Clamping device for chip processing

By designing a chip clamping device with limiting and squeezing components, the problem that existing devices can only clamp chips of fixed size is solved, and effective clamping of chips of various sizes is achieved, thus improving the applicability of the clamping device.

CN224129526UActive Publication Date: 2026-04-17SUZHOU YIPINXIN SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU YIPINXIN SEMICON CO LTD
Filing Date
2025-02-06
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

Existing chip processing clamping devices can only clamp chips of fixed size, which has limitations and cannot adapt to chips of various sizes.

Method used

A clamping device is designed, comprising a limiting component and a squeezing component. The limiting component limits the chip position by means of a first L-shaped plate and a first rubber pad. The squeezing component squeezes and clamps the chip by means of components such as a second L-shaped plate, a hollow tube, a solid rod, a squeezing plate and an air pump, thereby fixing chips of various sizes.

Benefits of technology

The applicability of the clamping device has been improved, enabling it to flexibly clamp chips of various sizes and enhancing its usability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of clamping, and particularly relates to a clamping device for chip processing, which comprises an installed surface, a bearing plate arranged at the top of the installed surface, and a limiting assembly used for limiting the position of a chip and arranged on the left side of the top of the bearing plate, and the extrusion assembly is used for extruding the limited chip, and the extrusion assembly is arranged on the top of the bearing plate. And the limiting assembly comprises a first L-shaped plate, the first L-shaped plate is fixedly installed on the left side of the top of the bearing plate, and a first rubber pad is fixedly installed on the inner surface of the first L-shaped plate. The chip clamping device has the advantages that chips of various sizes can be clamped when the chips are processed, the clamping range of the clamping device can be widened, and the use flexibility is improved.
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Description

Technical Field

[0001] This utility model relates to the field of clamping technology, specifically a clamping device for chip processing. Background Technology

[0002] A chip is a miniaturized electronic device that is fabricated on a semiconductor wafer. It typically contains integrated circuits and is an important component of many electronic devices, such as computers, mobile phones, and various other electronic devices.

[0003] Currently, chip processing typically involves clamping the chip to prevent its position from changing during the process. However, existing clamping devices are generally limited to holding chips with relatively fixed dimensions. Therefore, this invention aims to develop a clamping device for chip processing. Utility Model Content

[0004] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0005] A clamping device for chip processing includes a mounting surface, a support plate on the top of the mounting surface, and further includes:

[0006] A limiting component for defining the chip position, and the limiting component is mounted on the top left side of the carrier board;

[0007] An extrusion assembly is used to extrude the chip after it has been positioned, and the extrusion assembly is located on the top of the carrier plate.

[0008] In a preferred embodiment of the clamping device for chip processing described in this utility model, the limiting components include:

[0009] The first L-shaped plate is fixedly installed on the top left side of the support plate;

[0010] The first rubber pad is fixedly installed on the inner surface of the first L-shaped plate.

[0011] In a preferred embodiment of the clamping device for chip processing described in this utility model, the extrusion assembly includes:

[0012] The second L-shaped plate is fixedly installed on the top right side of the support plate;

[0013] A flow channel is formed in the second L-shaped plate;

[0014] Hollow tubes are fixedly installed on the inner side of the second L-shaped plate, and the hollow tubes are connected to the flow groove.

[0015] A solid rod, which is slidably connected in a hollow tube.

[0016] In a preferred embodiment of the clamping device for chip processing described in this utility model, the extrusion assembly further includes:

[0017] An extrusion plate, which is fixedly installed at one end of a solid rod;

[0018] The second rubber pad is fixedly installed on the inner side of the extrusion plate;

[0019] A spring is fitted onto a solid rod, and both ends of the spring are fixedly connected to an extrusion plate and a hollow tube, respectively.

[0020] In a preferred embodiment of the clamping device for chip processing described in this utility model, the extrusion assembly further includes:

[0021] An air pump, which is fixedly mounted on the top of the support plate;

[0022] The first pipe is fixedly installed on the air outlet end of the air pump and on the outer side of the second L-shaped plate, and is connected to the flow channel.

[0023] In a preferred embodiment of the clamping device for chip processing described in this utility model, the extrusion assembly further includes:

[0024] The second pipe is fixedly installed on the air inlet end of the air pump;

[0025] The exhaust pipe is equipped with a valve. The exhaust pipe is fixedly installed on the outer side of the second L-shaped plate and is connected to the flow groove.

[0026] In a preferred embodiment of the clamping device for chip processing described in this utility model, a carrier plate is mounted on the top of the mounting surface via a connecting assembly.

[0027] The connection component includes:

[0028] A stud is fixedly installed on the top of the surface to be mounted, and the stud passes through the bearing plate;

[0029] A fine stud is fixedly mounted on top of a coarse stud, and the thread directions of the coarse and fine studs are set in opposite directions.

[0030] In a preferred embodiment of the chip processing clamping device described in this utility model, the connecting component further includes:

[0031] A coarse nut, which is threaded onto a coarse stud, with the top of the stud located inside the cavity of the coarse nut;

[0032] A fine nut, which is threaded onto a fine stud.

[0033] Compared with existing technologies:

[0034] By setting a limiting component for defining the chip position and a pressing component for pressing the chip after it is positioned, the device can clamp chips of various sizes during chip processing, thereby increasing the clamping range of the clamping device and improving its flexibility of use. Attached Figure Description

[0035] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0036] Figure 2 This is a top view of the structure of this utility model;

[0037] Figure 3 This is a schematic diagram of the coarse stud and fine stud structure of this utility model;

[0038] Figure 4 This is a schematic diagram of the hollow tube and solid rod structure of this utility model;

[0039] Figure 5 This is a cross-sectional view of the hollow tube and solid rod structure of this utility model.

[0040] In the figure: mounting surface 10, bearing plate 20, coarse stud 30, fine stud 31, coarse nut 32, fine nut 33, first L-shaped plate 40, first rubber pad 41, second L-shaped plate 50, flow channel 51, hollow tube 52, solid rod 53, extrusion plate 54, second rubber pad 55, spring 56, air pump 57, first pipe 58, second pipe 59, exhaust pipe 591. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0042] This utility model provides a clamping device for chip processing. Please refer to [link / reference]. Figures 1-5 It includes a mounting surface 10, and a support plate 20 is provided on the top of the mounting surface 10. The mounting surface 10 includes, but is not limited to, a worktable.

[0043] It also includes: a limiting component for defining the chip position, and the limiting component is mounted on the top left side of the carrier plate 20;

[0044] The limiting components include: a first L-shaped plate 40 and a first rubber pad 41;

[0045] The first L-shaped plate 40 is fixedly installed on the top left side of the bearing plate 20, and the first rubber pad 41 is fixedly installed on the inner surface of the first L-shaped plate 40.

[0046] It also includes: a pressing assembly for pressing the chip after it has been positioned, and the pressing assembly is located on the top of the carrier plate 20;

[0047] The extrusion assembly includes: a second L-shaped plate 50, a flow channel 51, a hollow tube 52, a solid rod 53, an extrusion plate 54, a second rubber pad 55, a spring 56, an air pump 57, a first pipe 58, a second pipe 59, and an exhaust pipe 591 with a valve thereon;

[0048] The second L-shaped plate 50 is fixedly installed on the top right side of the support plate 20. A flow channel 51 is formed in the second L-shaped plate 50. Several hollow tubes 52 are fixedly installed on the inner side of the second L-shaped plate 50, and the hollow tubes 52 are connected to the flow channel 51. A solid rod 53 is slidably connected in the hollow tubes 52. An extrusion plate 54 is fixedly installed on one end of the solid rod 53. A second rubber pad 55 is fixedly installed on the inner side of the extrusion plate 54. A spring 56 is sleeved on the solid rod 53, and both ends of the spring 56 are fixedly connected to the extrusion plate 54 and the hollow tubes 52, respectively. An air pump 57 is fixedly installed on the top of the support plate 20. Pipe 58 is fixedly installed on the air outlet end of air pump 57. First pipe 58 is fixedly installed on the outer side of second L-shaped plate 50 and is connected to flow groove 51. Second pipe 59 is fixedly installed on the air inlet end of air pump 57. Exhaust pipe 591 is fixedly installed on the outer side of second L-shaped plate 50 and is connected to flow groove 51. Sliding grooves are provided at both ends of the inner cavity of hollow pipe 52. Guide blocks are fixedly installed at both ends of solid rod 53 and the guide blocks are slidably connected in the sliding grooves. In addition, a sealing ring can be provided between hollow pipe 52 and solid rod 53 as needed.

[0049] The top of the mounting surface 10 is fitted with a support plate 20 via a connecting assembly;

[0050] The connecting components include: a coarse stud 30, a fine stud 31, a coarse nut 32, and a fine nut 33;

[0051] A coarse stud 30 is fixedly installed on the top of the mounting surface 10 and passes through the bearing plate 20. A fine stud 31 is fixedly installed on the top of the coarse stud 30 and the thread directions of the coarse stud 30 and the fine stud 31 are set to be opposite. A coarse nut 32 is threadedly connected to the coarse stud 30 and the top end of the coarse stud 30 is located in the inner cavity of the coarse nut 32. A fine nut 33 is threadedly connected to the fine stud 31.

[0052] The specific steps involved in chip processing are as follows:

[0053] Step 1: Pass the coarse stud 30 through the support plate 20, and then thread the coarse nut 32 and the fine nut 33 onto the coarse stud 30 and the fine stud 31 in sequence. This will fix the support plate 20 onto the mounting surface 10.

[0054] Step 2: Place the chip on the carrier plate 20 and make the side of the chip contact the first rubber pad 41, so that the position of the chip can be defined.

[0055] Step 3: Air is injected into the hollow tube 52 by the air pump 57 so that the extrusion plate 54 extrudes the chip through the second rubber pad 55. During this process, the spring 56 will deform, thus clamping and fixing the chip. Afterwards, when it is necessary to remove the chip, the air can be discharged through the exhaust pipe 591 so that the second rubber pad 55 and the chip can be separated.

[0056] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A clamping device for chip processing, comprising a mounting surface (10) provided at the top thereof with a carrier plate (20), characterized in that, Also includes: A limiting component for defining the chip position, and the limiting component is mounted on the top left side of the carrier plate (20); An extrusion assembly for extruding the chip after it has been positioned, and the extrusion assembly is located on the top of the carrier plate (20); The defined components include: The first L-shaped plate (40) is fixedly installed on the top left side of the support plate (20); The first rubber pad (41) is fixedly installed on the inner surface of the first L-shaped plate (40). The extrusion assembly includes: The second L-shaped plate (50) is fixedly installed on the top right side of the support plate (20); A flow channel (51) is formed in the second L-shaped plate (50); Hollow tubes (52) are fixedly installed on the inner side of the second L-shaped plate (50), and the hollow tubes (52) are connected to the flow groove (51); A solid rod (53) is slidably connected in a hollow tube (52); An extrusion plate (54) is fixedly mounted on one end of a solid rod (53); The second rubber pad (55) is fixedly installed on the inner side of the extrusion plate (54). Spring (56), which is sleeved on solid rod (53), and the two ends of spring (56) are fixedly connected to extrusion plate (54) and hollow tube (52) respectively; An air pump (57) is fixedly mounted on the top of a support plate (20); The first pipe (58) is fixedly installed on the air outlet end of the air pump (57), and the first pipe (58) is fixedly installed on the outside of the second L-shaped plate (50), and the first pipe (58) is connected to the flow channel (51). The second pipe (59) is fixedly installed on the air inlet end of the air pump (57); An exhaust pipe (591) is fixedly installed on the outside of the second L-shaped plate (50), and the exhaust pipe (591) is connected to the flow groove (51). A valve is provided on the exhaust pipe (591).

2. The clamping device for processing a chip according to claim 1, wherein The top of the mounting surface (10) is fitted with a support plate (20) via a connecting assembly. The connection component includes: A stud (30) is fixedly installed on the top of the mounting surface (10) and passes through the support plate (20). A fine stud (31) is fixedly mounted on the top of a coarse stud (30), and the thread directions of the coarse stud (30) and the fine stud (31) are set to be opposite.

3. The clamping device for processing a chip according to claim 2, wherein The connection component also includes: A coarse nut (32) is threaded onto a coarse stud (30), and the top end of the coarse stud (30) is located in the inner cavity of the coarse nut (32); A fine nut (33) is threaded onto a fine stud (31).