Detectable golden finger pad structure, golden finger and connector

Abstract

The utility model discloses a detectable golden finger pad structure, a golden finger and a connector, the golden finger pad structure comprises a detection pad and an entity connection pad, the detection pad and the entity connection pad are connected through an access detection device, the detection pad comprises an initial detection pad and a tail end detection pad, and the tail end detection pad is connected with the detection pad. The initial detection bonding pad and the tail end detection bonding pad are connected with the path detection device through detection cables; according to the utility model, fault positioning can be realized by detecting the reliability of connection of the golden finger pad before welding of a PCB chip of a product, production debugging of the product, delivery inspection of the product, after-sale of the product and other stages, so that the working stability of the product is improved, the fault positioning time is shortened, and an effective test verification means is provided for the design and production links of the PCB of the product.

Description

Technical Field

[0001] This utility model relates to the field of gold finger detection technology, and in particular to a detectable gold finger pad structure, gold finger, and connector. Background Technology

[0002] As computer systems continue to evolve, the requirements for electrical functionality expansion have become increasingly diverse. At the same time, electrical circuit and printed circuit board (PCB) designs inevitably require the use of several high-density, high-reliability connectors with gold finger spring structures.

[0003] However, the signal connection of this type of connector uses an elastic connection between spring contacts and gold finger pads. Factors such as the width and spacing of the connector pads, the effective contact area, and structural errors all affect the reliability of this connection method. In industrial, military, automotive, naval, and aerospace applications, designing circuit boards using this type of signal interconnect device (connector) in harsh vibration environments to ensure reliable signal interconnection and testability presents a challenge for engineering designers and manufacturing engineers. Currently, gold finger pad designs in the industry generally suffer from the drawback of being undetectable. Utility Model Content

[0004] The main objective of this invention is to provide a detectable gold finger pad structure, gold finger, and connector, aiming to solve existing technical problems.

[0005] To achieve the above objectives, this utility model provides a detectable gold finger pad structure, including a detection pad and a physical connection pad, wherein the detection pad and the physical connection pad are connected by a path detection device.

[0006] The detection pads include a start detection pad and an end detection pad, both of which are connected to the path detection device via detection cables.

[0007] Furthermore, the detection pads are provided in at least two and are spaced apart.

[0008] Furthermore, the detection pads are distributed on both sides of the end of the physical connection pads.

[0009] Furthermore, the physical connection pad has a connection portion.

[0010] A gold finger includes a detectable gold finger pad structure as described above.

[0011] A connector that mates with the aforementioned gold fingers has a slot containing a metal spring.

[0012] Furthermore, when the gold finger is inserted into the connector, the detection pad partially overlaps with the metal spring.

[0013] Furthermore, when the gold finger is inserted into the connector, the detection pad is misaligned with the metal spring.

[0014] The beneficial effects of this utility model are reflected in:

[0015] This invention enables fault location by detecting the reliability of the gold finger pad connection at various stages, including before PCB chip soldering, product production debugging, factory inspection, and after-sales service. This improves product stability, shortens fault location time, and provides an effective testing and verification method for product PCB design and production. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the gold finger pad structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the gold finger structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the connector structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the gold finger and connector of this utility model before connection;

[0020] Figure 5 This is a schematic diagram showing the connection between the gold finger and the connector of this utility model.

[0021] Explanation of reference numerals in the attached figures:

[0022] 10. Gold finger; 11. Test pad; 111. Start test pad; 112. End test pad; 12. Solid connection pad; 13. Path detection device; 20. Connector; 21. Slot; 22. Metal spring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0024] Please see Figure 1This utility model provides a detectable gold finger pad structure, including a detection pad 11 and a physical connection pad 12, which are connected by a path detection device 13.

[0025] Specifically, the path detection device 13 can be a multimeter or other short-circuit testing instruments.

[0026] Please see Figure 1 The test pad 11 includes a start test pad 111 and an end test pad 112. Both the start test pad 111 and the end test pad 112 are connected to the path test device 13 via test cables.

[0027] This invention enables fault location by detecting the reliability of the gold finger pad connection at various stages, including before PCB chip soldering, product production debugging, factory inspection, and after-sales service. This improves product stability, shortens fault location time, and provides an effective testing and verification method for product PCB design and production.

[0028] In one embodiment, please refer to Figure 2 and Figure 3 The test pads 11 are provided in at least two locations and are spaced apart. This arrangement in this embodiment improves the fault tolerance of the test and avoids the problem of the test pads 11 being damaged, which would affect the overall test quality.

[0029] In one embodiment, please refer to Figure 2 and Figure 3 The detection pads 11 are distributed on both sides of the end of the solid connection pads 12.

[0030] In one embodiment, please refer to Figure 4 and Figure 5 The physical connection pad 12 has a connection portion. This configuration in this embodiment ensures that the physical connection pad 12 is effectively connected to the connector 20 during subsequent testing, guaranteeing testing quality.

[0031] Please see Figure 2 This utility model also provides a gold finger, including the detectable gold finger pad structure as described above.

[0032] Please see Figure 3 The present invention also provides a connector that is connected to the gold finger mentioned above, having a slot 21 and a metal spring 22 inside the slot 21.

[0033] In one embodiment, when the gold finger 10 is mated with the connector 20, the pad 11 is detected to partially overlap with the metal spring 22. This configuration ensures the connection stability between the gold finger 10 and the connector 20 while guaranteeing efficient mating.

[0034] In one embodiment, when the gold finger 10 is mated with the connector 20, misalignment between the solder pad 11 and the metal spring 22 is detected. This configuration in this embodiment improves the connection strength between the gold finger 10 and the connector 20, ensuring connection stability.

[0035] The working principle of this utility model is as follows: When the gold finger 10 is inserted into the connector slot 21, the metal spring 22 of the connector 20 will first contact the detection pad 11, and then all the detection pads 11 will be fully conductive. In this way, the continuity of the initial detection pad 111 and the final detection pad 112 can be detected by the connection path detection device 13. If there is a large processing error in the position of the gold finger 10, the copper thickness of the finished gold finger 10 is lower than the design value, or the chemical immersion gold or electroplated gold thickness of the gold finger 10 is thin and causes severe wear due to long-term insertion and removal, resulting in poor contact, these abnormalities can be detected. (If the position error of the gold finger pad is within the allowable error range, when the gold finger is inserted into the initial part of the connector, the path detection device shows that the path is closed, and after the gold finger is fully inserted into the connector, the path detection device shows that the path is open. Otherwise, it indicates that the pad processing error exceeds the allowable range, or abnormal wear of the gold finger pad occurs.)

[0036] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0037] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied. Furthermore, "multiple" refers to two or more. Moreover, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A detectable gold finger pad structure, characterized in that: It includes a detection pad (11) and a physical connection pad (12), which are connected by a path detection device (13); The detection pad (11) includes a starting detection pad (111) and an ending detection pad (112), both of which are connected to the path detection device (13) via detection cables.

2. The detectable gold finger pad structure as described in claim 1, characterized in that: The detection pads (11) are provided in at least two and are spaced apart.

3. The detectable gold finger pad structure as described in claim 2, characterized in that: The detection pads (11) are distributed on both sides of the end of the solid connection pads (12).

4. The detectable gold finger pad structure as described in claim 1, characterized in that: The physical connection pad (12) has a connection part.

5. A gold finger, characterized in that: Includes the detectable gold finger pad structure as described in any one of claims 1-4.

6. A connector, which mates with the gold finger as described in claim 5, characterized in that: It has a slot (21) and a metal spring (22) is provided in the slot (21).

7. The connector as described in claim 6, characterized in that: When the gold finger is inserted into the connector, the detection pad (11) and the metal spring (22) partially overlap.

8. The connector as described in claim 6, characterized in that: When the gold finger is inserted into the connector, the detection pad (11) is misaligned with the metal spring (22).

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