PET bottle preform injection molding cooling device

Abstract

The utility model discloses a PET bottle preform injection molding cooling device which comprises a first mold body and a second mold body, cavities are formed in the first mold body and the second mold body, fixing blocks are fixedly arranged at the top of the first mold body and the top of the second mold body, cavities are formed in the fixing blocks, and the fixing blocks are fixedly connected with the first mold body and the second mold body. And fans are fixedly arranged on the opposite sides in the two fixing blocks correspondingly, and water storage pipes are fixedly arranged in the first mold body and the second mold body correspondingly. According to the PET bottle preform injection molding cooling device, by arranging a fan, a water storage pipe, a semiconductor cooler and cooling fins, when the device is used, heat in a mold can be dissipated, so that it is ensured that the temperature in the mold is not too high, and the quality problems of burrs, bubbles, focal marks and the like of a product caused by the too high temperature in the mold are avoided; convenience is brought to a user, the practicability of the device is improved, and the use requirement of the user is met.

Description

Technical Field

[0001] This utility model relates to the field of injection molding product technology, specifically to a PET preform injection molding cooling device. Background Technology

[0002] PET preforms are typical injection-molded products, easy to transport, mostly made of plastic, with uniform texture and good insulation. They are an intermediate product between plastic bottles and oil drums. In the production process of PET preforms, some chemical materials need to be melted at high temperature, then poured into a specific mold and cooled to form the preform.

[0003] The prior art document, "A PET Preform Injection Molding Cooling Device," patent number (CN222645273U), describes a cooling system where a semiconductor cooler is activated first, and a cooling-conducting copper block conducts the cooling effect of the semiconductor cooler. When the coolant flows into the first water pipe, it is cooled by the copper block, and then flows into the second water pipe, thus cooling the molding column and completing the injection molding cooling of the preform. This effectively improves the stability and practicality of preform injection molding cooling, avoids the susceptibility of preform injection molding cooling to environmental influences, and facilitates production operations for workers.

[0004] However, the cooling device cannot dissipate heat from the mold during use, resulting in high temperatures inside the mold. This leads to quality problems such as burrs, bubbles, and scorch marks on the product, causing inconvenience to users and failing to meet their needs. Utility Model Content

[0005] The purpose of this utility model is to provide a PET preform injection molding cooling device to solve the problem that the cooling device mentioned in the background art cannot dissipate heat from the mold during use, resulting in a high temperature inside the mold, which leads to quality problems such as burrs, bubbles and scorch marks on the product, causing inconvenience to users and failing to meet user needs.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a PET preform injection molding cooling device, comprising a first mold body and a second mold body, both the first mold body and the second mold body having cavities inside, a fixing block fixedly installed on the top of both the first mold body and the second mold body, the fixing block having cavities inside, a fan fixedly installed on opposite sides of both fixing blocks, a water storage pipe fixedly installed inside both the first mold body and the second mold body, a semiconductor cooler fixedly installed on opposite sides of both fixing blocks, two guide rods fixedly installed at the output ends of both semiconductor coolers on opposite sides, a pipe array fixedly installed on opposite sides of both the first mold body and the second mold body, and heat dissipation fins fixedly installed on the front and rear surfaces of the pipe array.

[0007] Furthermore, each of the first mold body and the second mold body has a molding cavity on its opposite side, and the molding cavity is integrated with the first mold body and the second mold body.

[0008] Furthermore, the air outlets on opposite sides of the two fans are connected to air outlet pipes, and the opposite sides of the two air outlet pipes pass through the fixed block, the first mold and the second mold and extend into the interior of the first mold and the second mold.

[0009] Furthermore, the bottom of the guide rod passes through the fixing block, the first mold body, and the second mold body in sequence and extends into the interior of the first mold body and the second mold body.

[0010] Furthermore, both ends of the water storage pipe are fixedly connected to the guide rod.

[0011] Furthermore, the two pipes on opposite sides penetrate the first mold and the second mold and extend into the interior of the first mold and the second mold, and the pipes are connected to the inner cavities of the first mold and the second mold.

[0012] Furthermore, the opposite sides of the two heat dissipation fins both penetrate through the first mold and the second mold and extend to the outside of the first mold and the second mold.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This PET preform injection molding cooling device, equipped with a fan, water pipe, semiconductor cooler, and heat dissipation fins, dissipates heat from the mold during use, ensuring that the mold temperature does not become too high. This prevents quality problems such as burrs, bubbles, and scorch marks caused by excessive mold temperature, providing convenience to users, improving the device's practicality, and meeting user needs. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0017] Figure 3 for Figure 2 A magnified view of part A in the diagram;

[0018] Figure 4 for Figure 2 A magnified view of part B in the diagram.

[0019] In the diagram: 1. First mold body; 2. Second mold body; 3. Fixing block; 4. Fan; 5. Water storage pipe; 6. Semiconductor cooler; 7. Guide rod; 8. Pipeline; 9. Heat dissipation fins; 10. Molding cavity; 11. Air outlet pipe. Detailed Implementation

[0020] The utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The following embodiments are only descriptive and are not limiting of the scope of protection of this utility model.

[0021] Please see Figure 1-4 This utility model provides a technical solution: a PET preform injection molding cooling device, including a first mold body 1 and a second mold body 2. The first mold body 1 and the second mold body 2 cooperate with each other to perform injection molding. Both the first mold body 1 and the second mold body 2 have cavities inside. A fixing block 3 is fixedly installed on the top of both the first mold body 1 and the second mold body 2. The fixing block 3 is used to install corresponding components. The fixing block 3 also has cavities inside. A fan 4 is fixedly installed on opposite sides of each of the two fixing blocks 3. The fan 4 can generate airflow. Both the first mold 1 and the second mold 2 are fixedly equipped with water storage pipes 5 for storing water. Both fixed blocks 3 are fixedly equipped with semiconductor coolers 6 on opposite sides for cooling. Both semiconductor coolers 6 are fixedly equipped with two guide rods 7 at their output ends on opposite sides for transmitting cooling. Both mold 1 and the second mold 2 are fixedly equipped with exhaust pipes 8 for ventilation. Both the front and rear surfaces of exhaust pipes 8 are fixedly equipped with heat dissipation fins 9 for heat dissipation.

[0022] Furthermore, each of the first mold body 1 and the second mold body 2 has a molding cavity 10 on its opposite side. The molding cavity 10 is integrated with the first mold body 1 and the second mold body 2. The molding cavity 10 is used for injection molding.

[0023] Furthermore, the air outlets on opposite sides of the two fans 4 are connected to air outlet pipes 11. The opposite sides of the two air outlet pipes 11 pass through the fixing block 3, the first mold 1 and the second mold 2 and extend into the interior of the first mold 1 and the second mold 2. The air outlet pipes 11 serve to discharge air.

[0024] Furthermore, the bottom of the guide rod 7 passes through the fixing block 3, the first mold 1 and the second mold 2 in sequence and extends into the interior of the first mold 1 and the second mold 2, wherein the guide rod 7 is capable of transmitting cold energy.

[0025] Furthermore, both ends of the water storage pipe 5 are fixedly connected to the guide rod 7, and the water storage pipe 5 is capable of storing water.

[0026] Furthermore, the two exhaust pipes 8 each penetrate the first mold 1 and the second mold 2 on opposite sides and extend into the interior of the first mold 1 and the second mold 2. The exhaust pipes 8 are connected to the inner cavities of the first mold 1 and the second mold 2, and the exhaust pipes 8 are capable of exhausting air.

[0027] Furthermore, the two heat dissipation fins 9, on opposite sides, penetrate through the first mold body 1 and the second mold body 2 and extend to the outside of the first mold body 1 and the second mold body 2, wherein the heat dissipation fins 9 are capable of dissipating heat.

[0028] Working principle: When using this device, the user first starts the semiconductor cooler 6 to cool the water, which is then transferred to the water storage pipe 5 through the guide rod 7, causing the water in the water storage pipe 5 to freeze. After freezing, the water is kept at a constant temperature. When the mold has heat, the heat mixes with the water storage pipe 5, causing the water storage pipe 5 to melt. This process absorbs heat and cools the mold. Then, the user starts the fan 4 to generate airflow, which is delivered to the interior of the first mold body 1 and the second mold body 2 through the air outlet pipe 11. The airflow carries away the heat again, and the heat dissipation fins 9 conduct the heat outward, thus cooling the mold again.

[0029] Based on the above work process, we can conclude that:

[0030] This PET preform injection molding cooling device, by incorporating a fan 4, a water storage pipe 5, a semiconductor cooler 6, and heat dissipation fins 9, can dissipate heat from the mold during use, thereby ensuring that the temperature inside the mold does not become too high. This prevents quality problems such as burrs, bubbles, and scorch marks from the product caused by excessively high mold temperatures, bringing convenience to users, improving the practicality of the device, and meeting the user's needs.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PET preform injection cooling device comprising a first mold body (1) and a second mold body (2), characterized in that: The first mold (1) and the second mold (2) are both provided with cavities. The top of the first mold (1) and the second mold (2) are both fixedly provided with fixing blocks (3). The fixing blocks (3) are provided with cavities. Fans (4) are fixedly provided on opposite sides of the two fixing blocks (3). Water pipes (5) are fixedly provided inside the first mold (1) and the second mold (2). Semiconductor coolers (6) are fixedly provided on opposite sides of the two fixing blocks (3). Two guide rods (7) are fixedly provided on the output ends of the opposite sides of the two semiconductor coolers (6). Pipes (8) are fixedly provided on opposite sides of the first mold (1) and the second mold (2). Heat dissipation fins (9) are fixedly provided on the front and rear surfaces of the pipes (8).

2. The PET preform injection cooling device according to claim 1, characterized in that: The first mold (1) and the second mold (2) each have a molding cavity (10) on their opposite sides. The molding cavity (10) is integrated with the first mold (1) and the second mold (2).

3. The PET preform injection cooling device according to claim 1, characterized in that: The air outlets on opposite sides of the two fans (4) are connected to air outlet pipes (11). The opposite sides of the two air outlet pipes (11) pass through the fixed block (3), the first mold (1) and the second mold (2) and extend into the interior of the first mold (1) and the second mold (2).

4. The PET preform injection cooling device of claim 1, wherein: The bottom of the guide rod (7) passes through the fixing block (3), the first mold (1) and the second mold (2) in sequence and extends into the interior of the first mold (1) and the second mold (2).

5. The PET preform injection cooling device of claim 1, wherein: Both ends of the water storage pipe (5) are fixedly connected to the guide rod (7).

6. The PET preform injection cooling device of claim 1, wherein: The two pipes (8) pass through the first mold (1) and the second mold (2) on opposite sides and extend into the interior of the first mold (1) and the second mold (2). The pipes (8) are connected to the inner cavities of the first mold (1) and the second mold (2).

7. The PET preform injection cooling device of claim 1, wherein: The two heat dissipation fins (9) on opposite sides both penetrate the first mold (1) and the second mold (2) and extend to the outside of the first mold (1) and the second mold (2).

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