Hemispherical harmonic oscillator batch polishing device

Abstract

The utility model discloses a batch polishing device for hemispherical harmonic oscillators. The batch polishing device comprises a base, an inner polishing module, an outer polishing module and a clamping module, a plurality of clamping mechanisms of the clamping module are used for clamping the hemispherical harmonic oscillators, and a linear driving mechanism of the outer polishing module drives a base to move in the Z direction, so that a plurality of outer polishing mechanisms abut against the outer spherical surfaces of the corresponding harmonic oscillators and outer anchor rods; a linear driving mechanism of the inner polishing module drives a movable seat to move in the Y direction, so that a plurality of inner polishing mechanisms extend into the corresponding harmonic oscillator spaces and abut between the inner spherical surface of the hemispherical harmonic oscillator and the inner anchor rod; a rotation driving mechanism of the clamping module drives a clamping mechanism to rotate so as to drive the hemispherical harmonic oscillators to rotate in the circumferential direction, so that the outer polishing mechanism polishes the outer spherical surfaces and the outer anchor rods of the corresponding hemispherical harmonic oscillators, and the inner polishing mechanism polishes the inner spherical surfaces and the inner anchor rods of the corresponding hemispherical harmonic oscillators. According to the utility model, the processing efficiency can be effectively improved, and the consistency of the morphology of the harmonic oscillator is maintained.

Description

Technical Field

[0001] This utility model relates to the field of hemispherical gyroscope manufacturing technology, specifically to a batch polishing device for hemispherical harmonic oscillators. Background Technology

[0002] The hemispherical resonator gyroscope is an advanced inertial navigation sensor characterized by high reliability, high precision, long lifespan, and low noise. It is widely used in navigation, guidance, and control systems for various strategic and tactical weapons in aviation, aerospace, maritime, and ground-based fields. The hemispherical resonator is the core component of the hemispherical resonator gyroscope. Made of high-purity fused silica, it exhibits high hardness and brittleness, and requires precise surface morphology control. Its fabrication process is time-consuming, costly, and complex, presenting significant challenges. Therefore, stable mass production methods are difficult to establish, particularly in the polishing of the inner and outer spherical surfaces of the hemispherical resonator, where process control is demanding and the consistency of the morphology of the machined resonator is not ideal. Utility Model Content

[0003] To address the problems in the background art, this utility model proposes a batch polishing device for hemispherical harmonic oscillators that effectively improves processing efficiency and the consistency of oscillator morphology.

[0004] The present invention adopts the following technical solution:

[0005] A batch polishing device for hemispherical harmonic oscillators includes: a base, an inner polishing module, an outer polishing module, and a clamping module;

[0006] The clamping module includes a rotation drive mechanism and a mounting plate fixed on the base, as well as multiple clamping mechanisms rotatably mounted on the mounting plate. The multiple clamping mechanisms are arranged at intervals along the X direction. The clamping mechanisms are used to clamp the hemispherical resonator so that the hemispherical resonator is arranged axially along the Y direction.

[0007] The external polishing module includes: a Z-axis linear drive mechanism, a base connected to the Z-axis linear drive mechanism, and multiple external polishing mechanisms mounted on the base. The multiple external polishing mechanisms are arranged at intervals along the X-axis and correspond one-to-one with multiple clamping mechanisms. The external polishing mechanisms are located below the corresponding clamping mechanisms. The Z-axis linear drive mechanism is used to drive the base to move along the Z-axis so that the external polishing mechanisms abut against the outer spherical surface and outer anchor rod of the corresponding resonator.

[0008] The internal polishing module includes: a Y-axis linear drive mechanism, a movable seat connected to the Y-axis linear drive mechanism, and multiple internal polishing mechanisms mounted on the movable seat. The multiple internal polishing mechanisms are arranged at intervals along the X-axis and correspond one-to-one with multiple clamping mechanisms. The Y-axis linear drive mechanism is used to drive the movable seat to move along the Y-axis so that the internal polishing mechanism extends into the corresponding resonator space and abuts against the inner spherical surface of the hemispherical resonator and the inner anchor rod.

[0009] The rotation drive mechanism of the clamping module is connected to multiple clamping mechanisms to drive the clamping mechanisms to rotate, thereby causing the hemispherical resonator to rotate circumferentially. This allows the outer polishing mechanism to polish the outer spherical surface and outer anchor of the corresponding hemispherical resonator, and the inner polishing mechanism to polish the inner spherical surface and inner anchor of the corresponding hemispherical resonator.

[0010] As a further improvement to the above technical solution:

[0011] The outer polishing mechanism includes an outer polishing substrate and an outer polishing skin. The upper surface of the outer polishing substrate forms an outer contour surface, which mates with 1 / 8 to 1 / 5 of the outer peripheral wall of the hemispherical resonator. The outer polishing skin is attached to the outer contour surface and includes an outer anchor rod attachment part that mates with the outer anchor rod of the hemispherical resonator and an outer spherical surface attachment part that mates with the outer spherical surface of the hemispherical resonator. The outer anchor rod attachment part and the outer spherical surface attachment part are connected by a rounded transition.

[0012] The upper surface of the base has multiple grooves, each corresponding to a different external polishing mechanism. The lower part of the external polishing substrate is fitted into the grooves, and the external polishing substrate is fixed to the base by fasteners.

[0013] There are two Z-axis linear drive mechanisms, which are located at both ends of the base in the X direction. Each Z-axis linear drive mechanism includes a Z-axis lead screw and an adjusting nut. The base and the adjusting nut are mounted on the Z-axis lead screw, and the base is supported on the adjusting nuts of the two Z-axis linear drive mechanisms.

[0014] The internal polishing mechanism includes an internal polishing substrate and an internal polishing skin. The surface of the internal polishing substrate facing the hemispherical resonator forms an internal contour surface, which mates with 1 / 8 to 1 / 5 of the inner peripheral wall of the hemispherical resonator. The internal polishing skin is attached to the internal contour surface and includes an internal anchor rod attachment part that mates with the internal anchor rod of the hemispherical resonator and an internal spherical surface attachment part that mates with the inner spherical surface of the hemispherical resonator. The internal anchor rod attachment part and the internal spherical surface attachment part are connected at the end facing the hemispherical resonator by a rounded transition.

[0015] The internal polishing module also includes multiple mold bases, which are fixed on the movable base. The end of the internal polishing substrate away from the hemispherical harmonic oscillator is fixed in the corresponding mold base.

[0016] The Y-axis linear drive mechanism includes a direct drive motor and a slide rail mounted on a base, as well as a Y-axis lead screw connected to the direct drive motor. Both the Y-axis lead screw and the slide rail are arranged along the Y-axis. The movable seat slides on the slide rail and is threadedly connected to the Y-axis lead screw. The direct drive motor is used to drive the Y-axis lead screw to rotate so that the movable seat slides on the slide rail.

[0017] The clamping mechanism includes a spindle, a clamp, and a rotating rod. The spindle passes through the mounting plate and is rotatably connected to the mounting plate via bearings.

[0018] The clamp includes a mounting part and a clamping part. The clamping part has a mounting hole at one end facing the hemispherical resonator, which mates with the end of the outer anchor rod of the hemispherical resonator. The sidewall of the clamping part has multiple side grooves communicating with the mounting hole. These side grooves are spaced apart circumferentially along the clamp and extend through the clamping part axially toward the end face of the hemispherical resonator, thus making the clamping part consist of multiple clamping blocks.

[0019] The end face of the main shaft facing the hemispherical resonator has a receiving groove that mates with the clamp. The clamp is located in the receiving groove. The outer wall of the clamping part forms a first conical surface. The outer diameter of the first conical surface gradually decreases from the end near the hemispherical resonator to the end away from the hemispherical resonator. The side wall of the receiving groove and the part corresponding to the clamping part form a second conical surface that mates with the first conical surface. The rotating rod is rotatably connected to the main shaft. Its upper part passes through the main shaft and extends into the receiving groove and is threadedly connected to the mounting part. When the rotating rod rotates, it drives the clamp to move along the Y direction until the clamping part extends out or into the receiving groove, so that multiple clamping blocks close or open to clamp or release the hemispherical resonator.

[0020] The rotary drive mechanism includes a rotary motor, a main pulley, a belt, and multiple slave pulleys. Each slave pulley corresponds to a different fixture. The slave pulleys are threaded through the end of the corresponding main shaft facing away from the hemispherical harmonic oscillator and are detachably fixed to the main shaft. The main pulley is connected to the rotary motor for transmission. The belt is tensioned between the main pulley and the multiple slave pulleys.

[0021] It also includes a coolant module, which includes a liquid tank on the base, a water pump installed in the liquid tank, and multiple spray pipe mechanisms connected to the water pump. The multiple spray pipe mechanisms correspond one-to-one with multiple clamping mechanisms. The spray pipe mechanisms are fixed on the mounting plate, and their outlets are aligned with the hemispherical resonators on the corresponding clamping mechanisms.

[0022] Compared with the prior art, the advantages of this utility model are:

[0023] This invention can effectively achieve synchronous and batch polishing of the inner and outer surfaces of a hemispherical resonator, which not only effectively improves work efficiency, but also greatly improves the consistency of the morphology of the batch-processed resonators. Furthermore, the synchronous polishing of the inner and outer surfaces (including the inner anchor, inner spherical surface, outer anchor, and outer spherical surface) results in better coaxiality of the hemispherical resonator and an improved Q value. Attached Figure Description

[0024] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0025] Figure 1 This is a three-dimensional structural schematic diagram of the batch polishing device for hemispherical harmonic oscillators according to an embodiment of the present invention.

[0026] Figure 2 This is a three-dimensional structural schematic diagram of the batch polishing device for hemispherical harmonic oscillators according to an embodiment of the present invention.

[0027] Figure 3 This is a partial cross-sectional structural diagram of the batch polishing device for hemispherical harmonic oscillators according to an embodiment of the present invention.

[0028] Figure 4 This is a schematic diagram of the external polishing mechanism.

[0029] Figure 5 This is a schematic diagram of the external polishing module.

[0030] Figure 6 This is a schematic diagram of the Z-axis lead screw.

[0031] Figure 7 This is a schematic diagram of the internal polishing mechanism.

[0032] Figure 8 This is a schematic diagram of the internal polishing module.

[0033] Figure 9 This is a three-dimensional structural diagram of the clamping module.

[0034] Figure 10 This is a three-dimensional structural diagram of the mounting module from another perspective.

[0035] Figure 11 This is a schematic diagram of the structure of a hemispherical harmonic oscillator to be polished.

[0036] Figure 12 This is a schematic diagram of the three-dimensional structure of the fixture.

[0037] Figure 13 This is a schematic diagram of the cross-sectional structure of the fixture.

[0038] Figure 14 This is a schematic diagram of the three-dimensional structure of the base.

[0039] Figure label:

[0040] 230. Base; 220. Mounting plate; 210. Base; 210-1. Groove; 201. Movable seat; 103. Outer polished base; 105. Outer polished skin; 1051. Outer anchor bolt fitting part; 1052. Outer spherical fitting part; 211. Fastener; 212. Z-direction lead screw; 213. Adjusting nut; 102. Inner polished base; 104. Inner polished skin; 1041. Inner anchor bolt fitting part; 1042. Inner spherical fitting part; 106. Mold base; 207. Direct drive motor; 202. 1. Slide rail; 203. Y-axis lead screw; 109. Main shaft; 109-1. Receiving groove; 109-2. Second conical surface; 110. Clamp; 110-1. Mounting hole; 110-2. Mounting part; 110-3. Clamping part; 110-4. Side groove; 110-5. First conical surface; 111. Rotating rod; 112. Bearing; 240. Rotating motor; 247. Main pulley; 241. Belt; 113. Driven pulley; 230-2. Liquid tank; 244. Water pump; 242. Spray pipe mechanism; Detailed Implementation

[0041] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0042] like Figures 1-14 As shown, the batch polishing device for hemispherical harmonic oscillators in this embodiment includes: a base 230, an inner polishing module, an outer polishing module, and a clamping module;

[0043] The clamping module includes a rotation drive mechanism and a mounting plate 220 fixed on the base 230, and multiple clamping mechanisms rotatably mounted on the mounting plate 220. The multiple clamping mechanisms are arranged at intervals along the X direction. The clamping mechanisms are used to clamp the hemispherical resonator so that the hemispherical resonator is arranged axially along the Y direction.

[0044] The external polishing module includes: a Z-axis linear drive mechanism, a base 210 connected to the Z-axis linear drive mechanism, and multiple external polishing mechanisms mounted on the base 210. The multiple external polishing mechanisms are arranged at intervals along the X-axis and correspond one-to-one with multiple clamping mechanisms. The external polishing mechanisms are located below the corresponding clamping mechanisms. The Z-axis linear drive mechanism is used to drive the base 210 to move along the Z-axis so that the external polishing mechanisms abut against the outer spherical surface and outer anchor rod of the corresponding resonator.

[0045] The internal polishing module includes: a Y-axis linear drive mechanism, a movable seat 201 connected to the Y-axis linear drive mechanism, and multiple internal polishing mechanisms mounted on the movable seat 201. The multiple internal polishing mechanisms are arranged at intervals along the X-axis and correspond one-to-one with multiple clamping mechanisms. The Y-axis linear drive mechanism is used to drive the movable seat 201 to move along the Y-axis so that the internal polishing mechanism extends into the corresponding resonator space and abuts against the inner spherical surface of the hemispherical resonator and the inner anchor rod.

[0046] The rotation drive mechanism of the clamping module is connected to multiple clamping mechanisms to drive the clamping mechanisms to rotate, thereby causing the hemispherical resonator to rotate circumferentially. This allows the outer polishing mechanism to polish the outer spherical surface and outer anchor of the corresponding hemispherical resonator, and the inner polishing mechanism to polish the inner spherical surface and inner anchor of the corresponding hemispherical resonator.

[0047] Therefore, the batch polishing device for hemispherical resonators in this embodiment can effectively achieve synchronous and batch polishing of the inner and outer surfaces of the hemispherical resonator, which not only effectively improves work efficiency, but also greatly improves the consistency of the morphology of the batch-processed resonators; furthermore, the synchronous polishing of the inner and outer surfaces (including the inner anchor, inner spherical surface, outer anchor, and outer spherical surface) results in better coaxiality of the hemispherical resonator and an improved Q value.

[0048] In this embodiment, as Figure 4 As shown, the outer polishing mechanism includes an outer polishing substrate 103 and an outer polishing skin 105. The upper surface of the outer polishing substrate 103 forms an outer contour surface, which mates with 1 / 8 to 1 / 5 of the outer peripheral wall of the hemispherical resonator. The outer polishing skin 105 is attached to the outer contour surface and includes an outer anchor rod attachment part 1051 that is attached to the outer anchor rod of the hemispherical resonator, and an outer spherical surface attachment part 1052 that is attached to the outer spherical surface of the hemispherical resonator. The outer anchor rod attachment part 1051 and the outer spherical surface attachment part 1052 are connected by a rounded corner transition.

[0049] The outer polishing substrate 103 of the resonator adopts a lathe tool contour-oriented design, ensuring it is perpendicular to the surface of the resonator and the outer anchor post for effective polishing. The outer polishing skin 105 is bonded to the outer polishing substrate 103, forming a new integrated tool that can polish both the outer spherical surface of the resonator and the cylindrical surface of the outer anchor post. This effectively solves the problem of inaccurate polishing at the transition between the cylindrical surface and the outer spherical surface in existing processes.

[0050] In this embodiment, as Figure 5 As shown, the upper surface of the base 210 has multiple grooves 210-1, each groove 210-1 corresponding to a multiple external polishing mechanism. The lower part of the external polishing substrate 103 is fitted into the groove 210-1, and the external polishing substrate 103 and the base 210 are fixedly connected by fasteners 211.

[0051] In this embodiment, there are two Z-axis linear drive mechanisms, which are respectively located at both ends of the base 210 in the X direction. Each Z-axis linear drive mechanism includes a Z-axis lead screw 212 and an adjusting nut 213. The base 210 and the adjusting nut 213 are inserted through the Z-axis lead screw 212, and the base 210 is supported on the adjusting nuts 213 of the two Z-axis linear drive mechanisms.

[0052] The assembly process of the external polishing module is as follows:

[0053] Multiple outer polishing substrates 103 are positioned within corresponding grooves 210-1 of the base 210 and fixed to the base 210 using fasteners 211. The base 210 is then fitted into the Z-axis lead screw 212, and the up-and-down direction is effectively adjusted using adjusting nuts 213, thereby ensuring that the outer polishing skin 105 contacts the outer spherical surface and outer anchor of the hemispherical resonator 101, completing the polishing work. The main innovation lies in its multi-purpose functionality and compatibility with the inner spherical surface polishing module, effectively improving work efficiency, reducing time costs, and lowering risks.

[0054] In addition, the Z-axis lead screw 212 has an added positioning boss 212-1 in its structural design. Its main function is to ensure the precision assembly of the external polishing module and guarantee its positional accuracy.

[0055] In this embodiment, as Figure 7 As shown, the inner polishing mechanism includes an inner polishing substrate 102 and an inner polishing skin 104. The inner polishing substrate 102 forms an inner contour surface on one end of its surface facing the hemispherical resonator. The inner contour surface mates with 1 / 8 to 1 / 5 of the inner peripheral wall of the hemispherical resonator. The inner polishing skin 104 is attached to the inner contour surface and includes an inner anchor rod attachment part 1041 that is attached to the inner anchor rod of the hemispherical resonator, and an inner spherical surface attachment part 1042 that is attached to the inner spherical surface of the hemispherical resonator. The inner anchor rod attachment part 1041 and the inner spherical surface attachment part 1042 are connected at one end facing the hemispherical resonator by a rounded corner transition.

[0056] The inner polishing substrate 102 of the resonator employs a lathe tool-guided orientation design, ensuring it is horizontal and can effectively contact the inner spherical surface and inner anchor rod of the resonator for polishing. The inner polishing skin 104 is bonded to the inner polishing substrate 102, forming a new integrated tool that can polish both the inner spherical surface of the resonator and the cylindrical surface of the inner anchor rod. This effectively solves the defect in existing processes where the transition between the cylindrical surface and the inner spherical surface of the inner anchor rod cannot be precisely polished.

[0057] The internal polishing module also includes multiple mold bases 106, which are fixed on the movable base 201. The end of the internal polishing substrate 102 away from the hemispherical harmonic oscillator is fixed in the corresponding mold base 106.

[0058] In this embodiment, as Figures 1-3As shown, the Y-direction linear drive mechanism includes a direct drive motor 207 and a slide rail 202 mounted on a base 230, and a Y-direction lead screw 203 that is connected to the direct drive motor 207. The Y-direction lead screw 203 and the slide rail 202 are both arranged along the Y direction. The movable seat 201 is slidably mounted on the slide rail 202 and threadedly connected to the Y-direction lead screw 203. The direct drive motor 207 is used to drive the Y-direction lead screw 203 to rotate so that the movable seat 201 slides on the slide rail 202.

[0059] The assembly process of the internal polishing module is as follows:

[0060] Multiple mold bases 106 are installed on the movable base 201, primarily positioned using the positioning grooves 106-2 on the movable base 201, and then secured with mold base fixing screws 107. The inner polished substrate 102 is then installed in the slot of the mold base 106, fitting snugly against the mold base mounting surface 106-1, and finally fixed with adjusting screws 108, completing the installation. The main innovation lies in the multi-purpose nature of the mold, effectively improving work efficiency, reducing time costs, and lowering risks.

[0061] In this embodiment, as Figure 9 and Figure 10 As shown, the clamping mechanism includes a spindle 109, a clamp 110 and a rotating rod 111. The spindle 109 passes through the mounting plate 220 and is rotatably connected to the mounting plate 220 via a bearing 112.

[0062] In this embodiment, as Figure 11 As shown, a process clamping position 101-1 is added to the shape design of the hemispherical resonator before polishing, which is used for the assembly relationship of the fixture 110, so that it can maintain the requirements during rotation and the coaxial accuracy of the resonator itself.

[0063] like Figure 12 and Figure 13 As shown, the fixture 110 includes a mounting part 110-2 and a clamping part 110-3. The clamping part 110-3 has a mounting hole 110-1 at one end facing the hemispherical resonator. The mounting hole 110-1 mates with the process clamping position 101-1 of the hemispherical resonator. The side wall of the clamping part 110-3 has multiple side grooves 110-4 communicating with the mounting hole 110-1. These side grooves 110-4 are spaced apart circumferentially along the fixture 110. The side grooves 110-4 penetrate the clamping part 110-3 axially towards the end face of the hemispherical resonator, thus dividing the clamping part 110-3 into multiple clamping blocks.

[0064] The end face of the spindle 109 facing the hemispherical resonator has a receiving groove 109-1 that mates with the clamp 110. The clamp 110 is located inside the receiving groove 109-1. The outer wall of the clamping part 110-3 forms a first conical surface 110-5. The outer diameter of the first conical surface 110-5 gradually decreases from the end near the hemispherical resonator to the end away from the hemispherical resonator. The portion of the side wall of the receiving groove 109-1 corresponding to the clamping part 110-3 is shaped as follows: The second conical surface 109-2 is formed to cooperate with the first conical surface 110-5. The rotating rod 111 is rotatably connected to the main shaft 109. Its upper part passes through the main shaft 109 and extends into the receiving groove 109-1 and is threadedly connected to the mounting part 110-2. When the rotating rod 111 rotates, it drives the clamp 110 to move along the Y direction until the clamping part 110-3 extends out or into the receiving groove 109-1, so that multiple clamping blocks close or open to clamp or release the hemispherical harmonic oscillator.

[0065] An additional mounting hole 110-1 was designed on the basis of fixture 110 to enable effective and precise assembly with the hemispherical resonator. This hole is mainly used to ensure that the depth and size of the resonator are consistent during clamping, thus achieving a unified function.

[0066] The mounting plate 220 adopts an L-shaped structure design, mainly including bearing holes 220-3, limiting T-slots 220-1, and water nozzle fixing holes 220-2. It is fixed to the base 230 by the main board fastening screws 221. The limiting post 222 can be adjusted up and down through the limiting T-slots 220-1. It is mainly used to protect and limit the travel space of the outer spherical polishing module, so that it reaches a critical point.

[0067] In this embodiment, the rotation drive mechanism includes a rotation motor 240, a main pulley 247, a belt 241, and multiple slave pulleys 113. The multiple slave pulleys 113 correspond one-to-one with multiple clamps 110. The slave pulleys 113 are inserted through the end of the corresponding main shaft 109 facing away from the hemispherical harmonic oscillator and are detachably fixed to the main shaft 109. The main pulley 247 is connected to the rotation motor 240 for transmission. The belt 241 is tensioned between the main pulley 247 and the multiple slave pulleys 113.

[0068] In this embodiment, a coolant module is also included. The coolant module includes a liquid tank 230-2 opened on the base 230, a water pump 244 installed in the liquid tank 230-2, and a plurality of spray pipe mechanisms 242 connected to the water pump 244. The plurality of spray pipe mechanisms 242 correspond one-to-one with a plurality of clamping mechanisms. The spray pipe mechanism 242 is fixed on the mounting plate 220, and its outlet is aligned with the hemispherical resonator on the corresponding clamping mechanism.

[0069] like Figure 14As shown, the base 230 is equipped with a spindle motor mounting platform 230-1, a direct drive bearing housing mounting station 230-3, an external polishing module mounting platform 230-4, a clamping module mounting platform 230-5, a slide rail mounting area 230-6, and a direct drive motor mounting platform 230-7. This allows for the effective loading of various modules, thus achieving an integrated machine unit.

[0070] The assembly process of this utility model device is as follows:

[0071] Step 1: First, install the main body. Install the bearing 112 on the spindle 109, ensuring the spindle extension length remains consistent. Then, insert the transmission key 114 into the keyway of the spindle 109. Align the pulley with the transmission key 114 and install the driven pulley 113. Next, install the assembled part into the mounting plate 220 via the bearing 112, achieving a rotatable connection between the spindle 109 and the mounting plate 220. Then, install the entire assembly onto the main board mounting platform 230-5 of the base 230 and secure it with the main board fastening screws 221. Next, attach one end of the transmission belt 241 to the main pulley 247 of the rotating motor 240, and attach the other end to each driven pulley 113, allowing all spindles 109 to rotate simultaneously. Secure it with the spindle motor fixing screws 243. Finally, install the rotating rod 111 and the clamp 110 into the spindle 109. Rotating the rotating rod 111 effectively controls the clamping force of the clamp 110. To date, the main body has been assembled.

[0072] Step 2: Install the inner polishing module. First, install the slide rail 202 on the slide rail mounting area 230-6 and fix it with the slide rail fixing screw 204. Then, install multiple mold bases 106 into the positioning grooves 106-2 of the movable base 201 in sequence and fix them with the mold base fixing screw 107. The movable base 201 has a threaded hole 201-1 at the end facing the Y-direction linear drive mechanism. Then, install it as a whole onto the Y-direction lead screw 203 and the slide rail 202. Then, install the direct drive motor 207 on the direct drive motor mounting platform 230-7 and fix it with the direct drive motor fixing screw 206. In addition, a limit switch 205 is installed on the base to ensure that the movable base 201 slides along the Y direction on the slide rail 202 and stops running after it comes into contact with the connection between the inner spherical surface of the hemispherical resonator and the inner anchor rod at the front end of the inner polishing mechanism, thus avoiding crushing the hemispherical resonator 101. Next, insert the inner polishing substrate 102 together with the inner polishing skin 104 onto the mold base mounting surface 106-1, so that the mounting surfaces achieve zero contact. Finally, install the adjusting screw 108 to tighten the inner spherical polishing substrate 102, and the assembly is completed.

[0073] Step 3: Install the outer polishing module. First, install the Z-axis lead screw 212 on the outer polishing module mounting platform 230-4 and complete the assembly using the lead screw fastening screw 214. Then, insert the outer polishing base 103 together with the outer polishing skin 105 into the groove 210-1 of the base 210 and tighten each outer polishing base 103 in sequence using the fasteners 211 to complete the installation. Next, install the adjusting nut 213 onto the Z-axis lead screw 212 and then fit the base 210 onto the Z-axis lead screw 212. Finally, install the limiting post 222 into the limiting T-slot 220-1 for adjustment to complete the assembly.

[0074] Step 4: Finally, install the coolant module. First, install the multiple spray pipe mechanisms 242 on the corresponding water nozzle fixing holes 220-2, then cover with the cover plate 231, and finally connect the water pump 244.

[0075] The specific process of this utility model device for batch internal and external polishing of hemispherical harmonic oscillators is as follows:

[0076] 1) The hemispherical resonator 101 to be polished is installed into the fixture 110 by rotating the rotary rod 111, and the installation is completed.

[0077] 2) Adjust the base 210 upwards using the adjusting nut 213 so that the outer polished skin 105 contacts the outer area of ​​the hemispherical resonator 101.

[0078] 3) The movable seat 201 is linearly controlled by the direct drive motor 207 so that the inner polished skin 104 contacts the internal area of ​​the hemispherical harmonic oscillator 101.

[0079] 4) Turn on the water pump 244 so that the spray pipe mechanism 242 sprays evenly on the surface of the hemispherical harmonic oscillator 101.

[0080] 5) Start the rotating motor 240, which drives the pulley 113 via the belt 241, and then drives multiple spindles to rotate simultaneously, thereby realizing a highly efficient method of polishing the inner and outer areas of the hemispherical harmonic oscillator 101 in multiple stations and batches at one time.

[0081] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A batch polishing device for hemispherical harmonic oscillators, characterized in that, include: Base (230), inner polishing module, outer polishing module and clamping module; The clamping module includes a rotation drive mechanism and a mounting plate (220) fixed on the base (230), and multiple clamping mechanisms rotatably mounted on the mounting plate (220). The multiple clamping mechanisms are arranged at intervals along the X direction. The clamping mechanisms are used to clamp the hemispherical resonator so that the hemispherical resonator is arranged axially along the Y direction. The external polishing module includes: a Z-axis linear drive mechanism, a base (210) connected to the Z-axis linear drive mechanism, and multiple external polishing mechanisms mounted on the base (210). The multiple external polishing mechanisms are arranged at intervals along the X-axis and correspond one-to-one with multiple clamping mechanisms. The external polishing mechanisms are located below the corresponding clamping mechanisms. The Z-axis linear drive mechanism is used to drive the base (210) to move along the Z-axis so that the external polishing mechanisms abut against the outer spherical surface and outer anchor rod of the corresponding resonator. The internal polishing module includes: a Y-axis linear drive mechanism, a movable seat (201) connected to the Y-axis linear drive mechanism, and multiple internal polishing mechanisms mounted on the movable seat (201). The multiple internal polishing mechanisms are arranged at intervals along the X-axis and correspond one-to-one with multiple clamping mechanisms. The Y-axis linear drive mechanism is used to drive the movable seat (201) to move along the Y-axis so that the internal polishing mechanism extends into the corresponding resonator space and abuts against the inner spherical surface of the hemispherical resonator and the inner anchor rod. The rotation drive mechanism of the clamping module is connected to multiple clamping mechanisms to drive the clamping mechanisms to rotate, thereby causing the hemispherical resonator to rotate circumferentially. This allows the outer polishing mechanism to polish the outer spherical surface and outer anchor of the corresponding hemispherical resonator, and the inner polishing mechanism to polish the inner spherical surface and inner anchor of the corresponding hemispherical resonator.

2. The hemispherical resonator bulk polishing apparatus according to claim 1, wherein The outer polishing mechanism includes an outer polishing substrate (103) and an outer polishing skin (105). The upper surface of the outer polishing substrate (103) forms an outer contour surface, which mates with 1 / 8 to 1 / 5 of the outer peripheral wall of the hemispherical harmonic oscillator. The outer polishing skin (105) is attached to the outer contour surface and includes an outer anchor rod attachment part (1051) that is attached to the outer anchor rod of the hemispherical harmonic oscillator and an outer spherical surface attachment part (1052) that is attached to the outer spherical surface of the hemispherical harmonic oscillator. The outer anchor rod attachment part (1051) and the outer spherical surface attachment part (1052) are connected by a rounded corner transition.

3. The hemispherical resonator bulk polishing apparatus of claim 2, wherein, The upper surface of the base (210) is provided with multiple grooves (210-1), and the multiple grooves (210-1) correspond one-to-one with multiple external polishing mechanisms. The lower part of the external polishing substrate (103) is inserted into the groove (210-1), and the external polishing substrate (103) and the base (210) are fixedly connected by fasteners (211).

4. The hemispherical resonator bulk polishing apparatus of claim 1, wherein, There are two Z-axis linear drive mechanisms, which are respectively located at both ends of the base (210) in the X direction. The Z-axis linear drive mechanism includes a Z-axis lead screw (212) and an adjusting nut (213). The base (210) and the adjusting nut (213) are mounted on the Z-axis lead screw (212), and the base (210) is supported on the adjusting nuts (213) of the two Z-axis linear drive mechanisms.

5. The hemispherical resonator bulk polishing apparatus of claim 1, wherein, The inner polishing mechanism includes an inner polishing substrate (102) and an inner polishing skin (104). The inner polishing substrate (102) forms an inner contour surface on one end of the hemispherical resonator. The inner contour surface fits into 1 / 8 to 1 / 5 of the inner peripheral wall of the hemispherical resonator. The inner polishing skin (104) is attached to the inner contour surface. It includes an inner anchor rod attachment part (1041) that is attached to the inner anchor rod of the hemispherical resonator, and an inner spherical surface attachment part (1042) that is attached to the inner spherical surface of the hemispherical resonator. The inner anchor rod attachment part (1041) and the inner spherical surface attachment part (1042) are connected to the end of the hemispherical resonator by a rounded corner transition.

6. The hemispherical resonator bulk polishing apparatus of claim 5, wherein, The internal polishing module also includes multiple mold bases (106), which are fixed on the movable base (201). The end of the internal polishing substrate (102) away from the hemispherical harmonic oscillator is fixed in the corresponding mold base (106).

7. The hemispherical resonator bulk polishing apparatus of claim 1, wherein, The Y-direction linear drive mechanism includes a direct drive motor (207) and a slide rail (202) mounted on a base (230), and a Y-direction lead screw (203) connected to the direct drive motor (207). The Y-direction lead screw (203) and the slide rail (202) are both arranged along the Y direction. The movable seat (201) is slidably mounted on the slide rail (202) and threadedly connected to the Y-direction lead screw (203). The direct drive motor (207) is used to drive the Y-direction lead screw (203) to rotate so that the movable seat (201) slides on the slide rail (202).

8. The hemispherical resonator bulk polishing apparatus of claim 1, wherein, The clamping mechanism includes a spindle (109), a clamp (110) and a rotating rod (111). The spindle (109) passes through the mounting plate (220) and is rotatably connected to the mounting plate (220) via a bearing (112). The clamp (110) includes a mounting part (110-2) and a clamping part (110-3). The clamping part (110-3) has a mounting hole (110-1) at one end facing the hemispherical resonator. The mounting hole (110-1) mates with the end of the outer anchor rod of the hemispherical resonator. The side wall of the clamping part (110-3) has multiple side grooves (110-4) communicating with the mounting hole (110-1). The multiple side grooves (110-4) are arranged at intervals along the circumference of the clamp (110). The side grooves (110-4) penetrate the end face of the clamping part (110-3) in the axial direction facing the hemispherical resonator, so that the clamping part (110-3) is divided into multiple clamping blocks. The end face of the main shaft (109) facing the hemispherical resonator has a receiving groove (109-1) that mates with the clamp (110). The clamp (110) is located in the receiving groove (109-1). The outer wall of the clamping part (110-3) forms a first conical surface (110-5). The outer diameter of the first conical surface (110-5) gradually decreases from the end near the hemispherical resonator to the end away from the hemispherical resonator. The part of the side wall of the receiving groove (109-1) corresponding to the clamping part (110-3) is shaped as follows: The second conical surface (109-2) is formed to cooperate with the first conical surface (110-5). The rotating rod (111) is rotatably connected to the main shaft (109). Its upper part passes through the main shaft (109) and extends into the receiving groove (109-1) and is threadedly connected to the mounting part (110-2). When the rotating rod (111) rotates, it drives the clamp (110) to move along the Y direction to the clamping part (110-3) part to extend or extend into the receiving groove (109-1) so that multiple clamping blocks close or open to clamp or release the hemispherical harmonic oscillator.

9. The hemispherical resonator bulk polishing apparatus of claim 8, wherein, The rotation drive mechanism includes a rotation motor (240), a main pulley (247), a belt (241), and multiple slave pulleys (113). The multiple slave pulleys (113) correspond one-to-one with multiple clamps (110). The slave pulleys (113) are inserted through the end of the corresponding main shaft (109) facing away from the hemispherical harmonic oscillator and are detachably fixed to the main shaft (109). The main pulley (247) is connected to the rotation motor (240) for transmission. The belt (241) is tensioned between the main pulley (247) and the multiple slave pulleys (113).

10. The batch polishing apparatus of a hemispherical resonator according to any one of claims 1 to 9, wherein It also includes a coolant module, which includes a liquid tank (230-2) opened on the base (230), a water pump (244) installed in the liquid tank (230-2), and multiple spray pipe mechanisms (242) connected to the water pump (244). The multiple spray pipe mechanisms (242) correspond one-to-one with multiple clamping mechanisms. The spray pipe mechanism (242) is fixed on the mounting plate (220), and its outlet is aligned with the hemispherical resonator on the corresponding clamping mechanism.

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