Drying device with printed circuit board surface cleaning water adsorption mechanism

Abstract

The drying device with the printed circuit board surface cleaning water adsorption mechanism comprises a drying machine, a motor is arranged on the side edge of an inlet of the drying machine, a water adsorption assembly is arranged on the top of the motor, and the water adsorption assembly comprises a rotating shaft fixedly connected with the driving end of the top of the motor. A water absorption sponge barrel is sleeved on the periphery of the rotating shaft, and the water outlet end of the water pump is connected with a plurality of water spraying devices used for wetting the water absorption sponge barrel through communicating pipes. Compared with the prior art, the water pump can spray water to the water-absorbing sponge barrel through the water spraying device, so that the water-absorbing sponge barrel is always in an unsaturated wet state, the water-absorbing sponge barrel is prevented from being dried due to approaching to the dryer, and the size is reduced; therefore, it is ensured that the water absorption sponge cylinder can make contact with the printed circuit board all the time in the long-time using process, and then the cleaning water on the printed circuit board is adsorbed.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board manufacturing technology, and in particular to a drying device with a surface cleaning water adsorption mechanism for printed circuit boards. Background Technology

[0002] In the PCB manufacturing process, surface moisture pretreatment is required after wet processes such as etching and developing to prevent residual moisture from causing oxidation defects on the board surface in the high-temperature drying section. Currently, the industry generally uses water-absorbing sponge rollers to physically adsorb water onto the board surface, but this process has the following technical bottlenecks.

[0003] Based on material properties, sponges need to be kept moist and unsaturated to achieve optimal water absorption efficiency. However, the high-temperature environment at the front end of the drying section (usually reaching 80-120℃) will accelerate the evaporation of moisture from the sponge, causing it to dry and harden quickly. Furthermore, commercially available polyurethane (PU) sponges are prone to thermal shrinkage and deformation at high temperatures, which accelerates the collapse of the pore structure, causing the sponge to shrink in volume and no longer contact the PCB board, thus failing to absorb moisture from the PCB board. Using high-temperature resistant materials such as EPP faces the economic problem of a 3-5 times increase in cost.

[0004] Therefore, there is an urgent need for a drying device that can keep the absorbent sponge moist without shrinking its volume, in order to ensure its effectiveness in improving the quality of PCB board processing and production efficiency. Utility Model Content

[0005] The main purpose of this utility model is to provide a drying device with a mechanism for adsorbing cleaning water on the surface of a printed circuit board. The water pump can spray water onto the absorbent sponge cylinder through a spraying device, so that the absorbent sponge cylinder is always in an unsaturated wet state, avoiding the absorbent sponge cylinder from drying out and shrinking in volume due to its proximity to the dryer. This ensures that the absorbent sponge cylinder can always contact the printed circuit board during long-term use, thereby adsorbing the cleaning water on the printed circuit board.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A drying device with a water adsorption mechanism for cleaning the surface of a printed circuit board includes a dryer. A motor is provided on the inlet side of the dryer, and a water absorption component is provided on the top of the motor. The water absorption component includes a rotating shaft fixedly connected to the drive end of the top of the motor. A water-absorbing sponge is sleeved around the rotating shaft. The device also includes a water pump. The water outlet of the water pump is connected to several water spraying devices for wetting the water-absorbing sponge through a connecting pipe.

[0008] Furthermore, the water spraying device includes a shaped flexible hose connected to a connecting pipe, and the end of the shaped flexible hose is connected to a nozzle pointing towards the water-absorbing sponge cylinder.

[0009] Furthermore, the shaping hose is equipped with an adjustment valve.

[0010] Furthermore, the connecting pipe is fixedly connected to the dryer housing.

[0011] Furthermore, a base plate is fixed to the bottom periphery of the rotating shaft, a pressure plate is sleeved on the top of the rotating shaft, the water-absorbing sponge tube is located between the pressure plate and the base plate, and a nut is threadedly connected to the top of the rotating shaft.

[0012] Furthermore, the top of the absorbent sponge tube has several through holes, and the bottom of the pressure plate is fixed with a positioning rod that matches the position of the through holes.

[0013] Furthermore, the top of the base plate is provided with a positioning hole that matches the position of the positioning rod.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] The water pump of this invention can spray water onto the absorbent sponge cylinder through a spraying device, thereby keeping the absorbent sponge cylinder in an unsaturated and moist state. This prevents the absorbent sponge cylinder from drying out and shrinking in size due to proximity to the dryer, thus ensuring that the absorbent sponge cylinder can always contact the printed circuit board during long-term use, and thus absorb the cleaning water on the printed circuit board.

[0016] The shape of the flexible tube of this invention can be changed, thereby adjusting the position of the nozzle aligned with the water-absorbing sponge tube, so that the water-absorbing sponge tube is more evenly distributed under the action of the nozzle spraying water.

[0017] The positioning rod of this invention can pass through the through hole of the absorbent sponge tube and finally be inserted into the positioning hole. The base plate is fixedly connected to the rotating shaft. Therefore, when the rotating shaft rotates, it will definitely be able to drive the absorbent sponge tube to rotate through the base plate and the positioning rod. Attached Figure Description

[0018] Figure 1 This is an overall schematic diagram of a drying device with a water adsorption mechanism for cleaning the surface of a printed circuit board, according to the present invention.

[0019] Figure 2 This is a schematic diagram of the water spray device structure of a drying device with a water adsorption mechanism for cleaning the surface of a printed circuit board, according to the present invention.

[0020] Figure 3 This is a schematic diagram of the water absorption component of a drying device with a water adsorption mechanism for cleaning the surface of a printed circuit board, according to the present invention.

[0021] Figure 4This is a schematic diagram of the connection structure of the positioning rod, pressure plate, and base plate of a drying device with a water adsorption mechanism for cleaning the surface of a printed circuit board, according to the present invention.

[0022] In the diagram: 1. Dryer; 2. Water spraying device; 201. Shaping hose; 202. Regulating valve; 203. Spray head; 3. Motor; 4. Water pump; 5. Water absorption assembly; 501. Water absorption sponge tube; 502. Base plate; 5021. Positioning hole; 503. Through hole; 504. Positioning rod; 505. Pressure plate; 506. Rotating shaft; 507. Nut; 6. Connecting pipe. Detailed Implementation

[0023] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0024] like Figure 1-4 As shown, a drying device with a water adsorption mechanism for cleaning the surface of a printed circuit board includes a dryer 1. A motor 3 is provided on the inlet side of the dryer 1, and a water absorption component 5 is provided on the top of the motor 3. The water absorption component 5 includes a rotating shaft 506 fixedly connected to the top drive end of the motor 3. A water-absorbing sponge tube 501 is sleeved around the rotating shaft 506. The device also includes a water pump 4. The water outlet end of the water pump 4 is connected to several water spraying devices 2 for wetting the water-absorbing sponge tube 501 through a connecting pipe 6. The connecting pipe 6 is fixedly connected to the housing of the dryer 1.

[0025] In this embodiment, such as Figure 1 As shown, the water pump 4 is connected to the water supply pipe in the workshop. When the printed circuit board enters the dryer 1, the motor 3 drives the rotating shaft 506 to rotate, thereby causing the water-absorbing sponge cylinder 501 to rotate. The water-absorbing sponge cylinder 501 comes into contact with the moving printed circuit board. Therefore, the water-absorbing sponge cylinder 501 can absorb water on the printed circuit board. During this process, the personnel can control the water pump 4 to spray water onto the water-absorbing sponge cylinder 501 through the water spraying device 2, so that the water-absorbing sponge cylinder 501 is always kept moist, preventing the water-absorbing sponge cylinder 501 from being dried and shrinking in volume due to its proximity to the dryer.

[0026] Among them, such as Figure 2As shown, the water spraying device 2 includes a shaped hose 201 connected to the connecting pipe 6. The end of the shaped hose 201 is connected to a nozzle 203 pointing towards the water-absorbing sponge cylinder 501. A regulating valve 202 is provided on the shaped hose 201. The shape of the shaped hose 201 itself can be changed, thereby adjusting the position of the nozzle 203 aligned with the water-absorbing sponge cylinder 501. This allows the water in the water-absorbing sponge cylinder 501 to be distributed more evenly under the action of the nozzle 203. Furthermore, the regulating valve 202 can adjust the size of the water flow from the nozzle 203, thereby keeping the moisture content of the water-absorbing sponge cylinder 501 within the range of 30% to 70%, to ensure the absorption rate of liquid on the printed circuit board by the water-absorbing sponge cylinder 501.

[0027] Among them, such as Figure 3 As shown, a base plate 502 is fixed to the bottom of the outer periphery of the rotating shaft 506, and a pressure plate 505 is sleeved on the top of the rotating shaft 506. The water-absorbing sponge tube 501 is located between the pressure plate 505 and the base plate 502. A nut 507 is threadedly connected to the top of the rotating shaft 506. After the nut 507 is screwed onto the rotating shaft 506, it can press down the pressure plate 505, thereby causing the pressure plate 505 and the base plate 502 to apply a clamping force to the water-absorbing sponge tube 501, ensuring that the water-absorbing sponge tube 501 can rotate with the rotating shaft 506, so that the water-absorbing sponge tube 501 contacts the printed circuit board at different positions to absorb cleaning water.

[0028] like Figure 3 and Figure 4 As shown, the top of the absorbent sponge tube 501 has several through holes 503. The bottom of the pressure plate 505 is fixed with a positioning rod 504 that matches the position of the through holes 503. The diameter of the pressure plate 505 is smaller than the diameter of the absorbent sponge tube 501. The inner hole of the pressure plate 505 is in close contact with the rotating shaft 506 without affecting disassembly, ensuring that the pressure plate 505 rotates with the rotating shaft 506. Therefore, when the positioning rod 504 is inserted into the through hole 503 and the pressure plate 505 is placed on top of the absorbent sponge tube 501, it can be moved forward to ensure that the absorbent sponge tube 501 rotates with the rotating shaft 506.

[0029] Among them, such as Figure 4 As shown, the top of the base plate 502 is provided with a positioning hole 5021 that matches the position of the positioning rod 504. The positioning rod 504 can be inserted into the positioning hole 5021. The base plate 502 is fixedly connected to the rotating shaft 506. Therefore, when the rotating shaft 506 rotates, it will definitely be able to drive the water-absorbing sponge cylinder 501 to rotate through the base plate 502 and the positioning rod 504.

[0030] Working principle: The dryer 1, motor 3, and water pump 4 are connected to the mains power. The motor 3 drives the rotating shaft 506 to rotate, which in turn drives the water-absorbing sponge cylinder 501 to rotate. The water-absorbing sponge cylinder 501 comes into contact with the moving printed circuit board, so the water-absorbing sponge cylinder 501 can absorb water on the printed circuit board. During this process, the operator can control the water pump 4 to spray water onto the water-absorbing sponge cylinder 501 through the water spray device 2, so that the water-absorbing sponge cylinder 501 is always in an unsaturated wet state, preventing the water-absorbing sponge cylinder 501 from being dried out due to its proximity to the dryer and shrinking in volume. Finally, the dryer 1 dries the printed circuit board after the water-absorbing sponge cylinder 501 has absorbed water.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A drying apparatus having a printed circuit board surface cleaning water absorption mechanism, comprising a dryer (1), characterized in that: The dryer (1) has a motor (3) installed on the inlet side, and a water absorption assembly (5) installed on the top of the motor (3). The water absorption assembly (5) includes a rotating shaft (506) fixedly connected to the top drive end of the motor (3). A water-absorbing sponge tube (501) is sleeved around the rotating shaft (506). It also includes a water pump (4). The water outlet of the water pump (4) is connected to several water spraying devices (2) for wetting the water-absorbing sponge tube (501) through a connecting pipe (6).

2. The drying apparatus having a printed circuit board surface cleaning water absorption mechanism according to claim 1, characterized by: The water spraying device (2) includes a fixed hose (201) connected to the connecting pipe (6), and the end of the fixed hose (201) is connected to a nozzle (203) pointing to the water-absorbing sponge cylinder (501).

3. The drying apparatus having a printed circuit board surface cleaning water absorbing mechanism according to claim 2, characterized by: The shaping hose (201) is equipped with a regulating valve (202).

4. The drying apparatus having a printed circuit board surface cleaning water absorbing mechanism according to claim 1, characterized by: The connecting pipe (6) is fixedly connected to the shell of the dryer (1).

5. The drying apparatus having a printed circuit board surface cleaning water absorbing mechanism according to claim 1, characterized by: A base plate (502) is fixed to the bottom of the outer periphery of the rotating shaft (506), and a pressure plate (505) is sleeved on the top of the rotating shaft (506). The water-absorbing sponge tube (501) is located between the pressure plate (505) and the base plate (502). A nut (507) is threadedly connected to the top of the rotating shaft (506).

6. A drying apparatus with a printed circuit board surface cleaning water adsorption mechanism according to claim 5, characterized in that: The top of the absorbent sponge tube (501) has several through holes (503), and the bottom of the pressure plate (505) is fixed with a positioning rod (504) that matches the position of the through holes (503).

7. The drying apparatus having a printed circuit board surface cleaning water absorbing mechanism according to claim 6, characterized by: The top of the base plate (502) is provided with a positioning hole (5021) that matches the position of the positioning rod (504).

Images