Full-automatic optical detection machine for integrated circuit pins

Abstract

The utility model relates to the field of detection devices for integrated circuits, in particular to a full-automatic optical detection machine for pins of an integrated circuit. The controller is fixedly connected to the machine base; the placing frame is fixedly connected to the machine base; the first mounting frame is connected to the machine base in a sliding manner; the optical detector is connected to the first mounting frame in a sliding manner; the second mounting frame is connected to the machine base in a sliding manner; the connecting frame is connected to the second mounting frame in a sliding manner; the electric telescopic rod is fixedly connected to the connecting frame; and the suction nozzle is fixedly connected to the rod end part of the electric telescopic rod. According to the utility model, the row-by-row optical detectors and the suction nozzles are used for synergism, parallel operation of double working modes of detection and sorting is realized by establishing a linkage algorithm of coordinates of the optical detectors and target positions of the suction nozzles, and the two working procedures are kept to operate independently and do not interfere with each other, so that frequent interruption of production takt is avoided, and the production efficiency is improved. The overall detection efficiency is improved, and the smoothness of automatic production is improved.

Description

Technical Field

[0001] This utility model relates to the field of testing devices for integrated circuits, and in particular to a fully automatic optical inspection machine for integrated circuit pins. Background Technology

[0002] The integrity of the pin configuration of an integrated circuit is a key factor in ensuring the reliability of subsequent assembly processes. If the pins are skewed, bent, or have abnormal spacing, the chip will not be able to be installed correctly or matched with other components. Therefore, the pin configuration of an integrated circuit must be strictly inspected before it enters the assembly process.

[0003] Currently, the industry generally uses optical inspection machines for testing. These machines utilize image processing technology to acquire three-dimensional morphological data of the pins through high-precision image acquisition devices. Advanced image processing algorithms are then used to calculate key parameters such as pin coplanarity, spacing, and tilt angle. The measurement results are then compared in real-time with preset standards to automatically determine whether the tested integrated circuit is qualified. Defective products exceeding tolerance limits are triggered and rejected, thus achieving rapid and accurate inspection of integrated circuit pins and meeting the demands of modern electronics manufacturing for high-precision automated inspection.

[0004] When existing optical inspection systems detect defective products, the inspection process usually needs to be paused to wait for the sorting equipment to remove the defective products before it can continue. This interruption process causes frequent interruptions in the production cycle, reduces the overall inspection efficiency, and restricts the smoothness of automated production. Utility Model Content

[0005] In view of the deficiencies of the prior art mentioned in the background, this utility model proposes a fully automatic optical inspection machine for integrated circuit pins that does not require interruption to remove defective products.

[0006] The technical solution is as follows: A fully automatic optical inspection machine for integrated circuit pins includes: a base; a controller fixedly connected to the base and electrically connected to the base; a mounting frame fixedly connected to the base; a first mounting frame slidably connected to the base; an optical detector slidably connected to the first mounting frame; a second mounting frame slidably connected to the base; a connecting frame slidably connected to the second mounting frame; an electric telescopic rod fixedly connected to the connecting frame and electrically connected to the controller; a suction nozzle fixedly connected to the end of the electric telescopic rod; an air pump fixedly connected to the base and electrically connected to the controller; an air pipe fixedly installed and connected between the air pump and the suction nozzle; a drive unit disposed on the base and electrically connected to the controller, the drive unit being connected to the first mounting frame, the second mounting frame, the optical detector, and a servo motor respectively; and a collection box disposed on the base.

[0007] Preferably, the testing machine further includes: a mounting rail fixedly connected to the base, with the collection box slidably connected within the mounting rail; a push plate fixedly connected to the collection box, with a second mounting bracket in contact with the collection box; a first return spring fixedly connected between the mounting rail and the collection box; a mounting plate fixedly connected to the end of the mounting rail; a clamping plate slidably connected to the mounting plate, the clamping plate cooperating with the collection box to fix the collection box; and a second return spring fixedly connected between the clamping plate and the mounting plate.

[0008] Preferably, the testing machine further includes: a winder fixedly connected to the machine base for winding and unwinding the air tube, through which the air tube passes; and a guide frame fixedly connected to the machine base for guiding the position of the air tube, through which the air tube passes.

[0009] Preferably, the testing machine further includes a roller rotatably connected to the mounting track, the roller being located between the mounting track and the collection box.

[0010] Preferably, the testing machine further includes a buffer pad fixedly connected to the collection box and the second mounting frame, the buffer pad being disposed on the contact surface between the two.

[0011] Preferably, the testing machine further includes a protective pad fixedly connected inside the collection box, the protective pad being used to cushion the impact of the integrated circuit falling.

[0012] The beneficial effects of this utility model are:

[0013] This invention utilizes a row-type optical detector and a suction nozzle working in tandem. By establishing a linkage algorithm between the optical detector coordinates and the suction nozzle target position, it achieves parallel operation of both detection and sorting modes. The two processes operate independently without interference, thus avoiding frequent production interruptions and improving overall detection efficiency and the smoothness of automated production. This invention also uses a second mounting bracket to drive the synchronous displacement of the collection box. During the transfer of defective products, the connecting bracket only needs to perform lateral displacement, thereby improving the transfer efficiency of defective products. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the overall structure of the present invention from a rear view.

[0016] Figure 3 This is a cross-sectional view of the connection structure between the electric telescopic rod and the suction nozzle of this utility model.

[0017] Figure 4 This is a schematic diagram of the connection structure of the collection box, push plate and guide rod of this utility model.

[0018] Figure 5This is a cross-sectional view showing the structural relationship between the mounting plate and the card plate of this utility model.

[0019] Reference numerals: 1_Base, 2_Controller, 3_First mounting bracket, 31_Optical detector, 4_Placement bracket, 5_Electric slide rail, 6_Second mounting bracket, 7_Servo motor, 8_Lead screw, 9_Connecting bracket, 10_Electric telescopic rod, 11_Nose, 12_Air tube, 13_Rewinder, 14_Air pump, 15_Collection box, 16_Mounting rail, 17_Push plate, 18_Guide rod, 19_First return spring, 20_Mounting plate, 21_Clamping plate, 22_Second return spring, 23_Roller, 24_Buffer pad, 25_Protective pad, 26_Guide bracket. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Example: A fully automated optical inspection machine for integrated circuit pins, see reference. Figures 1-5The system includes: a base 1; a controller 2 fixedly mounted on the base 1, electrically connected to the base 1; a mounting bracket 4 fixedly mounted on the base 1 for placing integrated circuits; a first mounting bracket 3 slidably mounted on the base 1, which passes over the mounting bracket 4 when moving; an optical detector 31 slidably mounted on the first mounting bracket 3, which moves left and right; a second mounting bracket 6 slidably mounted on the base 1, which passes over the mounting bracket 4 when moving, with the heights of the first mounting bracket 3 and the second mounting bracket 6 offset; three sets of electric slide rails 5 fixedly mounted on the base 1 and the first mounting bracket 3, respectively connected to the first mounting bracket 3, the second mounting bracket 6, and the optical detector 31 to provide power to the three components, and all three sets of electric slide rails 5 are electrically connected to the controller 2; a servo motor 7 fixedly mounted on the second mounting bracket 6, which is electrically connected to the controller 2; and a lead screw 8 rotatably mounted inside the second mounting bracket 6. The following components are included: a connecting frame 9 fixed to the output end of the servo motor 7; a connecting frame 9 slidably mounted on the second mounting bracket 6, the connecting frame 9 being threaded onto the lead screw 8, the servo motor 7 providing power to the connecting frame 9 via the lead screw 8; an electric telescopic rod 10 fixedly mounted on the connecting frame 9, the electric telescopic rod 10 being electrically connected to the controller 2; a suction nozzle 11 fixedly mounted on the end of the electric telescopic rod 10; an air pump 14 fixedly mounted on the rear side of the base 1, the air pump 14 being electrically connected to the controller 2; an air pipe 12 fixedly mounted and connected between the air pump 14 and the suction nozzle 11, the air pump 14 controlling the suction nozzle 11 to adsorb integrated circuits via the air pipe 12; a retractor 13 fixedly mounted on the base 1 for taking in and releasing the air pipe 12, the air pipe 12 passing through the retractor 13; a guide frame 26 fixedly mounted on the base 1 for guiding the position of the air pipe 12, the air pipe 12 passing through the guide frame 26; a collection box 15 set on the base 1 for collecting integrated circuits; and a protective pad 25 fixedly mounted inside the collection box 15, the protective pad 25 being used to buffer the impact of the integrated circuits falling.

[0022] The coordinates of each placement position on the placement rack 4 are pre-calibrated to establish a coordinate system, and the motion control parameters of each set of electric slide rails 5 and servo motors 7 are set. Then, the integrated circuits to be inspected are neatly arranged in the placement rack 4. During the inspection process, the controller 2 controls the first mounting rack 3 to move back and forth and the optical detector 31 to move left and right, so that the optical detector 31 passes over each integrated circuit in turn to perform the inspection operation. When a defective product is detected, the optical detector 31 will send a signal to the controller 2. The controller 2 will calculate the target coordinates of the connecting rack 9 based on the real-time position coordinates of the optical detector 31, and control the second mounting rack 6 to move back and forth and the connecting rack 9 to move left and right to reposition it. After the connecting rack 9 moves to the top of the defective product, the controller 2 will start the electric telescopic rod 10 and the air pump 14 to work together, control the suction nozzle 11 to move downward to contact the defective product and perform adsorption. After adsorption is completed, it moves upward to remove the defective product. Finally, the defective product is transferred to the collection box 15 for unified storage.

[0023] Therefore, through the above-mentioned cyclic operation process, the parallel operation of the detection and sorting dual working modes can be realized. The two processes will operate independently and without interference, thereby avoiding frequent interruptions in production cycle, improving overall detection efficiency, and enhancing the smoothness of automated production. The rewinder 13 will rewind and extend the air tube 12 in real time according to the movement of the suction nozzle 11, keeping the tension of the air tube 12 moderate. The guide frame 26 is used to adjust the position of the air tube 12, so that the air tube 12 always remains neatly arranged as it moves with the suction nozzle 11, avoiding interference with the detection process. The protective pad 25 will provide buffer protection for the integrated circuit pins during the sorting process, preventing secondary deformation during adsorption and transfer, thereby reducing subsequent adjustment work for the pins.

[0024] See Figure 1 , Figure 2 , Figure 4 and Figure 5It also includes: a mounting rail 16 fixedly installed on the right side of the base 1, with the collection box 15 slidably installed inside the mounting rail 16; a roller 23 rotatably installed on the mounting rail 16, with the roller 23 located between the mounting rail 16 and the collection box 15; a push plate 17 fixedly installed on the collection box 15, with the second mounting bracket 6 in contact with the collection box 15; a buffer pad 24 fixedly installed on the collection box 15 and the second mounting bracket 6, with the buffer pad 24 disposed on the contact surface between the two; a guide rod 18 fixedly installed on the mounting rail 16; a first return spring 19 sleeved on the guide rod 18, with both ends of the first return spring 19 fixed to the mounting rail 16 and the collection box 15 respectively; a mounting plate 20 fixedly installed at the front of the mounting rail 16; a clamping plate 21 slidably installed on the mounting plate 20, with an inclined surface at the bottom of the clamping plate 21, and a clamping hole on the collection box 15 for the clamping plate 21 to pass through, with the clamping plate 21 cooperating with the clamping hole to fix the collection box 15; and a second return spring 22 fixedly installed between the clamping plate 21 and the mounting plate 20.

[0025] As the second mounting bracket 6 moves forward, the collection box 15 moves forward synchronously, stretching the first reset spring 19. Therefore, the suction nozzle 11 only needs to perform left and right displacement when transferring defective products, thereby improving the transfer efficiency of defective products. When the inspection process is completed and no defective products are found, the first mounting bracket 3 will remain stationary. However, if an integrated circuit is found and picked up during the inspection process, the second mounting bracket 6 will push the collection box 15 to the foremost position. During this process, the collection box 15 causes the card plate 21 to cross the limit and enter the card hole. The second reset spring 22 then pushes the card plate 21 into the card hole, fixing the collection box 15. The integrated circuit can then be transferred for subsequent pin arrangement work. After the arrangement is completed, the operator only needs to move the card plate 21, and the first reset spring 19 will automatically pull the collection box 15 back to its original position. Then, the card plate 21 can be released to restore the initial state. The roller 23 is used to reduce the impact force when the push plate 17 contacts the second mounting bracket 6, thereby improving the safety and stability of operation.

[0026] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. An integrated circuit pin full-automatic optical inspection machine, characterized in that, include: Base (1); controller (2) fixedly connected to base (1), controller (2) electrically connected to base (1); mounting bracket (4) fixedly connected to base (1) for placing integrated circuits; first mounting bracket (3) slidably connected to base (1); optical detector (31) slidably connected to first mounting bracket (3); second mounting bracket (6) slidably connected to base (1), the height positions of first mounting bracket (3) and second mounting bracket (6) are offset; connecting bracket (9) slidably connected to second mounting bracket (6), the optical detector (31) and connecting bracket (9) pass over the mounting bracket (4) during movement; electric telescopic device fixedly connected to connecting bracket (9) The electric telescopic rod (10) is electrically connected to the controller (2); the suction nozzle (11) is fixedly connected to the end of the electric telescopic rod (10); the air pump (14) is fixedly connected to the base (1) and is electrically connected to the controller (2); the air pipe (12) is fixedly installed and connected between the air pump (14) and the suction nozzle (11); the drive unit is provided on the base (1) for providing power, and is electrically connected to the controller (2). The drive unit is connected to the first mounting bracket (3), the second mounting bracket (6), the optical detector (31) and the servo motor (7) respectively; and the collection box (15) is provided on the base (1) for collecting defective integrated circuits.

2. The integrated circuit pin full-automatic optical inspection machine according to claim 1, wherein, The testing machine further includes: a mounting rail (16) fixedly connected to the base (1), a collection box (15) slidably connected to the mounting rail (16); a push plate (17) fixedly connected to the collection box (15), a second mounting bracket (6) in contact with the collection box (15); a first return spring (19) fixedly connected between the mounting rail (16) and the collection box (15); a mounting plate (20) fixedly connected to the end of the mounting rail (16); a clamping plate (21) slidably connected to the mounting plate (20), the clamping plate (21) cooperating with the collection box (15) to fix the collection box (15); and a second return spring (22) fixedly connected between the clamping plate (21) and the mounting plate (20).

3. The integrated circuit pin full-automatic optical inspection machine according to claim 2, wherein, The testing machine also includes: a winder (13) fixedly connected to the base (1) for winding and unwinding the air tube (12), through which the air tube (12) passes; and a guide frame (26) fixedly connected to the base (1) for guiding the position of the air tube (12), through which the air tube (12) passes.

4. The integrated circuit pin full-automatic optical inspection machine according to claim 3, wherein, The testing machine also includes a roller (23) rotatably connected to the mounting rail (16), the roller (23) being located between the mounting rail (16) and the collection box (15).

5. The integrated circuit pin automatic optical inspection machine of claim 4, wherein, The testing machine also includes a buffer pad (24) fixedly connected to the collection box (15) and the second mounting bracket (6), the buffer pad (24) being disposed on the surface in contact between the two.

6. The integrated circuit pin automatic optical inspection machine of claim 5, wherein, The testing machine also includes a protective pad (25) fixedly connected inside the collection box (15), the protective pad (25) being used to buffer the impact force of the integrated circuit falling.

Images