Wafer cleaning machine with high-pressure pump shared by double cavities

Abstract

The utility model discloses a wafer cleaning machine with double cavities sharing a high-pressure pump, which comprises two independent cleaning cavities and a high-pressure pump, the air inlet end of the high-pressure pump is connected with two high-pressure air paths through a three-way joint, a first air pressure regulating valve and a first air path electromagnetic valve are arranged on the first high-pressure air path, and a second air pressure regulating valve and a second air path electromagnetic valve are arranged on the second high-pressure air path. A second air pressure regulating valve and a second air path electromagnetic valve are arranged on the second high-pressure air path; the water outlet end of the high-pressure pump is connected with two spraying water paths, each spraying water path is provided with a high-pressure water electromagnetic valve, and each spraying water path is connected with a spray head in the cleaning cavity; the outlet air pressure of the first air pressure regulating valve is matched with the single cleaning cavity to work, and the outlet air pressure of the second air pressure regulating valve is matched with the two cleaning cavities to work. According to the wafer cleaning device, the single high-pressure pump is used for controlling the two independent cleaning cavities to carry out wafer cleaning operation, the high-pressure pump is matched with the single cleaning cavity to work independently or the two cleaning cavities work at the same time, and therefore the installation space can be reduced, and the installation cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a wafer cleaning machine with a dual-chamber shared high-pressure pump. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor integrated circuits. With the continuous miniaturization of critical dimensions in semiconductor devices and the introduction of new materials, the cleanliness requirements for wafer surfaces are becoming increasingly stringent during wafer manufacturing. Multiple cleaning processes are typically required to remove contaminants and process solutions adhering to the wafer. Currently, the industry widely employs high-pressure water jet cleaning technology, which uses a high-pressure pump to generate a powerful water jet to effectively remove nanoscale contaminants from the wafer surface.

[0003] Existing wafer cleaning equipment uses a single-chamber independent pressure supply architecture, meaning each cleaning chamber is equipped with a separate high-pressure pump unit. To improve wafer cleaning efficiency, many wafer processing equipment are equipped with dual cleaning stations. The two cleaning chambers require two independent high-pressure generation systems. However, having two high-pressure generation systems increases the equipment footprint, and the redundant configuration increases equipment investment costs. Utility Model Content

[0004] To address the aforementioned issues, this invention provides a wafer cleaning machine with a dual-chamber shared high-pressure pump, which reduces equipment footprint and lowers equipment costs.

[0005] Therefore, the technical solution of this utility model is: a wafer cleaning machine with a dual-chamber shared high-pressure pump, comprising two independent cleaning chambers and a high-pressure pump. The air inlet of the high-pressure pump is connected to two high-pressure air paths via a three-way connector. The first high-pressure air path is equipped with a first air pressure regulating valve and a first air path solenoid valve, and the second high-pressure air path is equipped with a second air pressure regulating valve and a second air path solenoid valve. The water outlet of the high-pressure pump is connected to two spray water paths, each of which is equipped with a high-pressure water solenoid valve. Each of the two spray water paths is connected to a nozzle in a cleaning chamber. The outlet air pressure of the first air pressure regulating valve is matched to the operation of a single cleaning chamber, and the outlet air pressure of the second air pressure regulating valve is matched to the operation of two cleaning chambers.

[0006] Based on the above scheme and as a preferred embodiment: the first air circuit solenoid valve is open, and only one high-pressure water solenoid valve is open, so that any one cleaning chamber is in working condition; the second air circuit solenoid valve is open, and both high-pressure water solenoid valves are open, so that both cleaning chambers are in working condition.

[0007] Based on the above scheme and as a preferred option, two high-pressure air circuits are connected to different outlets of the air compressor.

[0008] Based on the above scheme and as a preferred embodiment of the above scheme: the high-pressure water solenoid valve is connected to the nozzle of the cleaning chamber through a water distributor, and the water distributor is also connected to a pressure relief solenoid valve and a pressure gauge.

[0009] Based on the above scheme and as a preferred embodiment of the above scheme: the cleaning chamber is provided with a water inlet at the bottom, which is connected to the spray water path; the water inlet of the cleaning chamber is connected to the internal spray pipe, and the spray head is located at the front end of the spray pipe.

[0010] Compared with the prior art, the beneficial effects of this utility model are: using a single high-pressure pump to control two separate cleaning chambers for wafer cleaning operations, and using two high-pressure air paths to supply different air volumes to the high-pressure pumps, so that the high-pressure pump can be adapted to work independently of a single cleaning chamber or work simultaneously of two cleaning chambers, thereby reducing installation space and lowering installation costs. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model;

[0012] Figure 2 This is a schematic diagram of the cleaning chamber of this utility model;

[0013] Figure 3 This is a schematic diagram of the high-pressure water solenoid valve of this utility model.

[0014] The components in the diagram are labeled as follows: 1. Cleaning chamber; 2. High-pressure pump; 3. Air compressor; 4. Pilot air pressure regulating valve; 5. First tee connector; 6. First high-pressure air path; 7. Second high-pressure air path; 8. First air pressure regulating valve; 9. First air path solenoid valve; 10. Second air pressure regulating valve; 11. Second air path solenoid valve; 12. Second tee connector; 13. First spray water path; 14. Second spray water path; 15. First high-pressure water solenoid valve; 16. Second high-pressure water solenoid valve; 17. First water distributor; 18. First pressure relief solenoid valve; 19. First cleaning chamber; 20. Second water distributor; 21. Second pressure relief solenoid valve; 22. Second pressure gauge; 23. Second cleaning chamber; 24. Spray inner pipe; 25. Spray head; 26. Detailed Implementation

[0015] In the description of this utility model, it should be noted that the directional terms such as "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0016] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In the description of this utility model, "several" or "a number" means two or more, unless otherwise explicitly specified.

[0017] See the attached figures. The wafer cleaning machine with a shared high-pressure pump in a dual-chamber configuration described in this embodiment includes two independent cleaning chambers 1, a high-pressure pump 2, and an air compressor 3. A pilot air path is provided between the air compressor 3 and the high-pressure pump 2. A pilot air pressure regulating valve 4 is provided on the pilot air path to regulate the airflow pressure of the high-pressure pump 2. Simultaneously, the air inlet of the high-pressure pump 2 is connected to a first high-pressure air path 6 and a second high-pressure air path 7 via a first tee connector 5. The first high-pressure air path 6 is equipped with a first air pressure regulating valve 8 and a first air path solenoid valve 9. The second high-pressure air path 7 is equipped with a second air pressure regulating valve 10 and a second air path solenoid valve 11. The first high-pressure air path 6 and the second high-pressure air path 7 are respectively connected to different air outlets of the air compressor 3.

[0018] The outlet air pressure of the first air pressure regulating valve 8 is matched to the operation of a single cleaning chamber 1, and the outlet air pressure of the second air pressure regulating valve 10 is matched to the operation of two cleaning chambers 1. For example, the operating air pressure of the first air pressure regulating valve 8 is 0.3 Pa, and the operating air pressure of the second air pressure regulating valve 10 is 0.5 Pa, which is matched according to the actual air pressure value required for the operation of a single cleaning chamber or two cleaning chambers.

[0019] The outlet of the high-pressure pump 2 is connected to the first spray water path 13 and the second spray water path 14 via a second three-way connector 12 (or a four-way water distributor). The first spray water path 13 and the second spray water path 14 are respectively equipped with a first high-pressure water solenoid valve 15 and a second high-pressure water solenoid valve 16. The outlet of the first high-pressure water solenoid valve 15 is connected to a first water distributor 17, and each connection port of the first water distributor 17 is connected to a first pressure relief solenoid valve 18, a first pressure gauge 19, and a nozzle inside the first cleaning chamber 20. The outlet of the second high-pressure water solenoid valve 16 is connected to a second water distributor 21, and each connection port of the second water distributor 21 is connected to a second pressure relief solenoid valve 22, a second pressure gauge 23, and a nozzle inside the second cleaning chamber 24. The cleaning chamber 1 has an inlet at the bottom, connected to the spray water path; the inlet of the cleaning chamber 1 is connected to the internal spray pipe 25, and the nozzle 26 is located at the front end of the spray pipe.

[0020] The first high-pressure water solenoid valve 15, the second high-pressure water solenoid valve 16, the first water distributor 17 and the second water distributor 21 can be integrated together for easy installation and connection.

[0021] When only one cleaning chamber of the wafer cleaning machine is working (taking the first cleaning chamber 20 as an example), the first air path solenoid valve 9 is opened, allowing high-pressure air to be sent from the first high-pressure air path 6 into the high-pressure pump 2. The first air pressure regulating valve 8 can adjust the working pressure of the high-pressure pump 2 to meet the working requirements of the first cleaning chamber 20. At the same time, the first high-pressure water solenoid valve 15 is opened, and the high-pressure pump 2 sends high-pressure water into the first cleaning chamber 20, allowing the nozzles in the first cleaning chamber 20 to clean the wafers using high-pressure water. After use, the first pressure relief solenoid valve 18 can release the air pressure in the pipe, and the first pressure gauge 19 is used to detect the outlet pressure. During high-pressure cleaning, the cleaning pressure conditions are met.

[0022] When the wafer cleaning machine requires two cleaning chambers to operate simultaneously, the second air path solenoid valve 11 is opened, allowing high-pressure air to be sent from the second high-pressure air path 7 to the high-pressure pump 2. The second air pressure regulating valve 10 ensures that the working pressure of the high-pressure pump meets the air pressure requirements for the simultaneous operation of the first cleaning chamber 20 and the second cleaning chamber 24. Simultaneously, the first high-pressure water solenoid valve 15 and the second high-pressure water solenoid valve 16 are both opened, and the high-pressure pump 2 simultaneously sends high-pressure water into the first cleaning chamber 20 and the second cleaning chamber 24, allowing the nozzles in the first cleaning chamber 20 and the second cleaning chamber 24 to clean the wafers using high-pressure water. After use, the first pressure relief solenoid valve 18 and the second pressure relief solenoid valve 22 release the air pressure in the pipes. The first pressure gauge 19 and the second pressure gauge 23 are used to detect the outlet pressure, ensuring that the cleaning pressure conditions are met during high-pressure cleaning.

[0023] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A wafer cleaning machine with a dual-chamber shared high-pressure pump, characterized in that: It includes two independent cleaning chambers and a high-pressure pump. The air inlet of the high-pressure pump is connected to two high-pressure air paths via a three-way connector. The first high-pressure air path is equipped with a first air pressure regulating valve and a first air path solenoid valve, and the second high-pressure air path is equipped with a second air pressure regulating valve and a second air path solenoid valve. The water outlet of the high-pressure pump is connected to two spray water paths, each equipped with a high-pressure water solenoid valve. Each of the two spray water paths is connected to a nozzle in a cleaning chamber. The outlet air pressure of the first air pressure regulating valve is matched to the operation of a single cleaning chamber, and the outlet air pressure of the second air pressure regulating valve is matched to the operation of two cleaning chambers.

2. The wafer cleaning machine with a dual-chamber shared high-pressure pump as described in claim 1, characterized in that: When the first air path solenoid valve is open, only one high-pressure water solenoid valve is open, and any one cleaning chamber is in working condition; when the second air path solenoid valve is open, both high-pressure water solenoid valves are open, and both cleaning chambers are in working condition.

3. A wafer cleaning machine with a dual-chamber shared high-pressure pump as described in claim 1, characterized in that: The two high-pressure air circuits are connected to different outlets of the air compressor.

4. A wafer cleaning machine with a dual-chamber shared high-pressure pump as described in claim 1, characterized in that: The high-pressure water solenoid valve is connected to the nozzle of the cleaning chamber through a water distributor, and the water distributor is also connected to a pressure relief solenoid valve and a pressure gauge.

5. A wafer cleaning machine with a dual-chamber shared high-pressure pump as described in claim 1, characterized in that: The cleaning chamber is provided with a water inlet at the bottom, which is connected to the spray water path; the water inlet of the cleaning chamber is connected to the internal spray pipe, and the spray head is located at the front end of the spray pipe.

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