheet, while the use of flame-retardant adhesive material in the adhesive layer ensures a firm bond, preventing the insulating patch from falling off during use. Furthermore, the reinforced corner brackets enhance the connection stability between the vent ring and the main and secondary substrate layers, making the insulating patch less susceptible to damage under external forces and extending its service life. Moreover, the use of the flame-retardant layer and flame-retardant adhesive material improves the flame-retardant performance of the insulating patch, reducing the risk of fire and protecting the safety of the laptop and the user. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 yes Figure 1 An exploded view of the device shown.

[0017] Figure 3 This is an exploded structural diagram of the metal layer, adhesive layer and silicone thermal conductive sheet in an embodiment of this utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the breathable ring in an embodiment of this utility model;

[0019] Figure 5 This is a perspective view of the main substrate layer in an embodiment of this utility model;

[0020] Figure 6This is a perspective view of the thermally conductive copper plate and heat dissipation fins in an embodiment of this utility model.

[0021] In the diagram: 1. Main substrate layer; 10. Heat dissipation groove; 101. Thermally conductive copper plate; 102. Heat dissipation fins; 11. Flame retardant layer; 2. Metal layer; 3. Adhesive layer; 30. Positioning groove; 301. Silicone thermally conductive sheet; 4. Ventilation ring; 41. Reinforcing corner bracket; 5. Sub-substrate layer; 6. Temperature measuring wire; 61. Temperature measuring probe. Detailed implementation method:

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] The following description, in conjunction with the accompanying drawings and specific embodiments, provides further details:

[0024] Example 1

[0025] Reference Figure 1 , Figure 2 and Figure 3As shown, an insulating patch for laptops includes a main substrate layer 1, a metal layer 2 fixedly disposed on the lower end face of the main substrate layer 1, an adhesive layer 3 connected to the lower end face of the metal layer 2, a plurality of positioning grooves 30 evenly formed on the lower end face of the adhesive layer 3, and silicone thermal conductive sheets 301 installed in the positioning grooves 30. A vent ring 4 is installed on the upper end face of the main substrate layer 1, and a plurality of heat dissipation grooves 10 are formed on the upper end face of the main substrate layer 1. The vent ring 4 is adhered and fixed to the main substrate layer 1, and a secondary substrate layer 5 is adhered and fixed to the upper end face of the vent ring 4. The main substrate layer 1 provides the basic support structure for the entire insulating patch. The metal layer 2 has good electrical and thermal conductivity, which can quickly conduct heat away and, in some cases, can shield electromagnetic interference. The adhesive layer 3 is used to attach the insulating patch to the corresponding part of the laptop. The positioning groove 30 allows the silicone thermal pad 301 to be accurately installed. The silicone thermal pad 301 has good thermal conductivity, which can better transfer the heat generated by the laptop to the metal layer 2, and then dissipate it through the heat dissipation groove 10. The vent ring 4 can both separate the main substrate layer 1 and the sub-substrate layer 5 and protect the space between them. At the same time, the vent ring 4 allows air circulation, which helps with heat dissipation. The sub-substrate layer 5 further enhances the overall structural strength and insulation performance of the insulating patch, and serves as the uppermost protective layer to ensure the safety of the entire patch. The metal layer 2 can be made of metal materials such as copper or aluminum. Copper has better thermal conductivity, such as T2 copper, and the thickness can be selected from 0.05-0.2mm. The silicone thermal pad 301 uses silicone material with high thermal conductivity, such as Dow Corning's TC-5022 silicone thermal pad 301, which has a thermal conductivity of up to 2.2 W / (m·K).

[0026] Reference Figure 2 and Figure 5As shown, both the main substrate layer 1 and the secondary substrate layer 5 are made of PET material. PET material has excellent insulation, mechanical properties, and chemical stability. As the material for both the main substrate layer 1 and the secondary substrate layer 5, it ensures the insulation effect of the insulating patch while possessing a certain strength and flexibility, making it less prone to damage and resistant to the corrosion of some chemicals, thus extending the service life of the insulating patch. Both the main substrate layer 1 and the secondary substrate layer 5 are made of PET material, which has excellent insulation, mechanical properties, and chemical stability. Common models include Toray's Lumirror series, and its thickness can be selected according to actual needs, generally between 0.1-0.5 mm. A flame-retardant layer 11 is provided on the lower surface of the main substrate layer 1, which is formed by spraying flame-retardant material. The flame-retardant layer 11 improves the safety of the insulating patch. When overheating or short circuits occur inside the laptop, posing a fire hazard, the flame-retardant layer 11 can prevent the fire from spreading, reduce the risk of fire, and protect the safety of the laptop and the user.

[0027] Reference Figure 2 and Figure 3 As shown, adhesive layer 3 is coated with a flame-retardant adhesive material. The use of flame-retardant adhesive material in adhesive layer 3 further enhances the flame-retardant properties of the insulating patch. In the event of a fire, the flame-retardant adhesive can prevent the flame from spreading through adhesive layer 3, while also ensuring the adhesion of adhesive layer 3 at high temperatures, preventing the insulating patch from detaching due to a fire and allowing it to continue to perform its insulating and flame-retardant functions. The flame-retardant material can be a coating made by mixing inorganic flame retardants such as aluminum hydroxide and magnesium hydroxide with resin.

[0028] Reference Figure 2 and Figure 4 As shown, reinforcing corner brackets 41 are provided at the four corners of the inner side of the vent ring 4. The reinforcing corner brackets 41 are glued and fixed to the vent ring 4, and the upper and lower ends of the reinforcing corner brackets 41 are fixedly connected to the sub-substrate layer 5 and the main substrate layer 1, respectively. The reinforcing corner brackets 41 enhance the connection stability between the vent ring 4 and the main substrate layer 1 and the sub-substrate layer 5. When the insulating patch is subjected to external force, the reinforcing corner brackets 41 can disperse the stress and prevent separation or damage between the vent ring 4 and the main and sub-substrate layers 5, thereby improving the structural stability and durability of the entire insulating patch.

[0029] Example 2

[0030] Reference Figure 1 , Figure 2 and Figure 6As shown, an insulating patch for laptops includes a main substrate layer 1, a metal layer 2 fixedly disposed on the lower end surface of the main substrate layer 1, an adhesive layer 3 connected to the lower end surface of the metal layer 2, a plurality of positioning grooves 30 uniformly formed on the lower end surface of the adhesive layer 3, a silicone thermal conductive sheet 301 installed in the positioning grooves 30, a venting ring 4 installed on the upper end surface of the main substrate layer 1, and a plurality of heat dissipation grooves 10 formed on the upper end surface of the main substrate layer 1.

[0031] Reference Figure 2 and Figure 6 As shown, a thermally conductive copper plate 101 is installed in the heat sink 10. The lower end face of the thermally conductive copper plate 101 is in contact with the metal layer 2, and several heat dissipation fins 102 are evenly installed on the upper end face of the thermally conductive copper plate 101. The heat dissipation fins 102 are integrally formed with the thermally conductive copper plate 101. The thermally conductive copper plate 101 has excellent thermal conductivity, which can quickly conduct the heat transferred from the metal layer 2 to the heat dissipation fins 102. The heat dissipation fins 102 increase the heat dissipation area, allowing heat to be dissipated into the surrounding air more quickly, greatly improving the heat dissipation efficiency of the insulating patch, helping to reduce the temperature of the electronic components inside the laptop and ensuring their normal operation. The thermally conductive copper plate 101 is made of T2 copper with a thickness of 0.1-0.3mm.

[0032] Example 3

[0033] Reference Figure 1 and Figure 2 As shown, an insulating patch for laptops includes a main substrate layer 1, a metal layer 2 fixedly disposed on the lower end face of the main substrate layer 1, an adhesive layer 3 connected to the lower end face of the metal layer 2, a plurality of positioning grooves 30 uniformly formed on the lower end face of the adhesive layer 3, a silicone thermal conductive sheet 301 installed in the positioning grooves 30, a venting ring 4 installed on the upper end face of the main substrate layer 1, and a plurality of heat dissipation grooves 10 formed on the upper end face of the main substrate layer 1, the venting ring 4 being adhered and fixed to the main substrate layer 1, and a secondary substrate layer 5 being adhered and fixed to the upper end face of the venting ring 4.

[0034] Reference Figure 2As shown, it also includes a temperature sensing wire 6, one end of which passes through the vent ring 4 and the heat dissipation groove 10, and a temperature sensing probe 61 is connected to the temperature sensing wire 6 to be in contact with the metal layer 2. The setup of the temperature sensing wire 6 and the temperature sensing probe 61 allows for real-time monitoring of the temperature of the metal layer 2. By attaching the temperature sensing probe 61 to the metal layer 2, the temperature information of the metal layer 2 can be accurately obtained, and the temperature data can be transmitted to external devices such as the monitoring system of a laptop computer via the temperature sensing wire 6. Users can understand the heat dissipation of the laptop computer in a timely manner based on the temperature data, and take corresponding measures when the temperature is too high, such as cleaning the heat dissipation channel and reducing the computer load, to ensure the normal operation of the laptop computer. The temperature sensing wire 6 can be a high-temperature resistant silicone wire, such as an AWG24 specification silicone wire. The temperature sensing probe 61 is a high-precision thermistor type temperature sensing probe 61, such as an NTC thermistor probe, which can be of the MF52 series.

[0035] Working principle: When manufacturing is required, a flame-retardant layer 11 is sprayed onto the lower end face of the main substrate layer 1. After the flame-retardant layer dries, the metal layer 2 is fixed to the lower end face of the main substrate layer 1 by bonding or pressing. A flame-retardant adhesive material is applied to the lower end face of the metal layer 2 to form an adhesive layer 3, and several positioning grooves 30 are evenly opened on the lower end face of the adhesive layer 3. The silicone thermal conductive sheet 301 is installed in the positioning grooves 30. Several heat dissipation grooves 10 are opened on the upper end face of the main substrate layer 1, and the thermally conductive copper plate 101 is installed in the heat dissipation grooves 10, so that the lower end face of the thermally conductive copper plate 101 is in contact with the metal layer 2. Then, heat dissipation fins 102 are installed on the upper end face of the thermally conductive copper plate 101. The heat dissipation fins 102 and the thermally conductive copper plate 101 can be manufactured by integral molding. The vent ring 4 is glued and fixed to the upper surface of the main substrate layer 1. Reinforcing corner brackets 41 are glued to the four corners of the inner side of the vent ring 4, and the upper and lower ends of the reinforcing corner brackets 41 are fixedly connected to the sub-substrate layer 5 and the main substrate layer 1, respectively. Finally, the sub-substrate layer 5 is glued and fixed to the upper surface of the vent ring 4.

[0036] When it is necessary to install the temperature measuring wire 6 and the temperature measuring probe 61, pass one end of the temperature measuring wire 6 through the vent ring 4 and the heat dissipation groove 10, and attach the temperature measuring probe 61 to the metal layer 2 to fix the temperature measuring wire 6 and the temperature measuring probe 61.

[0037] In practical use, the prepared insulating patch is attached to the parts of the laptop that require insulation protection, such as the surface of electronic components on the motherboard, using the adhesive layer 3. Connecting the temperature sensing wire 6 to the laptop's monitoring system allows for real-time monitoring of the metal layer's temperature.

[0038] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An insulating patch for laptops, comprising a main substrate layer (1), characterized in that, A metal layer (2) is fixedly disposed on the lower end face of the main substrate layer (1). An adhesive layer (3) is disposed on the lower end face of the metal layer (2). A plurality of positioning grooves (30) are uniformly opened on the lower end face of the adhesive layer (3). A silicone heat-conducting sheet (301) is installed in the positioning groove (30). A venting ring (4) is installed on the upper end face of the main substrate layer (1). A plurality of heat dissipation grooves (10) are opened on the upper end face of the main substrate layer (1). The venting ring (4) is bonded and fixed to the main substrate layer (1). A secondary substrate layer (5) is bonded and fixed on the upper end face of the venting ring (4).

2. The insulating patch for laptops according to claim 1, characterized in that, The four corners of the inner side of the breathable ring (4) are provided with reinforcing corner seats (41). The reinforcing corner seats (41) are glued and fixed to the breathable ring (4), and the upper and lower ends of the reinforcing corner seats (41) are fixedly connected to the sub-substrate layer (5) and the main substrate layer (1) respectively.

3. The insulating patch for laptops according to claim 2, characterized in that, A heat-conducting copper plate (101) is installed in the heat dissipation groove (10). The lower end face of the heat-conducting copper plate (101) is in contact with the metal layer (2), and a number of heat dissipation fins (102) are evenly installed on the upper end face of the heat-conducting copper plate (101). The heat dissipation fins (102) are integrally formed with the heat-conducting copper plate (101).

4. An insulating patch for laptops according to claim 3, characterized in that, A flame-retardant layer (11) is provided on the lower end face of the main substrate layer (1), and the flame-retardant layer (11) is formed by spraying flame-retardant material.

5. An insulating patch for laptops according to claim 4, characterized in that, The adhesive layer (3) is made by applying flame-retardant adhesive material.

6. An insulating patch for notebook computers according to claim 5, characterized in that, Both the main substrate layer (1) and the sub-substrate layer (5) are made of PET material.

7. An insulating patch for notebook computers according to claim 6, characterized in that, It also includes a temperature measuring wire (6), one end of which passes through the vent ring (4) and the heat dissipation groove (10), and a temperature measuring probe (61) that is in contact with the metal layer (2) is connected to the temperature measuring wire (6).

Images