Touch detection module and electronic equipment
By using a stacked structure design for the touch detection module, the problems of limited functionality and large space occupation in existing technologies are solved. This allows the module to replace physical buttons in electronic devices, increasing the detection area and sensing range, and improving the user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GOODIX TECH CO LTD
- Filing Date
- 2025-04-17
- Publication Date
- 2026-04-17
AI Technical Summary
Existing touch detection modules have limited functionality, too short and small effective detection area, and take up too much space.
The system employs a stacked structure design consisting of multiple touch detection units, a first circuit board, a touch chip, and a substrate. Signal transmission is achieved through soldering and electrical connection lines, and an encapsulation layer is used for protection, thereby increasing the effective detection area and sensing range.
It enables the replacement of physical buttons in electronic devices, saving space, supporting a variety of custom functions, improving user experience, and increasing the setting area and sensing range of the touch detection unit.
Smart Images
Figure CN224137707U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of touch detection technology, and more particularly to a touch detection module and an electronic device. Background Technology
[0002] Touch technology is a human-computer interaction method. Users interact with electronic devices by touching or gesturing on the touch area of the device. With the development of smart devices, touch technology has become the mainstream operating method for mobile phones and other electronic devices. Mobile phones and other electronic devices receive touch commands input by users on the touch area and recognize the corresponding touch operations based on the touch commands.
[0003] Currently, touch detection technology is integrated into various devices such as mobile phones and other terminal devices, in-vehicle touch buttons, and earphones and other sensing devices.
[0004] However, existing touch detection modules have drawbacks such as limited functionality, short effective detection area, small range, and excessive space occupation. Utility Model Content
[0005] In view of this, embodiments of this application provide a touch detection module and an electronic device to at least partially solve the above-mentioned problems.
[0006] According to a first aspect of the present application, a touch detection module is provided for use in an electronic device. The touch detection module includes: a plurality of touch detection units, a first circuit board, a touch chip, and a substrate. The plurality of touch detection units are disposed on a first surface of the first circuit board, and a second surface of the first circuit board is electrically connected to the first surface of the substrate. The touch chip is disposed on the first surface of the substrate and electrically connected to the substrate, wherein the first surface of the first circuit board and the second surface of the first circuit board are opposite to each other. The plurality of touch detection units are configured to generate touch signals after a touch area is touched, and send the touch signals to the touch chip through the first circuit board and the substrate. The touch chip is configured to identify touch commands based on the touch signals, and send the touch commands to a processing unit of the electronic device through the substrate, so that the processing unit identifies touch operations according to the touch commands.
[0007] In one possible implementation, the second surface of the first circuit board is electrically connected to the first surface of the substrate via soldering, and the touch chip is electrically connected to the first surface of the substrate via electrical connection lines.
[0008] In one possible implementation, the touch detection module further includes an encapsulation layer, the inner surface of which is bonded to the plurality of touch detection units and to an area on the first surface of the first circuit board where no touch detection unit is disposed.
[0009] In one possible implementation, the edge of the encapsulation layer is attached to a first surface of the substrate, such that the plurality of touch detection units, the first circuit board, and the touch chip are located within a space surrounded by the encapsulation layer and the substrate.
[0010] In one possible implementation, a first filler adhesive is disposed between the substrate and the first circuit board. The first filler adhesive covers a second surface of the first circuit board, the touch chip, and a portion of the first surface of the substrate. The portion of the first surface of the substrate not covered by the first filler adhesive is bonded to the edge of the encapsulation layer.
[0011] In one possible implementation, the substrate includes: a first sub-substrate and a second sub-substrate; a second surface of the second sub-substrate is bonded to a first surface of the first sub-substrate, the touch chip is disposed on the first surface of the second sub-substrate, the first surface of the second sub-substrate is electrically connected to the first circuit board, the first surface of the second sub-substrate is electrically connected to the touch chip, the second sub-substrate is electrically connected to the first sub-substrate, the size of the second sub-substrate is smaller than the size of the first sub-substrate, wherein the first surface of the second sub-substrate is opposite to the second surface of the second sub-substrate.
[0012] In one possible implementation, the second surface of the first circuit board is electrically connected to the first surface of the second sub-substrate via soldering, the touch chip is electrically connected to the first surface of the second sub-substrate via an electrical connection line, and the first surface of the second sub-substrate is electrically connected to the first surface of the first sub-substrate via an electrical connection line.
[0013] In one possible implementation, a second filler adhesive is disposed between the first sub-substrate and the first circuit board. The second filler adhesive covers the first surface of the second sub-substrate, the touch chip, and the portion of the first surface of the first sub-substrate where the second sub-substrate is not disposed. The portion of the first surface of the first sub-substrate not covered by the second filler adhesive is attached to the edge of the encapsulation layer.
[0014] In one possible implementation, a peripheral circuit is disposed between the first surface of the first sub-substrate and the second surface of the first circuit board. The peripheral circuit is used to support the touch detection module to perform signal conversion. The peripheral circuit includes at least one of resistor, inductor and capacitor.
[0015] In one possible implementation, the thickness of the encapsulation layer is less than or equal to 200 μm.
[0016] In one possible implementation, the touch detection module further includes: a storage unit; the storage unit is disposed on a first surface of the substrate and electrically connected to the substrate; the storage unit is used to cache data required by the touch chip during the process of recognizing the touch command.
[0017] In one possible implementation, the plurality of touch detection units include a plurality of electrodes; the plurality of electrodes are distributed on a first surface of the first circuit board; the touch chip sends a drive signal to the plurality of electrodes, and at least some of the electrodes generate the touch signal after the touch area is touched.
[0018] According to a second aspect of the present application, an electronic device is provided, comprising: a processing unit as described in the first aspect of the present application regarding a touch detection module; the processing unit identifying touch operations based on touch instructions sent by the touch detection module.
[0019] In one possible implementation, the touch detection module is disposed in an opening in the mid-frame of the electronic device.
[0020] In one possible implementation, the electronic device further includes a second circuit board, through which the touch detection module is electrically connected to the processing unit.
[0021] In one possible implementation, the electronic device further includes: a protective layer; a second surface of the protective layer contacts the touch detection module, and a first surface of the protective layer is used to provide a touch area, wherein the first surface of the protective layer is opposite to the second surface of the protective layer.
[0022] In one possible implementation, the thickness of the protective layer is less than or equal to 30 μm.
[0023] In one possible implementation, the electronic device further includes: a cover plate and a metal protective ring; a second surface of the cover plate contacts the touch detection module, and a first surface of the cover plate is used to provide the touch area, wherein the first surface of the cover plate is opposite to the second surface of the cover plate; the metal protective ring is disposed around the touch detection module, and the inner side of the metal protective ring is opposite to the side surface of the cover plate and the side surface of the touch detection module.
[0024] In one possible implementation, the thickness of the cover plate ranges from [0.15mm, 2mm].
[0025] According to the touch detection module provided in the embodiments of this application, the touch detection module includes multiple touch detection units, a first circuit board, a touch chip, and a substrate. The multiple touch detection units can generate touch signals after the touch area is touched, and transmit the touch signals to the touch chip through the first circuit board and the substrate. The touch chip can generate touch commands based on the touch signals and transmit the touch commands to the processing unit through the substrate. Thus, the processing unit of the electronic device can recognize touch operations based on the touch commands. The touch detection module provided in the embodiments of this application can replace physical buttons (e.g., power buttons, volume control buttons, camera buttons, etc.) in electronic devices, saving internal space. Compared with the prior art, in addition to inputting touch commands to the electronic device through the touch screen, users can also input touch operations to the electronic device through the touch detection module, making it convenient for users to input touch commands. Furthermore, the touch detection module has multiple touch detection units, supporting single-point touch, swipe touch, etc., and has high functional expandability, allowing for various custom functions to be set, thus improving the user experience. In addition, in the touch detection module of this application embodiment, by arranging the touch detection unit, the first circuit board and the touch chip in a vertical stacked structure, the setting area of the touch detection unit can be maximized, thereby increasing the effective area of touch detection and the sensing area of touch, supporting sliding operations with a longer effective area, and improving the user experience. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.
[0027] Figure 1 This is a cross-sectional schematic diagram of a touch detection module provided in an embodiment of this application;
[0028] Figure 2 This is a cross-sectional schematic diagram of a touch detection module including an encapsulation layer provided in an embodiment of this application;
[0029] Figure 3 This is a cross-sectional schematic diagram of another touch detection module including an encapsulation layer provided in an embodiment of this application;
[0030] Figure 4 This is a cross-sectional schematic diagram of another touch detection module provided in an embodiment of this application;
[0031] Figure 5 This is a cross-sectional schematic diagram of another touch detection module provided in the embodiments of this application;
[0032] Figure 6 This is a cross-sectional schematic diagram of a touch detection module including a storage unit provided in an embodiment of this application;
[0033] Figure 7 This is a top view schematic diagram of a touch detection module provided in an embodiment of this application;
[0034] Figure 8 This is a schematic diagram of an electronic device provided in an embodiment of this application;
[0035] Figure 9 This is a cross-sectional view of another touch detection module provided in the embodiments of this application;
[0036] Figure 10 This is a cross-sectional schematic diagram of a touch detection module including a protective layer provided in an embodiment of this application;
[0037] Figure 11 This is a cross-sectional schematic diagram of a touch detection module including a cover plate provided in an embodiment of this application;
[0038] Figure 12 This is a top view of a touch detection module including a metal protective ring provided in an embodiment of this application. Detailed Implementation
[0039] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.
[0040] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0041] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."
[0042] The touch detection module and electronic device provided in this application are illustrated below through examples.
[0043] Figure 1 This is a cross-sectional schematic diagram of a touch detection module provided in an embodiment of this application, as shown below. Figure 1 As shown, the touch detection module 100 includes multiple touch detection units 101, a first circuit board 102, a touch chip 103, and a substrate 104. The multiple touch detection units 101 are disposed on a first surface of the first circuit board 102, and the second surface of the first circuit board 102 is electrically connected to the first surface of the substrate 104. The touch chip 103 is disposed on the first surface of the substrate 104 and electrically connected to the substrate 104, wherein the first surface of the first circuit board 102 and the second surface of the first circuit board 102 are opposite to each other.
[0044] Multiple touch detection units 101 can generate touch signals after the touch area is touched, and send the touch signals to the touch chip 103 through the first circuit board 102 and the substrate 104. The touch chip 103 can identify touch commands based on the touch signals, and send the touch commands to the processing unit of the electronic device through the substrate 104, so that the processing unit can identify touch operations according to the touch commands.
[0045] Multiple touch detection units 101 are disposed on the first surface of the first circuit board 102. When the object to be identified touches the touch area, such as when a finger presses or slides in the touch area, the multiple touch detection units 101 generate touch signals. Optionally, the multiple touch detection units 101 can be disposed at different positions on the first circuit board 102 to detect touch operations in different touch areas. Touch operations include, but are not limited to, single click, double click, long press, and swipe. Optionally, the sliding operation of the object to be identified can be identified based on the signal intensity change of the touch signals generated by the multiple touch detection units 101. For example, the multiple touch detection units 101 can be evenly distributed on the first surface of the first circuit board 102. When the object to be identified slides from the first direction to the second direction on the first circuit board 102, the touch detection units 101 on the first circuit board 102 from the first direction to the second direction generate touch signals in sequence, thereby identifying the sliding operation of the object to be identified.
[0046] After multiple touch detection units 101 generate touch signals, they can be sent to the touch chip 103 via the first circuit board 102 and the substrate 104. Specifically, the multiple touch detection units 101 are disposed on the first circuit board 102, which can transmit the touch signals generated by the touch detection units 101 to the substrate 104. The substrate 104 is electrically connected to the touch chip 103, and can transmit the touch signals to the touch chip 103. The touch chip 103 recognizes touch commands based on the touch signals transmitted by the substrate 104, for example, converting the electrical signals (touch signals) transmitted by the substrate 104 into digital signals (touch commands). The touch chip 103 sends the touch commands to the processing unit of the electronic device via the substrate 104. After receiving the touch commands, the processing unit can recognize touch operations based on the touch commands, such as recognizing finger pressing operations, recognizing finger sliding operations, etc.
[0047] In this embodiment, the touch detection module 100 includes multiple touch detection units 101, a first circuit board 102, a touch chip 103, and a substrate 104. The multiple touch detection units 101 generate touch signals after the touch area is touched, and transmit these signals to the touch chip 103 via the first circuit board 102 and the substrate 104. The touch chip 103 generates touch commands based on the touch signals and transmits these commands to the processing unit via the substrate 104. Thus, the processing unit of the electronic device can recognize touch operations based on the touch commands. The touch detection module 100 provided in this embodiment... The detection module 100 can replace physical buttons (e.g., power buttons, volume control buttons, camera buttons, etc.) in electronic devices, saving internal space. Compared with existing technologies, users can input touch commands to electronic devices not only through the touchscreen but also through the touch detection module 100, making it more convenient. The touch detection module 100 has multiple touch detection units 101, supporting single-point touch, swipe touch, etc., offering high functional expandability and allowing for various custom functions, thus improving the user experience. Furthermore, in this embodiment, by arranging the touch detection units 101, the first circuit board 102, and the touch chip 103 in a vertically stacked structure, the placement area of the touch detection units 101 can be maximized, thereby increasing the effective touch detection area and the touch sensing area, supporting swipe operations over a longer effective area, and enhancing the user experience.
[0048] In one possible implementation, such as Figure 1 As shown, the second surface of the first circuit board 102 is electrically connected to the first surface of the substrate 104 via solder 202, and the touch chip 103 is electrically connected to the first surface of the substrate 104 via an electrical connection line.
[0049] Since a touch chip 103 is disposed between the second surface of the first circuit board 102 and the first surface of the substrate 104, the space between the second surface of the first circuit board 102 and the first surface of the substrate 104 needs to accommodate the touch chip 103 and the electrical connection line between the touch chip 103 and the substrate 104. Therefore, the second surface of the first circuit board 102 and the first surface of the substrate 104 are electrically connected by soldering 202. In one example, the soldering 202 connection can be achieved by at least one pad on the second surface of the first circuit board 102 and at least one pad at a corresponding position on the first surface of the substrate 104. It should be noted that the height of the soldering 202 needs to be higher than the height of the touch chip 103, and the height of the soldering 202 needs to be higher than the distance from the highest point of the arc height of the electrical connection line between the touch chip 103 and the substrate 104 to the substrate 104. The touch chip 103 and the first surface of the substrate 104 are electrically connected by electrical connection lines, for example, the touch chip 103 and the first surface of the substrate 104 are electrically connected by bonding lines.
[0050] In this embodiment, the touch chip 103 is electrically connected to the first surface of the substrate 104 via an electrical connection line, thereby realizing the electrical connection between the touch chip 103 and the substrate 104. The second surface of the first circuit board 102 is electrically connected to the first surface of the substrate 104 via a solder 202, thereby realizing the electrical connection between the first circuit board 102 and the substrate 104. The solder 202 connection allows for a certain space between the first circuit board 102 and the substrate 104 to accommodate the touch chip 103 and the electrical connection line between the touch chip 103 and the substrate 104.
[0051] Figure 2 This is a cross-sectional schematic diagram of a touch detection module including an encapsulation layer provided in an embodiment of this application, as shown below. Figure 2 As shown, the touch detection module 100 also includes an encapsulation layer 105. The inner surface of the encapsulation layer 105 is bonded to the areas on the first surface of the first circuit board 102 where no touch detection units 101 are disposed, including the plurality of touch detection units 101.
[0052] The touch detection module 100 also includes an encapsulation layer 105, which can protect the touch detection module 100. In one example, the encapsulation layer 105 can be a molding layer. The inner surface of the encapsulation layer 105 is attached to a plurality of touch detection units 101 and a portion of the first surface of the first circuit board 102. The portion of the first surface of the first circuit board 102 is the area on the first surface of the first circuit board 102 where the plurality of touch detection units 101 are not disposed.
[0053] In this embodiment, the touch detection module 100 further includes an encapsulation layer 105, which can encapsulate the touch detection module 100. Since the inner surface of the encapsulation layer 105 is attached to the first surface of the multiple touch detection units 101 and the first circuit board 102, the encapsulation layer 105 can protect the multiple touch detection units 101 and the first circuit board 102, prevent the multiple touch detection units 101 and the first circuit board 102 from being affected by the external environment, and improve the reliability of the touch detection module 100.
[0054] Figure 3 This is a cross-sectional schematic diagram of another touch detection module including an encapsulation layer provided in an embodiment of this application, as shown below. Figure 3 As shown, the edge of the encapsulation layer 105 is attached to the first surface of the substrate 104, so that the multiple touch detection units 101, the first circuit board 102 and the touch chip 103 are located in the space surrounded by the encapsulation layer 105 and the substrate 104.
[0055] The edge of the encapsulation layer 105 is attached to a portion of the first surface of the substrate 104, thus forming a receiving space between the inner surface of the encapsulation layer 105 and the first surface of the substrate 104. Multiple touch detection units 101, the first circuit board 102, and the touch chip 103 are all located within this receiving space, thus protecting the multiple touch detection units 101, the first circuit board 102, and the touch chip 103 through the encapsulation layer 105 and the substrate 104. The surface on which the encapsulation layer 105 is attached to the first surface of the substrate 104 can be a connection surface on the encapsulation layer 105 that connects the inner surface and the outer surface of the encapsulation layer 105.
[0056] Optionally, such as Figure 3 As shown, the inner surface of the encapsulation layer 105 can be attached to the third surface of the first circuit board 102, and the third surface of the first circuit board 102 connects the first surface of the first circuit board 102 and the second surface of the first circuit board 102.
[0057] In this embodiment, the edge of the encapsulation layer 105 is attached to the first surface of the substrate 104. Multiple touch detection units 101, the first circuit board 102, and the touch chip 103 are located within the space enclosed by the encapsulation layer 105 and the substrate 104. This prevents the electronic components in the touch detection module 100 from being affected by the external environment, improving the overall strength of the touch detection module 100 and thus enhancing its reliability. Furthermore, since the touch chip 103 is located within the space enclosed by the encapsulation layer 105 and the substrate 104, and is not disposed on the first surface of the circuit board 102, the placement area of the touch detection units 101 can be maximized, thereby increasing the effective area of touch detection and the sensing area of touch, supporting sliding operations with a longer effective area, and enhancing the user experience.
[0058] In one possible implementation, such as Figure 2 and Figure 3 As shown, a first filler adhesive 203 is disposed between the substrate 104 and the first circuit board 102. The first filler adhesive 203 covers the second surface of the first circuit board 102, the touch chip 103 and part of the first surface of the substrate 104. The part of the first surface of the substrate 104 not covered by the first filler adhesive 203 is attached to the edge of the encapsulation layer 105.
[0059] A first filler 203 is disposed between the substrate 104 and the first circuit board 102, and the first filler 203 fills the space between the substrate 104 and the first circuit board 102, such as... Figure 3 As shown, the first filler adhesive 203 covers the second surface of the first circuit board 102, the touch chip 103, and a portion of the first surface of the substrate 104. It should be noted that the solder in the electrical connection of the soldering 202 and the electrical connection lines between the touch chip 103 and the first surface of the substrate 104 are all located within the first filler adhesive 203. The edge of the first surface of the substrate 104 not covered by the first filler adhesive 203 is bonded to the encapsulation layer 105 to form a receiving space. In one example, the first filler adhesive 203 is bonded to a portion of the inner surface of the encapsulation layer 105.
[0060] It should be noted that in other embodiments of this application, the first filler adhesive 203 may not be provided between the substrate 104 and the first circuit board 102. For example, there may be an air layer between the substrate 104 and the first circuit board 102.
[0061] In this embodiment, a first filler 203 is provided between the substrate 104 and the first circuit board 102. The first filler 203 can protect the solder and electrical connection lines, preventing the first circuit board 102 from losing electrical connection with the substrate 104 and the substrate 104 from losing electrical connection with the touch chip 103. The first filler 203 can also enhance the strength of the second surface of the first circuit board 102, thereby improving the reliability of the touch detection module 100.
[0062] Figure 4 This is a cross-sectional schematic diagram of another touch detection module provided in an embodiment of this application, as shown below. Figure 4As shown, the substrate 104 includes a first sub-substrate 1041 and a second sub-substrate 1042. The second surface of the second sub-substrate 1042 is bonded to the first surface of the first sub-substrate 1041. The touch chip 103 is disposed on the first surface of the second sub-substrate 1042. The first surface of the second sub-substrate 1042 is electrically connected to the first circuit board 102. The first surface of the second sub-substrate 1042 is electrically connected to the touch chip 103. The second sub-substrate 1042 is electrically connected to the first sub-substrate 1041. The size of the second sub-substrate 1042 is smaller than the size of the first sub-substrate 1041. The first surface of the second sub-substrate 1042 is opposite to the second surface of the second sub-substrate 1042.
[0063] The substrate 104 may include a first sub-substrate 1041 and a second sub-substrate 1042. The second sub-substrate 1042 can raise the height of a portion of the first sub-substrate 1041, increasing the space between the unraised portion of the first sub-substrate 1041 and the first circuit board 102. The second surface of the second sub-substrate 1042 is bonded to the first surface of the first sub-substrate 1041. In one example, the second surface of the second sub-substrate 1042 and the first surface of the first sub-substrate 1041 can be bonded using a die attach film 201 (DAF). The touch chip 103 is disposed on the first surface of the second sub-substrate 1042. In one example, the touch chip 103 can be bonded to the first surface of the second sub-substrate 1042. The size of the second sub-substrate 1042 is smaller than the size of the first sub-substrate 1041, for example: Figure 4 As shown, the length of the second sub-substrate 1042 is less than the length of the first sub-substrate 1041. Optionally, in the direction perpendicular to the first circuit board 102, the projection of the second sub-substrate 1042 on the first circuit board 102 is located within the edge of the projection of the first sub-substrate 1041 on the first circuit board 102.
[0064] Since the second sub-substrate 1042 is electrically connected to the first circuit board 102, after the multiple touch detection units 101 generate touch signals, the touch signals are transmitted to the second sub-substrate 1042 through the first circuit board 102. The second sub-substrate 1042 transmits the touch signals to the touch chip 103. After the touch chip 103 generates touch instructions based on the touch signals, it transmits the touch instructions to the first sub-substrate 1041 through the second sub-substrate 1042. The first sub-substrate 1041 transmits the touch instructions to the processing unit, thereby realizing the detection of touch operation.
[0065] It should be noted that, Figure 4 The encapsulation layer 105 in the illustrated scheme can be configured as follows: Figure 2The scheme shown is configured such that the encapsulation layer can only cover the area on the first surface of the first circuit board 102 where no touch detection unit 101 is provided, and the encapsulation layer 105 configuration scheme described in the above embodiments can be referred to for details, which will not be repeated here.
[0066] In this embodiment, the substrate 104 includes a first sub-substrate 1041 and a second sub-substrate 1042. The first surface of the second sub-substrate 1042 is electrically connected to the first circuit board 102, and the first surface of the second sub-substrate 1042 is electrically connected to the touch chip 103. The second sub-substrate 1042 is also electrically connected to the first sub-substrate 1041. This allows the touch detection module 100 to perform touch operation detection without affecting the second sub-substrate 1042. By raising a portion of the first sub-substrate 1041, the distance between the first sub-substrate 1041 and the first circuit board 102 is increased, allowing for the placement of more circuit components between them. Furthermore, since the touch chip 103 is located on the first surface of the second sub-substrate 1042, rather than on the first surface of the circuit board 102, the placement area of the touch detection unit 101 can be maximized, thereby increasing the effective area for touch detection and the sensing area for touch. This supports sliding operations over a longer effective area, enhancing the user experience.
[0067] In one possible implementation, such as Figure 4 As shown, the second surface of the first circuit board 102 is electrically connected to the first surface of the second sub-substrate 1042 by soldering 202, the touch chip 103 is electrically connected to the first surface of the second sub-substrate 1042 by an electrical connection line, and the first surface of the second sub-substrate 1042 is electrically connected to the first surface of the first sub-substrate 1041 by an electrical connection line.
[0068] like Figure 4As shown, the touch chip 103 is electrically connected to the first surface of the second sub-substrate 1042 via an electrical connection line. Similar to the principle in the above embodiment, since the touch chip 103 is disposed between the second surface of the first circuit board 102 and the first surface of the second sub-substrate 1042, the space between the second surface of the first circuit board 102 and the first surface of the second sub-substrate 1042 needs to accommodate the touch chip 103 and the electrical connection line between the touch chip 103 and the second sub-substrate 1042. Therefore, the second surface of the first circuit board 102 and the first surface of the second sub-substrate 1042 are electrically connected by solder 202. In one example, the solder 202 connection can be achieved by at least one pad on the second surface of the first circuit board 102 and at least one pad at a corresponding position on the first surface of the second sub-substrate 1042. It should be noted that the height of the solder 202 needs to be higher than the height of the touch chip 103, and the height of the solder 202 needs to be higher than the height of the highest point of the arc height of the electrical connection line between the touch chip 103 and the second sub-substrate 1042 from the substrate 104.
[0069] In this embodiment, the touch chip 103 is electrically connected to the first surface of the second sub-substrate 1042 via an electrical connection line, thereby realizing the electrical connection between the touch chip 103 and the second sub-substrate 1042. The second surface of the first circuit board 102 is electrically connected to the first surface of the second sub-substrate 1042 via a solder 202, thereby realizing the electrical connection between the first circuit board 102 and the substrate 104. The solder 202 connection allows for a certain space between the first circuit board 102 and the second sub-substrate 1042 to accommodate the touch chip 103 and the electrical connection line between the touch chip 103 and the second sub-substrate 1042. The second sub-substrate 1042 is electrically connected to the first sub-substrate 1041 via an electrical connection line, thus realizing the electrical connection between the second sub-substrate 1042 and the first sub-substrate 1041.
[0070] In one possible implementation, such as Figure 4 As shown, a second filler 204 is provided between the first sub-substrate 1041 and the first circuit board 102. The second filler 204 covers the first surface of the second sub-substrate 1042, the touch chip 103, and the part of the first surface of the first sub-substrate 1041 where the second sub-substrate 1042 is not provided. The part of the first surface of the first sub-substrate 1041 not covered by the second filler 204 is attached to the edge of the encapsulation layer 105.
[0071] A second filler 204 is provided between the first sub-substrate 1041 and the first circuit board 102, and between the second sub-substrate 1042 and the first circuit board 102. The second filler 204 fills the space between the first sub-substrate 1041, the second sub-substrate 1042, and the first circuit board 102. Figure 4As shown, the second filler 204 covers the first surface of the second sub-substrate 1042, the touch chip 103, and the portion of the first surface of the first sub-substrate 1041 where the second sub-substrate 1042 is not located. The second filler 204 also covers the third surface of the second sub-substrate 1042. The third surface of the second sub-substrate 1042 connects the first surface of the second sub-substrate 1042 and the second surface of the second sub-substrate 1042; that is, the second sub-substrate 1042 and the touch chip 103 are located within the second filler 204. It should be noted that the solder in the soldering 202 electrical connection and the electrical connection line between the touch chip 103 and the first surface of the second sub-substrate 1042 are both located within the second filler 204. The edges of the first surface of the first sub-substrate 1041 where the second filler 204 is not covered and where the second sub-substrate 1042 is not bonded are adhered to the encapsulation layer 105 to form a receiving space. In one example, the second filler 204 adheres to a portion of the inner surface of the encapsulation layer 105.
[0072] It should be noted that in other embodiments of this application, the second filler 204 may not be provided between the first sub-substrate 1041 and the first circuit board 102. For example, there may be an air layer between the first sub-substrate 1041 and the first circuit board 102.
[0073] In this embodiment, a second filler 204 is provided between the first sub-substrate 1041 and the first circuit board 102. The second filler 204 can protect the solder and electrical connection lines, preventing the first circuit board 102 from disconnecting from the second sub-substrate 1042, the second sub-substrate 1042 from the touch chip 103, and the first sub-substrate 1041 and the second sub-substrate 1042. The second filler 204 can also enhance the strength of the second surface of the first circuit board 102, thereby improving the reliability of the touch detection module 100.
[0074] Figure 5 This is a cross-sectional schematic diagram of another touch detection module provided in the embodiments of this application, such as... Figure 5 As shown, a peripheral circuit 106 is disposed between the first surface of the first sub-substrate 1041 and the second surface of the first circuit board 102. The peripheral circuit 106 is used to support the touch detection module 100 to perform signal conversion. The peripheral circuit 106 includes at least one of resistor, inductor and capacitor.
[0075] Since the substrate 104 includes a first sub-substrate 1041 and a second sub-substrate 1042 disposed on the first sub-substrate 1041, and with Figure 2 and Figure 3Compared to the embodiment shown, the space between the first sub-substrate 1041 and the first circuit board 102 is larger. Therefore, an external circuit 106 can be provided between the first surface of the first sub-substrate 1041 and the second surface of the first circuit board 102. The external circuit 106 may include at least one of resistor, inductor and capacitor. The external circuit 106 can provide support for the operation of the touch chip 103.
[0076] It should be noted that the first sub-substrate 1041 can transmit touch commands to the processing unit through a flexible printed circuit (FPC) disposed inside the electronic device. Since the peripheral circuit 106 can be disposed between the first surface of the first sub-substrate 1041 and the second surface of the first circuit board 102, the peripheral circuit disposed on the FPC can be reduced, thereby reducing the thickness of the FPC and reducing the space occupied by the FPC inside the electronic device.
[0077] It should also be noted that when the peripheral circuit 106 is disposed between the first surface of the first sub-substrate 1041 and the second surface of the first circuit board 102, since the first surface of the first sub-substrate 1041 and the second surface of the first circuit board 102 can be filled with a second filler, the peripheral circuit 106 is located in the second filler and can be protected by the second filler.
[0078] In this embodiment, a peripheral circuit 106 is disposed between the first surface of the first sub-substrate 1041 and the second surface of the first circuit board 102. The peripheral circuit 106 can provide support for the touch detection module 100, enabling the touch detection module 100 to work normally. Since the peripheral circuit 106 is disposed inside the touch detection module 100, the thickness of the FPC connected to the touch detection module 100 inside the electronic device can be reduced, thus reducing the space occupied by the FPC. Furthermore, since a second filler can be filled between the first surface of the first sub-substrate 1041 and the second surface of the first circuit board 102, the peripheral circuit 106 can be protected by the second filler, thereby improving the reliability of the module.
[0079] In one possible implementation, the thickness of the encapsulation layer 105 is less than or equal to 200 μm.
[0080] In this embodiment, the thickness of the encapsulation layer 105 is less than or equal to 200 μm. This can protect the touch detection module 100 while reducing the thickness of the encapsulation layer 105, preventing the presence of the encapsulation layer 105 from causing low signal strength of the touch signals generated by the multiple touch detection units 101 after being touched in the touch area. This can improve the reliability of the touch detection module 100 without affecting the touch detection of the touch detection module 100.
[0081] Figure 6 This is a cross-sectional schematic diagram of a touch detection module including a storage unit provided in an embodiment of this application, as shown below. Figure 6 As shown, the touch detection module 100 also includes a storage unit 107. The storage unit 107 is disposed on the first surface of the substrate 104 and is electrically connected to the substrate 104. The storage unit 107 is used to store data required by the touch chip 103 in the process of recognizing touch commands.
[0082] In the case where the touch chip 103 in the touch detection module 100 does not have a cache, an additional storage unit 107 can be set in the touch detection module 100. The touch chip 103 is electrically connected to the storage unit 107 through the substrate 104. The storage unit 107 can cache the data required by the touch chip 103 in the process of recognizing touch commands.
[0083] Optionally, when the substrate 104 includes a first sub-substrate 1041 and a second sub-substrate 1042, the storage unit 107 can be disposed on the second sub-substrate 1042 and electrically connected to the second sub-substrate 1042. The storage unit 107 can be electrically connected to the substrate 104 via an electrical connection line. When the substrate 104 and the first circuit board 102 are filled with a first filler adhesive, or the first sub-substrate 1041 and the first circuit board 102 are filled with a second filler adhesive, the storage unit 107 and the electrical connection line between the storage unit 107 and the substrate 104 are all located within the first filler adhesive or the second filler adhesive.
[0084] In this embodiment, the touch detection module 100 further includes a storage unit 107, which is disposed on the first surface of the substrate 104. The storage unit 107 is electrically connected to the touch chip 103 through the substrate 104. The storage unit 107 can store the data required by the touch chip 103 in the process of recognizing touch commands. Thus, a touch chip 103 without buffer can be set in the touch detection module 100, which can be applied to different touch chips 103.
[0085] In one possible implementation, multiple touch detection units 101 include multiple electrodes distributed on the first surface of the first circuit board 102. The touch chip 103 sends drive signals to the multiple electrodes, and at least some of the electrodes generate touch signals after the area touched by the finger is touched.
[0086] like Figures 1 to 6 As shown, the multiple touch detection units 101 may include multiple electrodes distributed on the first surface of the first circuit board 102. In one example, a metal layer may be deposited on the surface of the first circuit board 102 to form multiple electrodes. Optionally, taking an elongated oval shape as an example, the touch detection module 100 may be used as an example. Figure 7This is a top view schematic diagram of a touch detection module provided in an embodiment of this application, as shown below. Figure 7 As shown, multiple electrodes can be evenly distributed on the first surface of the first circuit board 102. The multiple electrodes divide the first surface of the first circuit board 102 into multiple touch areas. When a touch area is touched, the corresponding electrode generates a touch signal. When sliding in the touch area, for example, when sliding from the first direction to the second direction, the signal strength generated by the electrode set in the first direction decreases from large to small, and the signal strength generated by the electrode set in the second direction increases from small to large, thereby realizing the recognition of the sliding operation.
[0087] Multiple electrodes serve as both driving and receiving electrodes, meaning that multiple electrodes employ a self-capacitive solution for touch detection. Specifically, the touch chip 103 outputs driving signals to the multiple electrodes through the substrate 104 and the first circuit board 102. When the touch area is touched, the capacitance of the electrode located in the touch area changes, causing the electrode to generate a touch signal. The touch chip 103 receives the touch signal and identifies the touch command based on the touch signal.
[0088] In this embodiment, multiple touch detection units 101 include multiple electrodes distributed on the first surface of the first circuit board 102. A touch chip 103 sends drive signals to the electrodes, and at least some electrodes generate touch signals after the touch area is touched. This enables the detection of user touch operations using a self-capacitance detection scheme with multiple electrodes. Furthermore, since the touch chip 103 is not disposed on the first surface of the circuit board 102, the placement area of the touch detection units 101 (electrodes) can be maximized, thereby increasing the effective area for touch detection and the sensing area for touch, supporting sliding operations with a longer effective area, and enhancing the user experience.
[0089] Figure 8 This is a schematic diagram of an electronic device provided in an embodiment of this application, such as... Figure 8 As shown, the electronic device 300 includes a processing unit 301 and a touch detection module 100 as described in any of the above embodiments. The processing unit 301 identifies touch operations based on touch commands sent by the touch detection module 100.
[0090] In this embodiment, the electronic device 300 includes a processing unit 301 and a touch detection module 100. The processing unit 301 can identify touch operations based on touch commands sent by the touch detection module 100, thereby realizing the recognition of touch operations. Since the touch detection module 100 can replace physical buttons (e.g., power button, volume control button, camera button, etc.) in the electronic device 300, it can save internal space of the electronic device 300. Compared with the prior art, in addition to inputting touch commands to the electronic device 300 through the touch screen, touch commands can also be input to the electronic device 300 through the touch detection module 100, which can facilitate users to input touch commands. Moreover, the touch detection module 100 has high functional expandability and can be set with a variety of custom functions to improve the user experience.
[0091] In one possible implementation, the touch detection module 100 is disposed in an opening in the mid-frame of the electronic device 300.
[0092] In this embodiment, the touch detection module 100 is disposed in the opening of the middle frame of the electronic device 300, so that the touch detection module 100 can be disposed in the electronic device 300, allowing the user to input touch commands to the electronic device 300 by touching the touch detection module 100. The touch detection module 100 also has high functional expandability (for example, when the electronic device 300 is a mobile phone, the user can slide on the touch detection module 100 to adjust the volume, or use it as a shutter or zoom button when taking pictures with the mobile phone), which can improve the user experience.
[0093] It should be understood that the embodiments of this application do not limit the electronic devices or the application functions of the touch detection module. For example, the electronic device can also be an earphone, and the touch detection module can be used to realize single-point touch, swipe touch detection, etc. The electronic device can also be a vehicle button, and the touch detection module can be used to realize vehicle multimedia control, navigation control, etc.
[0094] Figure 9 This is a cross-sectional view of another touch detection module provided in the embodiments of this application, such as... Figure 9 As shown, the electronic device 300 also includes a second circuit board 302, through which the touch detection module 100 is electrically connected to the processing unit 301.
[0095] The electronic device 300 also includes a second circuit board 302, which can be an FPC. The touch detection module 100 is electrically connected to the processing unit 301 through the second circuit board 302. In one example, such as... Figure 9 As shown, the substrate 104 in the touch detection module 100 can be electrically connected to the second circuit board 302 via soldering 202, and the touch chip 103 transmits touch commands to the processing unit 301 through the substrate 104 and the second circuit board 302.
[0096] Optionally, when no peripheral circuitry is provided in the touch detection module 100, peripheral circuitry can be provided on the second circuit board 302 to provide circuit support for the touch detection module 100. Optionally, such as... Figure 9 As shown, when the second circuit board 302 is an FPC, a reinforcing plate 303 can be set, for example, a metal reinforcing plate 303, which can support the peripheral device patch and the touch detection module patch.
[0097] In this embodiment, the electronic device 300 further includes a second circuit board 302. The touch detection module 100 is electrically connected to the processing unit 301 through the second circuit board 302. This allows the touch detection module 100 to be electrically connected to the processing unit 301, and the touch commands generated by the touch detection module 100 to be transmitted to the processing unit 301. The processing unit 301 can then identify the touch operation based on the touch command and complete the touch detection.
[0098] Figure 10 This is a cross-sectional schematic diagram of a touch detection module including a protective layer provided in an embodiment of this application, as shown below. Figure 10 As shown, the electronic device 300 also includes a protective layer 304, the second surface of which contacts the touch detection module 100, and the first surface of which is used to provide a touch area, wherein the first surface of the protective layer 304 is opposite to the second surface of the protective layer 304.
[0099] The touch detection module 100 may be provided with a protective layer 304, which may be provided on the outer surface of the encapsulation layer 105 of the touch detection module 100. In one example, the protective layer 304 may be an ink layer. Optionally, the protective layer 304 may be set with different colors according to the color of the electronic device 300 to achieve uniformity of appearance.
[0100] In this embodiment, the electronic device 300 further includes a protective layer 304. The second surface of the protective layer 304 contacts the touch detection module 100, and the first surface of the protective layer 304 is used to provide a touch area. Thus, the protective layer 304 can protect the touch detection module 100 and provide a touch area, thereby improving the reliability of the touch detection module 100. Furthermore, the protective layer 304 can be set to different colors according to the color of the electronic device 300, ensuring the uniformity of the appearance of the electronic device 300.
[0101] In one possible implementation, the thickness of the protective layer 304 is less than or equal to 30 μm.
[0102] In this embodiment, the thickness of the protective layer 304 is less than or equal to 30 μm, thereby protecting the touch detection module 100 while preventing the signal strength of the touch detection unit 101 in the touch detection module 100 from being low due to the setting of the protective layer 304.
[0103] Figure 11 This is a cross-sectional schematic diagram of a touch detection module including a cover plate provided in an embodiment of this application, as shown below. Figure 11 As shown, the electronic device 300 also includes a cover plate 305 and a metal protective ring 306. The second surface of the cover plate 305 contacts the touch detection module 100, and the first surface of the cover plate 305 is used to provide a touch area. The first surface of the cover plate 305 is opposite to the second surface of the cover plate 305. The metal protective ring 306 is disposed around the touch detection module 100, and the inner side of the metal protective ring 306 is opposite to the side surface of the cover plate 305 and the side surface of the touch detection module 100.
[0104] The electronic device 300 may further include a cover plate 305, the second surface of which contacts the touch detection module 100. In one example, the second surface of the cover plate 305 may be bonded to the first surface of the encapsulation layer 105 of the touch detection module 100. To further improve the strength of the touch detection module 100, the electronic device 300 is also provided with a metal protective ring 306, which surrounds the cover plate 305 and the touch detection module 100, that is, the inner side of the metal protective ring 306 is opposite to the side surface of the cover plate 305 and the side surface of the touch detection module 100. Taking an oblong touch detection module 100 as an example... Figure 12 This is a top view of a touch detection module including a metal protective ring, as provided in an embodiment of this application. Figure 12 As shown, a metal protective ring 306 surrounds the touch detection module 100.
[0105] Alternatively, the cover plate 305 can be made of materials such as plastic, glass, and sapphire, and the color of the cover plate 305 can be set as needed.
[0106] In this embodiment of the application, the electronic device 300 may further include a cover plate 305 and a metal protective ring 306. The cover plate 305 can protect the touch detection module 100 and provide a touch area. The metal protective ring 306 is arranged around the touch detection module 100, thereby improving the reliability of the touch detection module 100.
[0107] In one possible implementation, the thickness of the cover plate 305 ranges from [0.15mm, 2mm].
[0108] Preferably, when the cover plate 305 is made of plastic, the thickness of the cover plate 305 is in the range of [1mm, 2mm], and when the cover plate 305 is made of glass and sapphire, the thickness of the cover plate 305 is in the range of [0.15mm, 0.2mm].
[0109] In this embodiment, the thickness of the cover plate 305 is in the range of [0.15mm, 2mm]. This can protect the touch detection module 100 while preventing the signal strength of the touch signal generated by the multiple touch detection units 101 after being touched in the touch area from being low due to the presence of the cover plate 305. This can improve the reliability of the touch detection module 100 without affecting the touch detection of the touch detection module 100.
[0110] Those skilled in the art will recognize that the units and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this application.
[0111] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.
Claims
1. A touch detection module applied to an electronic device, characterized in that, The touch detection module includes: multiple touch detection units, a first circuit board, a touch chip, and a substrate; The plurality of touch detection units are disposed on the first surface of the first circuit board, the second surface of the first circuit board is electrically connected to the first surface of the substrate, and the touch chip is disposed on the first surface of the substrate and electrically connected to the substrate, wherein the first surface of the first circuit board is opposite to the second surface of the first circuit board; The plurality of touch detection units are used to generate touch signals after the touch area is touched, and send the touch signals to the touch chip through the first circuit board and the substrate; The touch chip is used to identify touch commands based on the touch signals and send the touch commands to the processing unit of the electronic device through the substrate, so that the processing unit can identify touch operations according to the touch commands. 2.The touch detection module of claim 1, wherein, The second surface of the first circuit board is electrically connected to the first surface of the substrate by soldering, and the touch chip is electrically connected to the first surface of the substrate by electrical connection lines. 3.The touch detection module of claim 1, wherein, The touch detection module further includes an encapsulation layer, the inner surface of which is bonded to the plurality of touch detection units and the area on the first surface of the first circuit board where no touch detection unit is disposed. 4.The touch detection module of claim 3, wherein, The edge of the encapsulation layer is attached to the first surface of the substrate, so that the plurality of touch detection units, the first circuit board and the touch chip are located in the space surrounded by the encapsulation layer and the substrate. 5.The touch detection module of claim 4, wherein, A first filler adhesive is disposed between the substrate and the first circuit board. The first filler adhesive covers the second surface of the first circuit board, the touch chip, and a portion of the first surface of the substrate. The portion of the first surface of the substrate not covered by the first filler adhesive is attached to the edge of the encapsulation layer. 6.The touch detection module of claim 3, wherein, The substrate includes: a first sub-substrate and a second sub-substrate; The second surface of the second sub-substrate is bonded to the first surface of the first sub-substrate. The touch chip is disposed on the first surface of the second sub-substrate. The first surface of the second sub-substrate is electrically connected to the first circuit board. The first surface of the second sub-substrate is electrically connected to the touch chip. The second sub-substrate is electrically connected to the first sub-substrate. The size of the second sub-substrate is smaller than the size of the first sub-substrate. The first surface of the second sub-substrate is opposite to the second surface of the second sub-substrate. 7.The touch detection module of claim 6, wherein, The second surface of the first circuit board is electrically connected to the first surface of the second sub-substrate by soldering, the touch chip is electrically connected to the first surface of the second sub-substrate by electrical connection lines, and the first surface of the second sub-substrate is electrically connected to the first surface of the first sub-substrate by electrical connection lines. 8.The touch detection module of claim 6, wherein, A second filler adhesive is disposed between the first sub-substrate and the first circuit board. The second filler adhesive covers the first surface of the second sub-substrate, the touch chip, and the portion of the first surface of the first sub-substrate where the second sub-substrate is not disposed. The portion of the first surface of the first sub-substrate not covered by the second filler adhesive is attached to the edge of the encapsulation layer. 9.The touch detection module of claim 6, wherein, An external circuit is provided between the first surface of the first sub-substrate and the second surface of the first circuit board. The external circuit is used to support the touch detection module to perform signal conversion. The external circuit includes at least one of resistor, inductor and capacitor. 10.The touch detection module of claim 3, wherein, The thickness of the encapsulation layer is less than or equal to 200 μm. 11.The touch detection module of claim 1, wherein, The touch detection module also includes: a storage unit; The storage unit is disposed on the first surface of the substrate, and the storage unit is electrically connected to the substrate; The storage unit is used to cache the data required by the touch chip during the process of recognizing the touch command.
12. The touch detection module according to any one of claims 1-11, wherein, The plurality of touch detection units include a plurality of electrodes; The plurality of electrodes are distributed on the first surface of the first circuit board; The touch chip sends drive signals to the plurality of electrodes, and at least some of the electrodes generate the touch signal after the touch area is touched.
13. An electronic device, comprising: include: The processing unit is a touch detection module as described in any one of claims 1-12; The processing unit identifies touch operations based on the touch commands sent by the touch detection module.
14. The electronic device of claim 13, wherein, The touch detection module is disposed in the opening in the middle frame of the electronic device.
15. The electronic device according to claim 13, characterized in that, The electronic device further includes a second circuit board, through which the touch detection module is electrically connected to the processing unit.
16. The electronic device of claim 14, wherein, The electronic device further includes: a protective layer; The second surface of the protective layer is in contact with the touch detection module, and the first surface of the protective layer is used to provide a touch area, wherein the first surface of the protective layer is opposite to the second surface of the protective layer.
17. The electronic device of claim 16, wherein, The thickness of the protective layer is less than or equal to 30 μm.
18. The electronic device of claim 14, wherein, The electronic device also includes: a cover plate and a metal protective ring; The second surface of the cover plate contacts the touch detection module, and the first surface of the cover plate is used to provide the touch area, wherein the first surface of the cover plate is opposite to the second surface of the cover plate; The metal protective ring is arranged around the touch detection module, and the inner side of the metal protective ring is opposite to the side surface of the cover plate and the side surface of the touch detection module.
19. The electronic device of claim 18, wherein, The thickness of the cover plate ranges from 0.15mm to 2mm.