Double-cavity washing and spin-drying machine

Abstract

The utility model discloses a double-cavity washing and spin-drying machine which comprises a cavity, a drainage groove is formed in the bottom of the cavity, a heating assembly and an air guide assembly are arranged in the cavity, the heating assembly is located at the bottom of the cavity and does not make contact with cleaning liquid, gas heated by the heating assembly is guided by the air guide assembly, and finally dry gas replaces the gas in the cavity. According to the utility model, through the arrangement of the heating assembly and the air guide assembly, hot gas is introduced into the middle lower part of the cavity after the wafer is cleaned and then is discharged, the gas in the middle lower part of the cavity can be heated in the process that the gas flows in the cavity, and moisture can be taken away from the cavity while the gas is heated, and finally, rapid drying is achieved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor wafer cleaning technology, specifically, it relates to a dual-chamber rinsing and spin-drying machine. Background Technology

[0002] Dual-chamber spin dryers are suitable for fully automatic centrifugal dehydration and nitrogen purging drying of semiconductor wafers such as silicon wafers, sapphire wafers, gallium nitride, gallium arsenide, and silicon carbide wafers.

[0003] The main purpose of a dual-chamber spin dryer is to quickly remove moisture and residue from the surface of a wafer by using centrifugal force generated by high-speed rotation, thereby reducing the risk of contamination. The working process involves placing the wet wafer into the turntable, and after starting, centrifugal force is generated to throw out the moisture, which is then discharged through the exhaust system.

[0004] The vibration of modern dual-chamber spin dryers during high-speed rotation can affect the lifespan of the motor connecting shaft and rotor connecting bearings, leading to their breakage and increasing the frequency of maintenance.

[0005] After the dual-chamber rinse-and-dryer cleans the wafers, the cleaning solution is drained through the drain channel located at the bottom of the chamber, and then the drying process is started.

[0006] During the drying process, the wafers and wafer support brackets in each chamber are located in the lower middle part of the chamber, and the drainage channel is also located in the lower middle part of the chamber. Therefore, cleaning fluid tends to accumulate in the lower middle part of the chamber, resulting in higher humidity. This causes airflow disturbance between the upper and lower spaces during rotary drying, leading to differences in the local evaporation rate of the wafer. Ultimately, this results in uneven temperature distribution on the wafer surface, causing local condensation and ultimately damaging the wafer.

[0007] Therefore, dual-chamber rinsing and spin-drying machines have some shortcomings, and it is necessary to design a dual-chamber rinsing and spin-drying machine. Utility Model Content

[0008] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a dual-chamber rinsing and spin-drying machine.

[0009] To achieve the aforementioned objectives, the technical solution adopted by this utility model includes:

[0010] A dual-chamber rinsing and spin-drying machine includes a chamber with a drainage trough at the bottom. The chamber contains a heating element and a dual-chamber rinsing and spin-drying machine. The heating element is located at the bottom of the chamber and does not contact the cleaning liquid. The gas heated by the heating element is guided through the dual-chamber rinsing and spin-drying machine, and finally the dried gas replaces the gas in the chamber.

[0011] In the prior art, the water after cleaning is discharged from the drain tank, and the cleaning liquid accumulates in the lower middle part of the chamber. Some of this cleaning liquid is attached to the lower part of the chamber wall and the drain tank wall. Therefore, after nitrogen is introduced, the upper middle part of the chamber dries much faster than the lower middle part. This causes airflow disturbance between the upper and lower spaces during rotary drying, resulting in differences in the local evaporation rate of the wafer.

[0012] By setting up a heating component and a dual-chamber rinsing and drying machine, hot gas is introduced into the lower middle part of the chamber after wafer cleaning and then discharged. During the process of gas circulation in the chamber, the gas in the lower middle part of the chamber can be heated, and at the same time, the moisture can be carried away from the chamber, finally achieving rapid drying.

[0013] Furthermore, a receiving space is provided at the bottom of the cavity, and a drain trough is connected to the receiving space. The receiving space is used to install the heating components and the dual-chamber washing and drying machine. The original drainage trough of the cavity already has the receiving space of the cavity and can be directly used as the receiving space, thus making full use of the space inside the cavity.

[0014] Furthermore, the heating assembly includes an air intake pipe, heating wires, and a high-efficiency particulate air filter. The air intake pipe is used to deliver clean gas filtered by the high-efficiency particulate air filter into the cavity. The heating wires are installed inside the air intake pipe to heat the gas inside the air intake pipe. The heating wires are distributed on the inner surface of the air intake pipe or spaced apart inside the air intake pipe. When the gas passes through the space or gaps between the heating wires, the gas is heated.

[0015] Furthermore, the dual-chamber rinsing and spin-drying machine includes a spiral component and an exhaust pipe. The spiral component has a guide groove facing the air intake direction of the air intake pipe. The two ends of the guide groove are connected to the air intake pipe and the exhaust pipe, respectively. The gas input from the air intake pipe enters the guide groove and then is discharged through the exhaust pipe at the other end of the guide groove. The end of the exhaust pipe away from the spiral component extends from the upper end of the drain trough and is equipped with a valve.

[0016] The dual-chamber rinsing and spin-drying machine is fixed in the containment space. The air guide direction of the dual-chamber rinsing and spin-drying machine is consistent with the drainage direction of the drainage tank. In this way, the drain pipe connected to the drainage tank is also the drain pipe, which facilitates exhaust and also increases the use of the drain pipe.

[0017] Furthermore, the high-efficiency particulate air filter is located outside the cavity and is positioned above the housing space. This ensures that during the wafer spin dryer's wafer cleaning process, water from inside the cavity will not enter the high-efficiency particulate air filter through the air inlet pipe.

[0018] Furthermore, it also includes a gas extraction assembly, which includes a Roots vacuum pump. The Roots vacuum pump inlet is connected to the exhaust pipe. The Roots vacuum pump is installed outside the cavity. The Roots vacuum pump can both evacuate the space inside the cavity and remove the air inside the cavity.

[0019] Furthermore, the depth of the guide groove is 0.5-0.8 times the pitch of the spiral component. The guide groove is the flow path for guiding the clean gas from the high-efficiency particulate air filter. The groove depth of 0.5-0.8 times allows the gas to quickly form a spiral when flowing through the guide groove, generating centrifugal force, which draws the gas around the cavity into the spiral and carries it away together.

[0020] Furthermore, the centerline of the spiral component coincides with the centerline of the drainage groove, and the diameter of the spiral component is equal to the diameter of the drainage pipe hole of the drainage groove, so that the gas flow is not obstructed and can be discharged quickly.

[0021] Compared with the prior art, the advantages of this utility model include:

[0022] (1) The dual-chamber rinsing and spin-drying machine provided by this utility model only needs to be added to the original structure, making full use of the original structure, which is convenient to use, and the overall structure is simple and easy to maintain.

[0023] (2) The dual-chamber washing and spin-drying machine provided by this utility model can heat the space below the middle of the chamber, avoiding a large temperature difference between the upper and lower spaces in the chamber, which would result in an unsatisfactory drying effect for the wafers.

[0024] (3) The present invention provides a dual-chamber rinsing and spin-drying machine that can remove moisture from the chamber and achieve rapid drying. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of a dual-chamber rinsing and spin-drying machine according to the present invention;

[0027] Figure 2 This is a three-dimensional schematic diagram of the spiral component in this utility model;

[0028] Figure 3 This is a side view of the spiral component in this utility model.

[0029] Figure label:

[0030] 11. Chamber, 12. Drainage trough, 13. Heating component, 14. Dual-chamber washing and drying machine, 15. Accommodation space, 21. Air inlet pipe, 22. Heating wire, 23. High-efficiency particulate air filter, 31. Spiral component, 32. Exhaust pipe, 33. Guide channel, 41. Gas extraction component. Detailed Implementation

[0031] In view of the shortcomings of the prior art, the inventors of this case, through long-term research and extensive practice, have proposed the technical solution of this utility model. The technical solution, its implementation process, and principles will be further explained below with reference to the accompanying drawings and specific implementation examples.

[0032] It should be noted that the embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. The described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, the present invention covers any substitutions, modifications, equivalent methods and solutions made within the spirit, principles and scope of the present invention as defined by the claims. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] In the description of this application, the terms "first," "second," "third," and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar words, do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including," and similar words, mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including," and their equivalents, but do not exclude other elements or objects. The terms "connected" or "linked," and similar words, are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0034] In the description of this application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this application and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, when using positional terms such as "both sides," "outer side," and "upper and lower," it should be understood that they are used only for ease of understanding and description, taking into account that the structure may be oriented to other positions.

[0035] In the description of this application, unless otherwise expressly specified and limited, the technical or scientific terms used shall have the ordinary meaning understood by a person with ordinary skills in the art to which this application pertains. Terms such as “installation,” “connection,” and “joining” shall be interpreted broadly, for example, as fixed connection, detachable connection, mating connection, or integral connection. For a person skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0036] This utility model embodiment is intended to introduce and explain the structural composition of a dual-chamber rinsing and spin-drying machine and the cooperation relationship between the various components. Unless otherwise specified, the dimensions, materials, and manufacturing processes of the various components suitable for the dual-chamber rinsing and spin-drying machine in this utility model embodiment can be selected according to specific circumstances, and no special limitations or explanations are made here.

[0037] Furthermore, to provide the public with a better understanding of this utility model, certain specific details are described in detail in the following description. However, those skilled in the art can fully understand this utility model even without these detailed descriptions.

[0038] Example 1

[0039] Please see Figure 1 , Figure 2 and Figure 3 A dual-chamber rinsing and spin-drying machine includes a chamber 11, a drainage groove 12 at the bottom of the chamber 11, a heating component 13 and an air guide component 14 inside the chamber 11, the heating component 13 is guided by the air guide component 14, and finally the drying gas replaces the gas in the chamber 11.

[0040] Furthermore, a receiving space 15 is provided at the bottom of the cavity 11, and the drain trough 12 is connected to the receiving space 15. The receiving space 15 is used to install the heating component 13 and the air guide component 14. The original drain trough 12 of the cavity 11 already has the receiving space 15 of the cavity 11, and can be directly used as the receiving space 15 to install the heating component 13 and the air guide component 14. This makes full use of the space inside the cavity 11, simplifies the installation procedure, and improves the overall processing efficiency of the wafer dual-cavity washing and drying machine.

[0041] Furthermore, the heating assembly 13 includes an air inlet pipe 21, a heating wire 22, and a high-efficiency particulate air filter 23. The air inlet pipe 21 is used to deliver the clean gas filtered by the high-efficiency particulate air filter 23 into the cavity 11. The heating wire 22 is installed inside the air inlet pipe 21 to heat the gas inside the air inlet pipe 21. The heating wires 22 are evenly distributed on the inner surface of the air inlet pipe 21, or evenly distributed inside the air inlet pipe 21. When the gas passes through the space or gaps between the heating wires 22, the gas is heated. This principle is the same as the principle of a hair dryer blowing hot air. Finally, the gas enters the cavity 11 and is guided by the air guide assembly 14. The high-efficiency particulate air filter 23 is set outside the cavity 11 and is set higher than the receiving space 15. This ensures that during the wafer cleaning process, water in the cavity 11 will not enter the high-efficiency particulate air filter 23 through the air inlet pipe 21.

[0042] Furthermore, the air guide assembly 14 includes a spiral component 31 and an exhaust pipe 32. The spiral component 31 has a guide groove 33 facing the air intake direction of the air intake pipe 32. The two ends of the guide groove 33 are connected to the air intake pipe 21 and the exhaust pipe 32, respectively. The gas input from the air intake pipe 21 enters the guide groove 33 and is then discharged through the exhaust pipe 32 at the other end of the guide groove 33. The depth of the guide groove 33 is 0.5-0.8 times the pitch of the spiral component 31. The guide groove 33 guides the air from the high-efficiency particulate air filter 23. The clean gas flow path is everywhere; the groove depth is 0.5-0.8 times that of the flow groove. When the gas flows from the guide groove 33, it can quickly form a spiral and generate centrifugal force, which draws the gas in the cavity 11 into the spiral gas and carries it away. Finally, it is discharged through the exhaust pipe 32; the axis of the spiral component 31 coincides with the axis of the drainage groove 12, and the diameter of the spiral component 31 is equal to the diameter of the drainage pipe of the drainage groove 12. There is no obstruction between the pipes, so the gas flow is not obstructed and can be discharged quickly.

[0043] The air guide assembly 14 is fixed in the accommodating space. The straight direction of the air guide assembly 14 is consistent with the drainage direction of the drainage trough 12. The exhaust pipe 32 extends from the upper end of the drainage pipe of the drainage trough 12 out of the cavity 11. A valve is installed at one end of the exhaust pipe 32 that extends out of the cavity 11. Since the drainage pipe 32 is located outside the cavity 11, it is easy to assemble.

[0044] Preferably, the system also includes a gas extraction component 41, which is a Roots vacuum pump. The Roots vacuum pump inlet is connected to the exhaust pipe 32. The Roots vacuum pump is installed outside the cavity 11. The Roots vacuum pump can both evacuate the space inside the cavity 11 and remove the air inside the cavity 11. During the washing process of the dual-cavity washing and drying machine, the Roots vacuum pump first evacuates the inside of the cavity 11. This reduces internal mechanical friction and bearing load when the cleaning fluid is sprayed in and the dual-cavity washing and drying machine rotates, which helps to extend the service life of rotating parts. Moreover, the noise level of the dual-cavity washing and drying machine is relatively high when both cavities are used simultaneously. This vacuum rotation cleaning also reduces noise transmission and has a noise reduction effect. After cleaning, the heated gas is introduced into the cavity 11 through the high-efficiency particulate air filter 33, guided by the air guide component 14 to the exhaust pipe 32, and then extracted by the Roots vacuum pump to complete the exhaust function. Therefore, the Roots vacuum pump is used to achieve multiple purposes and optimize the performance of the dual-cavity washing and drying machine.

[0045] It is understood that this utility model product, by setting up heating components and air guiding components, introduces hot gas into the lower part of the cavity after the wafer cleaning is completed, and then exhausts it. During the process of the gas flowing in the cavity, it can heat up the gas in the lower part of the cavity. While heating up, it can also remove moisture from the cavity, and finally achieve rapid drying.

[0046] Working principle: The high-efficiency particulate air filter 23 is installed on the outer surface of the cavity 11 and is set higher than the accommodating space 15. The inlet pipe 21 and the exhaust pipe 32 are installed in sequence at both ends of the spiral component 31. The two ends of the spiral component 11 are directly or fixed in the accommodating space 15 by a fixing bracket. First, the dual-chamber rinsing and drying machine cleans the wafer. After cleaning, the drain valve is opened to drain the water from chamber 11. Then, the high-efficiency particulate air filter 23 is turned on. The high-efficiency particulate air filter 23 draws the filtered gas into the guide channel 33 through the air inlet pipe 21. As the gas flows through the guide channel 33, it quickly forms a spiral shape, generating centrifugal force that draws the gas from chamber 11 into the spiral gas and carries it away. Finally, it is discharged through the exhaust pipe 32, thus quickly expelling the humid gas from chamber 11. At the same time, when the filtered gas from the high-efficiency particulate air filter 23 enters chamber 11 through the air inlet pipe 21, it is heated by the heating wire 22, making it hot gas. As it flows through the lower part of chamber 11, it raises the temperature of the gas in the lower part of chamber 11, regulating the temperature of the upper and lower spaces of chamber 11 to be almost uniform. This ensures that when nitrogen is subsequently introduced to dry the wafer, there will be no airflow disturbance in the entire space of chamber 11, resulting in more uniform drying and a shorter drying time.

[0047] By installing this utility model product onto an existing dual-chamber washing and spin dryer in this way, the drying effect can be improved and the drying efficiency can be accelerated. It only needs to be added to the original structure, making full use of the original structure, which is convenient to use, and the overall structure is simple and easy to maintain.

[0048] It should be understood that the above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. It should not be considered that the specific implementation of this utility model is limited to these descriptions. For those skilled in the art to which this utility model pertains, several simple deductions or substitutions can be made without departing from the concept of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A dual-chamber rinsing and spin-drying machine, comprising a chamber, wherein a drain groove is provided at the bottom of the chamber, characterized in that: The cavity is equipped with a heating component and a ventilation component. The heating component is located at the bottom of the cavity and does not come into contact with the cleaning liquid. The ventilation component replaces the gas in the cavity with dry gas.

2. The dual-chamber rinsing and spin-drying machine according to claim 1, characterized in that: The bottom of the cavity is provided with a receiving space, and the drainage channel is connected to the receiving space.

3. The dual-chamber rinsing and spin-drying machine according to claim 1, characterized in that: The heating assembly includes an air inlet pipe, a heating wire, and a high-efficiency particulate air filter. The air inlet pipe is used to deliver clean gas filtered by the high-efficiency particulate air filter into the cavity. The heating wire is installed inside the air inlet pipe to heat the gas inside the air inlet pipe.

4. A dual-chamber rinsing and spin-drying machine according to claim 3, characterized in that: The air guide assembly includes a spiral component and an exhaust pipe. The spiral component has a guide groove facing the air intake direction of the air intake pipe. The two ends of the guide groove are connected to the air intake pipe and the exhaust pipe, respectively. The gas input from the air intake pipe enters the guide groove and is then discharged through the exhaust pipe at the other end of the guide groove. The air guide assembly is fixed within the accommodating space, and the air guiding direction of the air guide assembly is consistent with the drainage direction of the drainage trough.

5. A dual-chamber rinsing and spin-drying machine according to claim 3, characterized in that: The high-efficiency particulate air filter is located outside the cavity and is positioned above the containment space.

6. A dual-chamber rinsing and spin-drying machine according to claim 4, characterized in that: It also includes a gas extraction assembly, which includes a Roots vacuum pump. The Roots vacuum pump's inlet is connected to the exhaust pipe, and the Roots vacuum pump is installed outside the cavity.

7. A dual-chamber rinsing and spin-drying machine according to claim 4, characterized in that: The depth of the guide groove is 0.5-0.8 times the pitch of the spiral component.

8. A dual-chamber rinsing and spin-drying machine according to claim 4, characterized in that: The axis of the spiral component coincides with the axis of the drainage groove, and the diameter of the spiral component is equal to the diameter of the drainage pipe hole in the drainage groove.

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