Laser processing system

Abstract

The utility model relates to the technical field of laser processing, discloses a laser processing system, and aims to solve the problem that the processing precision and the processing effect are poor due to the fact that the defocusing amount cannot be accurately controlled in the laser processing process. The laser processing system comprises a light source part, a modulation assembly and a modeling assembly. The modulation assembly is used for modulating the laser beam emitted by the light source part so as to machine a preset object. The modeling assembly is used for measuring the three-dimensional contour shape and size of a preset object. According to the laser processing system, the modeling assembly is integrally installed in the laser processing system, so that the modeling assembly can accurately detect and calculate the three-dimensional contour shape and size of the preset object, the defocusing amount of the laser beam can be accurately controlled, and therefore the processing precision and effect of the laser processing system are improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and specifically to a laser processing system. Background Technology

[0002] Because of its high precision, high quality, low heat-affected zone, absence of recast layer, and ability to process a variety of complex materials, laser processing has been widely used in aerospace, electronic circuits, shipbuilding and other fields. Laser processing includes various processing methods such as laser cutting, laser marking, laser welding, laser engraving or laser drilling.

[0003] During laser processing, the distance between the laser beam focus and the surface of the preset object (i.e., the workpiece to be processed) is called the defocus amount. Accurately controlling the defocus amount within a small and suitable range can improve the laser processing effect.

[0004] However, because the surface shape of the preset object cannot be known before processing, or there is an error between the known surface information and the actual situation, the laser cannot be accurately focused on the processing surface of the preset object, that is, the defocus amount cannot be accurately controlled, which will affect the processing accuracy and effect of the preset object. Utility Model Content

[0005] The purpose of this application is to provide a laser processing system that aims to solve the problem of poor processing accuracy and effect caused by the inability to accurately control the defocusing amount during laser processing.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] Some embodiments of this application provide a laser processing system, including a light source, a modulation component, and a modeling component. The modulation component is used to modulate a laser beam emitted from the light source to process a preset object. The modeling component is used to measure the three-dimensional contour shape and size of the preset object.

[0008] In some implementations, the modeling components include a structured light projector, an optical collector, and a processing module. The structured light projector emits structured light toward a preset object. The optical collector acquires the image pattern of the structured light on the surface of the preset object. The processing module is at least electrically connected to the optical collector and is used to acquire the image pattern and calculate the three-dimensional contour dimensions of the preset object.

[0009] In some implementations, the processing module is also electrically connected to the light source, modulation assembly, and structured light projector, and the processing module is configured to have at least a detection state and a processing state.

[0010] When the processing module controls the laser processing system to be in the detection state, the processing module works with the structured light projector and optical collector to detect and calculate the three-dimensional contour shape and size of the preset object.

[0011] When the processing module controls the laser processing system to be in processing mode, it controls the light source and modulation components to process the preset object according to the three-dimensional contour shape and size.

[0012] In some embodiments, the bearing surface supporting the preset object along a first straight line is a reference surface, and the first straight line is perpendicular to the reference surface. Along the first straight line, the structured light projector and the optical collector are installed at the same height from the reference surface.

[0013] In some implementations, the processing module calculates the three-dimensional contour shape and size of the preset object using the following formula:

[0014] ;

[0015] Where h is the height of one point of the preset object relative to the reference plane along the first straight line. L is the distance between the optical collector and the reference plane along the first straight line. d is the minimum distance between the structured light projector and the optical collector along the second straight line, which is perpendicular to the first straight line. T is the grating period of the structured light. These are phase information parameters.

[0016] In some implementations, the light outlets of the structured light projector, optical collector, and modulation assembly are at the same mounting height from the reference plane along a first straight line.

[0017] In some implementations, structured light includes striped structured light or grid structured light.

[0018] In some embodiments, the laser processing system further includes a stage and a drive assembly. The stage is used to hold a preset object, and the processing module is electrically connected to the drive assembly to adjust the distance between the modulation assembly and the stage.

[0019] In some embodiments, the drive assembly includes a first drive member connected to and mounted on the stage, and the processing module is electrically connected to the first drive member for adjusting the relative position of the stage.

[0020] In some embodiments, the driving component includes a second driving member, at least the light source and the modulation component are connected and installed to the second driving member, and the processing module is electrically connected to the second driving member for adjusting the position state of the light source and the modulation component.

[0021] Thus, because the laser processing system integrates a modeling component, it can perform three-dimensional modeling and measurement of the surface of the preset object before processing it with a laser beam, thereby obtaining the accurate three-dimensional contour shape and size of the object. Subsequently, the laser beam is emitted through the light source, and the focusing position, focusing angle, and defocusing amount of the laser beam after passing through the modulation component are flexibly adjusted to perform precise processing on the preset object, such as laser cutting, laser marking, laser welding, laser engraving, or laser drilling.

[0022] Because the modeling component allows for precise measurement and acquisition of the 3D contour shape and dimensions of a preset object, it facilitates accurate control of the laser beam's defocus within a suitable range during the precise processing of the object using a laser processing system. This avoids situations where the laser beam cannot be precisely focused on the object's processing surface due to dimensional errors, thus preventing accurate control of the defocus. Therefore, the modeling component enhances the laser processing system's precise control over the laser beam's defocus, thereby improving the processing accuracy and quality of the preset object. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a laser processing system provided in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the connection structure of a laser processing system provided in an embodiment of this application;

[0026] Figure 3 for Figure 1 The diagram shows a simulated optical path of the structured light projector and optical collector.

[0027] Figure label:

[0028] 100. Laser processing system;

[0029] 10. Light source component; 20. Modulation component; 30. Modeling component; 31. Structured light projector; 32. Optical collector; 33. Processing module; 40. Stage; 41. Reference plane; 50. Driving component; 51. First driving component; 52. Second driving component;

[0030] 200. Preset objects. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0036] Because of its high precision, high quality, low heat-affected zone, absence of recast layer, and ability to process a variety of complex materials, laser processing has been widely used in aerospace, electronic circuits, shipbuilding and other fields. Laser processing includes various processing methods such as laser cutting, laser marking, laser welding, laser engraving or laser drilling.

[0037] During laser processing, the distance between the laser beam focus and the surface of the preset object (i.e., the workpiece to be processed) is called the defocus amount. Accurately controlling the defocus amount within a small and suitable range can improve the laser processing effect.

[0038] However, because the surface shape of the preset object cannot be known before processing, or there is an error between the known surface information and the actual situation, the laser cannot be accurately focused on the processing surface of the preset object, that is, the defocus amount cannot be accurately controlled, which will affect the processing accuracy and effect of the preset object.

[0039] For example, when a laser processing system processes the three-dimensional surface of a preset object, it cannot accurately control the defocusing amount because it cannot obtain the specific shape and size information of the three-dimensional surface, or the known shape and size information of the three-dimensional surface has a large error. In other words, the laser processing system cannot accurately process the surface of the preset object.

[0040] The proposed solution uses a vision inspection module to collect real-time surface information of a pre-defined object, thereby improving processing accuracy in conjunction with the laser beam. Currently, laser processing systems with vision inspection modules primarily locate and position the laser spot along the x and z axes, or observe processing marks on the surface of the pre-defined object. This allows for adjustments to the object and the laser beam during processing, enhancing both the processing effect and precision.

[0041] However, in practical applications, due to the influence of processing debris or cooling structures, the vision inspection module cannot accurately obtain the exact situation at the processing location, which will also affect the processing accuracy and effect.

[0042] Based on this, such as Figure 1 As shown, Figure 1This is a schematic diagram of a laser processing system 100 provided in an embodiment of this application. The laser processing system 100 includes a light source 10, a modulation component 20, and a modeling component 30. The modulation component 20 is used to modulate the laser beam emitted from the light source 10 to process a preset object 200. For example, the modulation component 20 can flexibly control the focusing position, focusing angle, and defocusing amount of the beam. The modeling component 30 is used to measure the three-dimensional contour shape and size of the preset object 200.

[0043] Thus, since the modeling component 30 is integrated into the laser processing system 100, before processing the preset object 200 with the laser beam, the laser processing system 100 can perform three-dimensional modeling and measurement of the surface of the preset object 200 through the modeling component 30 to obtain the accurate three-dimensional contour shape and size of the preset object 200. Subsequently, the laser beam is emitted through the light source 10, and the focusing direction, focusing angle, and defocusing amount of the laser beam after passing through the modulation component 20 are flexibly adjusted to perform precise processing on the preset object 200 such as laser cutting, laser marking, laser welding, laser engraving, or laser drilling.

[0044] Because the modeling component 30 can accurately measure and acquire the three-dimensional contour shape and size of the preset object 200, it facilitates precise control of the laser beam defocus within a suitable range and the focusing direction and angle of the processing beam during the precise processing of the preset object 200 using the laser processing system 100. This avoids situations where the laser beam cannot be accurately focused on the processing surface of the preset object 200 due to surface dimensional errors, thus preventing inaccurate control of the defocus. Therefore, the modeling component 30 enhances the precision of the laser processing system 100's control over the laser beam defocus, thereby improving the processing accuracy and effect of the preset object 200.

[0045] In some embodiments, such as Figure 2 As shown, Figure 2 This is a schematic diagram of the connection structure of a laser processing system 100 provided in an embodiment of this application. The modeling component 30 includes a structured light projector 31, an optical collector 32, and a processing module 33. Combined with... Figure 1 The structured light projector 31 emits structured light toward the preset object 200, and the optical collector 32 collects the imaging pattern of the structured light on the surface of the preset object 200. The processing module 33 is at least electrically connected to the optical collector 32 and is used to acquire the imaging pattern and calculate the three-dimensional contour dimensions of the preset object 200.

[0046] Structured light can be a planar structure, such as striped structured light or grid structured light. Alternatively, structured light can also be a point structure, which is presented as striped structured light or grid structured light through scanning.

[0047] For example, the structured light projector 31 can be a stripe projection device. A stripe projection device is a technical device used for three-dimensional topography measurement, and its working principle is mainly based on structured light technology. The stripe projection device generates a series of parallel, equidistant stripe patterns through a specific optical system. These stripes can be sinusoidal waveforms or other shapes, forming regular structured light in space. When the stripe structured light is projected onto the surface of the preset object 200, these stripes will deform on the surface of the preset object 200 due to the geometry of the surface, such as bending or twisting. At this time, the deformed stripe patterns (i.e., imaging patterns) can be captured and acquired by other optical acquisition devices 32, such as a high-speed camera. These imaging patterns contain the encoding of three-dimensional information of the surface of the preset object 200. Through the processing module 33 electrically connected to the optical acquisition unit 32, after acquiring the deformed stripe pattern (such as an imaging pattern), the processing module 33 can analyze and calculate the phase difference (i.e., phase information parameters) between the original stripes and the deformed stripes (i.e., the imaging pattern) according to preset algorithms such as Phase Measurement Profilometry (PMP) and Fourier Transform Profilometry (FTP), thereby calculating the three-dimensional coordinates of each point on the surface of the preset object 200. Subsequently, using the phase information obtained above, combined with the geometric position and optical parameters of the optical acquisition unit 32, the three-dimensional shape of the preset object 200 can be reconstructed in the preset coordinate system, that is, the precise three-dimensional contour shape and size of the preset object 200.

[0048] Alternatively, the structured light projector 31 can also be a grid projection device, enabling it to generate a series of parallel equidistant stripes in the horizontal and vertical directions to form a grid pattern, i.e., grid structured light. When the grid structured light is projected onto the surface of the preset object 200, these grids will deform on the surface of the preset object 200 due to the geometry of the surface, such as bending or twisting. At this time, the deformed grid pattern (i.e., the imaging pattern) can be captured and acquired by other optical acquisition devices 32 such as a high-speed camera. These imaging patterns contain the encoding of the three-dimensional information of the surface of the preset object 200. Through the processing module 33 electrically connected to the optical acquisition device 32, after acquiring the deformed grid pattern (i.e., the imaging pattern), the processing module 33 can analyze and calculate the phase difference (i.e., phase information parameters) between the original grid and the deformed grid (i.e., the imaging pattern) according to algorithms such as preset phase extraction, phase principal value calculation, phase unwrapping, and phase unfolding techniques, thereby calculating the three-dimensional coordinates of each point on the surface of the preset object 200. Subsequently, using the phase information obtained from the above calculations, combined with the geometric position and optical parameters of the optical acquisition unit 32, the three-dimensional shape of the preset object 200 can be reconstructed in the preset coordinate system, that is, the precise three-dimensional contour shape and size of the preset object 200.

[0049] Among them, by using the striped structured light scheme, the processing module 33 has a small amount of computation in the process of calculating the three-dimensional contour of the preset object 200, which helps to reduce the overall cost of the laser processing system 100.

[0050] However, by using the mesh structured light scheme, the processing module 33 needs to analyze and calculate the three-dimensional contour of the preset object 200 in a more complex way. But at the same time, the three-dimensional contour shape and size of the preset object 200 obtained have better accuracy, which is conducive to further improving the processing accuracy and effect of the laser processing system 100.

[0051] In the above scheme, compared to the original laser processing system 100 including the light source 10 and the modulation component 20, the modeling component 30, including the structured light projector 31, the optical collector 32, and the processing module 33, can be an independent integrated structure. For example, by adding a projection device (structured light projector 31), a high-speed camera (optical collector 32), and a computing module (such as the processing module 33) to the original laser processing system 100, and connecting the computing module to the relevant control module of the laser processing system 100 for data interaction, the original laser processing system 100 can be modified. This allows the laser processing system 100 to integrate a precise three-dimensional scanning and ranging function for the preset object 200, thereby improving the processing accuracy and effect of the preset object 200.

[0052] Alternatively, if the control module of the laser processing system 100 itself meets the computing power requirements, after integrating and installing a projection device (structured light projector 31) and a high-speed camera (optical acquisition device 32), the projection device and the high-speed camera can be electrically connected to the control module, and preset information such as adaptation parameters and algorithms can be imported into the control module, which can also improve the processing accuracy and effect of the laser processing system 100.

[0053] It should be noted that, compared to ordinary projection equipment, laser imaging has advantages such as high resolution, high precision, and strong anti-interference capabilities. The structured light projector 31 can be configured as a laser-type projector, enabling the optical collector 32 to acquire better imaging patterns, thereby improving the calculation accuracy of the three-dimensional contour of the preset object 200.

[0054] Based on this, since the light source 10 and the modulation component 20 can generate a laser beam, the light source 10 and the modulation component 20 can be modified to ensure both the laser processing function and the structured light projection effect, further simplifying the components of the laser processing system 100.

[0055] In some embodiments, such as Figure 2 As shown, the processing module 33 is also electrically connected to the light source 10, the modulation component 20 and the structured light projector 31, and the processing module 33 is configured to have at least a detection state and a processing state.

[0056] For example, the processing module 33 can be electrically connected to the light source 10 and the modulation component 20 via the control module. Alternatively, the processing module 33 can be part of the control module to enable control connection of the light source 10 and the modulation component 20.

[0057] When the processing module 33 controls the laser processing system 100 to be in the detection state, the processing module 33, together with the structured light projector 31 and the optical collector 32, detects and calculates the three-dimensional contour dimensions of the preset object 200.

[0058] The processing module 33 controls at least one of the light source 10 and the modulation component 20 to be in a closed or standby state, and controls the structured light projector 31 and the optical collector 32 to be in an activated state. That is, in the detection state, the structured light projector 31 emits structured light, such as preset stripes or preset grids, toward the preset object 200, and the optical collector 32 collects the imaging pattern of the structured light on the surface of the preset object 200. This allows the processing module 33 to cooperate with the structured light projector 31 and the optical collector 32 to collect the imaging pattern of the structured light on the surface of the preset object 200. Subsequently, the processing module 33 acquires the imaging pattern collected by the optical collector 32, analyzes and calculates the phase difference based on the original pattern and the imaging pattern of the structured light to obtain the three-dimensional coordinates of the surface of the preset object 200. Finally, the processing module 33 reconstructs the three-dimensional shape (i.e., three-dimensional contour shape and size) of the preset object 200 by combining the geometric positions of the preset object 200, the structured light projector 31, and the optical collector 32, so as to facilitate the precise processing of the preset object 200 by the laser beam.

[0059] When the processing module 33 controls the laser processing system 100 to be in the processing state, the processing module 33 controls the light source 10 and the modulation component 20 to process the preset object 200 according to the three-dimensional contour shape and size.

[0060] After obtaining the three-dimensional contour shape and size of the preset object 200 by detecting the state, the laser beam is accurately defocused during the processing of the preset object 200 by combining the spatial positions of the light outlet of the modulation component 20, the structured light projector 31 and the optical collector 32, and then precisely processed.

[0061] like Figure 1 As shown, the laser processing system 100 also includes a stage 40, on which a preset object 200 is placed and positioned between the stage 40 and the modulation component 20 along a first straight direction (i.e., the Z direction). The bearing surface supporting the preset object 200 along the first straight direction is defined as a reference surface 41, and the Z direction is set perpendicular to the reference surface 41. That is, the reference surface 41 is the side of the stage 40 facing the modulation component 20 along the Z direction, such as the upper plane of the stage 40.

[0062] Based on this, such as Figure 1 As shown, along the Z direction, the structured light projector 31 and the optical collector 32 are installed at the same height from the reference plane 41.

[0063] Combination Figure 3 , Figure 3 for Figure 1The diagram shows a schematic representation of the optical path of the structured light projector 31 and the optical collector 32. For example, point P is the first reference point of the optical collector 32, and point I is the second reference point of the structured light projector 31. Adjusting the mounting height of the structured light projector 31 and the optical collector 32 is equivalent to adjusting the distance between the second reference point I and the first reference point P along the Z direction relative to the reference plane 41.

[0064] Since the processing module 33 needs to combine the spatial coordinates of the reference plane 41, the second reference point I, and the first reference point P to calculate the phase information parameters based on the projection pattern (such as a preset stripe or grid projection) and the imaging pattern (i.e., the deformed stripe or grid projection), the installation height of the structured light projector 31 and the optical collector 32 from the reference plane 41 is set to be the same, that is, the second reference point I and the first reference point P have the same height coordinates relative to the reference plane 41, which helps to reduce the computing power requirement of the processing module 33.

[0065] In some other embodiments, the height difference between the structured light projector 31 and the optical collector 32 from the reference plane 41 can also be set to a preset value along the first straight line direction, and the preset difference is a known quantity. In this case, the processing module 33 can also perform calculations using the spatial coordinates between different points during the calculation of parameters such as phase difference, which facilitates the simplification of assembly and installation accuracy and process in the overall assembly of the laser processing system 100.

[0066] Combination Figure 1 and Figure 3 When arranging the optical collector 32, it is positioned along the Z-direction, facing and perpendicular to the reference surface 41 of the stage 40. At this time, the installation height L of the optical collector 32 along the Z-direction is the length of OP, and point O is the intersection of the optical collector 32 along the Z-direction and the reference surface 41. Correspondingly, the installation height of the structured light projector 31 along the Z-direction is the vertical distance between the second reference point P and the reference surface 41, which is also L.

[0067] In some embodiments, the processing module 33 can calculate the three-dimensional contour shape and size of the preset object 200 using the following formula:

[0068] .

[0069] Combination Figure 1 and Figure 3Let h be the height of one point of the preset object 200 relative to the reference plane 41 along the Z-direction. Since the reference plane 41 is a preset calibration plane, and the x-coordinate (e.g., x-axis coordinate) and y-coordinate (e.g., y-axis coordinate) of the point can be considered known quantities. The above formula can be used to calculate the height coordinates (e.g., z-axis coordinate, i.e., h) of multiple points on the surface of the preset object 200, thereby obtaining multiple three-dimensional coordinate parameters of the surface of the preset object 200. The specific accuracy requirements can be flexibly allocated according to computing power and resolution needs.

[0070] In the above formula, combined Figure 3 L is the distance between the structured light projector 31 and the optical collector 32 and the reference plane 41 along the Z direction. d is the minimum distance between the structured light projector 31 and the optical collector 32 along the second straight line direction (i.e., the X direction), which is the distance between the first reference point I and the second reference point P on the x-axis. T is the grating period of the structured light, also known as the grating constant, which refers to the distance between two adjacent grating lines on the grating. These are phase information parameters.

[0071] Once the laser processing system 100 is installed and set up, when calculating the positional information parameters of the preset object 200, the parameters L and d mentioned above are known quantities, or can be directly calculated from known coordinate parameters. Parameter T can be obtained based on the structured light (projection pattern) of the detection beam. This phase information parameter can be calculated by the processing module 33 using preset algorithms such as phase measurement profilometry and Fourier transform profilometry, combined with known parameters. This allows the processing module 33 to calculate the height dimensions along the Z direction of multiple points on the surface of the preset object 200 based on the aforementioned parameters and formulas, thereby obtaining the three-dimensional contour shape and size of the surface of the preset object 200 within the corresponding resolution range.

[0072] Through the above scheme, under the preset accuracy requirements, the coordinate parameter information (i.e., three-dimensional shape and size) of multiple points on the surface of the preset object 200 can be obtained through measurement and calculation. Based on this, since the coordinate parameters of the light output port of the modulation component 20 are also known, the accurate parameters of the laser beam defocusing amount, deflection direction, and deflection angle at the preset points can be calculated according to the processing accuracy and the requirements of the processing shape and size, thereby improving the processing accuracy and effect of the laser processing system 100.

[0073] In some embodiments, combined with Figure 1 Along the first straight line, the light outlets of the structured light projector 31, the optical collector 32, and the modulation assembly 20 are all installed at the same height from the reference surface 41. This helps reduce the computational power required to calculate the defocusing amount and deflection angle of the laser beam.

[0074] It should be noted that during the processing of the preset object 200, the deflection direction, deflection angle, and defocus amount of the laser beam can be adjusted by the modulation component 20 or by other structures.

[0075] For example, the modulation component 20 may include a first galvanometer and a second galvanometer. As the laser beam from the light source 10 to the output port of the modulation component 20 is reflected by the first galvanometer and the second galvanometer in sequence, the deflection angle and direction of the laser beam are changed by adjusting the deflection angle of the first galvanometer and the second galvanometer.

[0076] Correspondingly, the modulation component 20 may also include one or more lenses. By adjusting the positional spacing of the lenses between the second galvanometer and the light outlet, the focal position of the laser beam can be precisely adjusted, that is, the defocusing amount can be finely adjusted.

[0077] In addition, combined Figure 1 and Figure 2 The laser processing system 100 also includes a drive component 50. The processing module 33 is electrically connected to the drive component 50 and is used to adjust the distance between the modulation component 20 (its light outlet) and the stage 40, thereby adjusting the defocus of the laser beam to facilitate the precise processing of the preset object 200.

[0078] In the process of adjusting the defocus of the laser beam through the drive component 50, the spatial position of the stage 40 can be adjusted, the spatial position of the modulation component 20 can be adjusted, or the spatial positions of the stage 40 and the modulation component 20 can be adjusted simultaneously, without limitation.

[0079] For example, such as Figure 2 As shown, the drive assembly 50 includes a first drive element 51, which is electrically connected to the processing module 33. (In conjunction with...) Figure 1 The first driving component 51 can be connected and installed to the stage 40. For example, the first driving component 51 can be connected along the Z direction to the side of the stage 40 away from the modulation component 20 to support the stage 40, so that the processing module 33 can adjust the position of the stage 40 by controlling the first driving component 51. This allows for flexible adjustment of the defocusing amount, deflection direction, and deflection angle of the laser beam.

[0080] For example, the first drive member 51 is a multi-axis adjustment structure used to adjust the spatial position of the stage 40 on the x, y, and z axes. By controlling the first drive member 51 to move up and down along the Z-axis, the defocusing amount of the laser beam can be adjusted. When controlling the first drive member 51, the movement direction and displacement of the stage 40 can be adjusted by moving along at least one of the x-axis and y-axis directions, which allows for flexible control of the deflection direction and angle of the laser beam, facilitating the precise processing of the preset object 200 on the stage 40.

[0081] Or, combine Figure 2 The drive assembly 50 includes a second drive element 52, which is electrically connected to the processing module 33. Figure 1 At least the light source 10 and the modulation assembly 20 are connected and installed with the second driving component 52 so that the second driving component 52 can drive the light source 10 and the modulation assembly 20 to adjust their spatial position. This allows for flexible adjustment of the defocusing amount, deflection direction, and deflection angle of the laser beam relative to the stage 40.

[0082] If the second driving member 52 is a multi-axis adjustment structure, it is used to adjust the spatial position of the light source 10 and the modulation component 20 on the x-axis, y-axis, and z-axis. By controlling the second driving member 52 to move up and down along the Z-axis, the defocusing amount of the laser beam can be adjusted. When controlling the second driving member 52, by adjusting the moving direction and displacement of the light source 10 and the modulation component 20 along at least one of the X-axis and Y-axis, the deflection direction and deflection angle of the laser beam can be flexibly controlled, which facilitates the precise processing of the preset object 200 on the stage 40.

[0083] The light source 10 and the modulation component 20 can be configured as separate structures, respectively installed at corresponding positions of the second driving component 52, so that the laser beam emitted by the light source 10 can accurately enter the light inlet of the modulation component 20.

[0084] Alternatively, the light source 10 and the modulation component 20 can be configured as an integrated component, that is, the light source 10 is fixedly installed at the light inlet of the modulation component 20, and there is no limitation on this.

[0085] In some embodiments, the structured light projector 31 and the optical collector 32 are fixedly connected to opposite sides of the modulation assembly 20. This allows the second drive member 52 to drive the light source 10, the modulation assembly 20, the structured light projector 31, and the optical collector 32 to move synchronously. This maintains that the light outlet of the modulation assembly 20, the structured light projector 31, and the optical collector 32 have the same installation height along the Z direction.

[0086] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser processing system characterized by, include: Light source components; A modulation component is used to modulate the laser beam emitted by the light source to process a preset object; And modeling components, including: A structured light projector, used to emit structured light toward the preset object; An optical collector is used to collect the imaging pattern of the structured light on the surface of a preset object; The processing module is at least electrically connected to the optical acquisition unit and is used to acquire the imaging pattern and calculate the three-dimensional contour dimensions of the preset object. The processing module is also electrically connected to the light source, the modulation component, and the structured light projector, and the processing module is configured to have at least a detection state and a processing state. When the processing module controls the laser processing system to be in the detection state, the processing module, in conjunction with the structured light projector and the optical collector, detects and calculates the three-dimensional contour shape and size of the preset object; When the processing module controls the laser processing system to be in processing mode, the processing module controls the light source and the modulation component to process the preset object according to the three-dimensional contour shape and size.

2. The laser processing system according to claim 1, characterized by, The bearing surface supporting the preset object along the first straight line direction is the reference surface, and the first straight line direction is set perpendicular to the reference surface; Along the first straight line direction, the structured light projector and the optical collector are installed at the same height from the reference plane.

3. The laser processing system of claim 2, wherein, The processing module calculates the three-dimensional contour shape and size of the preset object using the following formula: ； Wherein, h is the height of one of the points of the preset object relative to the reference plane along the first straight line direction; L is the distance between the optical collector and the reference plane along the first straight line direction; d is the minimum distance between the structured light projector and the optical collector along the second straight line direction, the second straight line direction being perpendicular to the first straight line direction; and T is the grating period of the structured light. These are phase information parameters.

4. The laser processing system of claim 2, wherein, Along the first straight line direction, the light outlets of the structured light projector, the optical collector, and the modulation component are at the same installation height from the reference surface.

5. The laser processing system according to any one of claims 1 to 4, characterized by, The structured light includes striped structured light or grid structured light.

6. The laser processing system according to any one of claims 1 to 4, characterized by, The laser processing system also includes: A platform for supporting the preset object; A driving component, wherein the processing module is electrically connected to the driving component, is used to adjust the relative position of the modulation component and the stage.

7. The laser processing system of claim 6, wherein, The driving component includes a first driving element, which is connected and installed to the stage, and the processing module is electrically connected to the first driving element for adjusting the position of the stage.

8. The laser processing system of claim 6, wherein, The driving component includes a second driving element, at least the light source and the modulation component are connected and installed with the second driving element, and the processing module is electrically connected to the second driving element for adjusting the position state of the light source and the modulation component.

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