Chemical vapor deposition device

Abstract

The utility model provides a chemical vapor deposition device which is characterized in that a cavity cover is provided with a connector comprising a base plate and a lug boss, the base plate is fixed on the cavity cover, the lug boss is arranged on the surface of the base plate, the top of the lug boss is an outer arc-shaped surface, and an electric energy input interface is provided for a cavity; a radio frequency power supply and a linking piece coupled with the radio frequency power supply are arranged, and the radio frequency power supply provides electric energy for a cavity through a circuit path formed by communicating the linking piece with a connector; the connecting piece is cylindrical, the top of the connecting piece is provided with the downwards-concave connecting port, the bottom of the connecting port is the inner arc-shaped surface, and the connecting port can be attached to the protruding part to form a circuit access, so that the connector and the connecting piece are tightly connected. Therefore, vibration can be reduced, the contact area is increased, the phenomenon of sparking at the joint is reduced, and the problem of poor contact is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and in particular to a chemical vapor deposition apparatus. Background Technology

[0002] In the Sub-Atmospheric Chemical Vapor Deposition (SACVD) process, the Plasma Enhanced Tetraethyl Orthosilicate (PE-TEOS) process introduces tetraethyl orthosilicate (TEOS) and oxygen into the chamber, allowing them to react. The radio frequency (RF) power supply is a key component driving this equipment, responsible for providing stable and reliable high-frequency AC power. The RF power supply is connected to the chamber through a matching adapter, connector, and chamber, transmitting power to the chamber for the process.

[0003] The connectors in the cavity of the existing machine tool have defects, which can easily cause sparks at the connection point, leading to RF instability during the process and, in severe cases, RF power supply failure.

[0004] How to provide a chemical vapor deposition device that allows for a tight connection between the cavity and the radio frequency power supply, thereby reducing the problem of poor contact. Summary of the Invention

[0005] The technical problem to be solved by this utility model is to provide a chemical vapor deposition apparatus that enables the cavity and the radio frequency power supply to be tightly linked, thereby enabling the cavity of the deposition reaction to obtain stable radio frequency power.

[0006] To address the aforementioned problems, this utility model provides a chemical vapor deposition apparatus, comprising: a cavity for deposition reactions; an RF power supply for providing electrical energy to the cavity; a cavity cover for sealing the cavity; a connector including a base and a protrusion, the base being fixed to the cavity cover, the protrusion being provided on the surface of the base, the top of the protrusion being an outer arc-shaped surface; a connecting member having a recessed connection port at the top, the bottom of the connection port being an inner arc-shaped surface, the connection port being able to fit against the protrusion to form a circuit path; and an RF power supply coupled to the connecting member, the RF power supply being used to provide electrical energy to the cavity through the circuit path.

[0007] In some embodiments, the connector is made of metal.

[0008] In some embodiments, the protrusion is cylindrical in shape.

[0009] In some embodiments, the protrusion and the chassis are integrally formed.

[0010] In some embodiments, the inner wall of the link port includes a metal overlay.

[0011] In some embodiments, the top surface of the protrusion and the bottom surface of the connection port are both hemispherical.

[0012] In some embodiments, the bottom of the connector is fixed to a matching unit, and the connector is connected to the radio frequency power supply through the matching unit, which includes at least one of an inductor, a capacitor, and a transformer.

[0013] In some embodiments, the connector is cylindrical in shape, and the material on the outside of the connector is an insulating material.

[0014] In some embodiments, the chemical vapor deposition apparatus further includes a plug assembly fitted onto the cavity cover, and a connector fitted onto the plug assembly.

[0015] The above technical solution, by providing a connector including a chassis and a protrusion on the cavity cover, with the chassis fixed to the cavity cover and the protrusion having an outer arc-shaped top to provide a power input interface for the cavity; by providing an RF power supply and a connector coupled thereto, the RF power supply provides power to the cavity through a circuit path formed by the connector and the connector; by designing the connector to be cylindrical, with a recessed connection opening at the top and an inner arc-shaped bottom, the connection opening can fit snugly against the protrusion to form a circuit path, thereby ensuring a tight connection between the connector and the connector, reducing vibration and increasing the contact area, reducing sparking at the connection point, and effectively improving the problem of poor contact.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the present invention. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1This is a schematic diagram of the structure of a chemical vapor deposition apparatus provided in an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the connector structure provided in one embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of a connector provided in an embodiment of the present invention.

[0021] Explanation of reference numerals in the attached figures

[0022] 10 bases

[0023] 11 Cavities

[0024] 12. Cavity cover

[0025] 13 Connectors

[0026] 131 Protrusion

[0027] 132 chassis

[0028] 14 Connectors

[0029] 141 Link Port

[0030] 15 RF Power Supply

[0031] 16. Plug assembly

[0032] 17 Matcher

[0033] 18. Heater Lift Detailed Implementation

[0034] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0035] Please refer to this as well. Figures 1-3 ,in, Figure 1 This is a schematic diagram of the structure of a chemical vapor deposition apparatus provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the connector structure provided in one embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a connector provided in an embodiment of the present invention.

[0036] like Figure 1 As shown, the chemical vapor deposition apparatus includes: a cavity 11, a cavity cover 12, a connector 13, a link 14, and an RF power supply 15.

[0037] The cavity 11 is used for the deposition reaction and has a channel for introducing the gas required for the deposition reaction. In this embodiment, tetraethyl orthosilicate and oxygen are introduced into the cavity 11, thereby causing a chemical vapor deposition reaction on the wafer surface within the cavity 11 to form a thin film on the wafer surface. Figure 1 As shown, the cavity 11 is mounted on the base 10 via a heater lift 18.

[0038] The cavity cover 12 is used to seal the cavity 11, thereby preventing external contaminants from entering the cavity 11.

[0039] refer to Figure 2 The connector 13 includes a base 132 and a protrusion 131. The base 132 is fixed to the cavity cover 12, and the protrusion 131 is provided on the surface of the base 132. The top of the protrusion 131 is an outwardly arc-shaped surface. Specifically, the top surface of the protrusion 131 is a hemispherical surface, and the base 132 is circular. In some embodiments, the base 132 is square, adapted to the cavity 11.

[0040] The protrusion 131 is cylindrical in shape, for example, the protrusion 131 is cylindrical, or for example, the protrusion 131 is prismatic.

[0041] Also refer to Figure 1 and Figure 2 The chemical vapor deposition apparatus further includes a plug assembly 16, which is mounted on the cavity cover 12. A chassis 132 is fixed to the plug assembly 16 so that the connector 13 is mounted on the plug assembly 16, thereby fixing the chassis 132 to the cavity 11. The protrusion 131 and the chassis 132 are integrally formed.

[0042] The connector 13 is made of metal. In this embodiment, the protrusion 131 and the chassis 132 are integrally formed metal structures.

[0043] In some embodiments, the chassis 132 and the protrusion 131 are detachable. The protrusion 131 may include different shapes; for example, the protrusion 131 may include cylindrical shapes with different cross-sectional shapes, or the protrusions 131 may have the same shape but different heights. Accordingly, the protrusion 131 connected to the chassis 132 is replaceable, and protrusions 131 of different shapes can be used to adapt to different interface usage scenarios. Furthermore, when a protrusion 131 of the same shape wears out, the worn protrusion 131 can be replaced.

[0044] Also refer to Figure 3 The connector 14 has a recessed connection opening 141 at its top, and the bottom of the connection opening 141 is an inner arc-shaped surface. The connection opening 141 can fit against the protrusion 131 to form a circuit path. Specifically, the connection opening 141 is cylindrical in shape, and its shape matches that of the protrusion 131. For example, when the protrusion 131 is cylindrical, the connection opening 141 is also cylindrical in shape, and its dimensions are the same as those of the protrusion 131. Furthermore, the connection opening 141 is connected to the internal connection circuit of the connector 14.

[0045] The bottom surface of the connection port 141 is hemispherical. When the protrusion 131 of the connector 13 is inserted into the connection port 141, the sidewall of the connection port 141 is tightly fitted to the protrusion 131 and the top of the protrusion 131 is tightly fitted to the bottom of the connection port 141, thereby reducing the gap between the connector 13 and the matching device 17 and preventing sparks from being generated between them due to the gap.

[0046] In this embodiment, the connector 14 is cylindrical in shape, and the connector 14 includes a connection circuit inside.

[0047] The material on the outside of the connector 14 is an insulating material that can protect the connection circuit inside the connector 14. For example, the material on the outside of the connector 14 is plastic.

[0048] The radio frequency power supply 15 is used to provide electrical energy to the cavity 11. In this embodiment, the radio frequency power supply 15 provides high-frequency AC power. In some embodiments, the radio frequency power supply 15 is also connected to a low-frequency power supply via a radio frequency coaxial cable.

[0049] refer to Figure 1 The connector 14 is disposed between the radio frequency power supply 15 and the cavity 11, and the radio frequency power supply 15 provides power to the cavity 11 through the circuit path formed by the connector 14 and the connector 13.

[0050] The bottom of the connector 14 is fixed to a matching device 17, and the connector 14 is connected to the RF power supply 15 through the matching device 17. The matching device 17 is used to match the impedance between the RF power supply 15 and the load to ensure that the RF power supply 15 transmits electrical energy to the cavity 11. The load includes the load of the circuit path formed by the cavity 11, the connector 13, and the matching device 17. In this embodiment, the matching device 17 includes at least one of an inductor, a capacitor, and a transformer. The connection circuit inside the connector 14 is connected to the matching device 17.

[0051] In this embodiment, the matching unit 17 includes an inductor, a capacitor, and a transformer. The inductor is a coil-type inductor used to provide the required inductance value; the capacitor is a fixed capacitor or a variable capacitor used to provide the required capacitance value; and the transformer is used to change the impedance conversion ratio between the power supply and the load. The internal connection circuitry of the connector 14 is connected to the inductor, capacitor, and transformer.

[0052] The depth D of the connection port 141 is less than or equal to the length of the protrusion 131. For example, by increasing the depth D of the connection port 141 by 5 mm, when the protrusion 131 is inserted into the connection port 141, the contact area at the connection point can be increased, thereby better securing the connector 13 and the mating device 17 and reducing vibration when the connector 13 and the mating device 17 are connected, effectively improving the problem of poor contact between the connector 13 and the mating device 17.

[0053] In some embodiments, the depth D of the connection port 141 is equal to the length of the protrusion 131, so that the protrusion 131 is completely embedded in the connection port 141, which can better ensure that the connection port 141 and the protrusion 131 fit tightly together.

[0054] Accordingly, the connection port 141 includes a metal cover layer. When the protrusion 131 of the connector 13 is inserted into the connection port 141 of the matching device 17, the connector 13 communicates with the connection circuit inside the connector 14, thereby forming a circuit path between the connector 13 and the circuit inside the matching device 17. The radio frequency power supply 15 supplies power to the cavity 11 through the circuit path formed by the matching device 17 and the connector 13.

[0055] The above technical solution, by providing a connector including a chassis and a protrusion on the cavity cover, with the chassis fixed to the cavity cover and the protrusion having an outer arc-shaped top to provide a power input interface for the cavity; by providing an RF power supply and a connector coupled thereto, the RF power supply provides power to the cavity through a circuit path formed by the connector and the connector; by designing the connector to be cylindrical, with a recessed connection opening at the top and an inner arc-shaped bottom, the connection opening can fit snugly against the protrusion to form a circuit path, thereby ensuring a tight connection between the connector and the connector, reducing vibration and increasing the contact area, reducing sparking at the connection point, and effectively improving the problem of poor contact.

[0056] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion. The various embodiments in this specification are described in a related manner, and similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments.

[0057] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A chemical vapor deposition apparatus characterized by comprising: include: A cavity, the cavity being used for the deposition reaction; A cavity cover for sealing the cavity; A connector, comprising a base and a protrusion, the base being fixed to the cavity cover, the protrusion being provided on the surface of the base, the top of the protrusion being an outer arc-shaped surface; The connector has a recessed connection port at the top and an inner arc-shaped surface at the bottom. The connection port can fit with the protrusion to form a circuit path. A radio frequency (RF) power supply, coupled to the connector, is used to provide power to the cavity through the circuit path.

2. The chemical vapor deposition apparatus according to claim 1, wherein The connector is made of metal.

3. The chemical vapor deposition apparatus according to claim 1, wherein The protrusion is cylindrical in shape.

4. The chemical vapor deposition apparatus according to claim 1, wherein The protrusion and the chassis are integrally formed.

5. The chemical vapor deposition apparatus according to claim 1, wherein The inner wall of the connection port includes a metal covering layer.

6. The chemical vapor deposition apparatus according to claim 1, wherein The top surface of the protrusion and the bottom surface of the connection port are both hemispherical.

7. The chemical vapor deposition apparatus according to claim 1, wherein The bottom of the connector is fixed to a matching unit, and the connector is connected to the radio frequency power supply through the matching unit. The matching unit includes at least one of an inductor, a capacitor, and a transformer.

8. The chemical vapor deposition apparatus according to claim 1, wherein The connector is cylindrical in shape, and the outer material of the connector is an insulating material.

9. The chemical vapor deposition apparatus according to claim 1, characterized in that, The chemical vapor deposition apparatus further includes a plug assembly, which is mounted on the cavity cover, and a connector is mounted on the plug assembly.

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