Gallium nitride device and driving component integrated module convenient for heat dissipation
By optimizing the heat dissipation path of gallium nitride (GaN) devices through a sandwich structure and power management module, combined with a forced air cooling system, the problem of excessive temperature rise of GaN devices was solved, achieving efficient heat dissipation and stable operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING WEISHI TIANCHENG TECH CO LTD
- Filing Date
- 2025-06-04
- Publication Date
- 2026-04-14
AI Technical Summary
The heat dissipation problem of gallium nitride devices leads to excessive temperature rise, affecting reliability and lifespan. Existing DFN packages have limited heat dissipation area and poor thermal conductivity of the molding material.
It adopts a sandwich structure design, including an upper metal plate, a dielectric layer and a lower metal plate, combined with heat dissipation fins, serpentine flow channels and heat pipes to optimize the heat dissipation path, and the heat dissipation is monitored and regulated in real time through a power management and drive control module, combined with a forced air cooling system.
It significantly improves the heat dissipation of gallium nitride devices, extends their service life, and ensures stable operation of devices under high frequency and high voltage through dynamic frequency adjustment and overcurrent and overvoltage protection.
Smart Images
Figure CN224124568U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for semiconductor devices, and in particular to an integrated module for a gallium nitride device and driving components that facilitates heat dissipation. Background Technology
[0002] Gallium nitride (GaN), as a third-generation semiconductor material, is becoming an ideal choice for high-voltage, high-temperature, and high-frequency applications due to its high electron mobility and wide bandgap characteristics, enabling higher switching frequencies, system efficiency, and power density. However, compared with traditional silicon or silicon carbide devices, GaN devices have a lower threshold voltage (1V-2V) and extremely fast switching speed, making them highly sensitive to parasitic parameters (such as parasitic capacitance and inductance). This can easily lead to problems such as drive ringing and voltage / current spikes, thereby reducing system efficiency or even damaging the device. At the same time, GaN chips have a smaller area and higher thermal resistance, requiring more sophisticated heat dissipation systems. Therefore, an integrated module of GaN devices and drive components that facilitates heat dissipation is needed.
[0003] An integrated module for gallium nitride (GaN) devices and driving components, designed for efficient heat dissipation, significantly improves power density, efficiency, and reliability under high frequency and high voltage conditions through optimized heat dissipation structure and highly integrated design. In existing technologies, GaN devices mostly employ DFN surface mount technology, relying on a bottom heat sink for heat dissipation. However, the heat dissipation area of DFN packages is limited, and the poor thermal conductivity of the molding compound leads to excessively high device temperature rise, affecting reliability and lifespan. Utility Model Content
[0004] To overcome the above shortcomings, this utility model provides an integrated module for gallium nitride devices and driving components that facilitates heat dissipation, aiming to improve the problem of excessive device temperature rise caused by reliance on DFN packaging for heat dissipation in the prior art, which affects reliability and lifespan.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: an integrated module for a gallium nitride device and a driving component that facilitates heat dissipation, comprising a housing, wherein heat dissipation fins are fixedly connected to the inner wall of the housing, and a serpentine flow channel is integrated inside the heat dissipation fins; a lower metal plate is fixedly connected to the outer wall of the heat dissipation fins; a dielectric layer is fixedly connected to the upper surface of the lower metal plate; a tapered through hole is formed inside the dielectric layer; an upper metal plate is fixedly connected to the upper surface of the dielectric layer; a gallium nitride element and a driving component are disposed on the upper surface of the upper metal plate; an electrical connection portion is disposed on the upper surface of the upper metal plate; the electrical connection portion electrically connects the gallium nitride element and the driving component; heat dissipation holes are formed on the outer wall of the housing; and a clamping assembly is disposed on the outer wall of the housing.
[0006] The above technical solution involves fixing the dielectric layer to the upper surface of the lower metal plate, and the upper metal plate to the upper surface of the dielectric layer. The layer-by-layer design of the lower metal plate, dielectric layer, and upper metal plate creates a sandwich structure. This allows the upper metal plate to transfer the heat generated by the gallium nitride (GaN) device and driving components downwards layer by layer, promoting heat dissipation. Simultaneously, the tapered vias inside the dielectric layer increase flow distribution, accelerating heat transfer from the upper metal plate to the lower metal plate. Heat pipes inside the lower metal plate accelerate the lateral diffusion of heat to the heat dissipation fins. The connection between the heat dissipation fins and the external metal casing further accelerates heat dissipation. Furthermore, the serpentine flow channels inside the heat dissipation fins, aided by the coolant, further enhance heat dissipation. By optimizing the heat dissipation pathway, the heat generated by the GaN device can be dissipated more quickly, preventing device overheating and extending its lifespan.
[0007] As a further description of the above technical solution:
[0008] The clamping assembly includes a fixed post, the outer wall of which is slidably connected to the outer wall of the housing, a connecting post slidably connected to the inside of the fixed post, a clamping block one fixedly connected to the outer wall of the connecting post, the outer wall of the clamping block one slidably connected to the inside of the fixed post, a spring sleeved on the outer wall of the connecting post, the top end of the spring fixedly connected to the inside of the fixed post, the bottom end of the spring connected to the upper surface of the clamping block one, and a clamping block two fixedly connected to the outer wall of the fixed post. The outer walls of the clamping block one and the clamping block two are connected to the outer wall of the housing.
[0009] Through the above technical solution: the clamping block 2 on the outer wall of the lower fixed column is in a fixed state, positioning the clamping block 1. The fixed column provides support for the connecting column. The connecting column is fixedly connected to the clamping block 1. By pulling the connecting column, the clamping block 1 can move upward inside the fixed column. When the connecting column is released, the clamping block 1 can be reset by the spring force. The upward movement of the clamping block 1 can release the clamping block 1 from the shell. The reset of the clamping block 1 can make the clamping block 1 and the clamping block 2 clamp the shell again, thereby achieving quick clamping, fixing and disassembly, which is convenient for fixing and removing the shell, and for repairing or replacing the fan blades. The operation is simple.
[0010] As a further description of the above technical solution:
[0011] The outer wall of the fixed column is fixedly connected to an outer shell, which is located inside the housing. A magnetic block is fixedly connected to the outer wall of the outer shell, and the outer wall of the magnetic block is connected to the inside of the housing.
[0012] The above technical solution involves creating a groove on the outer wall of the housing and placing a magnetic block inside the groove. The magnetic block and the magnetic block inside the housing adhere tightly to each other through magnetic attraction, which helps to stabilize the outer shell inside the housing and ensure stable heat dissipation.
[0013] As a further description of the above technical solution:
[0014] A fixing block is fixedly connected inside the outer casing, and a motor is fixedly connected inside the fixing block. A rotating shaft is fixedly installed at the output end of the motor, and a fan blade is fixedly connected to the outer wall of the rotating shaft. The outer wall of the rotating shaft is rotatably connected to the inside of the outer casing.
[0015] Through the above technical solution: the fixing effect of the outer shell on the fixing block can ensure the stable operation of the motor. The drive motor can make the fan blades rotate and generate forced airflow. Furthermore, the opposing design of the airflow of the fan blades and the heat dissipation holes opened in the outer shell can accelerate the airflow, quickly remove the heat inside the outer shell, assist the lower metal layer in heat dissipation, and improve the heat dissipation effect.
[0016] As a further description of the above technical solution:
[0017] The housing contains a power management and drive control module, which is signal-connected to a thermal management module. The output of the thermal management module is signal-connected to a fan module, which consists of a motor, a shaft, and fan blades.
[0018] Through the above technical solution: the power management and drive control module, as the control core, will monitor the device temperature, current and other data in real time through built-in sensors. When an overheating risk is detected, it will immediately output a speed regulation signal to drive the fan module for forced heat dissipation. The fan module mainly provides physical heat dissipation for the inside of the housing, improves the heat dissipation efficiency inside the housing, and provides a stable temperature state for the operation of gallium nitride devices.
[0019] As a further description of the above technical solution:
[0020] The power management and drive control module is electrically connected to the drive control module, and the output signal of the power management and drive control module is connected to the input of the dynamic frequency adjustment module.
[0021] The above technical solution uses a power management and drive control module as the core hub, which is directly controlled by the drive control module through electrical hard wiring. This ensures that the gallium nitride device receives precise gate drive voltage and nanosecond-level switching timing control. At the same time, a high-speed signal link is used to link with a dynamic frequency adjustment module to adjust the switching frequency in real time according to load and temperature changes, thereby better balancing efficiency and heat dissipation.
[0022] As a further description of the above technical solution:
[0023] The output of the power management and drive control module is electrically connected to the input of the overcurrent and overvoltage protection module.
[0024] Through the above technical solution: the power management and drive control module establishes a direct hardware linkage with the overcurrent and overvoltage protection module through electrical connection. When the overcurrent and overvoltage protection module detects an abnormality based on the voltage and current data collected by the power management and drive control module, it will quickly cut off the power output within 1 microsecond to prevent gallium nitride devices from being damaged due to electrical stress.
[0025] As a further description of the above technical solution:
[0026] The output signal of the power management and drive control module is connected to the communication and monitoring module, and the signal of the power management and drive control module is connected to the user interaction module.
[0027] Through the above technical solution: the communication and monitoring module can remotely transmit the data collected by the power management and drive control module, providing data support for fault analysis and data tracing; the user interaction module can visualize the data collected by the power management and drive control module, allowing users to view the status in real time, which not only meets the needs of intelligent operation and maintenance, but also ensures the flexibility of on-site operation.
[0028] This utility model has the following beneficial effects:
[0029] 1. In this utility model, through the coordinated work of the upper metal plate, the dielectric layer and the lower metal plate, the heat generated by the gallium nitride device and the driving components can be transferred layer by layer to the heat dissipation fins on the outer wall of the upper metal plate. Through the optimized design of the sandwich heat dissipation structure, the heat dissipation effect can be improved and the service life of the equipment can be extended.
[0030] 2. In this utility model, by integrating gallium nitride devices and driving components into the housing, and through the coordinated operation of the power management and drive control module and the thermal management module, the fan blades improve the heat dissipation effect inside the housing. At the same time, the drive control module and the dynamic frequency adjustment module realize frequency reduction and current limiting to assist heat dissipation, thereby providing a more stable temperature working environment for gallium nitride devices and driving components. Attached Figure Description
[0031] Figure 1 This is a perspective view of an integrated module for a gallium nitride device and driving components that facilitates heat dissipation, as proposed in this utility model.
[0032] Figure 2 This is a partial structural diagram of the lower metal plate of an integrated module for a gallium nitride device and driving components that facilitates heat dissipation, as proposed in this utility model.
[0033] Figure 3 This is a cross-sectional schematic diagram of the internal structure of the heat sink fins of an integrated module for a gallium nitride device and driving components that facilitates heat dissipation, as proposed in this utility model.
[0034] Figure 4 A partial structural diagram of the fan blade of an integrated module for a gallium nitride device and driving components that facilitates heat dissipation, as proposed in this utility model.
[0035] Figure 5 This is a schematic block diagram of the module connection of an integrated module for a gallium nitride device and driving components that facilitates heat dissipation, as proposed in this utility model.
[0036] Legend:
[0037] 1. Housing; 2. Heat dissipation fins; 3. Lower metal plate; 4. Dielectric layer; 5. Upper metal plate; 6. Gallium nitride element; 7. Drive element; 8. Electrical connection part; 9. Heat dissipation hole; 10. Clamping assembly; 1001. Fixing post; 1002. Connecting post; 1003. Spring; 1004. Clamping block one; 1005. Clamping block two; 11. Outer shell; 12. Fixing block; 13. Motor; 14. Rotating shaft; 15. Fan blade; 16. Magnetic block; 17. Serpentine flow channel; 18. Conical through hole. Detailed Implementation
[0038] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0039] Reference Figure 1 , Figure 2 and Figure 3 An embodiment of this utility model provides an integrated module for a gallium nitride device and driving components that facilitates heat dissipation. The module includes a housing 1, a heat dissipation fin 2 fixedly connected to the inner wall of the housing 1, a serpentine flow channel 17 integrated inside the heat dissipation fin 2, a lower metal plate 3 fixedly connected to the outer wall of the heat dissipation fin 2, a dielectric layer 4 fixedly connected to the upper surface of the lower metal plate 3, a tapered through hole 18 opened inside the dielectric layer 4, an upper metal plate 5 fixedly connected to the upper surface of the dielectric layer 4, a gallium nitride element 6 and a driving element 7 disposed on the upper surface of the upper metal plate 5, an electrical connection part 8 disposed on the upper surface of the upper metal plate 5, the electrical connection part 8 connecting the gallium nitride element 6 and the driving element 7, heat dissipation holes 9 opened on the outer wall of the housing 1, and a clamping assembly 10 disposed on the outer wall of the housing 1.
[0040] Specifically, the dielectric layer 4 provides a fixing function for the upper metal plate 5. The serpentine flow channel 17 inside the dielectric layer 4 is located at the bottom of the gallium nitride element 6. The tapered design of the tapered via 18 guides the gas flow, optimizing the flow rate and flow distribution. Simultaneously, the dielectric layer 4 is made of a high thermal conductivity ceramic material, and the tapered via 18 is filled with electroplated copper, achieving better heat dissipation and preventing heat concentration. The housing 1 provides a fixing function for the heat dissipation fins 2, and the heat dissipation fins 2 provide support and fixing function for the lower metal plate 3. The lower metal plate 3 integrates embedded... The in-line heat pipe accelerates the lateral diffusion of heat to the heat sink fins 2. The serpentine flow channel 17 contains coolant, which can improve heat dissipation efficiency. The layered connection design of the lower metal plate 3, the dielectric layer 4, and the upper metal plate 5 forms a sandwich structure, which allows the heat generated by the gallium nitride element 6 and the driving element 7 to be transferred from the upper metal plate 5 to the lower metal plate 3 through the serpentine flow channel 17, and then transferred to the heat sink fins 2 through the heat pipe inside the lower metal plate 3. Through the action of the heat sink fins 2 and the serpentine flow channel 17, the heat is dissipated faster and the heat dissipation effect is improved.
[0041] Reference Figure 1 , Figure 2 and Figure 4 The clamping assembly 10 includes a fixed post 1001, the outer wall of the fixed post 1001 is slidably connected to the outer wall of the housing 1, a connecting post 1002 is slidably connected to the inside of the fixed post 1001, a clamping block 1004 is fixedly connected to the outer wall of the connecting post 1002, the outer wall of the clamping block 1004 is slidably connected to the inside of the fixed post 1001, a spring 1003 is sleeved on the outer wall of the connecting post 1002, the top end of the spring 1003 is fixedly connected to the inside of the fixed post 1001, the bottom end of the spring 1003 is connected to the upper surface of the clamping block 1004, a clamping block 2 1005 is fixedly connected to the outer wall of the fixed post 1001, and the outer walls of the clamping block 1004 and the clamping block 2 1005 are connected to the outer wall of the housing 1.
[0042] Specifically, the fixed post 1001 supports and limits the offset of the connecting post 1002, ensuring that the connecting post 1002 can only move up and down within the fixed post 1001. The connecting post 1002 also fixes the clamping block 1004. When the connecting post 1002 is pulled, it causes the clamping block 1004 to move synchronously. When the clamping block 1004 moves upward, the spring 1003 is compressed by it, and its elastic force helps to reset the clamping block 1004. After the connecting post 1002 is released... Clamping block 1004 loses its upward pulling force, and spring 1003 loses its compressive force. Consequently, spring 1003 causes clamping block 1004 to return to its original position. Pulling clamping block 1004 upward and returning it to its original position achieves the functions of quick disassembly and clamping fixation. The fixing post 1001 on the lower side provides fixed support for clamping block 2 1005. Clamping block 2 1005 and clamping block 1004 are arranged symmetrically. Through the cooperation of clamping block 1004 and clamping block 2 1005, the stability of the clamping action can be ensured.
[0043] Reference Figure 1 and Figure 4 The outer wall of the fixed column 1001 is fixedly connected to the outer shell 11, the outer shell 11 is located inside the housing 1, and the outer wall of the outer shell 11 is fixedly connected to the magnetic block 16, the outer wall of the magnetic block 16 is connected to the inside of the housing 1;
[0044] Specifically, the fixing post 1001 has a fixing function for the outer shell 11, and the outer shell 11 has a fixing function for the magnetic block 16. The outer wall of the outer shell 1 has a groove that matches the outer wall of the magnetic block 16. The groove contains a magnetic block. By having the magnetic block 16 adhere to the groove, the outer shell 11 can be fixed inside the outer shell 1.
[0045] Reference Figure 4 A fixing block 12 is fixedly connected inside the outer casing 11, and a motor 13 is fixedly connected inside the fixing block 12. A rotating shaft 14 is fixedly installed at the output end of the motor 13, and a fan blade 15 is fixedly connected to the outer wall of the rotating shaft 14. The outer wall of the rotating shaft 14 is rotatably connected to the inside of the outer casing 11.
[0046] Specifically, the outer casing 11 fixes the fixing block 12, which in turn fixes the motor 13, ensuring its stable operation. The motor 13 fixes the rotating shaft 14, allowing the shaft to rotate by starting the motor 13. The rotating shaft 14 fixes the fan blade 15, allowing the fan blade 15 to rotate by rotating the shaft 14, thus accelerating the exchange of internal hot air and external cold air and removing more heat. At the same time, the outer casing 11 faces the heat dissipation hole 9, which makes the airflow generated when the outer casing 11 rotates smoother, reduces air resistance, accelerates heat dissipation, improves heat dissipation, and prevents equipment from malfunctioning due to overheating.
[0047] Reference Figure 1 and Figure 5 The housing 1 contains a power management and drive control module, which is connected to a thermal management module. The output of the thermal management module is connected to a fan module. The fan module consists of a motor 13, a shaft 14, and fan blades 15.
[0048] Specifically, the power management and drive control module, as the core control unit, is responsible for power distribution, operation status monitoring, and signal scheduling. Through its built-in ADC circuit, it can monitor input voltage, current, temperature, and load demand in real time, and adjust power supply parameters according to operation requirements. When the power management and drive control module detects an increase in temperature or load, it sends a control signal to the thermal management module. After receiving the signal, the thermal management module analyzes and calculates the data from the temperature sensor to generate a corresponding heat dissipation strategy, and outputs it to the fan module through a PWM speed control signal. The motor 13 in the fan module starts to run after receiving the drive signal. The operation of the motor 13 drives the shaft 14 to rotate, and the rotation of the shaft 14 drives the fan blades 15 to rotate, thereby generating forced airflow to dissipate heat from the inside of the housing 1. The heat dissipation through the fan blades 15 ensures that the device maintains a stable operating temperature during operation.
[0049] Reference Figure 5 The power management and drive control module is electrically connected to the drive control module, and the output signal of the power management and drive control module is connected to the input of the dynamic frequency adjustment module.
[0050] Specifically, the power management and drive control module provides a precise 6-10V drive voltage to the drive control module via the power bus, including the gate drive voltage and grounding loop, ensuring efficient switching of the gallium nitride power devices. The power management and drive control module collects data from current and voltage sensors through its built-in ADC circuit and transmits the real-time current and temperature data to the dynamic frequency adjustment module via a high-speed PWM signal line. The dynamic frequency adjustment module immediately implements temperature-frequency linkage control through FPGA programmable logic to achieve a 5% frequency increase / decrease every 5°C temperature, dynamically adjusting the switching frequency from 1MHz to 800kHz. At the same time, the drive control module simultaneously optimizes the gate drive parameters to ensure the integrity of the switching waveform after frequency reduction. Through the coordinated work of these three modules, efficient power conversion and intelligent thermal management can be achieved, and automatic and timely frequency reduction and current limiting can be implemented in case of emergencies to stabilize the temperature rise within a safe range.
[0051] Reference Figure 5 The output of the power management and drive control module is electrically connected to the input of the overcurrent and overvoltage protection module;
[0052] Specifically, the power management and drive control module transmits the real-time collected voltage and current data to the overvoltage protection module. When the overvoltage protection module detects overcurrent or overvoltage through the current sensor or voltage transformer, it immediately initiates a three-level response. First, it triggers the hardware protection circuit through the comparator, immediately disconnecting the gate drive of the gallium nitride element 6. Then, it sends a fault code to the main control MCU through the digital isolator, starts the software protection program, and finally displays the fault level through the indicator light, making it easy for users to intuitively understand the fault situation. By quickly initiating protection when an abnormality occurs, the risk of device damage can be better reduced.
[0053] Reference Figure 5 The output signal of the power management and drive control module is connected to the communication and monitoring module, and the signal of the power management and drive control module is connected to the user interaction module.
[0054] Specifically, the power management and drive control module connects to the communication and monitoring module and the user interaction module via signal connections to form a complete intelligent control system. The real-time data processed and collected by the power management and drive control module is transmitted to the communication and monitoring module. The communication and monitoring module packages this data and uploads it to the cloud wirelessly, enabling real-time visualization and historical traceability of operating parameters. The user interaction module includes a touch screen and indicator lights. The power management and drive control module transmits data to the touch screen for real-time display via the SPI interface. It also reflects abnormal situations through the touch screen and indicator lights. Users can manually reduce the output power within the set power value through the touch screen.
[0055] Working principle: When using this device, the gallium nitride element 6 and the driving element 7 generate heat during operation. This heat is diffused through the upper metal plate 5. During diffusion, the dielectric layer 4 conducts heat downward through the internal conical through-hole 18. The conical design of the conical through-hole 18 can accelerate the downward transfer of heat. The heat is transferred to the lower metal plate 3 through the conical through-hole 18. The lower metal plate 3 conducts heat to the heat dissipation fins 2 through the internal heat pipes via a lateral phase change heat transfer. The heat dissipation fins 2 come into contact with the housing 1. The housing 1 is made of metal material. Through the good thermal conductivity of the housing 1, heat can be quickly transferred from the heat source to the surrounding environment.
[0056] Meanwhile, when the heat is too high, the drive motor 13 can make the shaft 14 rotate and drive the fan blade 15 to rotate. The forced airflow generated by the rotation of the fan blade 15 can accelerate the airflow inside the housing 1, remove the heat inside the housing 1, and improve the heat dissipation effect. When the motor 13 needs to be replaced, the connecting column 1002 can be pulled. The connecting column 1002 will drive the clamping block 1004 to move downward, so that the clamping block 1004 is separated from the outer wall of the housing 1, releasing the restriction on the housing 1. Then the outer shell 11 can be taken out, and the fan blade 15 can be repaired or replaced.
[0057] During the operation of the gallium nitride (GaN) device 6, the power management and drive control module collects data such as temperature, current, and voltage in real time. When an excessively high temperature is detected, a control signal is sent to the thermal management module. Upon receiving the signal, the thermal management module generates a corresponding heat dissipation strategy and sends the signal to the fan module. After receiving the drive signal, the motor 13 in the fan module causes the fan blades 15 to rotate, generating forced airflow for heat dissipation, reducing the temperature, and providing a stable operating environment. Simultaneously, the power management and drive control module precisely regulates the switching of the GaN device through the electrical signal drive control module and links with the dynamic frequency adjustment module to optimize the switching frequency to balance efficiency and temperature rise. In the event of abnormal conditions such as overvoltage or overcurrent, the overcurrent and overvoltage protection module will respond quickly, triggering hardware protection through a comparator. The protection circuit immediately disconnects the gate drive of the gallium nitride element 6 and displays the fault level through indicator lights to prevent damage to the gallium nitride element 6 under abnormal conditions. After the power management and drive control module collects data in real time, it transmits the data to the communication and monitoring module and the user interaction module. The user interaction module can visualize the data, allowing users to understand the working status more clearly. The communication and monitoring module can package and upload the data to the cloud to provide data support for troubleshooting and other operations. This device not only optimizes the heat dissipation path of gallium nitride element 6 and drive element 7 through the sandwich structure, but also improves the heat dissipation effect of fan blade 15 through the coordinated operation of the power management and drive control module and the thermal management module, providing a stable working environment for gallium nitride element 6 and drive element 7.
[0058] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. An integrated module for a gallium nitride device and driving components that facilitates heat dissipation, comprising a housing (1), characterized in that: The inner wall of the housing (1) is fixedly connected to a heat dissipation fin (2), and the interior of the heat dissipation fin (2) is integrated with a serpentine flow channel (17). The outer wall of the heat dissipation fin (2) is fixedly connected to a lower metal plate (3). The upper surface of the lower metal plate (3) is fixedly connected to a dielectric layer (4). The interior of the dielectric layer (4) is provided with a tapered through hole (18). The upper surface of the dielectric layer (4) is fixedly connected to an upper metal plate (5). The upper surface of the upper metal plate (5) is provided with a gallium nitride element (6) and a driving element (7). The upper surface of the upper metal plate (5) is provided with an electrical connection part (8). The electrical connection part (8) is electrically connected to the gallium nitride element (6) and the driving element (7). The outer wall of the housing (1) is provided with a heat dissipation hole (9). The outer wall of the housing (1) is provided with a clamping assembly (10).
2. The integrated module for a gallium nitride device and driving components with easy heat dissipation according to claim 1, characterized in that: The clamping assembly (10) includes a fixed post (1001), the outer wall of which is slidably connected to the outer wall of the housing (1), a connecting post (1002) is slidably connected inside the fixed post (1001), a clamping block one (1004) is fixedly connected to the outer wall of the connecting post (1002), the outer wall of the clamping block one (1004) is slidably connected to the inside of the fixed post (1001), a spring (1003) is sleeved on the outer wall of the connecting post (1002), the top end of the spring (1003) is fixedly connected to the inside of the fixed post (1001), the bottom end of the spring (1003) is connected to the upper surface of the clamping block one (1004), a clamping block two (1005) is fixedly connected to the outer wall of the fixed post (1001), and the outer walls of the clamping block one (1004) and the clamping block two (1005) are connected to the outer wall of the housing (1).
3. The integrated module for a gallium nitride device and driving components with easy heat dissipation according to claim 2, characterized in that: The outer wall of the fixed column (1001) is fixedly connected to the outer shell (11), the outer shell (11) is located inside the shell (1), and the outer wall of the outer shell (11) is fixedly connected to the magnetic block (16), the outer wall of the magnetic block (16) is connected to the inside of the shell (1).
4. The integrated module for a gallium nitride device and driving components with easy heat dissipation according to claim 3, characterized in that: A fixing block (12) is fixedly connected inside the outer shell (11), and a motor (13) is fixedly connected inside the fixing block (12). A rotating shaft (14) is fixedly installed at the output end of the motor (13). A fan blade (15) is fixedly connected to the outer wall of the rotating shaft (14), and the outer wall of the rotating shaft (14) is rotatably connected to the inside of the outer shell (11).
5. The integrated module for a gallium nitride device and driving components with easy heat dissipation according to claim 4, characterized in that: The housing (1) is equipped with a power management and drive control module. The power management and drive control module is connected to a thermal management module. The output of the thermal management module is connected to a fan module. The fan module consists of a motor (13), a rotating shaft (14), and fan blades (15).
6. The integrated module for a gallium nitride device and driving components with easy heat dissipation according to claim 5, characterized in that: The power management and drive control module is electrically connected to the drive control module, and the output signal of the power management and drive control module is connected to the input of the dynamic frequency adjustment module.
7. The integrated module for a gallium nitride device and driving components with easy heat dissipation according to claim 6, characterized in that: The output of the power management and drive control module is electrically connected to the input of the overcurrent and overvoltage protection module.
8. The integrated module for a gallium nitride device and driving components with easy heat dissipation according to claim 7, characterized in that: The output signal of the power management and drive control module is connected to the communication and monitoring module, and the signal of the power management and drive control module is connected to the user interaction module.