Small-diameter tin wire tin breaking mechanism

The relative motion between the grinding wheel structure and the solder wire achieves a kneading effect, solving the problems of breakage and oxide layer removal of small-diameter solder wire in traditional scraper processing, thus improving the welding quality.

CN224128795UActive Publication Date: 2026-04-17OUYA HI TECH CHONGYANG CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
OUYA HI TECH CHONGYANG CO LTD
Filing Date
2025-04-24
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

Traditional scrapers are prone to breaking and causing uneven diameter when processing small-diameter solder wires, making it difficult to effectively remove the oxide film.

Method used

It employs a two-grinding-wheel structure, with a friction layer on the stepped surface of one of the grinding wheels. The solder wire passes through the gap between the two grinding wheels, and the relative movement between the friction layer and the solder wire achieves a kneading effect to remove the oxide layer.

Benefits of technology

It effectively removes the oxide layer under relatively low extrusion pressure, reduces solder wire breakage and damage, and ensures soldering quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a small-diameter tin wire tin breaking mechanism, and belongs to the technical field of tin soldering. Comprising two grinding wheels, the grinding wheels comprise the first supporting wheel with the small diameter and the second supporting wheel with the large diameter, the first supporting wheel of one grinding wheel abuts against the second supporting wheel of the other grinding wheel, the end face, close to one side of the first supporting wheel, of the second supporting wheel forms an annular step face, and a friction layer is arranged on the step face. And a threading gap is formed between the step surfaces of the two grinding wheels. The utility model has the advantage that the yarn is not easy to break.
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Description

Technical Field

[0001] This utility model belongs to the field of soldering technology and relates to a small-diameter solder wire breaking mechanism. Background Technology

[0002] Solder wire breaking is a process to remove the oxide film on the surface of the solder to ensure the quality of the soldering. For solder wires with a small diameter, traditional scrapers can easily break the solder wire and also cause uneven solder wire diameter. Utility Model Content

[0003] The purpose of this invention is to address the aforementioned problems in existing technologies by providing a small-diameter solder wire breaking mechanism. The technical problem this invention aims to solve is how to break small-diameter solder wires.

[0004] The purpose of this utility model can be achieved through the following technical solution: a small-diameter tin wire breaking mechanism, characterized in that it includes two grinding wheels, each grinding wheel including a first support wheel with a smaller diameter and a second support wheel with a larger diameter, wherein the first support wheel of one grinding wheel abuts against the second support wheel of the other grinding wheel, the end face of the second support wheel near the first support wheel forms an annular stepped surface, the stepped surface has a friction layer, and a wire threading gap is formed between the stepped surfaces of the two grinding wheels.

[0005] Furthermore, the friction layer is a felt.

[0006] Both grinding wheels are rotatably connected to the mounting frame. The solder wire passes through the wire-threading gap between the two stepped surfaces. As the solder wire is pulled, the grinding wheels rotate, and the grinding wheels and solder wire tend to be synchronized. However, there is relative movement between the friction layer on the stepped surface and the solder wire. As the solder wire is squeezed by the two friction layers and moves relative to each other, the oxide layer on the surface of the solder wire is removed. The friction caused by this method is not along the length of a single wire, but also has a "rubbing" effect on the solder wire. Thus, the oxide removal on the surface of the solder wire can be completed well under a small extrusion force, reducing the pulling force on the solder wire and making it less likely to cause breakage and damage to small-diameter solder wires. Attached Figure Description

[0007] Figure 1 This is a three-dimensional diagram of the tin-breaking mechanism.

[0008] Figure 2 This is a side view of the tin-breaking mechanism.

[0009] In the diagram, 1 is the grinding wheel; 11 is the first support wheel; 12 is the second support wheel; and 13 is the step surface. Detailed Implementation

[0010] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0011] like Figure 1 and Figure 2 The small-diameter tin wire breaking mechanism shown includes two grinding wheels 1. Each grinding wheel 1 includes a first support wheel 11 with a smaller diameter and a second support wheel 12 with a larger diameter. The first support wheel 11 of one grinding wheel 1 abuts against the second support wheel 12 of the other grinding wheel 1. The end face of the second support wheel 12 near the first support wheel 11 forms an annular stepped surface 13. The stepped surface 13 has a friction layer. A wire threading gap is formed between the stepped surfaces 13 of the two grinding wheels 1. The friction layer is felt, or it can be rigid foam.

[0012] Both grinding wheels 1 are rotatably connected to the mounting frame. The solder wire passes through the wire-threading gap between the two stepped surfaces 13. During the process of the solder wire being pulled, the grinding wheel 1 rotates and the grinding wheel 1 and the solder wire tend to be synchronized. However, there is relative movement between the friction layer on the stepped surface 13 and the solder wire. During the process of the solder wire being squeezed by the two friction layers and moving relative to each other, the oxide layer on the surface of the solder wire is removed. The friction caused by this method is not along the length of a single wire, but also has a "rubbing" effect on the solder wire. Thus, the oxide on the surface of the solder wire can be cleaned well under a small extrusion force, reducing the pulling force on the solder wire and making it less likely to cause breakage and damage to small-diameter solder wires.

[0013] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

Claims

1. A small diameter tin wire breaking mechanism, characterized by, The device includes two grinding wheels (1), each grinding wheel (1) having a first support wheel (11) with a smaller diameter and a second support wheel (12) with a larger diameter. The first support wheel (11) of one grinding wheel (1) abuts against the second support wheel (12) of the other grinding wheel (1). The end face of the second support wheel (12) near the first support wheel (11) forms an annular stepped surface (13). The stepped surface (13) has a friction layer. A wire threading gap is formed between the stepped surfaces (13) of the two grinding wheels (1).

2. The small diameter tin wire break tin mechanism according to claim 1, wherein The friction layer is felt.