Spiral spring for automobile shock absorber

Abstract

The utility model discloses a spiral spring for an automobile shock absorber, which structurally comprises a spring main body and heat conduction devices, the heat conduction devices are arranged at the upper end and the lower end of the spring main body, each heat conduction device comprises an N-type semiconductor, a P-type semiconductor, anti-slip rings and a small fan, the N-type semiconductor is fixedly connected to the spring main body through the two anti-slip rings, and the P-type semiconductor is fixedly connected to the spring main body through the small fan. The P-type semiconductor is connected to the end face of the N-type semiconductor, and the small fan is installed on the end face of the P-type semiconductor. The two heat conduction devices are installed on the end face of the spring body, electrons enter the high-energy-level P-type semiconductor from the low-energy-level N-type semiconductor to absorb energy by conducting the N-type semiconductor, and therefore heat is absorbed in the surrounding environment, the temperature of the N-type semiconductor is lowered, and the service life of the N-type semiconductor is prolonged. And the N-type semiconductor is attached to the end face of the spring body to absorb heat, so that the heat dissipation effect is achieved, fatigue stress generated by heating of the spring body is reduced, and the strain speed of the spring body is prevented.

Description

Technical Field

[0001] This utility model relates to the field of automotive shock absorption technology, and in particular to a helical spring for automotive shock absorbers. Background Technology

[0002] Automotive shock absorbers reduce vibrations and impacts from uneven road surfaces, improving ride comfort. They also suppress spring rebound oscillations, maintaining vehicle stability during driving. They reduce body roll and pitch during cornering, braking, and acceleration, improving handling. Furthermore, they reduce wear and fatigue on the frame, body, and other components caused by vibration, extending vehicle lifespan. However, existing automotive shock absorbers using coil springs are prone to overheating and fatigue stress during prolonged operation due to repeated compression, accelerating wear and tear. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model is achieved through the following technical solution:

[0004] A helical spring for automotive shock absorbers comprises a spring body and a heat-conducting device. The spring body has heat-conducting devices at both its upper and lower ends. Each heat-conducting device includes an N-type semiconductor, a P-type semiconductor, anti-slip rings, and a small fan. The N-type semiconductor is fixedly connected to the spring body via two anti-slip rings. The P-type semiconductor is connected to the end face of the N-type semiconductor, and the small fan is installed on the end face of the P-type semiconductor. By conducting electricity to the N-type semiconductor, electrons can move from the lower energy level of the N-type semiconductor to the higher energy level of the P-type semiconductor. This requires energy absorption, resulting in heat absorption from the surrounding environment and a decrease in the temperature of the N-type semiconductor. Thus, a heat dissipation effect is achieved at this junction, forming a cold end and cooling the spring body.

[0005] As a further optimization of this technical solution, a power line is connected to the side of the small fan. The power line can conduct electricity to the N-type semiconductor. Current flows from the P-type semiconductor to the N-type semiconductor. The movement direction of electrons and holes is opposite to that described above. At this time, electrons and holes move from the high energy level to the low energy level, releasing energy and causing the temperature at the joint to rise, forming a hot end. Therefore, a small fan is needed for heat dissipation.

[0006] As a further optimization of this technical solution, the anti-slip ring includes an embedding groove and a friction groove. The embedding groove is disposed on the outer end face of the anti-slip ring, and four friction grooves are provided, while the friction grooves are arranged on the inner end face of the anti-slip ring.

[0007] As a further optimization of this technical solution, the anti-slip ring is made of rubber.

[0008] As a further optimization of this technical solution, the upper and lower ends of the spring body are fixedly connected to the lower support via the upper support seat.

[0009] As a further optimization of this technical solution, the upper support seat is fixedly connected to the upper piston, the lower support seat is fixedly connected to the lower piston, and the bottom of the lower piston is bolted to the base. Beneficial effects

[0010] This utility model provides a helical spring for automotive shock absorbers, which has the following advantages compared to existing technologies:

[0011] This invention installs two heat-conducting devices on the end face of the spring body. By conducting electricity to the N-type semiconductor, electrons need to absorb energy to move from the low-energy N-type semiconductor to the high-energy P-type semiconductor, thereby absorbing heat from the surrounding environment and lowering the temperature of the N-type semiconductor. The heat is then absorbed by the end face of the N-type semiconductor attached to the spring body, achieving a heat dissipation effect. This reduces the fatigue stress caused by the heating of the spring body and prevents the spring body from wearing out quickly. Attached Figure Description

[0012] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0013] Figure 1 This is a front view schematic diagram of a helical spring for an automotive shock absorber according to the present invention.

[0014] Figure 2 This is a front view cross-sectional structural diagram of the spring body of a helical spring for an automotive shock absorber according to this utility model.

[0015] Figure 3 This is a top view cross-sectional structural diagram of a heat conduction device for a helical spring used in an automotive shock absorber according to this utility model.

[0016] Figure 4 This is a schematic diagram of the anti-slip ring structure of a helical spring for an automotive shock absorber according to the present invention.

[0017] In the figure: spring body 1, upper piston 2, lower piston 3, base 4, upper support seat 11, lower support seat 12, heat conduction device 13, N-type semiconductor 131, P-type semiconductor 132, anti-slip ring 133, small fan 134, power cord 135, embedded groove 1331, friction groove 1332. Detailed Implementation

[0018] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the preferred embodiments of this utility model are further described below in conjunction with specific implementation methods and accompanying drawings. Example

[0019] Please see Figures 1-4 This utility model provides a helical spring for automotive shock absorbers, the structure of which includes a spring body 1 and a heat-conducting device 13. The spring body 1 has a heat-conducting device 13 at each of its upper and lower ends. The heat-conducting device 13 includes an N-type semiconductor 131, a P-type semiconductor 132, anti-slip rings 133, and a small fan 134. The N-type semiconductor 131 is fixedly connected to the spring body 1 by two anti-slip rings 133. The P-type semiconductor 132 is connected to the end face of the N-type semiconductor 131. The small fan 134 is installed on the end face of the P-type semiconductor 132. By conducting electricity to the N-type semiconductor 131, electrons can move from the low-energy N-type semiconductor to the high-energy P-type semiconductor, requiring energy absorption and thus absorbing heat from the surrounding environment, lowering the temperature of the N-type semiconductor 131. Therefore, a heat dissipation effect is achieved at this junction, forming a cold end, which cools the spring body 1.

[0020] The side end of the small fan 134 is connected to a power line 135, which can conduct electricity to the N-type semiconductor 131. Current flows from the P-type semiconductor to the N-type semiconductor. The movement direction of electrons and holes is opposite to that described above. At this time, electrons and holes move from the high energy level to the low energy level, releasing energy and causing the temperature at the junction to rise, forming a hot end. Therefore, the small fan 134 is needed for heat dissipation.

[0021] The anti-slip ring 133 includes an embedding groove 1331 and a friction groove 1332. The embedding groove 1331 is disposed on the outer end face of the anti-slip ring 133, and four friction grooves 1332 are provided. At the same time, the friction grooves 1332 are arranged on the inner end face of the anti-slip ring 133.

[0022] The anti-slip ring 133 is made of rubber.

[0023] The upper and lower ends of the spring body 1 are fixedly connected to the lower support 12 via the upper support 11.

[0024] The upper support seat 11 is fixedly connected to the upper piston 2, the lower support seat 12 is fixedly connected to the lower piston 3, and the bottom of the lower piston 3 is bolted to the base 4.

[0025] Working principle: The heat-conducting device 13 is installed on the end face of the spring body 1. By conducting electricity to the N-type semiconductor 131, electrons need to absorb energy to move from the low-energy N-type semiconductor to the high-energy P-type semiconductor, which requires absorbing heat from the surrounding environment, thus lowering the temperature of the N-type semiconductor 131. The heat is absorbed by the N-type semiconductor 131 adhering to the end face of the spring body 1, achieving a heat dissipation effect. This avoids fatigue stress caused by the spring body 1 working for a long time, thereby reducing damage to the spring body 1. The N-type semiconductor 131 is fixed to the end face of the spring body 1 by a rubber anti-slip ring 133, which does not affect the normal operation of the spring body 1. At the same time, the friction groove 1332 in the anti-slip ring 133 can increase the friction between it and the spring body 1, preventing the heat-conducting device 13 from shifting on the end face of the spring body 1.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Without departing from the spirit or basic characteristics of this utility model, not only can this utility model be implemented in other specific forms, but various changes and modifications can also be made. All such changes and modifications fall within the scope of protection of this utility model. Therefore, the scope of protection of this utility model is defined by the appended claims and their equivalents, rather than by the foregoing description.

[0027] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A helical spring for a motor vehicle shock absorber, the structure of which comprises a spring body (1) and a heat conducting device (13), characterized in that: The upper and lower ends of the spring body (1) are each provided with a heat conduction device (13), and the heat conduction device (13) includes an N-type semiconductor (131), a P-type semiconductor (132), an anti-slip ring (133), and a small fan (134). The N-type semiconductor (131) is fixedly connected to the spring body (1) through two anti-slip rings (133). The P-type semiconductor (132) is connected to the end face of the N-type semiconductor (131). The small fan (134) is installed on the end face of the P-type semiconductor (132).

2. The coil spring for a shock absorber of a vehicle according to claim 1, characterized in that: The small fan (134) is connected to a power line (135) on its side. The power line (135) can conduct electricity to the N-type semiconductor (131). Current flows from the P-type semiconductor to the N-type semiconductor. The movement direction of electrons and holes is opposite to that described above. At this time, electrons and holes move from the high energy level to the low energy level, which releases energy and causes the temperature at the junction to rise, forming a hot end. Therefore, the small fan (134) is needed for heat dissipation.

3. The coil spring for a shock absorber of a vehicle according to claim 1, wherein: The anti-slip ring (133) includes an embedding groove (1331) and a friction groove (1332). The embedding groove (1331) is located on the outer end face of the anti-slip ring (133), and there are four friction grooves (1332). At the same time, the friction grooves (1332) are arranged on the inner end face of the anti-slip ring (133).

4. The coil spring for a shock absorber of a vehicle according to claim 1, wherein: The anti-slip ring (133) is made of rubber.

5. A helical spring for an automotive shock absorber according to claim 1, characterized in that: The upper and lower ends of the spring body (1) are fixedly connected to the lower support seat (12) through the upper support seat (11).

6. The coil spring according to claim 5, wherein: The upper support seat (11) is fixedly connected to the upper piston (2), the lower support seat (12) is fixedly connected to the lower piston (3), and the bottom of the lower piston (3) is bolted to the base (4).

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