Display panel and display device

Abstract

The utility model discloses a display panel and a display device. The display panel comprises a substrate; the connecting areas and the buffer areas are alternately arranged on one side of the substrate; the connection area is provided with a chip pin connection terminal, the buffer area comprises at least two inorganic film layers and at least one organic film layer which are stacked, and the inorganic film layers and the organic film layers are alternately arranged. According to the technical scheme, the inorganic film layers and the organic film layers are alternately arranged in the buffer area in the stacked mode, the patterns are arranged on the surfaces of the inorganic film layers, in the pressure bearing process, the pressure resisting capacity is enhanced, stress is fully released, the film layers are prevented from cracking, and the risk that the film layers of the display panel fall off is avoided.

Description

Technical Field

[0001] This utility model relates to the field of display device technology, and in particular to a display panel and a display device. Background Technology

[0002] Traditional display technology has matured significantly, while flexible display panels have become the mainstream in the display field due to their thinness, lightness, and bendability. Among them, OLED (Organic Light Emitting Display) has become one of the hottest research topics in the field of flexible displays in recent years due to its excellent performance, such as fast response speed, wide viewing angle, high brightness, low power consumption, self-emissive devices, and anti-bending properties.

[0003] Existing flexible display panels, due to the compressible space and plastic deformation characteristics between the screen layers, exhibit significant differences in stress matching between different film layers during the pressure-bearing process of flexible display panel bonding. This can lead to peeling of the layers under external pressure. Furthermore, the risk of inorganic film layer breakage increases during stress release, affecting product quality. Utility Model Content

[0004] This invention provides a display panel and display device to solve the problem that the film layer of existing display panels will peel off and break during pressure.

[0005] According to one aspect of the present invention, a display panel is provided, comprising:

[0006] substrate;

[0007] A connection area and a buffer zone are alternately arranged on one side of the substrate;

[0008] The connection area is provided with chip pin connection terminals, and the buffer includes at least two inorganic film layers and at least one organic film layer stacked together, with the inorganic film layers and the organic film layers being alternately arranged.

[0009] Optionally, the at least two inorganic membrane layers include a first inorganic membrane layer, a second inorganic membrane layer, and a third inorganic membrane layer;

[0010] At least one of the organic membrane layers includes a first organic membrane layer and a second organic membrane layer;

[0011] The first inorganic film layer is located on one side of the substrate;

[0012] The first organic film layer is located on the side of the first inorganic film layer away from the substrate;

[0013] The second inorganic film layer is located on the side of the first organic film layer away from the substrate;

[0014] The second organic film layer is located on the side of the second inorganic film layer away from the substrate;

[0015] The third inorganic film layer is located on the side of the second organic film layer away from the substrate.

[0016] Optionally, at least one of the inorganic film layers has a pattern on its surface away from the substrate.

[0017] Optionally, the pattern shape disposed on the surface of the inorganic film layer away from the substrate includes circles, squares, and rhombuses.

[0018] Optionally, the pattern thickness of the inorganic film layer disposed on the surface away from the substrate ranges from 8 nm to 12 nm.

[0019] Optionally, the buffer further includes:

[0020] A filler layer is located on the side of the third inorganic film layer away from the substrate.

[0021] Optionally, the thickness of the chip pin connection terminal is lower than the thickness of the buffer.

[0022] Optionally, the thickness of the inorganic film layer ranges from 0.05um to 0.5um, and the thickness of the organic film layer ranges from 0.5um to 1um.

[0023] According to another aspect of the present invention, a display device is provided, comprising: any of the display panels described above.

[0024] Optionally, the display device further includes an anisotropic conductive layer located between the pins of the driving chip and the chip pin connection terminals.

[0025] The technical solution of this utility model embodiment involves alternately setting a connection area and a buffer zone on one side of the substrate. The buffer zone includes at least two inorganic film layers and at least one organic film layer stacked together, with the inorganic and organic film layers alternating, and the inorganic film layer serving as the upper and lower sealing layers. This utility model enhances the ability to resist pressure during the pressure-bearing process by stacking and alternating inorganic and organic film layers. The inorganic film layer has a high elastic modulus and hardness, which can resist the normal pressure during the pressure-bearing process, providing effective rigid support for the display panel. The organic film layer has a lower elastic modulus and higher flexibility, which can convert the normal pressure received during the pressure-bearing process into tension, and absorb excess stress through its own deformation, increasing the ability to release pressure. By fully utilizing the complementary characteristics of the organic and inorganic film layers, the peeling and breakage of the film layers in the display panel during the pressure-bearing process are avoided.

[0026] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of this utility model;

[0029] Figure 2 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present utility model;

[0030] Figure 3 Top view of one inorganic film layer of the display panel provided in this embodiment of the utility model.

[0031] Figure 4 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present utility model;

[0032] Figure 5 This is a schematic diagram of the structure of a display device provided in an embodiment of the present utility model. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0035] As described in the background section, existing flexible display panels are prone to localized overpressure and film peeling during the bonding process. This is primarily because flexible display panels exhibit plastic deformation characteristics, resulting in uneven stress distribution among the various film layers and compressible spaces between them. During pressure application, the stress between the film layers changes, leading to significant differences in stress matching. This causes peeling and detachment of the film layers when the display panel is subjected to external pressure. Furthermore, during stress release, cracks in the inorganic film layers continue to propagate, increasing the risk of inorganic film layer breakage, reducing product reliability, and consequently affecting product quality.

[0036] To solve the above-mentioned technical problems, this utility model provides a display panel. Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present utility model. See also... Figure 1 The display panel 100 includes: a substrate 10; a connection area 20 and a buffer zone 30 alternately disposed on one side of the substrate; wherein the connection area 20 is provided with chip pin connection terminals 21, and the buffer zone 30 includes at least two inorganic film layers 31 and at least one organic film layer 32 stacked together, with the inorganic film layer 31 and the organic film layer 32 alternately disposed.

[0037] Specifically, during the bonding process of the display panel 100, due to the compressible space between each film layer, the flexible tension during the pressure-bearing process causes changes in the stress of each film layer, resulting in peeling and breakage. A connection area 20 and a buffer zone 30 are provided on one side of the display panel 100. The connection area 20 is mainly used for signal transmission, providing data signals to the light-emitting units of the display panel 100. The connection area 20 and the buffer zone 30 can be located in the non-display area of ​​the display panel 100; for example, they can be located in the bonding area of ​​the display panel 100, where the bonding area is used to bond the driver chip. The buffer zone 30 is used to enhance the resistance to pressure during the pressure-bearing process and to increase the ability to release stress. The buffer zone 30 surrounds the connection area 20, and a chip pin connection terminal 21 is provided within the connection area 20, through which data signals are transmitted to the light-emitting units. At least two inorganic membrane layers 31 and at least one organic membrane layer 32 are disposed within the buffer zone 30, with the inorganic membrane layers 31 and organic membrane layers 32 alternating, forming a sandwich structure. The number of inorganic membrane layers 31 and organic membrane layers 32 is not specifically limited in this embodiment, but there are at least two inorganic membrane layers 31 and at least one organic membrane layer 32. The inorganic membrane layer 31 has high elastic modulus and hardness, which can enhance resistance to normal pressure during the pressure-bearing process and provide rigid support. The organic membrane layer 32 has lower elastic modulus and higher flexibility, which can convert the received normal pressure into tension during the pressure-bearing process, increasing the ability to release pressure. Figure 1 The vertical arrows represent normal force, and the horizontal arrows represent tension.

[0038] For example, the buffer zone 30 may include two inorganic membrane layers 31 and one organic membrane layer 32, forming a sandwich structure of inorganic membrane layer 31, organic membrane layer 32, and inorganic membrane layer 31. The buffer zone 30 may also include three inorganic membrane layers 31 and two organic membrane layers 32, forming a sandwich structure of inorganic membrane layer 31, organic membrane layer 32, inorganic membrane layer 31, organic membrane layer 32, and inorganic membrane layer 31. The buffer zone 30 may also include four inorganic membrane layers 31 and three organic membrane layers 32.

[0039] The technical solution provided by this utility model involves alternately setting a connection area and a buffer zone on one side of the substrate. The buffer zone includes at least two stacked inorganic film layers and at least one organic film layer, with the inorganic and organic film layers alternating, and the inorganic film layer serving as the upper and lower sealing layers. This utility model enhances the ability to resist pressure during the pressure-bearing process by stacking and alternating inorganic and organic film layers. The inorganic film layer has a high elastic modulus and hardness, which can resist the normal pressure during the pressure-bearing process and provide effective rigid support for the display panel. The organic film layer has a lower elastic modulus and higher flexibility, which can convert the normal pressure received during the pressure-bearing process into tension, and absorb excess stress through its own deformation, increasing the ability to release pressure. By fully utilizing the complementary characteristics of the organic and inorganic film layers, the peeling and detachment of the film layers during the pressure-bearing process of the display panel is avoided.

[0040] Optionally, based on the above embodiments, Figure 2 This is a schematic diagram of another display panel provided in an embodiment of the present utility model. See also... Figure 2 At least two inorganic film layers 31 include a first inorganic film layer 311, a second inorganic film layer 312, and a third inorganic film layer 313; at least one organic film layer 32 includes a first organic film layer 321 and a second organic film layer 322; the first inorganic film layer 311 is located on one side of the substrate 10; the first organic film layer 321 is located on the side of the first inorganic film layer 311 away from the substrate 10; the second inorganic film layer 312 is located on the side of the first organic film layer 321 away from the substrate 10; the second organic film layer 322 is located on the side of the second inorganic film layer 312 away from the substrate 10; and the third inorganic film layer 313 is located on the side of the second organic film layer 322 away from the substrate 10.

[0041] Specifically, the buffer zone 30 comprises three inorganic film layers 31 and two organic film layers 32. The three inorganic film layers 31 are respectively the first inorganic film layer 311, the second inorganic film layer 312, and the third inorganic film layer 313. The two organic film layers 32 are respectively the first organic film layer 321 and the second organic film layer 322. The three inorganic film layers 31 and the two organic film layers 32 are stacked and alternately arranged to form a sandwich structure of the first inorganic film layer 311, the first organic film layer 321, the second inorganic film layer 312, the second organic film layer 322, and the third inorganic film layer. The upper and lower layers are sealed with the first inorganic film layer 311 and the third inorganic film layer 313. During the pressure-bearing process of the display panel 100, the buffer zone 30 can better resist pressure and better release stress. Figure 2 The vertical arrows represent normal force, and the horizontal arrows represent tension.

[0042] The inorganic film layer 31 has a thickness of 0.05µm-0.5µm, while the organic film layer 32 has a thickness of 0.5µm-1µm. The inorganic film layer 31 can be made of inorganic materials such as silicon oxide or silicon nitride, while the organic film layer 32 can be made of organic materials such as polyimide.

[0043] Optionally, based on the above embodiments, Figure 3 A top view of one inorganic film layer of the display panel provided in an embodiment of this utility model. See also Figures 1-3 At least one inorganic film layer 31 has a pattern a disposed on its surface away from the substrate 10.

[0044] Specifically, a pattern a is formed on at least the surface of the inorganic film layer 31 away from the substrate 10. Pattern a can be formed on all surfaces of the inorganic film layer 31 away from the substrate 10, or it can be formed on a portion of the inorganic film layer 31 away from the substrate 10. The inorganic film layer 31 typically has a high elastic modulus but is brittle and prone to cracking under stress. By forming equally spaced patterns on the surface of the inorganic film layer 31, stress can be dispersed to multiple localized areas, avoiding excessive stress concentration in a single direction. Patterning of the inorganic film layer 31 away from the substrate 10 can be achieved through methods such as chemical vapor deposition or laser ablation, forming grooves or raised patterns on the surface of the inorganic film layer 31 to hinder the diffusion of tension and delay crack propagation.

[0045] Optionally, a pattern a is formed on the surface of the inorganic film layer 31 away from the substrate 10. The shape of the pattern a can be circular, square, or rhomboid, and the thickness of the pattern a can range from 8 nm to 12 nm. The shapes of the patterns a on the same surface of the inorganic film layer 31 can be the same, and they need to be evenly spaced. The thickness a can be the same. The patterns a on different inorganic film layers 31 can be different, and the thickness can also be different. The projections of the patterns a on different inorganic film layers 31 onto the substrate 10 can at least partially overlap or not overlap at all.

[0046] The display panel provided by this invention has a pattern formed on the surface of the inorganic film layer in the buffer zone away from the substrate. During the pressure-bearing process of the display panel, stress can be dispersed to multiple local areas, avoiding stress concentration, improving crack resistance, and preventing crack propagation. Simultaneously, it can increase the contact area between the inorganic and organic film layers, enhancing the adhesion strength between them.

[0047] Optionally, based on the above embodiments, Figure 4 This is a schematic diagram of another display panel provided in an embodiment of the present utility model. See also... Figure 4 The buffer zone 30 also includes a filling layer 33 located on the side of the third inorganic film layer 313 away from the substrate 10.

[0048] Specifically, a filling layer 33 is also provided in the buffer zone 30 of the display panel 100. The filling layer 33 is disposed on the side of the uppermost inorganic film layer 31 of the buffer zone 30 away from the substrate. The filling layer 33 can be an organic material and can be prepared by inkjet printing (IJP). The filling layer 33 can further resist the positive pressure experienced by the display panel 100 during pressure bearing. Figure 4 The vertical arrows represent normal force, and the horizontal arrows represent tension.

[0049] Optionally, based on the above embodiments, see also... Figure 1 , Figure 2 and Figure 4 The thickness of the chip pin connection terminal 21 is lower than the thickness of the buffer 30.

[0050] Specifically, the chip pin connection terminal 21 is connected to the substrate 10, and data signals are transmitted through the chip pin connection terminal 21. The thickness of the chip pin connection terminal 21 is lower than the thickness of the buffer 30. The buffer 30 surrounds the chip pin connection terminal 21, which can protect the chip pin connection terminal 21 and prevent it from being damaged during the pressure of the display panel 100.

[0051] The display panel provided by this invention alternately layers inorganic and organic films in a buffer zone, with patterns formed on the surface of the inorganic films. During pressure application, the inorganic films increase the panel's resistance to pressure, and the patterns on the inorganic films disperse the positive pressure, preventing breakage. The organic films convert and release the pressure, thus preventing film peeling and detachment during pressure application.

[0052] This embodiment of the utility model also provides a display device 300. Figure 5 This is a schematic diagram of a display device provided in an embodiment of the present invention. See also... Figure 5 The display device 300 includes a display panel 100 and a driver chip 200 as described in any of the above embodiments. The pins of the driver chip 200 are bonded to chip pin connection terminals 21. An anisotropic conductive layer 210 is also provided between the pins of the driver chip 200 and the chip pin connection terminals 21. The pins of the driver chip 200 and the chip pin connection terminals 21 are electrically connected and fixed through the anisotropic conductive layer 210. The data signals output by the driver chip 200 are transmitted vertically to the chip pin connection terminals 21 through the anisotropic conductive layer 210. Horizontal insulation is provided to prevent lateral leakage or short circuits.

[0053] The display device provided in this embodiment of the present invention can achieve the beneficial effects of the display panel 100 provided in any of the above embodiments, and will not be described in detail here.

[0054] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A display panel, characterized in that, include: substrate; A connection area and a buffer zone are alternately arranged on one side of the substrate; The connection area is provided with chip pin connection terminals, and the buffer includes at least two inorganic film layers and at least one organic film layer stacked together, with the inorganic film layers and the organic film layers being alternately arranged.

2. The display panel according to claim 1, characterized in that, The at least two inorganic membrane layers include a first inorganic membrane layer, a second inorganic membrane layer, and a third inorganic membrane layer; At least one of the organic membrane layers includes a first organic membrane layer and a second organic membrane layer; The first inorganic film layer is located on one side of the substrate; The first organic film layer is located on the side of the first inorganic film layer away from the substrate; The second inorganic film layer is located on the side of the first organic film layer away from the substrate; The second organic film layer is located on the side of the second inorganic film layer away from the substrate; The third inorganic film layer is located on the side of the second organic film layer away from the substrate.

3. The display panel according to claim 1, characterized in that, At least one of the inorganic film layers has a pattern formed on its surface away from the substrate.

4. The display panel according to claim 3, characterized in that, The patterns formed on the surface of the inorganic film layer away from the substrate include circles, squares, and rhombuses.

5. The display panel according to claim 3, characterized in that, The pattern thickness of the inorganic film layer on the surface away from the substrate ranges from 8 nm to 12 nm.

6. The display panel according to claim 2, characterized in that, The buffer also includes: A filler layer is located on the side of the third inorganic film layer away from the substrate.

7. The display panel according to claim 1, characterized in that, The thickness of the chip pin connection terminal is lower than the thickness of the buffer.

8. The display panel according to claim 1, characterized in that, The thickness of the inorganic film layer ranges from 0.05um to 0.5um, and the thickness of the organic film layer ranges from 0.5um to 1um.

9. A display device, characterized in that, include: The display panel and driver chip according to any one of claims 1-8, wherein the pins of the driver chip are bonded to the chip pin connection terminals.

10. The display device according to claim 9, characterized in that, Also includes: An anisotropic conductive layer is located between the pins of the driver chip and the chip pin connection terminals.

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