Chip taking and placing device and semiconductor die bonder

Abstract

The utility model relates to a chip pick-and-place device and a semiconductor die bonder, in the chip pick-and-place device, a moving mechanism is utilized to drive a pick-up mechanism to move in a first direction and a second direction, so that the pick-up mechanism moves to a position above a chip to be processed. According to the pick-up mechanism, at least two parallel pick-up assemblies are arranged on the mounting seat, so that the mounting seat is driven by the moving mechanism to move along the third direction, each pick-up assembly respectively picks up the corresponding chip, at least two chips can be synchronously picked up in the die bonding process, the pick-and-place efficiency of the chips is effectively improved, and the die bonding efficiency is further improved.

Description

Technical Field

[0001] This application relates to the field of die bonder technology, and in particular to chip pick-and-place devices and semiconductor die bonders. Background Technology

[0002] The chip pick-and-place device is a key component of a semiconductor die bonder. Depending on the chip package, it has various designs, such as swing-arm, cantilever, needle-type, and linear types. However, the traditional structural design of chip pick-and-place devices results in low chip pick-and-place efficiency, affecting die bonding efficiency. Utility Model Content

[0003] Therefore, it is necessary to provide a chip pick-and-place device and a semiconductor die bonder to improve chip pick-and-place efficiency, thereby improving die bond efficiency.

[0004] A chip picking and placing device includes: a picking mechanism, including a mounting base and at least two picking components, all of which are arranged side-by-side on the mounting base, the picking components being used to pick up and place chips; and a moving mechanism, the mounting base being disposed on the moving mechanism, the moving mechanism being used to drive the mounting base to move along a first direction, a second direction, and a third direction, wherein the first direction, the second direction, and the third direction intersect each other and are not on the same plane.

[0005] The aforementioned chip pick-and-place device utilizes a moving mechanism to drive the pick-up mechanism to move in a first and second direction, bringing it above the chip to be processed. Since the pick-up mechanism has at least two parallel pick-up components on the mounting base, the moving mechanism drives the mounting base to move along a third direction, allowing each pick-up component to pick up its corresponding chip. This effectively ensures that at least two chips can be picked up simultaneously during the die bonding process, significantly improving chip pick-and-place efficiency and thus enhancing die bonding efficiency.

[0006] In some embodiments, each of the pickup components includes a mounting base and a pickup element disposed on the mounting base, the mounting bases being arranged side by side, and the pickup element being used to pick up and place the chip.

[0007] In some embodiments, each of the pickup components further includes a rotary driver disposed on the mounting base, the rotary driver being used to drive the pickup to rotate about its own axis, wherein the axial direction of the pickup is consistent with the third direction.

[0008] In some embodiments, the mounting base includes a first base body, a second base body, and a fixing part. The first base body is disposed on the mounting base, the second base body is disposed at the bottom of the first base body and extends at least partially along the third direction, the fixing part is disposed at the end of the second base body away from the first base body, and the pickup member is disposed on the fixing part.

[0009] In some embodiments, each of the pickup components further includes an adjustment driver disposed on the mounting base for driving the pickup element to move along the third direction.

[0010] In some embodiments, the spacing between two adjacent pickup components is adjustable.

[0011] In some embodiments, the chip pick-and-place device includes a base, the moving mechanism is disposed on the base, and the base is used to fix it to the table of the die bonder.

[0012] In some embodiments, the base includes a connecting portion and a first mounting portion and a second mounting portion that are parallel and spaced apart. The connecting portion is connected between the first mounting portion and the second mounting portion, and both the first mounting portion and the second mounting portion are used to fix the die bonder to the table surface.

[0013] In some embodiments, the moving mechanism includes a first driving component, a second driving component, and a third driving component, with the mounting base disposed on the third driving component. The first driving component is used to drive both the second driving component and the third driving component to move along the first direction, the second driving component is used to drive the third driving component to move along the second direction, and the third driving component is used to drive the mounting base to move along the third direction.

[0014] In some embodiments, the pickup component is configured to pick up the chip using a negative pressure adsorption method.

[0015] A semiconductor die bonder, the semiconductor die bonder comprising the chip pick-and-place device described in any of the above claims.

[0016] The aforementioned semiconductor die bonder employs the chip pick-and-place device described above. A moving mechanism drives the pick-up mechanism to move in a first and second direction, positioning it above the chip to be processed. Since the pick-up mechanism has at least two parallel pick-up components on the mounting base, the moving mechanism drives the mounting base to move along a third direction, allowing each pick-up component to pick up its corresponding chip. This effectively ensures that at least two chips can be picked up simultaneously during the die bonder process, significantly improving chip pick-and-place efficiency and thus enhancing the overall die bonder efficiency. Attached Figure Description

[0017] Figure 1 This is a perspective view of the structure of the chip pick-and-place device described in some embodiments of this application.

[0018] Figure 2 This is a schematic diagram of the picking mechanism described in some embodiments of this application.

[0019] Figure 3 This is another perspective view of the structure of the chip pick-and-place device described in some embodiments of this application.

[0020] Figure 4 This is a schematic diagram of the structure of the first driving component described in some embodiments of this application.

[0021] 100. Chip pick-up and place device; 10. Pick-up mechanism; 11. Mounting base; 12. Pick-up assembly; 121. Fixing base; 12a. First base body; 12b. Second base body; 12c. Fixing part; 122. Pick-up component; 123. Adjustment driver; 124. Rotary driver; 125. Belt; 20. Moving mechanism; 21. First drive assembly; 211. Slide plate; 212. Guide rail; 213. Drive component; 22. Second drive assembly; 23. Third drive assembly; 30. Base; 31. First mounting part; 32. Second mounting part; 33. Connecting part; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0028] In some embodiments, please refer to Figure 1This application provides a chip pick-and-place device 100, which includes a pick-up mechanism 10 and a moving mechanism 20. The pick-up mechanism 10 includes a mounting base 11 and at least two pick-up components 12, all of which are arranged side-by-side on the mounting base 11. The pick-up components 12 are used to pick up and place chips. The mounting base 11 is mounted on the moving mechanism 20, which drives the mounting base 11 to move along a first direction X, a second direction Y, and a third direction Z, wherein the first direction X, the second direction Y, and the third direction Z intersect each other and are not on the same plane.

[0029] The aforementioned chip pick-and-place device 100 utilizes a moving mechanism 20 to drive a picking mechanism 10 to move in a first direction X and a second direction Y, thereby moving the picking mechanism 10 above the chip to be processed. Since the picking mechanism 10 has at least two parallel picking components 12 arranged on the mounting base 11, the moving mechanism 20 drives the mounting base 11 to move along a third direction Z, allowing each picking component 12 to pick up its corresponding chip. This effectively satisfies the requirement that at least two chips can be picked up simultaneously during the die bonding process, effectively improving chip pick-and-place efficiency and thus enhancing die bonding efficiency.

[0030] It should be noted that each pickup component 12 can be fixedly mounted on the mounting base 11 or designed to be adjustable. For example, each pickup component 12 can be fixed to the mounting base 11 with bolts or pins. In this way, when adjusting the spacing between the pickup components 12, the bolts or pins can be fixed at different positions on the mounting base 11 to achieve adjustment. Of course, the adjustment between two adjacent pickup components 12 can also be designed to be automatic. For example, each pickup component 12 can be mounted on the mounting base 11 with a guide rail 212 or a slide, and each pickup component 12 can be driven and adjusted by a cylinder, hydraulic cylinder, electric cylinder, or other equipment; or, each pickup component 12 can cooperate with a motor on the mounting base 11 through a gear and rack, lead screw mechanism, or other means to achieve automatic spacing adjustment.

[0031] The pickup component 12 can pick up chips in various ways, such as picking up chips by negative pressure adsorption or by gripping.

[0032] It should also be noted that the moving mechanism 20 refers to a device capable of driving the picking mechanism 10 to move in three different directions. The structure of the moving mechanism 20 can have various designs. For example, the moving mechanism 20 can be composed of linear modules with three different driving directions; or, the moving mechanism 20 can be composed of a combination of motors and transmission mechanisms with three different driving directions. The transmission mechanism can be, but is not limited to, a combination of gears and racks, a lead screw mechanism, etc. Of course, the moving mechanism 20 can also be composed of cylinders, hydraulic cylinders, or electric cylinders with three different driving directions. Specifically, in some embodiments, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other, and the third direction Z is a vertical direction.

[0033] Further, please refer to Figure 1 Each pickup assembly 12 includes a mounting base 121 and a pickup element 122 disposed on the mounting base 121. Each mounting base 121 is arranged side by side on the mounting base 11, and the pickup element 122 is used to pick up and place the chip. In this way, the mounting base 121 enables the pickup element 122 to be stably mounted on the mounting base 11, which facilitates the pickup assembly 12 to stably pick up the chip.

[0034] It should be noted that the fixed base 121 may not be adjustable on the mounting base 11, for example, by welding, riveting, etc.; it may also be adjustable, for example, by bolt connection, snap-fit, pin connection, etc. Of course, the fixed base 121 may be slidably mounted on the mounting base 11, for example, the fixed base 121 may be mounted on the mounting base 11 via a guide rail 212 or guide groove, etc.

[0035] Similarly, the pickup 122 on the fixed base 121 can be designed to be either non-adjustable or adjustable. When the pickup 122 is adjustable on the fixed base 121, the pickup 122 can be rotated around its own axis for adjustment, thus adjusting the placement angle of the chip. The pickup 122 can also be adjusted along the third direction Z on the fixed base 121. After the pickup 122 moves along the third direction Z via the moving mechanism 20, it can also be finely adjusted along the third direction Z by moving itself on the fixed base 121, so that the pickup 122 can accurately reach the surface of the chip and avoid excessive movement along the third direction Z that could damage the chip.

[0036] The pickup component 122 is adjusted along the third direction Z on the fixed base 121. There are several ways to achieve this. For example, a cylinder, hydraulic cylinder, electric cylinder, or other device can be installed on the fixed base 121 to drive the pickup component 122 to move along the third direction Z. Of course, the pickup component 122 can also be driven to move along the third direction Z by a combination of a motor and a gear and rack, or a combination of a motor and a lead screw mechanism.

[0037] In addition, the pickup element 122 can pick up the chip by negative pressure adsorption, mechanical gripping, etc. Specifically, in some embodiments, the pickup element 122 is constructed as a hollow structure, and one end of the pickup element 122 is used to communicate with a negative pressure device.

[0038] In some embodiments, please refer to Figure 2 Each pickup assembly 12 also includes a rotary driver 124 mounted on a mounting base 121. The rotary driver 124 drives the pickup 122 to rotate around its own axis, wherein the axis of the pickup 122 is aligned with the third direction Z. Therefore, when the pickup 122 picks up a chip, if the chip's placement angle deviates, the rotary driver 124 can drive the pickup 122 to rotate, ensuring the chip's placement angle matches the set angle, thus improving the die bonding effect.

[0039] It is understood that the rotary actuator 124 refers to the device that provides power for the rotation of the pickup 122, and it can be an electric motor. The rotary actuator 124 can be directly connected to the pickup 122 via a direct shaft connection, or it can be connected to the pickup 122 via a transmission component. For example, a belt 125 can be sleeved between the output end of the rotary actuator 124 and the pickup 122; or, the output end of the rotary actuator 124 can be connected to the pickup 122 via a gear set.

[0040] Optionally, the rotary driver 124 can be connected to the fixed base 121 in various ways, such as, but not limited to, bolt connection, snap-fit, riveting, welding, etc.

[0041] In some embodiments, please refer to Figure 3 The mounting base 121 includes a first base body 12a, a second base body 12b, and a fixing part 12c. The first base body 12a is disposed on the mounting base 11, the second base body 12b is disposed at the bottom of the first base body 12a and extends at least partially along a third direction Z, and the fixing part 12c is disposed at the end of the second base body 12b away from the first base body 12a. The pickup 122 is disposed on the fixing part 12c. Thus, by designing the mounting base 121 as the first base body 12a, the second base body 12b, and the fixing part 12c, it is easy to stably fix the pickup 122 on the mounting base 121; at the same time, it is also easy to stably fix the pickup 122 below the mounting base 121, making it easier for the pickup 122 to contact the chip.

[0042] It should be noted that the structures of the first base 12a and the second base 12b can have various designs, such as being block-shaped, plate-shaped, or frame-shaped. Specifically, in some embodiments, both the first base 12a and the second base 12b include a base plate, a side plate, and a reinforcing plate. The base plate and the side plate are connected at an angle, and the reinforcing plate is connected between the base plate and the side plate. Simultaneously, the base plate of the first base 12a is fitted to the base plate of the second base 12b, the side plate of the first base 12a is connected to the mounting base 11, and the side plate of the second base 12b is connected to the fixing part 12c.

[0043] The connection between the first seat 12a and the second seat 12b can be, but is not limited to, bolt connection, snap-fit, riveting, welding, pin connection, etc. Similarly, the connection between the second seat 12b and the fixing part 12c can also be, but is not limited to, bolt connection, snap-fit, riveting, welding, pin connection, etc.

[0044] In some embodiments, please refer to Figure 2Each pickup component 12 also includes an adjustment driver 123 disposed on the mounting base 121. The adjustment driver 123 is used to drive the pickup component 122 to move along the third direction Z. In this way, the pickup component 122 can be further adjusted in the third direction Z by the driver, so that the pickup component 12 can better act on the chip and ensure that the chip is picked up stably.

[0045] It should be noted that the adjustment driver 123 provides power for the movement of the pickup element 122 in the third direction Z. It can be a cylinder, hydraulic cylinder, voice coil motor, or a combination of a motor and a transmission mechanism, such as a combination of a motor and a gear and rack mechanism, or a combination of a motor and a lead screw mechanism. During chip pickup, the pickup element 122 moves close to the chip in the third direction Z under the action of the moving mechanism 20. Then, the adjustment driver 123 drives the pickup element 122 to continue moving in the third direction Z, achieving fine-tuning of the pickup element 122 to ensure effective and stable contact with the chip and complete the pickup action.

[0046] Additionally, when the pickup assembly 12 also includes a rotary driver 124, the adjusting driver 123 can simultaneously drive the pickup 122 and the rotary driver 124 to move together along a third direction Z. For example, the pickup 122 and the rotary driver 124 can be slidably mounted on the fixed base 121 as a whole. Of course, considering that the adjustment driver 123 drives the pickup 122 to move only a small distance, the adjustment driver 123 can also drive the pickup 122 to move independently, which will not affect the fact that the pickup 122 is driven by the rotary driver 124.

[0047] In some embodiments, the spacing between two adjacent pickup components 12 is adjustable. This allows two adjacent pickup components 12 to simultaneously and accurately pick up two chips, improving pick-and-place accuracy.

[0048] Understandably, when the distance between two adjacent pickup components 12 is greater than the distance between two chips, the distance between the two pickup components 12 can be shortened so that the distance between the two adjacent pickup components 12 is comparable to the distance between the two chips. When the distance between two adjacent pickup components 12 is less than the distance between the two chips, the distance between the two pickup components 12 can be increased.

[0049] The distance between the two pickup components 12 can be adjusted manually, for example, by manually moving one of the pickup components 12 to move it on the mounting base 11; or by installing the pickup components 12 in different fixed positions, such as different bolt holes or pin holes. The adjustment can also be automatic, for example, by sliding the pickup component 12 on the mounting base 11 via a guide rail 212, a slide rail, or other structure, and then driving the pickup component 12 to slide using a cylinder, hydraulic cylinder, electric cylinder, or other device. Alternatively, the pickup component 12 can be mounted on the mounting base 11 via a screw mechanism, and then the screw can be rotated by a motor, causing the slider to move, thereby moving the pickup component 12.

[0050] In some embodiments, please refer to Figure 3 The chip pick-and-place device 100 includes a base 30 and a moving mechanism 20 disposed on the base 30. The base 30 is used to fix the moving mechanism 20 on the die bonder table. In this way, the base 30 ensures that the moving mechanism 20 is stably fixed on the die bonder, thus ensuring the stable operation of the chip pick-and-place device 100.

[0051] The installation method of the moving mechanism 20 on the base 30 can be, but is not limited to, bolt connection, snap-fit, riveting, welding, or bonding. Similarly, the installation method of the base 30 on the die bonder's table can also be, but is not limited to, bolt connection, snap-fit, riveting, welding, or bonding.

[0052] Furthermore, the base 30 includes a connecting portion 33 and two parallel and spaced-apart first mounting portions 31 and second mounting portions 32. The connecting portion 33 connects the first mounting portions 31 and the second mounting portions 32, and both the first mounting portions 31 and the second mounting portions 32 are used to fix the base 30 to the table surface of the die bonder. It can be seen that the introduction of the first mounting portions 31 and the second mounting portions 32 makes the fixation of the base 30 on the die bonder more stable.

[0053] It should be noted that the connecting parts 33 can be connected to the first mounting part 31 and the second mounting part 32 by means of bolts, snap-fit, riveting, welding, bonding, etc., or they can be designed as an integrated structure, for example, integrally formed by injection molding, die casting, bending, etc. In some specific embodiments, the first mounting part 31, the connecting part 33 and the second mounting part 32 are an integrated structure, and the two opposite ends of the connecting part 33 are bent towards the same side to lower the first mounting part 31 and the second mounting part 32, making it easier to fix the base 30 on the die bonder. In addition, lowering the first mounting part 31 and the second mounting part 32 also facilitates the installation of the slide plate 211 structure on the side of the first mounting part 31 and the second mounting part 32 that faces away from the die bonder table.

[0054] In some embodiments, please refer to Figure 1The moving mechanism 20 includes a first driving component 21, a second driving component 22, and a third driving component 23. The mounting base 11 is disposed on the third driving component 23. The first driving component 21 is used to drive the second driving component 22 and the third driving component 23 to move along the first direction X. The second driving component 22 is used to drive the third driving component 23 to move along the second direction Y. The third driving component 23 is used to drive the mounting base 11 to move along the third direction Z.

[0055] Therefore, during the chip picking and placing process, the first driving component 21 can drive the second driving component 22 and the third driving component 23 to move along the first direction X; then the second driving component 22 can drive the third driving component 23 to move along the second direction Y. Since the mounting base 11 is located on the third driving component 23, the mounting base 11 moves along the first direction X and the second direction Y respectively under the action of the first driving component 21 and the second driving component 22, so that the picking component 12 on the mounting base 11 reaches above the chip; finally, the third driving component 23 drives the mounting base 11 to move along the third direction Z, so that the picking component 12 can pick up the chip. In this way, an effective and stable picking and placing operation is achieved.

[0056] It should be noted that the structures of the first drive assembly 21, the second drive assembly 22, and the third drive assembly 23 can be designed in various ways. For example, all three can be cylinders, hydraulic cylinders, electric cylinders, linear modules, etc.; they can also be combinations of motors and transmission mechanisms. The transmission mechanism can be a lead screw mechanism, a rack and pinion mechanism, etc. When the transmission mechanism is a lead screw mechanism, it includes a lead screw and a slider screwed to the lead screw. The motor drives the lead screw to rotate, thereby driving the slider to move along the length of the lead screw. To ensure smoother movement, the first drive assembly 21, the second drive assembly 22, and the third drive assembly 23 can all include a guide rail structure.

[0057] For specific embodiments, please refer to Figure 4 The first drive assembly 21 includes a drive component 213 and a slide plate 211. The base 30 includes a connecting portion 33 and two parallel and spaced-apart first mounting portions 31 and second mounting portions 32. Guide rails 212 extending along a first direction X are provided on both the first mounting portions 31 and the second mounting portions 32. The slide plate 211 is slidably mounted on the guide rails 212 of the first mounting portions 31 and the second mounting portions 32. The second drive assembly 22 is mounted on the slide plate 211. The drive component 213 is located on the first mounting portion 31 and is used to drive the slide plate 211 to move along the first direction X.

[0058] In some embodiments, the pickup component 12 is configured to pick up the chip using a negative pressure adsorption method. It is understood that the pickup component 12 picks up the chip by adsorption, and once the chip is transferred to the desired position, the adsorption can be disengaged, releasing the chip.

[0059] In some embodiments, this application provides a semiconductor die bonder, which includes the chip pick-and-place device 100 described above.

[0060] The aforementioned semiconductor die bonder employs the chip pick-and-place device 100. A moving mechanism 20 drives the pick-up mechanism 10 to move in the first direction X and the second direction Y, positioning the pick-up mechanism 10 above the chip to be processed. Since the pick-up mechanism 10 has at least two parallel pick-up components 12 on the mounting base 11, the moving mechanism 20 drives the mounting base 11 to move along the third direction Z, allowing each pick-up component 12 to pick up its corresponding chip. This effectively ensures that at least two chips can be picked up simultaneously during the die bonder process, significantly improving chip pick-and-place efficiency and thus enhancing the die bonder's overall efficiency.

[0061] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chip pick-and-place device, characterized in that, The chip pick-and-place device includes: The picking mechanism (10) includes a mounting base (11) and at least two picking components (12), all of which are arranged side by side on the mounting base (11) and are used to pick up and place chips. The moving mechanism (20) is provided on the mounting base (11), and the moving mechanism (20) is used to drive the mounting base (11) to move along a first direction (X), a second direction (Y) and a third direction (Z), wherein the first direction (X), the second direction (Y) and the third direction (Z) intersect each other and are not on the same plane.

2. The chip pick-and-place device according to claim 1, characterized in that, Each of the pickup components (12) includes a mounting base (121) and a pickup element (122) disposed on the mounting base (121). Each of the mounting bases (121) is arranged side by side on the mounting base (11). The pickup element (122) is used to pick up and put down the chip.

3. The chip pick-and-place device according to claim 2, characterized in that, Each of the pickup components (12) further includes a rotary driver (124) disposed on the fixed base (121), the rotary driver (124) being used to drive the pickup (122) to rotate about its own axis, wherein the axial direction of the pickup (122) is consistent with the third direction (Z).

4. The chip pick-and-place device according to claim 3, characterized in that, The fixing base (121) includes a first base body (12a), a second base body (12b), and a fixing part (12c). The first base body (12a) is disposed on the mounting base (11), the second base body (12b) is disposed at the bottom of the first base body (12a) and extends at least partially along the third direction (Z), the fixing part (12c) is disposed at the end of the second base body (12b) away from the first base body (12a), and the picking member (122) is disposed on the fixing part (12c).

5. The chip pick-and-place device according to claim 2, characterized in that, Each of the pickup components (12) further includes an adjustment driver (123) disposed on the mounting base (121), the adjustment driver (123) being used to drive the pickup (122) to move along the third direction (Z).

6. The chip pick-and-place device according to claim 1, characterized in that, The spacing between two adjacent pickup components (12) is adjustable.

7. The chip pick-and-place device according to any one of claims 1-6, characterized in that, The chip pick-and-place device includes a base (30), and the moving mechanism (20) is disposed on the base (30). The base (30) is used to fix the chip pick-and-place device on the table of the die bonder.

8. The chip pick-and-place device according to claim 7, characterized in that, The base (30) includes a connecting part (33) and a first mounting part (31) and a second mounting part (32) that are parallel and spaced apart. The connecting part (33) is connected between the first mounting part (31) and the second mounting part (32). Both the first mounting part (31) and the second mounting part (32) are used to fix the die bonder on the table surface.

9. The chip pick-and-place device according to any one of claims 1-6, characterized in that, The moving mechanism (20) includes a first drive component (21), a second drive component (22), and a third drive component (23). The mounting base (11) is disposed on the third drive component (23). The first drive component (21) is used to drive both the second drive component (22) and the third drive component (23) to move along the first direction (X). The second drive component (22) is used to drive the third drive component (23) to move along the second direction (Y). The third drive component (23) is used to drive the mounting base (11) to move along the third direction (Z). And / or, The pickup component (12) is configured to pick up the chip by negative pressure adsorption.

10. A semiconductor die bonder, characterized in that, The semiconductor die bonder includes the chip pick-and-place device according to any one of claims 1-9.

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